JPS6240848U - - Google Patents
Info
- Publication number
- JPS6240848U JPS6240848U JP13174085U JP13174085U JPS6240848U JP S6240848 U JPS6240848 U JP S6240848U JP 13174085 U JP13174085 U JP 13174085U JP 13174085 U JP13174085 U JP 13174085U JP S6240848 U JPS6240848 U JP S6240848U
- Authority
- JP
- Japan
- Prior art keywords
- light
- transparent plastic
- receiving window
- light receiving
- receiving element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920003023 plastic Polymers 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は、本考案の受光素子断面図、第２図ａ
は従来の受光素子取付け図、第２図ｂは従来の受
光素子断面図、第３図ａは受光素子駆動回路図、
第３図ｂは本考案の受光素子の出力レベル図、第
３図ｃは従来の受光素子の出力レベル図。
１４：外乱光遮蔽膜。
Figure 1 is a cross-sectional view of the light receiving element of the present invention, Figure 2a
is a conventional photodetector installation diagram, FIG. 2b is a cross-sectional view of a conventional photodetector, FIG. 3a is a photodetector drive circuit diagram,
FIG. 3b is an output level diagram of the light receiving element of the present invention, and FIG. 3c is an output level diagram of a conventional light receiving element. 14: Disturbance light shielding film.
Claims (1)
おいて、光センサチツプを透明プラスチツクでモ
ールドして、その検出すべき光の入射方向に受光
窓と光を導く路を持ち、受光窓以外の透明プラス
チツク表面には光遮蔽膜を有することを特徴とす
る受光素子。 In a sensor that detects the level of light from a certain direction, the optical sensor chip is molded with transparent plastic, and has a light receiving window and a path for guiding the light in the direction of incidence of the light to be detected, and the transparent plastic surface other than the light receiving window is A light-receiving element characterized by having a light-shielding film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13174085U JPS6240848U (en) | 1985-08-29 | 1985-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13174085U JPS6240848U (en) | 1985-08-29 | 1985-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240848U true JPS6240848U (en) | 1987-03-11 |
Family
ID=31030469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13174085U Pending JPS6240848U (en) | 1985-08-29 | 1985-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240848U (en) |
-
1985
- 1985-08-29 JP JP13174085U patent/JPS6240848U/ja active Pending
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