JPH0723960Y2 - IC carrier - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a structure of an IC carrier to be used for storing an IC package or protecting its lead terminals.

[Problems to be solved by conventional techniques and devices]

Generally, an IC carrier carries and protects an IC package during handling, for example, but it is set in an IC socket or the like while being carried so that the IC package and the IC socket can be electrically connected. Things are known. Such an IC carrier must be carried with the required parts exposed to the IC carrier in order to electrically connect the lead terminals of the IC package and the contact pins of the IC socket, and its locking structure is There is a constraint that it has to be done by a part such as the edge of the IC package. From this point of view, various locking means have been proposed. For example, Japanese Utility Model Laid-Open No. 60-8165.
In the so-called rotary type lever as the locking means as shown in No. 4, a lock lever for fixing the IC package housed in one end of the carrier body is pivotally attached. Since it opens and closes in the vertical direction, there is a problem in that it is bulky in use. On the other hand, in the case of the carrier whose locking means is a slide type, which is disclosed in Japanese Utility Model Laid-Open No. 61-158956, as shown in FIG. The semiconductor 24 is carried by the claw portion 23a of the slide member 23 which is attached so as to be possible. However, in such an IC carrier, since the slide member 23 slides in parallel with two opposite sides of the four sides of the IC package, the number of lead terminals of the IC package is increased, and each side is arranged in a row. If there is no dimensional allowance between the terminals on both ends of the lead terminal and the sides of the package, the claws 23 of the slide member 23
There was a danger that the IC package would fall off due to impact or the like because the carrying part is unstable because the engaging part for locking a becomes small.

In view of such circumstances, an object of the present invention is to provide an IC carrier of this type which can carry an IC package or a semiconductor safely and surely and is compact as a whole.

[Means and Actions for Solving the Problems]

The IC carrier of the present invention comprises a carrier body having a recess for arranging the IC package and a plurality of slits arranged along the periphery of the recess so that the lead terminals of the IC package can be inserted, and one end. Is pivotally supported by the carrier body and swings so that the other end enters / retracts from the corner of the recess, and when the other end is located, the corner of the IC package housed in the recess is Locking means formed with a pawl portion for locking the portion, an engaging portion located between the one end that is pivotally supported and the pawl portion, and the locking means is in the advanced position and retracted. The slider is slidably mounted on the carrier body to guide it to a position and has a guide portion that is in sliding contact with the engaging portion of the locking means.

Therefore, when the slider is slid toward the concave portion accommodating the IC package, the lock means is rocked by the engagement between the guide portion of the slider and the engaging portion of the lock means, and is guided to the above-mentioned intruded position. The claw moves toward the corner of the IC package without the lead terminals and engages with a large stroke dimension from the corner toward the center of the package to securely lock the package and stably fix it in the recess can do.

Further, when the slider is slid in the direction opposite to the concave portion, the lock means swings in the direction opposite to the swing due to the engagement of the guide portion of the slider and the engaging portion of the lock means and retracts. Guided to the position, this releases the engagement of the pawl with the corner of the package.

〔Example〕

Hereinafter, a first embodiment of an IC carrier according to the present invention will be described with reference to FIGS. 1 to 4. In the figure, 1 is the carrier body,
Reference numeral 2 is a recess formed in the center of the carrier body 1 for disposing the IC package P. Although not shown in detail, 3 is a partition (not shown) provided along the periphery of the recess 2 so that the lead terminals L of the IC package P housed in the recess 2 can be inserted. A group of slits defined between the walls, 4 is a vent hole penetratingly formed on the lower side of the recess 2, and 5 has one end pivotally supported by a support shaft 6 planted in the carrier body 1. It swings so that the end side moves in and out of the recess 2 (in the direction of arrow B) and engages with the upper corner of the IC package P housed in the recess 2 (see FIG. 3).
Locking means 7 formed with claws 5a capable of locking the corners are slidably fitted with guide grooves 8 formed on opposite sides of the carrier body 1, and hooks 7a are provided with the grooves. The slider is adapted to be fitted to the carrier body 1 by engaging with the locking portion 8a of 8, and 9 is an engaging portion which stands upright toward the slider 7 at an appropriate intermediate position between both ends of the locking means 5. , 10 is a long hole as a guide portion formed in the slider 7 so that the pin 9 can be loosely fitted, and 11 is an ejector pin 12 (see FIG. 3) on the side of an assembly device such as an automatic machine. It is a guide projection that can move the slider 7 in the direction away from the recess 2 (dotted arrow C ') by penetrating the guide hole 13 formed in the above and contacting the inclined surface 11a (dotted arrow C).

Since the IC carrier according to the present invention is constructed as described above, when the IC package P is loaded in the recess 2, when the slider 7 is moved in the direction away from the recess 2 (hereinafter referred to as "retraction"), the lock means 5 is pinned. Since the claw portion 5a swings so as to retract from the concave portion 2 through the pin connection of the slot 9 and the elongated hole 10, the concave portion 2 is opened. In this state, the IC package P is set in the recess 2 and then the slider 7
When the locking means 5 is moved toward the concave portion 2 (hereinafter referred to as forward movement), the locking means 5 swings in the opposite direction to the above, so that the claw portion 5a.
All at once engage with the upper corners of the IC package P housed in the recess 2 to lock the package. In this case, since each component such as the locking means 5 is made of synthetic resin, the flexibility of the locking means 5 allows the locking means 5 to be pressed with an appropriate elastic force if the engaging surface is tapered. The result is that the IC package P is recessed 2
It is securely held without rattling inside. The basic operation of the IC carrier of the present invention is performed as described above, but a plurality of IC sockets and the like to be connected to the IC package P in actual use are arranged in a row on a certain substrate, and the IC package P is carried by the IC carrier. It is placed on each IC socket as it is and electrically connected. In this way, the performance test of the IC package P is performed. After that, for example, when only the IC package P is removed from the IC socket, the ejector pin 12 mounted on the automatic machine is inserted into the guide hole 13 of the carrier body 1. Then, as shown in FIG. 3, when the slider 7 is retracted by bringing it into contact with the inclined surface 11a of the guide protrusion 11, the claw portion 5a of the locking means 5 is retracted from the recess 2 so that the IC package P is removed. You can take it out freely.

In the basic and general operation of the IC carrier of the present invention as described above, the claw portions 5a of the lock means 5 engage with each other at each corner of the IC package P in the direction of the diagonal line (center) thereof, and the lead terminal is provided at this corner. Since the claw portion 5a and the IC package P are not hindered because they are not provided, a sufficient engagement state can be obtained, and the lead terminal L can be securely locked and the lead terminal L can be damaged due to a collision or the like. It is extremely safe with no danger.
This is particularly effective for this type of IC package P that has been densified because the lead terminals are not disposed in the corners of a fixed size even if the lead terminals L of the IC package P are densified. is there. In this way, the claw portion 5a is connected to the IC package P
Since it was moved parallel to the upper surface of the
It is possible to realize a compact structure in which the lever as the lock means described in the conventional example is not bulky in the vertical direction as compared with the lever of the vertical rotation type. Next, since the pin 9 provided on the locking means 5 is disposed at a position closer to at least one end pivotally supported by the support shaft 6 than the claw portion 5a, the forward and backward movement of the slider 7 pin-coupled to the pin 9 is prevented. The claw portion 5a is enlarged as a stroke. Therefore, even if the slider 7 is slightly moved back and forth with respect to the recessed portion 2, the claw portion 5a will not move to the IC package P.
Since the stroke for moving in and out of the concave portion 2 to carry the IC is sufficient, the IC carrier can be made compact in the width direction also in this respect. Since the height and width are compact as a whole, the size can be extremely reduced as a whole. Since the stroke of the slider 7 is small, the inclination angle θ (see FIG. 3) of the inclined surface 11a of the guide projection 11 that abuts the ejector pin 12 can be set to a large value. The backward movement of the slider 7 can be easily performed.

FIG. 4 shows a modification of the locking means 5, in which the locking means 5 is integrally formed with the carrier body and one end 5b is hinged. In this way, the hinge connection does not cause breakage or the like due to the flexibility of the synthetic resin, does not cause any practical problems, and can further reduce the number of parts and simplify the structure.

5 and 6 show a second embodiment. In this example, the projection 14 formed integrally with the bottom wall 1a in the recess 2 of the carrier body 1 is formed.
The support arm portion 14a having the above is provided in a cantilever manner, and the lower surface of the tip end portion of the claw portion 5a is formed with a tapered taper 5a ₁ . The IC package P set in the recess 2 has the protrusion 14
Of the height of the bottom wall 1a, but the claw portion 5a is easily engaged with the upper corner portion of the IC package P by the taper 5a ₁ and the bent arm portion 14a ( (Fig. 6)
Due to the elasticity, the IC package P held and fixed between the claw portion 5a and the support protrusion 14 and held by the carrier body is reliably prevented from falling off.

Incidentally, the pin 9 as the engaging portion and the elongated hole 10 as the guiding portion in the above embodiment have the opposite relationship to the above, that is, the slider 7
It is also possible to provide a pin as a guide portion on the side and an elongated hole as an engaging portion on the side of the locking means 5. Further, as guide portions, projections that engage with both sides of the arm portion of the lock means 5 are integrally formed in the slider 7, and the surfaces of both sides of the arm portion of the lock means 5 serve as engaging portions to move the lock means 5 with the projections. May be regulated.

[Effect of device]

As mentioned above, the IC carrier according to the present invention is stable and reliable.
The IC package can be loaded and removed by a simple operation of sliding the slider so that it can be carried and the size can be reduced. It is suitable for automation as well as improving workability. Have the advantages of.

[Brief description of drawings]

FIG. 1 is a perspective view of an IC carrier according to a first embodiment of the present invention, FIG. 2 is a partially enlarged exploded perspective view of the IC carrier as seen from the direction A of FIG. 1, and FIG. FIG. 4 is a partial perspective view showing a relationship with the slider, FIG. 4 is a partial perspective view of a modification of the locking means, and FIGS. 5 and 6 are partial perspective views and partial longitudinal sectional views of a carrier body according to the second embodiment. FIG. 7 is an exploded perspective view of a conventional semiconductor carrier. 1 ... Carrier body, 2 ... Recess, 5 ... Locking means,
6 ... Spindle, 7 ... Slider, 9 ... Pin, P ... IC package.

Claims (3)

[Scope of utility model registration request] 1. A carrier body having a recess for arranging an IC package and a plurality of slits arranged in a row along the periphery of the recess so that lead terminals of the IC package can be inserted, and a carrier at one end. The other end of the IC package is pivotally supported by the main body so that the other end of the IC package moves into and out of the corner of the recess. A locking means having a stopping claw portion and an engaging portion located between the pivotally supported one end and the claw portion, and guiding the locking means to the advanced position and the retracted position. To this end, the slider is slidably mounted on the carrier body and comprises a slider having a guide portion that is in sliding contact with the engaging portion of the locking means. Move to the above IC carrier, characterized in that moves between a position and a retracted position. 2. The IC carrier according to claim 1, wherein a spring for pressing the IC package is provided in a receiving portion of the IC package provided in the recess. 3. The engaging surface of the locking means for engaging with the IC package in which the claw portion is housed is a tapered taper surface or a curved surface, according to claim (1) or (2). The listed IC carrier.