JPS6234441U - - Google Patents
Info
- Publication number
- JPS6234441U JPS6234441U JP1985125339U JP12533985U JPS6234441U JP S6234441 U JPS6234441 U JP S6234441U JP 1985125339 U JP1985125339 U JP 1985125339U JP 12533985 U JP12533985 U JP 12533985U JP S6234441 U JPS6234441 U JP S6234441U
- Authority
- JP
- Japan
- Prior art keywords
- element mounting
- semiconductor device
- semiconductor
- resin
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
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- H10W90/756—
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985125339U JPS6234441U (oth) | 1985-08-15 | 1985-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985125339U JPS6234441U (oth) | 1985-08-15 | 1985-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6234441U true JPS6234441U (oth) | 1987-02-28 |
Family
ID=31018154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985125339U Pending JPS6234441U (oth) | 1985-08-15 | 1985-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234441U (oth) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04369382A (ja) * | 1991-06-14 | 1992-12-22 | Hikari Dento Kogyosho:Yugen | 表面処理加工を行った金属の乾燥方法 |
| JP2004165646A (ja) * | 2002-10-24 | 2004-06-10 | Matsushita Electric Ind Co Ltd | リードフレーム，樹脂封止型半導体装置及びその製造方法 |
-
1985
- 1985-08-15 JP JP1985125339U patent/JPS6234441U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04369382A (ja) * | 1991-06-14 | 1992-12-22 | Hikari Dento Kogyosho:Yugen | 表面処理加工を行った金属の乾燥方法 |
| JP2004165646A (ja) * | 2002-10-24 | 2004-06-10 | Matsushita Electric Ind Co Ltd | リードフレーム，樹脂封止型半導体装置及びその製造方法 |