JPS623273U - - Google Patents
Info
- Publication number
- JPS623273U JPS623273U JP9241585U JP9241585U JPS623273U JP S623273 U JPS623273 U JP S623273U JP 9241585 U JP9241585 U JP 9241585U JP 9241585 U JP9241585 U JP 9241585U JP S623273 U JPS623273 U JP S623273U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- chute
- guide section
- charging guide
- melted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のはんだ供給装置の一実施例を
示す一部切欠の正面図、第２図はその要部の平面
図、第３図本装置の側面図、第４図はそのはんだ
押出に係る機構の平面図である。
１……はんだ槽、４……溶解はんだ面、５……
シユート、５ａ……シユート本体、５ｂ……投入
ガイド部、７……固形はんだ、３１……筒部、３
２……袋部、３３……開口部。
Fig. 1 is a partially cutaway front view showing an embodiment of the solder supply device of the present invention, Fig. 2 is a plan view of the main parts thereof, Fig. 3 is a side view of the present device, and Fig. 4 is the solder extrusion. FIG. 1...Solder bath, 4...Dissolved solder surface, 5...
Chute, 5a...Chute body, 5b...Insertion guide part, 7...Solid solder, 31...Cylinder part, 3
2...Bag portion, 33...Opening portion.
Claims (1)
じて、前記はんだ槽の外部からシユートを経ては
んだ槽の内部に固形はんだを投入するはんだ供給
装置において、前記シユートは、シユート本体の
先端部に、前記溶解はんだ中に挿入される投入ガ
イド部を連続的に設け、この投入ガイド部の溶解
はんだ面に対応する位置に筒部を設け、前記投入
ガイド部の先端部に前記投入された固形はんだが
嵌合する袋部を設け、前記筒部と前記袋部との間
に開口部を設けたことを特徴とするはんだ供給装
置。 In a solder supply device that injects solid solder from the outside of the solder tank into the solder tank via a chute in response to a decrease in the amount of melted solder inside the solder tank, the chute is configured to supply the melted solder to the tip of the chute body. A charging guide section that is inserted into the solder is continuously provided, a cylindrical section is provided at a position corresponding to the melted solder surface of the charging guide section, and the charged solid solder fits into the tip of the charging guide section. 1. A solder supply device, comprising: a bag portion, and an opening provided between the cylindrical portion and the bag portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9241585U JPH0140619Y2 (en) | 1985-06-19 | 1985-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9241585U JPH0140619Y2 (en) | 1985-06-19 | 1985-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS623273U true JPS623273U (en) | 1987-01-10 |
| JPH0140619Y2 JPH0140619Y2 (en) | 1989-12-04 |
Family
ID=30649190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9241585U Expired JPH0140619Y2 (en) | 1985-06-19 | 1985-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0140619Y2 (en) |
-
1985
- 1985-06-19 JP JP9241585U patent/JPH0140619Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0140619Y2 (en) | 1989-12-04 |