JPS623272U - - Google Patents
Info
- Publication number
- JPS623272U JPS623272U JP9241485U JP9241485U JPS623272U JP S623272 U JPS623272 U JP S623272U JP 9241485 U JP9241485 U JP 9241485U JP 9241485 U JP9241485 U JP 9241485U JP S623272 U JPS623272 U JP S623272U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- container
- chute
- extrusion
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 28
- 238000001125 extrusion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のはんだ供給装置の一実施例を
示す正面図、第２図はそのはんだ押出に係る機構
の平面図、第３図は本装置の一部を切欠いて示し
た側面図、第４図はそのシユート先端部の平面図
である。
１……はんだ槽、４……溶解はんだ面、５……
シユート、６……はんだ収容体、７……固形はん
だ、１１……押出体挿入口、１２……はんだ押出
体、１３……はんだ押出口、１４……はんだ滑落
面、２５……アクチユエータ。
FIG. 1 is a front view showing an embodiment of the solder supply device of the present invention, FIG. 2 is a plan view of a mechanism related to solder extrusion, and FIG. 3 is a side view showing a part of the device with a cutaway. FIG. 4 is a plan view of the tip of the chute. 1...Solder bath, 4...Dissolved solder surface, 5...
Chute, 6...Solder container, 7...Solid solder, 11...Extrusion body insertion port, 12...Solder extrusion body, 13...Solder extrusion port, 14...Solder sliding surface, 25...Actuator.
Claims (1)
じて、前記はんだ槽の内部に固形はんだを供給す
るはんだ供給装置において、前記はんだ槽上に溶
解はんだ面に向つて下降傾斜状に取付けたシユー
トと、このシユートの上面に積重ねられた固形は
んだを内部に保持するはんだ収容体と、このはん
だ収容体の一側部の下端に設けた押出体挿入口と
、この押出体挿入口に進退自在に設けたはんだ押
出体と、前記はんだ収容体の他側部の下端に設け
たはんだ押出口と、このはんだ押出口の外側部で
あつて前記シユートの上面に設けたはんだ滑落面
と、前記溶解はんだの減少に応じて前記はんだ押
出体を前記押出体挿入口から前記はんだ収容体内
に挿入するアクチユエータとを具備したことを特
徴とするはんだ供給装置。 A solder supply device that supplies solid solder to the inside of the solder tank in response to a decrease in molten solder inside the solder tank includes a chute installed on the solder tank in a downwardly inclined manner toward a surface of the molten solder; A solder container that holds solid solder stacked on the top surface of the chute, an extruded body insertion port provided at the lower end of one side of the solder container, and a solder container provided in the extruded body insertion port so as to be able to move forward and backward. an extrusion body, a solder extrusion port provided at the lower end of the other side of the solder container, a solder sliding surface provided on the upper surface of the chute on the outside of the solder ejection port, and a solder slipping surface provided on the upper surface of the chute; and an actuator for inserting the solder extrusion body into the solder container from the extrusion body insertion opening in accordance with the solder supplying device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9241485U JPS623272U (en) | 1985-06-19 | 1985-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9241485U JPS623272U (en) | 1985-06-19 | 1985-06-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS623272U true JPS623272U (en) | 1987-01-10 |
Family
ID=30649188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9241485U Pending JPS623272U (en) | 1985-06-19 | 1985-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS623272U (en) |
-
1985
- 1985-06-19 JP JP9241485U patent/JPS623272U/ja active Pending
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