JPS6234964B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing and assembling minute parts by forming a minute thin plate into a hole having the same shape as the thin plate and easily inserting and burying the hole.

Conventionally, this type of method has been used, for example, as shown in FIG.
When inserting or embedding into the hole 201 of the substrate 2, the cross-sectional shapes of the micro thin plate 1 and the hole 201 are rectangular, that is, the diameters of the front surface 1a side and the back surface 1b side of the micro thin plate 1 are made to be the same size. However, in this method, it is difficult to insert the thin thin plate 1 into the hole 201 manually or even by a mechanical robot.
The edges of the hole 201 were scratched or chipped, resulting in poor yield.

As one of the measures to improve this, a conventional method has been to chamfer the edge on the back side 1b of the thin microplate 1 or the edge on the front side of the substrate 2.
However, with this method, even though insertion is easier, the surface of the inserted (embedded) board remains in the form of a groove due to chamfering, which may be pointed out as a fatal flaw in terms of improving component function and characteristics. Ta. Moreover, it was also a cause of disturbing the aesthetic appearance of the product. Furthermore, there was a drawback that the micro thin plate 1 easily fell off from the substrate 2, resulting in poor reliability as a component. For this reason, there were cases where it was unavoidable to bond the side surfaces of the micro thin plate 1 and the substrate 2 with an adhesive, but this had the disadvantage of complicating the process.

The present invention was made in view of the above circumstances, and
When embedding a microthin plate of a predetermined shape into a hole of the same shape as the microthin plate formed in another microthin plate,
To provide a method for easily inserting and burying a minute thin plate into a hole formed in another thin plate without chamfering or using adhesive. The feature of this invention is that the cross-sectional shape of the hole is processed into a tapered shape, and dummy thin plates are bonded to the front and back surfaces of the micro thin plate to form a rod-shaped sample, and the sample is processed into a tapered shape. By doing so, the thin thin plate in the sample is made to have the same shape and the same size as the hole, and the sample is inserted into the hole to substantially match the thin thin plate in the sample and the hole, and then The dummy thin plate is removed from the micro thin plate.

Embodiments of the present invention will be described below, but first, a method of embedding a micro thin plate, which is the basis of the present invention, will be described with reference to FIG. In FIG. 2, reference numeral 1 indicates a glass disk which is a micro thin plate for insertion and embedding, and reference numeral 2 indicates a glass substrate having a hole 201 of the same shape as the glass disk 1. The thickness of the glass disk 1 and the glass substrate 2 are both 0.3 mm,
The diameter d ₁ on the surface side of disk 1 and hole 201 is 5.0
mm, and the side surface of the disk 1 and the inner surface of the hole 201 are machined into a tapered shape. The disk 1 was machined using a peripheral grinder, and the hole 201 was machined in a wrapping manner using a tapered jig.

When I inserted the disk 1 into the hole 201 while viewing it under a stereomicroscope, it was inserted smoothly, and when I carefully pressed the disk 1 through an elastic body (for example, silicone rubber) and observed the embedding situation with an optical microscope, I found that the disk 1 was inserted smoothly. It was embedded tightly, and the gap between the disk 1 and the hole 201 on the front and back sides was 6 μm or less at most.

The present invention is based on the above-mentioned basic embedding method, and has made it possible to embed and fix a micro thin plate in a hole even more easily and with high precision. Explain.

In the method of this embodiment, a dummy disk d (dummy thin plate) is placed on the front surface of the disk 1 (top surface in FIG. 3), and a dummy disk d (dummy thin plate) is placed on the back surface of the disk 1 (bottom surface in FIG. 3). A rod-shaped sample 302 is formed in advance by bonding disks a and b, respectively. Then, this sample 302 is attached to the bonding jig 3.
01, and disk 1 in sample 302 is attached to substrate 2.
The entire sample 302 is tapered so that it has the same shape and dimensions as the tapered hole 201. Thereafter, as shown in FIG. 3, a sample 302 is inserted into the hole 201 from its tip. In this case, a sample 302 whose thickness is several times or more than the thickness of the substrate 2 is inserted into the hole 201 of the thin substrate 2.
Insertion becomes extremely easy, and the disc 1 can be inserted tightly without being damaged. Sample 30
2 until the disk 1 approximately matches the hole 201, and after confirming with a microscope that the front or back surface of the disk 1 matches the front or back surface of the substrate 2, insert the adhesive (for example, ceramics) that adhered the disk 1. , superglue) solvents (e.g. acetone, alcohol)
The disks 1a, b, d of the sample 302 are immersed in
and the jig 301 were peeled off. Subsequently, when the state of insertion and embedding of the disk 1 left in the hole 201 was observed using a microscope, the gap between the disk 1 and the hole 201 was 3 μm or less, and the level difference between the disk 1 and the substrate 2 on the surface was 5 μm. . Needless to say, the front and back surfaces of the glass disk 1 embedded by the method shown in FIG. 3 are free of scratches because they are not touched at all during the embedding process.

The disk 1 embedded in FIGS. 2 and 3 does not come off to the surface side of the substrate 2 even under ultrasonic waves.
It stayed there. Of course, the disk 1 cannot escape to the back side of the substrate 2.

Similarly, in the present invention, the thickness of the substrate 2 is 0.05 to 5.00 mm,
When applied to various combinations of embedded disks 1 with diameters of 0.1 to 10.0 mm, the effects of the present invention were sufficiently effective. In principle, it is possible to embed a large shape in a thicker substrate, and a polygonal shape is also possible.

Furthermore, it goes without saying that the present invention is effective for embedding not only hard and brittle materials such as glass, but also solid materials such as metals, or dissimilar materials.

As explained above, according to the present invention, since the insertion hole and the insertion part (microthin plate) are inserted and embedded with a tapered cross section, the insertion and embedding work of the insertion part is easy and reliable. This has the advantage that the inserted part can be reliably held in the insertion hole, and the inserted part can be firmly and tightly embedded. Furthermore, according to the present invention, a rod-shaped sample is formed by bonding dummy thin plates to the front and back surfaces of the disk, which is an inserted part, and the entire sample is tapered. Machining is much easier than when machining the sample, and since the dummy thin plate is removed after inserting the sample into the hole, it is extremely easy to insert the disk into the hole, and it can be inserted firmly enough. I can do it,
Moreover, it has the effect of preventing scratches on the front and back surfaces of the disc.

The present invention can be applied to assembling mechanical parts, embedding elements in electronic parts, and manufacturing circulators in which a magnetic material is embedded in a dielectric substrate, for example.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a conventional method of embedding a micro thin plate, FIG. 2 is a diagram showing an embedding method which is the basis of the present invention, and FIG. 3 is a diagram showing an embodiment of the embedding/fixing method of the present invention. . 1... Micro thin plate (disk), 2... Thin plate (substrate),
201... Hole for embedding in the substrate, 301... Adhesive jig, 302... Rod-shaped sample, a, b,
d...Dummy thin plate (disk).

Claims (1)

[Claims] 1. When a micro thin plate having the same shape as the hole is embedded and fixed in a hole of a predetermined shape formed in a thin plate, the cross-sectional shape of the hole is processed into a tapered shape,
A rod-shaped sample is formed by gluing dummy thin plates to the front and back sides of the thin thin plate, respectively, and the sample is processed into a tapered shape so that the thin thin plate in the sample has the same shape as the hole. , having the same dimensions, and inserting the sample into the hole to substantially match the micro thin plate in the sample with the hole, and then removing the dummy thin plate from the micro thin plate. Embedding/fixing method.