JPS623266U - - Google Patents
Info
- Publication number
- JPS623266U JPS623266U JP9233085U JP9233085U JPS623266U JP S623266 U JPS623266 U JP S623266U JP 9233085 U JP9233085 U JP 9233085U JP 9233085 U JP9233085 U JP 9233085U JP S623266 U JPS623266 U JP S623266U
- Authority
- JP
- Japan
- Prior art keywords
- heating
- changing
- hot air
- solder welding
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims 4
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9233085U JPS623266U (fi) | 1985-06-20 | 1985-06-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9233085U JPS623266U (fi) | 1985-06-20 | 1985-06-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS623266U true JPS623266U (fi) | 1987-01-10 |
Family
ID=30649032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9233085U Pending JPS623266U (fi) | 1985-06-20 | 1985-06-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS623266U (fi) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009597A (ja) * | 2010-06-24 | 2012-01-12 | Elpida Memory Inc | 半導体デバイスの製造方法および半導体デバイスの製造装置 |
-
1985
- 1985-06-20 JP JP9233085U patent/JPS623266U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012009597A (ja) * | 2010-06-24 | 2012-01-12 | Elpida Memory Inc | 半導体デバイスの製造方法および半導体デバイスの製造装置 |
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