JP3743016B2 - IC carrier - Google Patents

Description

[0001]
[Industrial application fields]
The present invention relates to an IC carrier that removably accommodates an IC component in order to facilitate handling of the IC component mainly in a production process.
[0002]
[Prior art]
Usually, when IC components are accommodated one by one in an IC carrier and transported or when a temperature test is performed, a plurality of IC carriers are accommodated in a large tray. When individually inspecting IC components with an IC socket or the like, the IC components are taken out from the IC carrier and loaded into the IC socket. After the inspection is completed, the IC components are again accommodated in the IC carrier. The IC carrier may be taken out of the tray and loaded into the IC socket as it is, and may be accommodated in the tray again after the inspection is completed. Moreover, recently, a series of operations are automatically performed by a machine. The present invention relates to an IC carrier that is effective for automatic accommodation / removal operation of IC components, mainly suitable for the former case.
[0003]
When a plurality of IC carriers are accommodated in the tray for the purpose of use as described above, several specifications are required for the configuration of the IC carrier in order to facilitate handling of the IC components. In other words, since the IC carriers are accommodated side by side in the tray, it is necessary to allow the IC components to be taken out and accommodated by a machine or the like only by a simple vertical operation. IC parts are first housed in an IC carrier at a high speed by a mechanical device or the like, but the IC parts may jump out of the IC carrier due to vibrations at that time, vibrations during transportation, etc. Don't change. Therefore, when an IC component is accommodated in an IC carrier, a mechanism for reliably latching the IC component so as not to move in the IC carrier is required.
[0004]
Furthermore, in order to accommodate as many IC carriers as possible in one tray, it is necessary to make the planar outer dimensions of the IC carriers as small as possible. Furthermore, the IC carrier is not used for only one IC component, but is used repeatedly many times, and may be used for various environmental tests in a state where the IC component is accommodated. For this reason, the operating part may cause fatigue or deterioration, leading to a decrease in function or damage, but it is necessary to have durability enough to prevent such an occurrence.
[0005]
[Problems to be solved by the invention]
Whether or not the required specifications as described above can be met depends on the configuration of the latch mechanism. For this reason, various devices related to the latch mechanism have been devised so far, but even if functionally supported, the entire latch mechanism cannot be made compact in the end, and a satisfactory IC carrier can be realized even now. It has not been.
[0006]
The present invention has been made in order to solve such problems. The object of the present invention is to facilitate the operation of storing and taking out IC components from above, and to place the IC components in an appropriate receiving position. It is an object of the present invention to provide an IC carrier having a space-saving latch mechanism that can be reliably maintained and has a high durability.
[0007]
[Means and Actions for Solving the Problems]
In order to achieve the above object, an IC carrier of the present invention has a carrier main body in which a locking member having a claw portion is provided on at least one side edge of an IC component housing portion, and an operation portion on an upper surface. An operation member adjacent to the locking member and provided with an upward operating behavior and arranged to be movable up and down on the carrier body, and a force that is rotatably attached to the operation member and comes into contact with at least the claw portion from above. A latch member having an engagement portion to be applied and an extension portion of the engagement portion as a pressing portion from above the IC component, and the rotation shaft of the latch member is located below the operation member The latch member is retracted to a position substantially below the operation member when the operation member is pushed down .
[0008]
In the IC carrier of the present invention, preferably, the latch member is formed with a groove portion parallel to the rotation axis thereof, and the engaging portion is configured to contact both side surfaces of the groove with the claw portion of the locking member from above and below. In addition, an extension portion of the engaging portion contacting from above is used as the pressing portion of the IC component .
In the IC carrier of the present invention, preferably, the locking member has flexibility, and is integrally formed with the carrier body and a synthetic resin.
[0009]
In the IC carrier of the present invention, it is preferable that a holding chamber for the latch member is formed at a position below the operation member, the rotation shaft is provided in the holding chamber, and the latch member is the operation member. When is pushed down, it is accommodated in the holding chamber.
In a further, IC carrier of the present invention, preferably, the lower position of the operation member to be provided an engagement portion engaged from below the claw portion to the claw portion of the locking member.
[0010]
【Example】
An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view of an IC carrier in the present embodiment, and FIG. 2 is a cross-sectional view taken along line AA in FIG. 3 and 4 are cross-sectional views taken along the line BB in FIG. 1. FIG. 3 shows a state in which the latch member does not lock the IC component in the IC carrier accommodating portion, and FIG. 4 shows a latch in the IC carrier accommodating portion. The member has shown the state which has locked IC components. FIG. 5 is an exploded perspective view of the main part of the present embodiment.
[0011]
The carrier body of the present embodiment is made of synthetic resin, and is configured by integrating the base body 1 and the frame body 2. The base 1 is integrally formed with a locking portion 1a having flexibility upward at substantially both end positions in the longitudinal direction, and a claw portion 1b is formed at the tip thereof. The inner surfaces of the four walls 2a of the frame body 2 are inclined guide surfaces, and these wall surfaces and the upper surface of the base body 1 accommodate IC components (shown by alternate long and short dash lines in FIGS. 3 and 4). Part. Two walls 2a facing each other in the longitudinal direction are respectively formed with vertical holes 2b. These holes 2b are partly cut away from the wall 2a and connected to the IC component housing part, and the locking part 1a is arranged at the part where the part is cut out.
[0012]
An operation member 3 is disposed in the hole 2b so as to be movable up and down, and an operating habit is imparted upward by two springs 4. As is apparent from FIG. 5, two engaging portions 3 a are formed on the operation member 3. These engaging portions 3a are for engaging the claw portion 1b of the locking portion 1a to regulate the upper limit position of the operation member 3. The upper surface of the operation member 3 is an operation portion 3b that is pushed downward by a machine or the like, and a holding chamber 3c is formed at a lower position thereof. A rotation prevention wall 3d is formed on a part of the rear surface of the holding chamber 3c.
[0013]
A shaft 5 is press-fitted into the operation member 3, and a latch member 6 is rotatably attached. A groove is formed in the latch member 6 in a direction parallel to the shaft 5, and the upper and lower surfaces of the groove form engaging portions 6a and 6b for the claw portion 1b of the locking portion 1a. Further, a pressing portion 6c for the IC component is formed in the extension portion of the engaging portion 6a.
[0014]
Next, a case where an IC component is taken out from the carrier in the embodiment having the above configuration will be described. FIG. 4 shows a state in which the IC component (dashed line) is accommodated and locked by the latch member 6. In this state, the operation member 3 is moved upward by the spring 4, and the latch member 6 has the engaging portion 6b engaged with the claw portion 1b of the locking portion 1a, and rotates to the IC component side on the shaft 5, respectively. Then, the pressing portion 6c pushes the IC component substantially downward, thereby positioning the IC component reliably.
[0015]
In order to take out the IC component from the state shown in FIG. 4, the operation unit 3b is pushed from above by a machine or the like, and the operation member 3 is moved downward. When the operating member 3 is pushed down, the shaft 5 moves downward, so that the engaging portion 6a of the latch member 6 engages with the claw portion 1b, and the latch member 6 rotates on the shaft 5 to separate the pressing portion 6c from the IC component. Go. Although most of the latch member 6 enters the holding chamber 3c by this rotation, the latch member 6 comes into contact with the anti-rotation wall 3d and stops when the state shown in FIG. At this time, the tip of the latch member 6 on which the pressing portion 6c is formed is completely retracted from the IC component housing portion, and the operation member 3 is positioned near the lower end of the hole 2b. In that case, it is needless to say that the latch member 6 can be completely inserted into the lower position of the operation member 3 if necessary.
[0016]
In the state shown in FIG. 3, in order to take out the IC component from the IC carrier housing, when the operating member 3 is pushed down by the machine, the suction part provided in the machine is pressed in advance to suck the IC component. Therefore, when the machine is moved upward from the state of FIG. 3, the IC component can be taken out from the IC carrier housing as it is.
[0017]
When the machine moves upward in this way, the operation member 3 is moved upward by the spring 4. As a result, the shaft 5 is raised, so that the latch member 6 rotates. In particular, after the engaging portion 6b is engaged with the claw portion 1b, the latch member 6 is forcibly rotated to reach the position shown in FIG. Depending on the shape of the groove between the engaging portions 6a and 6b and the shape of the claw portion 1b, the rotation of the latch member 6 can be stopped immediately after this state, but this is not the case if it is not so designed. Even so, when the engaging portion 3a engages with the claw portion 1b, the raising of the operating member 3 is stopped, and the series of IC component take-out operations is completed.
[0018]
In order to accommodate the IC component in the IC carrier, the operation described so far is repeated, and the description thereof is omitted. As can be understood from the above description, the latch member 6 is rotatably attached to the operation member 3 at a lower position thereof. When the IC component is accommodated or taken out, the latch member 6 accommodates the IC component. 1 is completely retracted, and many of the parts enter the lower position of the operation member 3, so that the latch mechanism can be made compact and the outer shape can be reduced in plan view as shown in FIG. When arranged in a tray, it is advantageous in terms of space. Further, since the latch member 6 is attached to the operation member 3 and both of them are unitized, the assembling work is facilitated, and it is advantageous to be used as a common unit part for IC carriers of various sizes. Yes.
[0019]
In the above description of the embodiment, the engaging portion 6b is formed in the latch member 6. However, in the present invention, this engaging portion 6b can be eliminated. That is, in such a case, it is only necessary to provide a separate spring to give the latch member 6 a turning behavior that allows the pressing portion 6c to face the accommodating portion. In that case, there is no problem because the upper limit position restriction of the operation member 3 is performed by the engagement of the engagement portion 3a of the operation member 3 and the claw portion 1b. 2 and 4, when the operation portion 3b of the operation member 3 is not protruded from the upper surface of the wall 2a, the IC carriers may be stacked or the trays containing the IC carriers may be stacked. The operating member 3 is not pushed carelessly.
[0020]
Further, in the above embodiment, the two springs 4 are used for one operation member 3, but one spring may be arranged directly under the center of the operation member 3, or the spring portion may be made of synthetic resin. May be formed integrally with the operation member 3. Furthermore, although the locking portion 1a is integrally formed with the base body 1, it may be manufactured as a separate member and assembled to the base body 1. If there is no problem in the assembly, the locking portion 1a is formed. There is no need to be flexible. Furthermore, in the above embodiment, two operation members 3 are provided on one IC carrier, but may be provided for each wall 2a, or only one may be provided depending on the shape of the IC component. Good.
[0021]
【The invention's effect】
As described above, the IC carrier according to the present invention can store and take out the IC component by a simple operation in the vertical direction, and the latch member is attached to the operation member, and the latch member is interlocked with the operation of storing and taking out the IC component. In this way, the latching structure of the IC component is robust and compact, and is extremely advantageous for downsizing the planar shape.
[Brief description of the drawings]
FIG. 1 is a plan view showing an IC carrier according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view taken along line AA in FIG.
3 is a cross-sectional view taken along line BB in FIG. 1, showing a state in which the latch member does not lock the IC component within the IC carrier accommodating portion.
FIG. 4 is a cross-sectional view taken along the line B-B, showing a state in which the latch member locks the IC component in the IC carrier accommodating portion.
FIG. 5 is an exploded perspective view showing an enlarged main part of the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Base 1a Locking part 1b Claw part 2 Frame 2a Wall 2b Hole 3 Operation member 3a, 6a, 6b Engagement part 3b Operation part 3c Holding chamber 3d Anti-rotation wall 4 Spring 5 Shaft 6 Latch member 6c Press part

Claims (5)

A carrier body provided with a locking member having a claw portion on at least one side edge of the accommodating portion of the IC component ;
And vertically movably arranged operating member to the carrier body is assigned a hydraulic habit to adjacent said locking member has an operating portion in the upper surface upwards,
Has an engaging portion which is a force for contacting from above at least the claw portion rotatably attached to the front SL operating member, and a pressing portion of the extension portion of the engaging portion from the upper side of the IC component A latch member ,
The rotation axis of the latch member is at a position below the operation member,
The IC carrier according to claim 1, wherein the latch member is retracted to a position substantially below the operation member when the operation member is pushed down .   The latch member is formed with a groove portion in parallel with the rotation axis, and both side surfaces of the groove are engaging portions that contact the claw portion of the locking member from above and below, and an extension portion of the engaging portion that contacts from above. The IC carrier according to claim 1, wherein the IC carrier is a pressing portion of the IC component.   3. The IC carrier according to claim 1, wherein the locking member has flexibility and is integrally formed with the carrier main body with a synthetic resin. A holding chamber for the latch member is formed at a position below the operation member, the rotating shaft is provided in the holding chamber, and the latch member is substantially accommodated in the holding chamber when the operation member is pushed down. IC carrier according to any one of claims 1 to 3, characterized in that it has to be. IC according to any one of claims 1 to 4, characterized in that a engagement portion for engaging from below the claw portion to the claw portion of the locking member is in the lower position of the operating member Career.

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