JP3076782B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket in which a contact is displaced forward to form a contact state with a terminal of an IC package, and is displaced rearward to form a contact release state with the terminal. Contact structure.

[0002]

2. Description of the Related Art Japanese Patent Publication No. Hei 3-24035 discloses a method in which a pair of holding pieces are provided in parallel from the base of a contact, and each holding piece is elastically moved forward and backward through a unique spring portion. It can be displaced. The pair of holding pieces hold the upper and lower surfaces of the terminals of the IC package to form an IC socket having a two-point contact structure. At this time, the holding pieces on the inside facing each other are fixed with elasticity accumulated in the facing direction. To make contact with the lower surface of the terminal, and only the outer clamping piece is elastically displaced forward and backward by the vertical movement of the contact opening / closing member (release body). To form the above-mentioned two-point contact structure with the holding piece.

[0003]

However, in the above-mentioned two-point contact structure, the signal flows through the spring portion of the inner holding piece and the spring portion of the outer holding piece. Although it is desirable to make
In practice, it is necessary to secure a displacement component for contact and release of contact by the spring portion forming the outer holding piece, and it is difficult to design the two line lengths to be equal.

That is, as shown in FIG.
It is necessary to secure a sufficient spring length, for example, by providing a curved spring portion on the outer holding piece, and a remarkable difference naturally occurs between the line length of the inner holding piece and the line length of the outer holding piece. As a result, the electric signal tends to flow to the inner holding piece having a short line length (spring length), and the effect of the two-point contact structure is reduced.

On the other hand, when the line lengths of the inner and outer holding pieces are made equal as shown in FIG. 3 of the above-mentioned prior art, the length of the spring portion for supporting the outer holding pieces cannot be sufficiently secured, and the vertical movement is accompanied. There is a problem in that the operating force of the release body for causing the displacement to move back and forth becomes excessive and permanent deformation is caused by repeated displacement.

More specifically, USP based on the prior art
As shown in FIG. 4 and the like of No. 4,691,975, when both the inner holding piece and the outer holding piece are provided with curved spring portions, the line lengths can be made equal, but the curved spring portions are superposed, so that the contact is made. And the disadvantage that the socket becomes large is newly derived.

Further, in the above prior art, the wiping action of the contact to the IC terminal cannot be expected, and even more, the wiping of the upper and lower surfaces of the IC terminal is impossible.

[0008]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and displaces a pair of contact pieces sandwiching the upper and lower surfaces of an IC terminal and making two-point contact by a single common spring portion. By adopting the structure, the line length by the spring part is made as uniform as possible to improve the reliability of two-point contact, and at the same time contribute to the miniaturization of contacts and sockets. This realizes a structure that can easily secure the function.

As a means for achieving this, the contact in the IC socket has an upper contact piece and a lower contact piece supported by a common first spring portion for causing the forward displacement and the backward displacement. At least one of the contact pieces can be elastically displaced up and down by the second spring portion.

The upper contact piece and the lower contact piece are opened by expanding the upper contact piece and the lower contact piece against the second spring portion at the time of forward displacement through the common first spring portion. A contact structure was adopted in which the terminal was pressed and held in between.

A cam member may be provided as a means for vertically or elastically displacing both or one of the upper and lower contact pieces. As an example, the cam member elastically displaces both the upper contact piece and the lower contact piece vertically when the contact is displaced rearward, or displaces only the upper contact piece upward to form an expanded state of both contact pieces. .

Similarly, when the contact is displaced forward, the upper and lower contact pieces are elastically displaced up and down, or only the upper contact piece is displaced downward to form a closed state of both contact pieces. And clamp the IC terminal.

Conversely, a cam member is provided for displacing only the lower contact piece downward when the contact is rearwardly displaced and displacing only the lower contact piece upwardly when the contact is displaced forward.

A terminal supporting portion is provided at a tip of the lower contact piece and protrudes from a tip of the upper contact piece to support a lower surface of the IC terminal. The terminal supporting portion supports the lower surface of the IC terminal when the IC package is mounted, or supports the lower surface of the IC terminal before the upper contact piece when the contact is displaced forward after the mounting of the IC package.

When one or both of the upper contact piece and the lower contact piece are displaced forward by the common first spring portion, they slide on both or one of the upper and lower surfaces of the IC terminal to exert a wiping action.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to FIGS.

As shown in FIG. 1 and FIG.
Has an IC accommodating section 2 in the center on the upper surface side, and the IC accommodating section 2
Has a large number of contacts 3 arranged in rows along two or four opposite sides thereof.

The contact 3 can be elastically displaced forward and backward. The contact 3 comes into pressure contact with the terminal 5 of the IC package 4 when displaced forward, and releases contact with the terminal 5 when displaced backward. As an operation means for displacing the contact 3 forward and backward, a contact opening / closing member 6 arranged on the upper part of the socket body 1 is provided. The contact opening / closing member 6 has a frame shape, and has a central opening 7 which is opened above the IC accommodating portion 2 so as to face the IC accommodating portion 2. The IC package 4 is accommodated in the IC accommodating portion 2 through the central opening 7. Is made and released.

The contact opening / closing member 6 slides a vertical guide portion 8 suspended from the frame wall thereof with a vertical guide portion 8 'provided on the outer surface of the socket body 1 to guide the vertical movement.

A contact opening / closing cam portion 9 is provided on the frame wall of the contact opening / closing member 6 so as to correspond to the row of the contacts 3, and the cam portion 9 is attached to the contact 3 by lowering the opening / closing member 6. Act on the contact 3
Is elastically displaced rearward for each row to form a contact release state with the terminal 5, and when the opening / closing member 6 is raised, the contact 3 is elastically displaced forward for each row to press and hold the terminal 3 with the terminal 5. Form a state.

The contact opening / closing member 6 is
Is supported by a return spring for urging the contact 3 upward, or the contact 3 is configured to accumulate elasticity when the contact 3 is displaced rearward and to be displaced forward by the restoring force. To rise.

As means for causing the cam portion 9 provided on the contact opening / closing member 6 to act on the contact 3, as shown in FIG.
The lever 10 is provided rotatably with the shaft 11 as a fulcrum, and the lever 10 is provided horizontally along each row for each row of contacts to engage with the contacts 3 in each row, and a contact opening / closing member is provided. When the cam 6 presses the pressure receiving portion 12 formed at the end of the contact opening / closing lever 10, the lever 10 is rotated in one direction by the guide of the cam 9, and the contacts 3 in each row are described later. The first spring portion 13 is displaced backward against the elasticity. When the pressing operation force to the contact opening / closing member 6 is released, the lever 10 is rotated in the other direction by the restoring force of the first spring portion 13 of the contact 3 in the forward direction, and the opening / closing member is rotated via the cam portion 9. 6 is raised.

That is, FIG. 7 shows an example in which the contact 3 is elastically displaced via a movement transmitting member such as the opening / closing lever 10 which converts the vertical movement of the contact opening / closing member 6 into the forward / backward movement of the contact 3.

On the other hand, as shown in FIG. 1 and the like, the cam portion 9 of the contact opening / closing member 6 directly acts on a pressure receiving portion 12 integrally formed at the upper end or the intermediate portion of the contact 3 to displace the contact 3 back and forth. Can be caused.

The jig provided at the working end of the robot without the contact opening / closing member 6 is used.
Alternatively, the contact 3 may act on the pressure receiving portion 12 of the lever 10 to cause the contact 3 to elastically move in the front-rear direction.

The contact 3 is connected to the one common first
The contact 3 has an upper contact piece 14 and a lower contact piece 15 supported by the spring portion 13, and the contact 3 has a rigid base 23 at a lower end of the first spring portion 13, and a press-fitting claw 24 inward from the base 23. And press-fitting claw 24 is attached to socket body 1,
For example, the whole contact is fixed to the socket body by press-fitting into a press-fitting hole 26 opened on a side surface of the terminal support 19 described later. A male terminal 25 projects downward from the base 23 and is connected to a printed circuit board or the like.

The upper contact piece 1 is attached to the tip of the lower contact piece 15.
A terminal support portion 21 protruding from the tip of the terminal 4 and supporting the lower surface of the terminal 5 is provided. The terminal supporting portion 21 supports the lower surface of the terminal 5 when the IC package 4 is mounted, or
After the package 4 is mounted, the lower surface of the terminal 5 is supported prior to the upper contact piece 14 when the contact 3 is displaced forward.

The first spring portion 13 mainly includes the upper contact piece 1.
4 is a spring element for causing forward displacement and rearward displacement of the lower contact piece 4 and the lower contact piece 15.

The first spring portion 13 is formed by a curved spring bulging forward as shown by a solid line in FIG. 2A, or by a substantially vertical straight spring as shown by a dotted line. As described later, both or one of the upper contact piece 14 and the lower contact piece 15 can be elastically displaced up and down, and the first and second contact pieces are provided with a vertical movement component to add the first moving element.
The spring portion 13 can be substantially vertically linear.

Either the upper contact piece 14 and the lower contact piece 15 are connected to the upper end of the first spring portion 13 or the upper contact piece 14 is provided at the upper end of the first spring portion 13 and the lower contact piece 1 is provided.
5 can be provided near the upper end of the first spring portion 13 so that a part of the first spring portion 13 is interposed between the upper contact piece 14 and the lower contact piece 15.

The present invention also includes a case where a rigid connecting portion is provided at the upper end of the first spring portion 13 and the upper and lower contact pieces 14 and 15 are connected to the upper end of the rigid connecting portion.

The upper contact piece 14 and the lower contact piece 15 are vertically opposed to each other and extend forward to form contact portions 16 and 17 on the inner surfaces of the free ends (front ends) of the respective contact pieces 14 and 15.
The contact portions 16 and 17 may be formed by protrusions protruding from the inner surfaces of the contact pieces 14 and 15 in the facing direction. The contact portions 16 and 17 are always placed in contact with each other due to the elasticity of the upper and lower contact pieces 14 and 15, and the upper and lower contact pieces 14 and 15 are placed in a state where the elasticity is stored.

As shown in FIG. 1 and FIG.
4 and the lower contact piece 15 are both formed by a cantilever arm having a spring property (this is referred to as a second spring portion).
The upper and lower elastic displacements (opening and closing of both contact pieces) of the upper and lower parts 4 and 15 are enabled. In this case, substantially the entire length of both contact pieces 14 and 15 is formed by a relatively thin cantilever arm having spring properties as described above. Alternatively, both connecting pieces 14 and 15 are formed by rigid cantilever arms, and the base of the arms is supported by a connecting piece having a spring property (this is referred to as a second spring portion), thereby enabling elastic displacement in the vertical direction. To

As another example, as shown in FIGS. 3 and 4, only the upper contact piece 14 is formed by a cantilever arm (second spring portion) having a spring property, or the upper contact piece 14 has rigidity. The base is formed by a cantilever arm, and its base is supported by a connecting piece (second spring portion) having a spring property, thereby enabling vertical elastic displacement. This connecting piece comprises an upper contact piece 14 and a first spring portion 13.
It is provided between them.

As still another example, as shown in FIGS. 5 and 6, only the lower contact piece 15 is formed by a cantilever arm (second spring portion) having spring properties, or the lower contact piece 15 has rigidity. The base is formed by a cantilever arm, and its base is supported by a connecting piece (second spring portion) having a spring property, thereby enabling vertical elastic displacement. This connecting piece comprises a lower contact piece 15 and a first spring portion 1.
3 is provided.

As described above, the upper and lower contact pieces 14 and 15 are supported by the common single first spring portion 13 so as to be elastically displaceable in the front-rear direction, and the first spring portion 13 is bent against its elasticity. As a result, it is displaced synchronously backward, and conversely, displaced synchronously forward by the restoring force of the common first spring portion 13, and when displaced forward, both or at least the upper and lower contact pieces 14, 15 The terminal 5 of the IC package 4 is clamped while being elastically displaced in one of the up and down directions, and the upper and lower surfaces thereof are brought into pressure contact with the contact portions 16 and 17. Contact part 1
When the first and second springs 13 and 17 are displaced forward by the elastic force of the first spring portion 13, they slide while holding the upper and lower surfaces of the terminal 5, and exhibit a wiping action.

As means for resiliently displacing both or one of the upper and lower contact pieces 14, 15 vertically, FIGS.
As shown in FIG. 6, a cam member 18 can be used. The cam member 18 is interposed, for example, between the upper contact piece 14 and the lower contact piece 15 and is arranged close to the contact portions 16 and 17. The contact portions 16 and 17 are placed in a closed state at positions off the front end of the cam member 18 to form a standby state.

Alternatively, as shown in FIGS. 1, 3 and 5, the ends of the upper and lower contact pieces 14, 15 are connected to the terminals 5 without using the cam member 18.
The upper and lower contact pieces 14, 1 are forcibly opened by the ends of
The terminal 5 can be held between the terminals 5.

Next, the structure of the present invention will be described in more detail with reference to FIGS. FIGS. 1 and 2 show a case where both the upper and lower contact pieces 14 and 15 can be elastically displaced up and down in the order of operation.
FIG. 2 shows an embodiment in which the upper and lower contact pieces 14, 15 are opened and closed (vertical displacement) by a cam member 18, and FIG. 1 shows an embodiment in which the cam member 18 is not used.

As shown in FIG. 1A, the upper and lower contact pieces 14, 15
Is placed in a state of being displaced forward by the restoring force of the first spring portion 13 and forms a standby state.

Next, as shown in FIG. 1B, the contact opening / closing member 6 is moved down to displace the contact 3 rearward, and the IC
The housing 2 is opened.

That is, the first spring portion 13 is bent rearward against its elasticity, whereby the upper and lower contact pieces 14, 15 supported by the first spring portion 13 are synchronously displaced rearward, and To release.

Next, as shown in FIG. 1C, the IC package 4 is housed in the IC housing 2 through the central opening 7.

An IC support 19 is provided at the bottom of the IC accommodating section 2. The lower surface of the IC package 4 is supported on the upper surface of the IC support 19, or provided on the lower contact piece 15 as shown. The terminal 5 is placed on the terminal support 21 that has been set. I
Positioning ridges 20 are provided on two opposite sides or four sides of the C support base 19, and the positioning ridges 20 regulate the side surfaces of the IC package 4. The terminal 5 protruding from the side surface of the IC package 4 goes over the positioning ridge 20 and protrudes outward from the terminal tip.

Next, as shown in FIG. 1D, when the pressing force applied to the contact opening / closing member 6 is released, the contact 3
Is elastically displaced forward while pushing up the opening / closing member 6 by the restoring force of the first spring 13.

The upper contact piece 1 is caused by this forward elastic displacement.
When the tip of the terminal 5 abuts between the tip of the lower contact piece 4 and the tip of the lower contact piece 15 and the contact 3 is subsequently elastically displaced forward, the upper and lower contact pieces 14, 15 are forcibly opened by the terminal 5 while being forcedly opened by the terminal 5. The terminal 5 is interposed therebetween to form a pressure holding state.

At this time, as shown in FIG.
The contacts 4 and 15 press and hold the upper and lower surfaces of the terminal 5 between the contact portions 16 and 17, and the contact portions 16 and 17 slide from the terminal tip to the base to exert a wiping action.

In FIG. 1C, when the terminal 5 of the IC package 4 is placed on the terminal support 21 provided at the tip of the lower contact piece 15, a gap 22 is formed between the upper surface of the IC support 19 and the IC package 4. The IC package 4 is floated and supported on the IC support 19.

Then, as shown in FIG.
When the terminal 5 is clamped between the terminals 4 and 15, the upper and lower contact pieces 1
The upper and lower contacts 14 and 15 hold the terminal 5 by the upper and lower contacts 14 and 15 by rotating the terminals 4 and 15 obliquely downward.
Presses the terminal 5 downward to lower the IC package 4 to be supported on the upper surface of the support base 19. This further promotes the wiping action.

When the opening / closing member 6 is moved downward from the state shown in FIG. 1D, the contact 3 is displaced rearward, whereby the upper and lower contact pieces 14 and 15 are displaced rearward while sliding on the upper and lower surfaces of the terminal 5 and again the upper and lower surfaces of the terminal 5. Wiping. Contact 3
The contact with the IC terminal 5 is released by the rearward displacement of the IC package, and the IC package 4 can be extracted by opening the IC housing 2.

Next, an example using the cam member 18 will be described with reference to FIG.

As shown in FIG. 2A, the upper and lower contact pieces 14, 15
Is placed in a state of being displaced forward by the restoring force of the first spring portion 13 and forms a standby state.

Next, as shown in FIG. 2B, the contact opening / closing member 6 is moved downward to displace the contact 3 rearward, and
The housing 2 is opened.

That is, the first spring portion 13 is bent backward against its elasticity, whereby the upper and lower contact pieces 14 and 15 supported by the first spring portion 13 are synchronously displaced rearward, and To release. A cam member 18 is provided between the upper contact piece 14 and the lower contact piece 15 near the contact portions 16 and 17.

The cam member 18 is provided integrally with the socket body 1 so as to extend along the row of the contacts 3 and is interposed between the upper and lower contact pieces 14 and 15 as described above.

For example, as shown in FIG. 2A ', the IC support base 19 has a contact piece regulating groove 2 for receiving the upper and lower contacts 14, 15 at a position facing the upper and lower contacts 14, 15 of each contact 3.
A cam member 18 having an upper and lower portion 8 is provided to receive the upper and lower contact pieces 14 and 15 in the contact piece regulating groove 28, and the following cam surface 27 is formed on the inner bottom surface of the groove to open and close the upper and lower contact pieces 14 and 15. Do it.

As shown in FIG. 2B ', this cam member 18
A pair of inclined cam surfaces 27 are provided on the upper and lower surfaces of the upper and lower surfaces to expand rearward, that is, reduce forward. When the contact 3 is displaced rearward with the upper and lower contact pieces 14 and 15, the upper and lower contact pieces 14 are provided. , 15 are guided by the respective inclined cam surfaces 27, and the upper contact piece 14 is elastically displaced upward and the lower contact piece 15 is elastically displaced downward to be in an open state.

The upper and lower contact pieces 14 and 15 are placed in a closed state at a position deviated from the front end of the cam member 18, and from this closed state, the contact portions 16 and 17 ride on the inclined cam surface 27 by the rearward displacement of the contact 3. Thus, the open state is formed.

Next, as shown in FIG. 2C, the IC package 4 is housed in the IC housing 2 through the central opening 7.

As described above, the IC
A support base 19 is provided, and the lower surface of the IC package 4 is supported on the upper surface of the IC support base 19, or the terminal 5 is placed on a terminal support 21 provided on the lower contact piece 15 as shown in the figure. . Positioning ridges 20 are provided on two or four sides of the IC support base 19 facing each other.
0 regulates the side surface of the IC package 4. The terminal 5 protruding from the side surface of the IC package 4 goes over the positioning ridge 20 and protrudes outward from the terminal tip.

Next, as shown in FIG. 2D, when the pressing force applied to the contact opening / closing member 6 is released, the contact 3
Is elastically displaced forward while pushing up the opening / closing member 6 by the restoring force of the first spring portion 13.

The vertical contact piece 1 is formed by this forward elastic displacement.
The contact portions 16 and 17 of 4 and 15 slide forward on the inclined cam surface of the cam member 18, and the upper contact piece 14 is elastically displaced downward by the restoring force, and the lower contact piece 15 is elastically displaced upward by the restoring force. At the position deviated from the tip of the cam member 18, the upper and lower surfaces of the tip of the terminal 5 are sandwiched.

Subsequently, when the contact 3 is elastically displaced forward, as shown in FIGS. 2E and 1D ', the upper and lower contact pieces 14,
The contact 15 slides from the terminal tip to the base while pressing the upper and lower surfaces of the terminal 5 between the contact parts 16 and 17 to exert a wiping action.

As described above, in the state of FIG.
The terminal 5 of the package 4 can be placed on the terminal support 21 provided at the tip of the lower contact piece 15. At this time, a gap 22 is formed between the upper surface of the IC support 19 and the IC package 4, The package 4 is floated and supported on the IC support base 19, and as shown in FIG.
5, when the terminal 5 is pressed and held between the upper and lower contact pieces 14, 15
Is rotated obliquely downward in the forward direction so that the upper contact piece 14 is held by the upper and lower contact pieces 14 and 15 while the upper contact piece 14
Is pressed downward to lower the IC package 4 and
Can be supported on the upper surface. This further promotes the wiping action.

When the opening / closing member 6 is lowered from the state shown in FIG. 2E, the contact 3 is displaced rearward, whereby the upper and lower contact pieces 14, 15 are displaced rearward while sliding on the upper and lower surfaces of the terminal 5, and again become upper and lower surfaces of the terminal 5. Wiping. Contact 3
The contact with the IC terminal 5 is released by the rearward displacement of the IC package, and the IC package 4 can be extracted by opening the IC housing 2.

Next, another embodiment of the present invention will be described with reference to FIGS.
This will be described in more detail with reference to FIG. 3 and 4 show a case where the upper contact piece 14 can be elastically displaced up and down in the order of operation. FIG. 4 shows an example in which the upper contact piece 14 is vertically displaced by a cam member 18. FIG. An example without using 18 is shown.

As described above, the upper and lower contact pieces 14, 15 are the first
It is placed in a state of being displaced forward by the restoring force of the spring portion 13 and forms a standby state. From this state, as shown in FIG. 3A,
The contact opening / closing member 6 is lowered to displace the contact 3 rearward to open the IC housing 2.

That is, the first spring portion 13 is bent rearward against its elasticity, whereby the upper and lower contact pieces 14 and 15 supported by the first spring portion 13 are synchronously displaced rearward, and And the IC package 4 is accommodated in the IC accommodating section 2 through the central opening 7.

At the time of this accommodation, as described above, the IC support 19
The lower surface of the IC package 4 is supported on the upper surface, or the terminal 5 is placed on a terminal support 21 provided on the lower contact piece 15 as shown in the figure. Positioning ridges 20 are provided on two or four opposite sides of the IC support base 19, and the side faces of the IC package 4 are regulated by the positioning ridges 20. The terminal 5 protruding from the side surface of the IC package 4 goes over the positioning ridge 20 and protrudes outward from the terminal tip.

Next, as shown in FIG. 3B, when the pressing force applied to the contact opening / closing member 6 is released, the contact 3
Is elastically displaced forward while pushing up the opening / closing member 6 by the restoring force of the first spring portion 13.

The upper contact piece 1 is formed by the elastic displacement to the front.
When the distal end of the terminal 5 abuts between the distal end of the lower contact piece 4 and the distal end of the lower contact piece 15 and the contact 3 is subsequently elastically displaced forward, the upper contact piece 14 is forcibly elastically displaced upward by the terminal 5 so that the upper and lower contact pieces 14, 15 and the upper and lower contact pieces 1
The terminal 5 is interposed between the terminals 4 and 15 to form a pressing and holding state by the downward restoring force of the upper contact piece.

At this time, as shown in FIG.
The contacts 4 and 15 press and hold the upper and lower surfaces of the terminal 5 between the contact portions 16 and 17, and the contact portions 16 and 17 slide from the terminal tip to the base to exert a wiping action.

In FIG. 3A, when the terminal 5 of the IC package 4 is placed on the terminal support 21 provided at the tip of the lower contact piece 15, a gap 22 is formed between the upper surface of the IC support 19 and the IC package 4. Then, the IC package 4 is floated and supported with respect to the nineteenth IC support.

Then, as shown in FIG.
When the terminal 5 is clamped between the terminals 4 and 15, the upper and lower contact pieces 1
When the upper and lower contact pieces 14 and 15 fold the terminals 5, the upper contact pieces 14 press the terminals 5 downward to lower the IC package 4 and lower the support base 19 and 4. On the upper surface. This further promotes the wiping action.

When the opening / closing member 6 is lowered from the state shown in FIG. 3B, the contact 3 is displaced rearward, whereby the upper and lower contact pieces 14 and 15 are displaced rearward while sliding on the upper and lower surfaces of the terminal 5, and the upper and lower surfaces of the terminal 5 again. Wiping. Contact 3
The contact with the IC terminal 5 is released by the rearward displacement of the IC package, and the IC package 4 can be extracted by opening the IC housing 2.

In the embodiment shown in FIG.
Has a contact piece structure capable of elastic displacement vertically, the lower contact piece 15 has a rigid contact piece structure, and only the upper contact piece 14 is elastically displaced vertically to clamp and release the terminal 5. .

Next, an example in which the upper contact piece 14 in FIG. 3 is elastically displaced up and down using the cam member 18 will be described with reference to FIG.

As described above, the upper and lower contact pieces 14, 15 are placed in a state of being displaced forward by the restoring force of the first spring portion 13, and the upper and lower contact pieces 14, 15 are placed in a state of being closed to store elasticity. A standby state is formed.

From this standby state, as shown in FIG. 4A, the contact opening / closing member 6 is moved down to displace the contact 3 rearward to open the IC housing 2.

That is, the first spring portion 13 is flexed rearward against its elasticity, whereby the upper and lower contact pieces 14 and 15 supported by the first spring portion 13 are synchronously displaced rearward, and To release.

As described above, the upper contact piece 14 and the lower contact piece 15
A cam member 18 is provided between the contact portions 16 and 17 between them. The cam member 18 is provided integrally with the socket body 1 so as to extend along the same row for each row of the contacts 3,
It is interposed between the upper and lower contact pieces 14 and 15 as described above.

For example, as shown in FIG. 2A ', the IC support base 19 has a contact piece regulating groove 2 for receiving the upper and lower contacts 14 and 15 at a position facing the upper and lower contacts 14 and 15 of each contact 3.
A cam member 18 having an upper and lower portion 8 is provided to receive the upper and lower contact pieces 14 and 15 in the contact piece regulating groove 28, and the following cam surface 27 is formed on the inner bottom surface of the groove to open and close the upper and lower contact pieces 14 and 15. Do it.

The upper surface of the cam member 18 is provided with an inclined cam surface 27 which is inclined upward toward the rear, that is, inclined downward toward the front.
When displacing rearward with 15, the contact portion 16 of the upper contact piece 14 is guided by the inclined cam surface 27, and the upper contact piece 14 is elastically displaced upward and the space between the contact pieces 14 and 15 is opened.

The upper and lower contact pieces 14 and 15 are placed in a closed state at a position deviated from the front end of the cam member 18. From this closed state, the contact portion 16 rides on the inclined cam surface 27 by the rearward displacement of the contact 3. An open state is formed.

Next, as shown in FIG. 4A, the IC package 4 is housed in the IC housing 2 through the central opening 7.

As described above, the IC
A support base 19 is provided, and the lower surface of the IC package 4 is supported on the upper surface of the IC support base 19, or the terminal 5 is placed on a terminal support 21 provided on the lower contact piece 15 as shown in the figure. . Positioning ridges 20 are provided on two or four sides of the IC support base 19 facing each other.
0 regulates the side surface of the IC package 4. The terminal 5 protruding from the side surface of the IC package 4 goes over the positioning ridge 20 and protrudes outward from the terminal tip.

Next, as shown in FIG. 4B, when the pressing force applied to the contact opening / closing member 6 is released, the contact 3
Are the upper and lower contact pieces 14, 15 due to the restoring force of the first spring portion 13.
, And is elastically displaced forward while pushing up the opening / closing member 6.

The upper contact piece 1 is formed by the forward elastic displacement.
4 is slid forward on the inclined cam surface 27 of the cam member 18, the upper contact piece 14 is elastically displaced downward by the restoring force, and the terminal 5 is displaced from the tip of the cam member 18. The upper and lower surfaces of the front end are sandwiched between the contact portions 16 and 17 of the upper and lower contact pieces 14 and 15.

Subsequently, when the contact 3 is elastically displaced forward, as shown in FIG. 1D ′, the upper and lower contact pieces 14 and 15 hold the upper and lower surfaces of the terminal 5 between the contact portions 16 and 17 while pressing them.
The contact portions 16 and 17 slide from the terminal tip to the base, and exert a wiping action.

In FIG. 4A, when the terminal 5 of the IC package 4 is placed on the terminal support 21 provided at the tip of the lower contact piece 15, a gap 22 is formed between the upper surface of the IC support 19 and the IC package 4. The IC package 4 is floated and supported on the IC support 19.

Then, as shown in FIG.
When the terminal 5 is clamped between the terminals 4 and 15, the upper and lower contact pieces 1
The upper and lower contacts 14 and 15 hold the terminal 5 by the upper and lower contacts 14 and 15 by rotating the terminals 4 and 15 obliquely downward.
Presses the terminal 5 downward to lower the IC package 4 to be supported on the upper surface of the support base 19. This further promotes the wiping action.

When the opening / closing member 6 is lowered from the state shown in FIG. 4B, the contact 3 is displaced rearward, whereby the upper and lower contact pieces 14, 15 are displaced rearward while sliding on the upper and lower surfaces of the terminal 5, and again the upper and lower surfaces of the terminal 5 Wiping. Contact 3
The contact with the IC terminal 5 is released by the rearward displacement of the IC package, and the IC package 4 can be extracted by opening the IC housing 2.

Next, another embodiment of the present invention will be described with reference to FIGS.
This will be described in more detail with reference to FIG. 5 and 6 show a case in which the lower contact piece 15 is elastically displaceable up and down in the order of operation. FIG. 6 shows an example in which the upper contact piece 14 is vertically displaced by a cam member 18, and FIG. An example without using 18 is shown.

As described above, the upper and lower contact pieces 14 and 15 are
It is placed in a state of being displaced forward by the restoring force of the spring portion 13 and forms a standby state. From this state, as shown in FIG. 5A,
The contact opening / closing member 6 is lowered to displace the contact 3 rearward to open the IC housing 2.

That is, the first spring portion 13 is flexed rearward against its elasticity, whereby the upper and lower contact pieces 14, 15 supported by the first spring portion 13 are synchronously displaced rearward, and And the IC package 4 is accommodated in the IC accommodating section 2 through the central opening 7.

At the time of this accommodation, as described above, the IC support 19
The lower surface of the IC package 4 is supported on the upper surface, or the terminal 5 is placed on a terminal support 21 provided on the lower contact piece 15 as shown in the figure. Positioning ridges 20 are provided on two or four opposite sides of the IC support base 19, and the side faces of the IC package 4 are regulated by the positioning ridges 20. The terminal 5 protruding from the side surface of the IC package 4 goes over the positioning ridge 20 and protrudes outward from the terminal tip.

Next, as shown in FIG. 5B, when the pressing force applied to the contact opening / closing member 6 is released, the contact 3
Is elastically displaced forward while pushing up the opening / closing member 6 by the restoring force of the first spring portion 13.

The upper contact piece 1 is formed by the elastic displacement to the front.
When the distal end of the terminal 5 abuts between the distal end of the lower contact piece 4 and the distal end of the lower contact piece 15 and the contact 3 is subsequently elastically displaced forward, the lower contact piece 15 is forcibly elastically displaced downward by the terminal 5 and the upper and lower contact pieces 14, 15 and the upper and lower contact pieces 1
The terminal 5 is interposed between the terminals 4 and 15 to form a press-clamp state by the upward restoring force of the lower contact piece 15.

At this time, as shown in FIG.
The contacts 4 and 15 press and hold the upper and lower surfaces of the terminal 5 between the contact portions 16 and 17, and the contact portions 16 and 17 slide from the terminal tip to the base to exert a wiping action.

In FIG. 5A, when the terminal 5 of the IC package 4 is placed on the terminal support 21 provided at the tip of the lower contact piece 15, a gap 22 is formed between the upper surface of the IC support 19 and the IC package 4. The IC package 4 is floated and supported on the IC support 19.

Then, as shown in FIG.
When the terminal 5 is clamped between the terminals 4 and 15, the upper and lower contact pieces 1
The upper and lower contact pieces 14 and 15 hold the terminals 5 while the upper and lower contact pieces 14 and 15 are rotated in the obliquely downward forward direction.
4 presses the terminal 5 downward to lower the IC package 4 and support it on the upper surface of the support base 19. This further promotes the wiping action.

When the opening / closing member 6 is moved downward from the state shown in FIG. 5B, the contact 3 is displaced rearward, whereby the upper and lower contact pieces 14, 15 are displaced rearward while sliding on the upper and lower surfaces of the terminal 5, and again the upper and lower surfaces of the terminal 5 Wiping. Contact 3
The contact with the IC terminal 5 is released by the rearward displacement of the IC package, and the IC package 4 can be extracted by opening the IC housing 2.

In the embodiment of FIG. 5, the lower contact 15
Has a contact piece structure capable of being elastically displaced up and down, the upper contact piece 14 has a contact piece structure having rigidity, and only the lower contact piece 15 is elastically displaced up and down to clamp and release the terminal 5 under pressure. .

Next, an example in which the lower contact piece 15 in FIG. 5 is elastically displaced up and down using the cam member 18 will be described with reference to FIG.

As described above, the upper and lower contact pieces 14 and 15 are placed in a state of being displaced forward by the restoring force of the first spring portion 13 and the upper and lower contact pieces 14 and 15 are placed in a state where they are closed to store elasticity. A standby state is formed.

From this standby state, as shown in FIG. 6A, the contact opening / closing member 6 is moved down to displace the contact 3 rearward to open the IC housing portion 2.

That is, the first spring portion 13 is bent rearward against its elasticity, whereby the upper and lower contact pieces 14, 15 supported by the first spring portion 13 are synchronously displaced rearward, and To release.

As described above, the upper contact piece 14 and the lower contact piece 15
A cam member 18 is provided between the contact portions 16 and 17 between them. The cam member 18 is provided integrally with the socket body 1 so as to extend along each row of the contacts 3,
It is interposed between the upper and lower contact pieces 14 and 15 as described above.

For example, as shown in FIG. 2A ′, the IC support base 19 has a contact piece regulating groove 2 for receiving the upper and lower contacts 14, 15 at a position facing the upper and lower contacts 14, 15 of each contact 3.
A cam member 18 having an upper and lower portion 8 is provided to receive the upper and lower contact pieces 14 and 15 in the contact piece regulating groove 28, and the following cam surface 27 is formed on the inner bottom surface of the groove to open and close the upper and lower contact pieces 14 and 15. Do it.

The lower surface of the cam member 18 is provided with an inclined cam surface 27 which is inclined downward toward the rear, that is, inclined upward toward the front.
When the contact portion 17 of the lower contact piece 15 is displaced rearward with the contact 15, the contact portion 17 of the lower contact piece 15 is guided by the inclined cam surface 27 and elastically displaces downward to be in an open state.

The upper and lower contact pieces 14 and 15 are placed in a closed state at a position deviated from the front end of the cam member 18. From this closed state, the contact portion 17 rides on the inclined cam surface 27 by the rearward displacement of the contact 3. An open state is formed.

Next, as shown in FIG. 6B, the IC package 4 is housed in the IC housing 2 through the center opening 7.

As described above, the IC
A support base 19 is provided, and the lower surface of the IC package 4 is supported on the upper surface of the IC support base 19, or the terminal 5 is placed on a terminal support 21 provided on the lower contact piece 15 as shown in the figure. . Positioning ridges 20 are provided on two or four sides of the IC support base 19 facing each other.
0 regulates the side surface of the IC package 4. The terminal 5 protruding from the side surface of the IC package 4 goes over the positioning ridge 20 and protrudes outward from the terminal tip.

Next, as shown in FIG. 6B, when the pressing force applied to the contact opening / closing member 6 is released, the contact 3
Are the upper and lower contact pieces 14, 15 due to the restoring force of the first spring portion 13.
, And is elastically displaced forward while pushing up the opening / closing member 6.

The lower contact piece 1 is formed by the elastic displacement to the front.
5 is slid forward on the inclined cam surface 27 of the cam member 18, the lower contact piece 15 is elastically displaced upward by its restoring force, and the terminal 5 is displaced from the tip of the cam member 18. The upper and lower surfaces of the front end are sandwiched between the contact portions 16 and 17 of the upper and lower contact pieces 14 and 15.

Subsequently, when the contact 3 is elastically displaced forward, as shown in FIG. 1D ', the upper and lower contact pieces 14 and 15 hold the upper and lower surfaces of the terminal 5 between the contact portions 16 and 17 while pressing.
The contact portions 16 and 17 slide from the terminal tip to the base, and exert a wiping action.

In FIG. 6A, when the terminal 5 of the IC package 4 is placed on the terminal support 21 provided at the tip of the lower contact piece 15, a gap 22 is formed between the upper surface of the IC support 19 and the IC package 4. The IC package 4 is floated and supported on the IC support 19.

Then, as shown in FIG.
When the terminal 5 is clamped between the terminals 4 and 15, the upper and lower contact pieces 1
The upper and lower contacts 14 and 15 hold the terminal 5 by the upper and lower contacts 14 and 15 by rotating the terminals 4 and 15 obliquely downward.
Presses the terminal 5 downward to lower the IC package 4 to be supported on the upper surface of the support base 19. This further promotes the wiping action.

When the opening / closing member 6 is lowered from the state shown in FIG. 6B, the contact 3 is displaced rearward, whereby the upper and lower contact pieces 14 and 15 are displaced rearward while sliding on the upper and lower surfaces of the terminal 5, and again the upper and lower surfaces of the terminal 5 are moved. Wiping. Contact 3
The contact with the IC terminal 5 is released by the rearward displacement of the IC package, and the IC package 4 can be extracted by opening the IC housing 2.

[0120]

According to the present invention, the upper and lower surfaces of the IC terminal can be properly held in two-point contact by synchronously displacing the upper and lower contact pieces back and forth by one common spring portion. As a result, the line length by the spring portion is made as uniform as possible, improving the reliability of two-point contact, contributing to downsizing of the contact and socket, and further ensuring the wiping action on the upper and lower surfaces or one surface of the terminal. An easy structure can be realized. That is, when one or both of the upper contact piece and the lower contact piece are displaced forward by the common first spring portion, they slide on both or one of the upper and lower surfaces of the terminal to exert a wiping action.

Further, by providing a terminal supporting portion projecting from the tip of the upper contact piece and supporting the lower surface of the terminal at the tip of the lower contact piece, the corresponding state of each terminal and the upper and lower contact pieces when the IC package is mounted. Can be formed appropriately.

Further, the upper and lower contact pieces are reliably opened and closed by the cam member, and the above-mentioned two-point contact state can be secured.

[Brief description of the drawings]

1A to 1D are side views of a first embodiment of the present invention, that is, a half-cut side view of an IC socket for opening and closing an upper and lower contact piece without using a cam member. I have.
D 'is an enlarged side view for explaining the wiping operation of the upper and lower contact pieces with respect to the IC terminal.

FIGS. 2A to 2E are side views showing a second embodiment of the present invention, that is, a half-cut side view of an IC socket for opening and closing an upper and lower contact piece using a cam member, and showing the operation order. . A '
Is an enlarged perspective view of the cam member, and B 'is an enlarged side view for explaining the opening and closing operation of the upper and lower contact pieces by the cam member.

FIGS. 3A and 3B are side views showing a third embodiment of the present invention, that is, an IC socket that opens and closes an upper contact piece without using a cam member, and shows an operation sequence. I have.

FIGS. 4A and 4B are side views showing a fourth embodiment of the present invention, that is, a half-cut side view of an IC socket for opening and closing an upper contact piece by using a cam member, and showing the operation order. .

FIGS. 5A and 5B are side views of a fifth embodiment of the present invention, that is, a half-cut side view of an IC socket for opening and closing a lower contact piece without using a cam member. I have.

FIGS. 6A and 6B are side views of a sixth embodiment of the present invention, that is, a half-cut side view of an IC socket that opens and closes a lower contact piece by using a cam member, and shows the operation order. .

FIG. 7 is a side view showing another example of the contact displacing means by cutting a socket in half.

FIG. 8 is a plan view of an IC socket.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Socket main body 2 IC accommodating part 3 Contact 4 IC package 5 Terminal 6 Opening / closing member 7 Central opening 8, 8 'Vertical guide part 9 Cam part 10 Opening / closing lever 11 Shaft 12 Pressure receiving part 13 1st spring part 14 Upper contact piece 15 Lower contact Piece 16, 17 contact portion 18 cam member 19 support base 20 ridge 21 terminal support portion 23 base 24 press-in claw 25 male terminal 26 press-in hole 27 inclined cam surface 28 regulating groove

Claims (5)

(57) [Claims] 1. A front displacement for accommodating an IC package in an IC package accommodating portion provided in a socket main body, the contact being arranged in a row along the IC package accommodating portion, and bringing the contact into contact with a terminal of the IC package. In the IC socket which is elastically displaced between a position and a rearward displacement position where the contact is released, the contact is an upper contact piece supported by a common first spring portion for causing the forward displacement and the rearward displacement. And a lower contact piece. At least one of the upper contact piece and the lower contact piece can be elastically displaced up and down by a second spring portion, and the upper contact piece and the lower contact piece are connected via the common first spring portion. A contact structure that presses and clamps the terminal between the upper contact piece and the lower contact piece at the time of the forward displacement, and further displaces the upper contact piece at the time of the rearward displacement of the contact and at the same time, lowers the lower contact piece. Is square displacement, and an IC socket, characterized in that it comprises a cam member allowed to upwardly displace the lower contact piece causes downward displacement of the upper contact piece upon forward displacement of the contact. 2. An IC package accommodating portion provided in a socket body, an IC package accommodating portion, a contact arranged in a row along the IC package accommodating portion, and a forward displacement for contacting the contact with a terminal of the IC package. In the IC socket which is elastically displaced between a position and a rearward displacement position where the contact is released, the contact is an upper contact piece supported by a common first spring portion for causing the forward displacement and the rearward displacement. And a lower contact piece. At least one of the upper contact piece and the lower contact piece can be elastically displaced up and down by a second spring portion, and the upper contact piece and the lower contact piece are connected via the common first spring portion. A contact structure that presses and clamps the terminal between the upper contact piece and the lower contact piece at the time of the forward displacement, and further displaces the upper contact piece upward at the time of the rear displacement of the contact; IC socket, characterized in that it comprises a cam member allowed to downward displacement of the upper contact piece during forward displacement. 3. An IC package accommodating portion provided in a socket body, the IC package accommodating portion provided with contacts arranged in a row along the IC package accommodating portion, and the contacts being brought into contact with terminals of the IC package. In the IC socket which is elastically displaced between a position and a rearward displacement position where the contact is released, the contact is an upper contact piece supported by a common first spring portion for causing the forward displacement and the rearward displacement. And a lower contact piece. At least one of the upper contact piece and the lower contact piece can be elastically displaced up and down by a second spring portion, and the upper contact piece and the lower contact piece are connected via the common first spring portion. A contact structure for pressing and holding the terminal between the upper contact piece and the lower contact piece at the time of the forward displacement, and further displacing the lower contact piece downward at the time of the rear displacement of the contact; IC socket, characterized in that it comprises a cam member allowed to upwardly displace the lower contact piece when the forward displacement. 4. An IC according to claim 1, further comprising a terminal supporting portion projecting from a tip of said upper contact piece and supporting a lower surface of said terminal at a tip of said lower contact piece.
socket. 5. The IC socket according to claim 1, wherein the upper contact piece and the lower contact piece wipe the upper and lower surfaces of the terminal during the forward displacement.