JPS6235231B2 - - Google Patents

Description

[Detailed description of the invention] The present invention relates to a socket for an LSI package.

Conventionally, when an LSI package having a large number of leads is mounted in a socket, a considerable amount of force is required because all of the leads come into contact with spring terminals provided on the socket at the same time. Furthermore, this force may damage other parts. Also,
Even when attempting to move the LSI package using a lever or the like, there is a risk of damage to the lever unless the lever structure is sufficiently strong. In order to prevent this lever from being damaged, it is necessary to complicate the structure and increase costs due to materials, etc.

An object of the present invention is to provide an LSI socket that eliminates the above-mentioned drawbacks.

The socket of the present invention includes a base housing having a plurality of accommodation grooves for accommodating spring-like terminals on a predetermined surface side, and a base housing at a position facing the plurality of accommodation grooves.
A plurality of through holes for guiding the leads of the LSI package are provided, and a tapered protrusion protrudes from near the end of the through hole on the side of the predetermined surface, and in a direction perpendicular to the predetermined surface. A drive plate slidably attached to the base housing and first and second contacts are in elastic contact with each other, and when the drive plate approaches the predetermined surface, the tapered protrusion the plurality of spring-shaped terminals accommodated in the plurality of accommodation grooves, and configured such that the first and second contacts move in a direction away from each other upon engagement with the terminal section.

Next, the present invention will be explained in detail with reference to the drawings.

FIG. 1 is a perspective view showing one embodiment of the present invention, and FIGS. 2 and 3 are sectional views taken along line A-A' in FIG.

As shown in FIGS. 1 to 3, the socket of this embodiment has an accommodation groove 9 for accommodating the spring terminal 6 at a position corresponding to the lead 2 of the LSI package 1.
The base housing 5 has a
2 provided with a through hole 10 for guiding the lead 2 of the
a cam-like lever 4 rotatably attached to a shaft 11 on the side surface of the base housing 5 so as to engage with a protrusion 7 provided on the side surface of the drive plate 3 for driving the drive plate 3; It is configured.

First, attach the LSI package 1 to the base housing 5.
This section explains how to implement it.

As shown in FIG. 1, when the cam-like lever 4 is rotated about the shaft 11 in the direction of arrow A with the drive plate 3 raised upward, the protrusion 7 and the cam-like lever 4 engage with each other. As a result, the rotational movement of the lever 4 is converted into a linear movement of the drive plate 3, and the drive plate 3 moves downward. At this time, as shown in Figure 2,
A tapered protrusion 8 formed near the lower end of the through hole 10 of the drive plate 3 pushes the tip of the spring terminal 6 to expand. In this way, since the tips of the spring-like terminals 6 are pushed apart, the leads 2 of the package 1 can be easily inserted between the contacts of the terminals 6. Thereafter, when the lever 4 is returned to its original state, the protrusion 8 of the drive plate 3 comes out of the spring terminal, and the contact point of the terminal 6 comes into contact with the surface of the lead 2 with a specified contact force.

When removing the package 1 from the housing 5, the same operation as described above can be carried out, so the explanation will be omitted.

In addition, although the above-mentioned Example demonstrated the example in which two drive plates were provided, it may be one or three or more.

As described above, the socket of the present invention has the effect that an LSI package having a large number of leads can be easily mounted with little force.

[Brief explanation of the drawing]

Fig. 1 is a perspective view showing one embodiment of the present invention;
This figure and FIG. 3 are cross-sectional views taken along the line A-A' in FIG. 1...LSI package, 2...lead, 3...
Drive plate, 4...Cam-shaped lever, 5...Base housing, 6...Spring-shaped terminal, 7...Protrusion, 8...
... Tapered protrusion, 9 ... Accommodation groove, 10 ... Through hole, 11 ... Shaft.

Claims (1)

[Scope of Claims] 1. A base housing having a plurality of accommodation grooves for accommodating spring-like terminals on a predetermined surface side, and a plurality of through holes for guiding leads of an LSI package to positions facing the plurality of accommodation grooves. and a tapered protrusion protruding from near the end of the through hole on the predetermined surface side, and is attached to the base housing so as to be slidable in a direction perpendicular to the predetermined surface. A drive plate and first and second contacts are elastically in contact with each other, and when the drive plate approaches the predetermined surface, engagement with the tapered protrusion causes the first and second contacts to contact each other. 1. An LSI socket comprising: a plurality of spring-shaped terminals accommodated in the plurality of accommodation grooves, and the plurality of spring-shaped terminals are configured such that the two contacts move in a direction away from each other.