JPH11149669A - Simultaneously grinding method for inside diameter and outside diameter of substrate for recording medium - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable working with high concentricity by simultaneously executing boring of the inside diameter of a substrate blank for recording medium consisting of a material, such as glass, and outer peripheral grinding thereof, to minimize the cutting allowance in the ensuing stage of substrate production as the outer periphery is ground as well and to further diminish the cutting allowance of the ensuing stage by adding chamfering. SOLUTION: The boring of the substrate set at a fixture 4 and the outer peripheral grinding thereof are simultaneously executed by rotating a grinding tool 3, such as diamond grinding wheel, integrated with a grinding tool 1 for boring of the inside diameter and an outer peripheral grinding tool 2. In the case of execution of the chamfering, rotational motion is applied to the substrate as well and the chamfering is executed by the V-grooves of the grinding tool.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of simultaneously performing inner hole drilling and outer peripheral grinding of a rough material of a recording medium substrate made of a material such as glass, and, if necessary, chamfering an inner diameter and an outer diameter. It is about.

[0002]

2. Description of the Related Art Conventionally, processing has been carried out only for drilling a hole having an inner diameter while holding a substrate on the basis of the outer diameter of a substrate coarse material which is not a perfect circle.

[0003]

The conventional method has the following drawbacks. (A) Since the outer diameter of the workpiece is not a perfect circle, a misalignment occurs between the outer diameter and the inner diameter after processing. I was (B) In the next process of substrate manufacturing, there were many allowances for the outer diameter and the inner diameter. The present invention has been made to solve these disadvantages.

[0004]

Means for Solving the Problems (a) Using a grinding tool (3) in which an inner diameter drilling tool (1) and an outer circumference grinding tool (2) are integrated, the inner diameter drilling and outer circumference grinding are performed simultaneously. (B) After grinding in (a), grinding tool for drilling holes for inner diameter (1)
And, chamfering is performed by a V-shaped groove provided on the side surface of the outer peripheral grinding tool (2).

[0005]

According to the grinding method of the present invention, drilling with high concentricity and grinding of the outer periphery are possible, and chamfering of the inner and outer diameters can be performed.

[0006]

(A) A substrate (W) is set on a fixture (4), and a cutting tool (3) for an inner diameter and an outer diameter is integrally rotated to grind the substrate. (FIGS. 2 and 3) (b) When performing further chamfering, move the grinding tool to a position where the tool V-groove and the substrate match, and move the rotating fixture or grinding tool in a direction parallel to the substrate plane. The inner and outer diameters are chamfered simultaneously by moving. (FIG. 4)

[0007]

By grinding in the above manner,
Prevention of misalignment of the inner and outer diameters, rough cutting of the outer diameter, and chamfering of the inner and outer diameters are possible.

[Brief description of the drawings]

FIG. 1 is a perspective view of the present invention.

FIG. 2 is a cross-sectional view of a line a in FIG. 1 of the present invention (before grinding).

FIG. 3 is a cross-sectional view taken along line a of FIG. 1 of the present invention (after grinding).

FIG. 4 is a sectional view taken along line a of FIG. 1 of the present invention (chamfering of inner and outer diameters).

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Internal diameter drilling tool 2 Peripheral grinding tool 3 Integrated tool 4 Fixture W Substrate

Claims (2)

[Claims] 1. A method for simultaneously processing an inner diameter and an outer diameter using a grinding tool (3) such as a diamond grindstone in which an inner diameter drilling tool (1) and an outer circumference grinding tool (2) are integrated. 2. A machining method according to claim 1, wherein a groove such as a V-shape is provided on a side surface of the grinding tool, and after chamfering the inner and outer diameters, the groove is chamfered.