JPS6242244U - - Google Patents
Info
- Publication number
- JPS6242244U JPS6242244U JP13474385U JP13474385U JPS6242244U JP S6242244 U JPS6242244 U JP S6242244U JP 13474385 U JP13474385 U JP 13474385U JP 13474385 U JP13474385 U JP 13474385U JP S6242244 U JPS6242244 U JP S6242244U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- interlayer insulating
- contact hole
- multilayer wiring
- wiring device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011229 interlayer Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985134743U JPH0546274Y2 (ko) | 1985-09-03 | 1985-09-03 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985134743U JPH0546274Y2 (ko) | 1985-09-03 | 1985-09-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6242244U true JPS6242244U (ko) | 1987-03-13 |
JPH0546274Y2 JPH0546274Y2 (ko) | 1993-12-03 |
Family
ID=31036269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985134743U Expired - Lifetime JPH0546274Y2 (ko) | 1985-09-03 | 1985-09-03 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0546274Y2 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016171150A (ja) * | 2015-03-11 | 2016-09-23 | 株式会社東芝 | 半導体装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079748A (ja) * | 1983-10-06 | 1985-05-07 | Sanyo Electric Co Ltd | 半導体集積回路の多層配線構造 |
-
1985
- 1985-09-03 JP JP1985134743U patent/JPH0546274Y2/ja not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6079748A (ja) * | 1983-10-06 | 1985-05-07 | Sanyo Electric Co Ltd | 半導体集積回路の多層配線構造 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016171150A (ja) * | 2015-03-11 | 2016-09-23 | 株式会社東芝 | 半導体装置 |
US9947574B2 (en) | 2015-03-11 | 2018-04-17 | Kabushiki Kaisha Toshiba | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0546274Y2 (ko) | 1993-12-03 |