JPH0799708B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an IC socket used for an IC performance test or the like, particularly
The present invention relates to an IC socket that allows easy insertion and removal of an IC package.

[Conventional technology]

The applicant of the present invention is LCC type or PLCC
Proposal of socket for type IC package. The outline thereof will be described with reference to FIGS. 8 and 9. The vertical movement of the presser cover 31 operates the passive piece 34b of the contact pin 34 to make contact with the lead terminal P ₁ of the IC package P. The first and second contact portions 34a ₁ and 34a ₂ of the piece 34a are connected and released, and the IC package P can be locked to the socket body 32 side. That is, when the cover 31 is pushed downward in the same figure, the contact pin 34 opens by its own spring force (see FIG. 8, one-dot chain line), whereby the hole 31a of the cover 31 is opened.
The IC package P can be inserted / removed via the, and the IC package P is set under such a state. After this, when the downward pressure on the cover 31 is released, the cover 31
Is returned upward by the elastic force of a return spring (not shown), the passive piece 34b is pressed by the projection of the spacer 33, and the contact pin 34 is closed (shown by the solid line in FIG. 8). Contact piece of contact pin 34
34a contacts the lead P ₁ of the IC package P, and the IC package P is locked to the socket body 32 side.

[Problems to be solved by the invention]

By the way, in the case of the above socket, in order to open the contact pin 34 and release the lead P ₁ from the contact of the contact pin 34, it is necessary to resist the resilience of the return spring (not shown) that biases the cover 31 upward. Since it is necessary to hold the IC package P at the pushing position, it is troublesome to insert and remove the IC package P. In addition to the return springs described above, the parts that make up the socket include the presser cover 31 and the socket body.
There is also a problem that the number of parts is increased by interposing a spacer 33 between the two and the like, which makes the assembling work of the socket itself complicated.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an IC socket which can facilitate the work of inserting and removing the IC package and has a simple structure.

[Means and Actions for Solving Problems]

The IC socket according to the present invention comprises a base body on which an IC package is to be placed, a socket body having a placement groove arranged in a row around the base, an insertion portion inserted into the placement groove, and the insertion portion. Pin having a contact piece and a passive piece that branches from a curved portion through a curved portion, and a pushing piece that is mounted on the socket body so as to be vertically movable and can engage with the insertion / removal window of the IC package and the passive piece of the contact pin. When the cover is pushed down, the pushing piece urges the passive piece to release the connection between the contact piece and the IC package terminal, and also pushes the passive piece of the contact pin and the cover. Engagement with the piece is performed through an inclined surface formed on the passive piece, and the socket body is made to disengage a hooking piece that can engage with a protrusion formed on the cover and the joining of the hooking piece. The release piece is integrally molded There. Therefore, when the cover is pushed down, the connection between the IC package terminal and the contact pin is released, but at that time, the projection of the cover and the latching piece of the socket body are engaged with each other, and the cover is locked at the pushed-down position. Holds the state of disconnection. It is possible to insert and remove the IC package in this state, but if the release piece is operated from this state, the lock on the cover is released, and if the IC package is inserted, it will not contact the contact piece.
Connection with the IC package terminals will be made.

〔Example〕

An embodiment of an IC socket according to the present invention will be described below with reference to FIGS. 1 to 7. Of the drawings, FIG. 2 and FIG. 3 show the contact pin disconnection state, and FIG. The connection states are shown respectively. In the figure, reference numeral 1 denotes a base 2 for mounting the IC package P at the center thereof, and grooves 3 for arranging contact pins arranged along the periphery of the base 2. The socket body 4 is a partition wall defining the groove 3, and 5 is an insertion hole in which a hook of a cover, which will be described later, is inserted, and a projection 6 for engaging with the hook to prevent the cover from coming off, 7 Is a guide projection for guiding the terminal P ₁ when the IC package P is set on the base 2, and 8 is integrally formed with the socket body 1 so that the latching portion 8a can be bent by an appropriate amount (see FIG. 1, arrow A). The latching pieces 9 are formed integrally with the socket body 1, and the arm portion 9b erected on the base 1 is bent by the operation of the lever portion 9a so that the abutting portion 9c has the latching piece 8c.
A releasing piece 10 capable of pushing the hooking portion 8a of the socket 10a is fixed to the socket body 1 by being inserted into the above-mentioned arrangement groove 3 as shown in detail in FIG. 5, and the bending portion 10b. It is a contact pin provided with a passive piece 10c and a contact piece 10d that branch off via. Passive piece 10c of this contact pin 10
An inclined surface 10c ₁ is formed on the cover so that it can be engaged with a pushing piece of the cover when the cover is pushed down, and when the cover is pushed down, an elastic surface 10c ₁ is formed by the curved portion 10b via the inclined surface 10c _1. Tensile force is applied, but at that time the passive piece 10c
Is pushed to the right in FIG. 5, the contact piece 10d is not in contact with the terminal P ₁ of the IC package P on the base 2, and the IC package P is inserted into and removed from the socket body 1. If possible, do it.

Reference numeral 11 is a cover, which is an IC package P formed in the center of the cover.
It is mounted and movably mounted on the socket body 1 by being positioned and guided by each outer peripheral surface of the guide projection 7 on the socket body 1 side through the insertion / removal window 12. Window 12 of the cover 11
Along the lower edge of the first and second insertion grooves 14 and 15 for receiving the contact piece 10d and the passive piece 10c of the contact pin 10, respectively.
And a pushing piece 16 disposed between the grooves 14 and 15 and capable of pushing the passive piece 10c of the contact pin 10 described above, each of which is formed in alignment with the placement groove 3. The slit 13 is formed. Further, in order to accommodate the hooking pieces 8, the cover 11 is provided with recesses 17 corresponding to the respective hooking pieces 8 at four corners of the outer peripheral portion thereof. This cover
11 is, when mounted on the socket body 1, as described above, the pushing piece 16 is the inclined surface 10c ₁ of the passive piece 10c of the contact pin 10.
The hook 18 integrally formed with the cover 11 engages with the projection 6 on the socket body 1 side to be hooked at the upper moving position thereof, although the hook 18 integrally engaged with the bending portion 10b receives the upward elastic force. (See FIG. 4), the latching projection 19 formed in the recess 17 is engaged with and locked by the latching portion 8a of the latching piece 8 on the socket body 1 side in the upward movement position. Is set to. Reference numeral 20 is a partition wall that defines the slit 13.

Since the IC socket according to the present invention is configured as described above, first, in the empty state in which the IC package P is not loaded, the cover 11 is positioned at its upper moving position. Since the contact pin 10 is in the connected state as shown in, the IC package P
The terminal P ₁ of the contact pin 10 is in a position where it collides with the contact piece 10d of the contact pin 10, so that the insertion of the package P is substantially impossible. However, when the cover 11 is pushed down from such an upward movement position, the pushing piece 16 engages with the passive piece 10c of the contact pin 10, whereby the contact piece 10d moves from the collision position directly above the base 2 to the first insertion groove. The IC package P can be inserted by retracting inward of 14 (toward the outer periphery of the cover 11), that is, when the contact pin 10 is disconnected.
When the cover 11 is further brought to the downward movement position, each of the latching projections 19 engages with the latching portion 8a of the corresponding latching piece 8 and, at this time, the pusher piece 16 moves the passive piece. Since the cover 11 is urged upward through 10c, the cover 11 is held in this downward movement position, that is, the contact pin 10 is maintained in the disconnected state. By the way, in the conventional IC socket, in order to maintain such a disconnected state, the presser cover (31) is continuously pushed down as described above, and the IC
Although the troublesome work of setting the package P is unavoidable, the disconnected state of the cover 11 is automatically secured and held by pushing it down as described above, so that the troublesome work as in the conventional example is no longer required. Without accompanying
It is extremely easy to insert the IC package P through the window 12 and then the base 2
It can be set in place above. (See Figure 3).

The above is the basic operation by pushing down the cover 11,
Next, the operation of the lever 9 will be described. At the downward movement position of the cover 11 shown in FIG. 3 in which the IC package P is set on the base 2, the hooking portion 8a of the hooking piece 8 has the hooking protrusion 19a.
However, when the lever portion 9a of each release piece 9 is pushed toward the inside of the socket body 1 (see arrow A in FIG. 4), the contact portion 9c pushes the hook portion 8a ( (See FIG. 4), whereby the engagement between the engagement portion 8a and the engagement projection 19 is released.
At this time, since the pushing piece 16 on the cover 11 side is elastically pressed upward by the passive piece 10c of the contact pin 10 via the inclined surface 10c ₁ , the cover 11 is biased upward (arrow in FIG. 4). B) Protrusion 6 on the socket body 1 side and hook 18 on the cover 11 side
The cover 11 is positioned at the upper moving position by the engagement with and the contact piece 10d of the contact pin 10 presses the corresponding terminal P ₁ of the IC package P as shown in FIG. Contact pin 10 is connected. Thus, the operation of the lever 9 completes the loading of the IC package P, after which the IC package P is subjected to various tests and the like.

When replacing the IC package P after the test with another new IC package, as described above, the cover 11 is pushed down to bring the contact pins 10 into the disconnected state, and the loaded IC package P is taken out and a new one is added. Then, the IC package is set, and then the contact pin 10 is connected by operating the lever 9.

That is, the IC package P can be replaced by only pushing down the cover 11 once, which speeds up the work and reduces the number of times the cover 11 is operated with respect to the contact pin 10. pin
It is possible to improve the durability of 10.

As described above, the IC package P can be loaded and replaced reliably and easily. However, because of the structure, the passive piece 10 of the contact pin 10 engages with the pushing piece 16 and urges the cover 11 upward. In addition to the need for a spring for returning the cover in the conventional IC socket, the passive piece 10c and the contact piece 10d are arranged at substantially the same height position so that the first and second insertion grooves 14 for receiving them can be provided. , 15 can both be provided on the cover 11, whereby the spacer (33) (see FIG. 9) of the conventional IC socket is not required and the structure is simplified.

Incidentally, FIG. 7 shows a modification of the contact pin 10, which is a passive piece.
With the inclined surface 10'c ₁ of 10'c are in contact engagement with the pressing piece 16, the contact piece 10'd and receiving Dohen 10'c has a configuration in which the branched, same effect as the above embodiment in this case The effect is obtained.

〔The invention's effect〕

As described above, according to the IC socket of the present invention, there are advantages that the work of loading and replacing the IC package is facilitated to improve the work efficiency, and that the structure is simplified and the number of parts is reduced. Further, in particular, since the cover is automatically held at the downward movement position and the number of parts is reduced, the assembly is facilitated, which is extremely advantageous in manufacturing.

[Brief description of drawings]

1 to 7 relate to an embodiment of an IC socket of the present invention, and FIG. 1 is a perspective view showing the entire structure, FIG. 2 and FIG.
The figure shows a perspective view and a partial side sectional view, respectively, of an IC socket in which the contact pins are in a non-contact state. FIG. 4 is a partial side sectional view of an IC socket in which the contact pins are in a contact state. FIG. 6 is a sectional view showing the relationship between the vertical movement of the cover and the operation of the contact pin, FIG. 7 is a side view showing a modified example of the contact pin, and FIGS. 8 and 9 are conventional IC sockets. 8 is a partial sectional view showing a schematic structure, and FIG. 9 is a side view showing a connection state between contact pins and terminals of an IC package. 1 ... Socket body, 2 ... Base, 3 ... Groove, 4 ... Partition wall, 6 ... Projection, 7 ... Guide projection, 8 ... Latching piece,
9 ...... releasing pieces, 10 ...... contact pins, 10a ...... insertion portion, 10b ...... curved portion, 10c ...... passive piece 10c ₁ ...... inclined surface,
10d ... Contact piece, 11 ... Cover, 12 ... Window, 13 ... Slit, 14 ... First insertion groove, 15 ... Second insertion groove, 16 ...
… Pushing piece, 18 …… Hook, 19 …… Latching projection, 20 …… Partition wall.

Claims (1)

[Claims] 1. A socket main body having a base on which an IC package is to be mounted and a placement groove arranged in a row around the base, and an insertion portion to be inserted into the placement groove and the insertion portion. A contact pin having a passive piece and a contact piece branched via a curved portion, and a socket that is vertically movably mounted on the socket body and is capable of engaging with the insertion / removal window of the IC package and the passive piece of the contact pin. An IC socket including a cover having a pushing piece, wherein the pushing piece biases the passive piece by pushing down the cover to release the connection between the contact piece and the terminal of the IC package. The engagement of the pushing piece with the passive piece is performed via an inclined surface formed on the passive piece, and the socket body is engaged with a protrusion formed on the cover. Stopper and engagement of the hook The release piece that can release the lock is integrally molded, and the cover is locked in the depressed position by the engagement of the engagement piece, while the contact piece is connected to the terminal of the IC package in the engagement release state. IC socket characterized in that