JPS6236709A - Production of magnetic head - Google Patents

Abstract

PURPOSE:To simplify a bonding job and to improve the production yield together with prevention of dispersion of chips, by performing a grinding process for R, a slicing process and a grinding process for bottom surface with the head blocks attached to the same supporting tool. CONSTITUTION:A head block 1 is set close to a revolving grindstone 16 and receives the R grinding with a left shift of a fixed tool 15. In this case, the gap step adjustment is also carried out. Then a supporting tool 11 is removed from the tool 15 and then fixed to a plate 17 with a screw 18. Thus the block 1 undergoes a slicing process from an upper side through a dotted line 19 so as to produce a remaining margin F. Then the tool 11 is fixed on the plate 17 at the opposite side by means of an adhesive resin 20. That is, the block 1 is set inside with the tool 11 set outside respectively. The block is ground up to a position shown by a line 22 from the outside while the block 1 is kept fixed on the plate 17. Then the resin 20 is removed for production of many head chips. The windings, etc. are given to those head chips. Thus a magnetic head is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION B) Industrial Application Field The present invention relates to a method of manufacturing a magnetic head used in VRR, etc.

(b) The conventional method for manufacturing a new type of magnetic head is as shown in FIG.
) The front part of the head block (1) which is joined by the above-mentioned head block (1) is rounded and polished. Slicing the prayer block (1) into each head chip [see dotted line (3) in Figure 8]
Thus, a large number of head chips (4) as shown in FIG. 9 are obtained. Such slicing is carried out using a wire saw or a multi-blade slicing machine, for example, as described in Japanese Patent Laid-Open No. 53-9509.

During the slicing, I! A method in which a plurality of head blocks (1) are placed on a flat plate (5) as shown in Fig. 10, and a method in which a plurality of head blocks (1) are placed in the grooves (6) of a plate (5) as shown in Fig. 11. , and as shown in FIG. 12, the head block (1) is
There is a method in which the head block (1) is arranged in the same manner as shown in Fig. 11, but the head block (1) is not completely cut off. In both the methods shown in Fig. 11 and Fig. 12, head chips scatter during slicing.
This was devised to prevent the yield from decreasing. Incidentally, in ``10th Factor-I'JX Para~3 in Figure 12, the dotted line (7) indicates the lower end position to be applied to the slicing. (8) is a rotating grindstone, and the arrow (q) indicates the grinding feed of the plate grinder.

P'l Problems to be Solved by the Invention However, in the case of FIG. 10, there is a drawback that the yield is low as the head chips are scattered during slicing, resulting in parting and chipping. In addition, in the case of Figures 11 and 12,
The tape sliding surface (i.e., the front part of the magnetic head block (1)) is attached to a jig for polishing, and then the head block (1) is once removed from the jig.
The head block (1) is bonded again to meet predetermined conditions, and then slicing is performed. Furthermore, in Fig. 12, the bottom surface of the head block (1) is ground, and after the head block (1) is bonded to the plate (II) as shown in Fig. 13, grinding is performed to obtain a hard tip. , the bonding process, which requires precision, must be performed six times.

Therefore, three types of jigs and three types of bonding operations are required, and the process becomes quite complicated. Further, as shown in FIG. 11, it is impossible to completely prevent chips from scattering during slicing.

The present invention solves the above problems.

b)) Means for Solving the Problem A head block formed by joining a pair of core half blocks is fixed to a support jig, and the rounded portion of the front part of the head block is polished. A process of slicing each head chip so as to leave a remaining margin at the rear end of the head block, and then slicing the combined head block and support jig against a fixing jig with the head block on the inside and the support jig on the outside. A manufacturing method comprising the steps of: fixing the material so that it becomes , and removing the residual material by grinding from the outside.

(Excellent) Function Performs curved surface polishing, slicing, and bottom surface polishing using one support jig. The head block does not need to be peeled off until the head block processing process is completed. The entire body is made of carbon material. A head block (1) as shown in FIG. 7 is fixed to this support jig.

At this time, as shown in FIG. 2, an adhesive tape u3 is placed on the support J4C1ll to prevent chips from scattering, and a head block (1) is placed on top of the adhesive tape u3. At that time, the head block (1) is positioned so as to be positioned by the recess (13) formed by the pair of pillars U, and the adhesive resin α
Fixed by Φ. In FIG. 2, p) is the gap depth before polishing. The distance fi (El is set to a predetermined value) between the lower surface of the support jig u11 and the gap depth end. The fixing jig (151) is fixed to the fixing jig opening of the pond with a screw field, and the fixing jig (151) rotates within a predetermined angle range around the fi1 point.Towards the left of the fixing jig By the grinding feed, the head block (υ) approaches the rotary grindstone (161) and is rounded and polished.The two grindstones (1e) are fixed and do not move.

At the time of this radius polishing, the gear lug depth is also adjusted. After polishing, remove the support jig uD from the fixing jig α9, then fix the support jig I to the plate (1η) with screw marks as shown in Figure 4, and perform slicing. The head block (1) and the support jig U1+ are shown during slicing when viewed from above, and the slicing is performed from above to the dotted line u1 so that there is a remaining area.

Next, on the same plate u9, fix the support jig +lll in the opposite direction, that is, with the head block (1) on the inside and the support jig σD on the outside, using adhesive resin ■ as shown in Figure 6. do. The resin (2) is, for example, an epoxy resin that has a low shrinkage rate and must have adhesive strength that can withstand grinding operations. The resin (2) also extends into the groove (2) formed by slicing, as shown in Figure fJ6+b). Grinding is performed from the outside to the position indicated by the line ■ while it is fixed on the plate (17) in this manner.

After that, the adhesive resin (2) is peeled off to obtain a large number of head chips. The head chip has windings, etc. that make it magnetic.

The head is completed.

(G) Effects of the Invention According to the present invention, polishing, slicing, and bottom surface grinding can be performed with the head block attached to the same support jig, so the bonding work that was conventionally required can be done. This greatly simplifies the process, prevents chip scattering, and improves yield.

[Brief explanation of the drawing]

1, 2, 6, 4, 5, and 6 are diagrams showing a method of manufacturing a magnetic head according to the present invention. FIGS. 7, 8, and 9 are diagrams illustrating a method of manufacturing a magnetic head, which is an object of the present invention. i
lO diagram! Figure 811. FIG. 12 and FIG. 15 are diagrams showing a conventional manufacturing method. (IA) (IB)... Core half flock, (1)...
・Head block, ull...support jig, Uη...
・Fixing jig, fFl...Remaining allowance.

Claims (1)

[Claims] (1) Fix the head block formed by joining a pair of core half blocks to a support jig, and
A process of applying polishing, a process of slicing each head chip so as to leave a residual margin at the rear end of the head block, and then a process of slicing the combined head block and support jig to a fixing jig. A method for manufacturing a magnetic head, comprising the steps of: fixing the support jig on the inside so that it faces outside, and grinding from the outside to remove the remaining amount.