JPS6237929U - - Google Patents

Info

Publication number
JPS6237929U
JPS6237929U JP12843485U JP12843485U JPS6237929U JP S6237929 U JPS6237929 U JP S6237929U JP 12843485 U JP12843485 U JP 12843485U JP 12843485 U JP12843485 U JP 12843485U JP S6237929 U JPS6237929 U JP S6237929U
Authority
JP
Japan
Prior art keywords
clamp
spring plate
movable spring
clamping force
movable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12843485U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0236279Y2 (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12843485U priority Critical patent/JPH0236279Y2/ja
Publication of JPS6237929U publication Critical patent/JPS6237929U/ja
Application granted granted Critical
Publication of JPH0236279Y2 publication Critical patent/JPH0236279Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP12843485U 1985-08-23 1985-08-23 Expired JPH0236279Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12843485U JPH0236279Y2 (enrdf_load_html_response) 1985-08-23 1985-08-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12843485U JPH0236279Y2 (enrdf_load_html_response) 1985-08-23 1985-08-23

Publications (2)

Publication Number Publication Date
JPS6237929U true JPS6237929U (enrdf_load_html_response) 1987-03-06
JPH0236279Y2 JPH0236279Y2 (enrdf_load_html_response) 1990-10-03

Family

ID=31024099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12843485U Expired JPH0236279Y2 (enrdf_load_html_response) 1985-08-23 1985-08-23

Country Status (1)

Country Link
JP (1) JPH0236279Y2 (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPH0236279Y2 (enrdf_load_html_response) 1990-10-03

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