JPS6230740Y2 - - Google Patents

Info

Publication number
JPS6230740Y2
JPS6230740Y2 JP2271381U JP2271381U JPS6230740Y2 JP S6230740 Y2 JPS6230740 Y2 JP S6230740Y2 JP 2271381 U JP2271381 U JP 2271381U JP 2271381 U JP2271381 U JP 2271381U JP S6230740 Y2 JPS6230740 Y2 JP S6230740Y2
Authority
JP
Japan
Prior art keywords
contact
gold
silver
layer
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2271381U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57135018U (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2271381U priority Critical patent/JPS6230740Y2/ja
Publication of JPS57135018U publication Critical patent/JPS57135018U/ja
Application granted granted Critical
Publication of JPS6230740Y2 publication Critical patent/JPS6230740Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Contacts (AREA)
JP2271381U 1981-02-18 1981-02-18 Expired JPS6230740Y2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2271381U JPS6230740Y2 (fr) 1981-02-18 1981-02-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2271381U JPS6230740Y2 (fr) 1981-02-18 1981-02-18

Publications (2)

Publication Number Publication Date
JPS57135018U JPS57135018U (fr) 1982-08-23
JPS6230740Y2 true JPS6230740Y2 (fr) 1987-08-07

Family

ID=29820504

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2271381U Expired JPS6230740Y2 (fr) 1981-02-18 1981-02-18

Country Status (1)

Country Link
JP (1) JPS6230740Y2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112007000674B4 (de) * 2006-03-24 2023-06-07 Uchiya Thermostat Co., Ltd. Überzogenes kontaktpunktmaterial, kontaktpunktobjekt und verfahren zum anbringen des kontaktpunktobjekts

Also Published As

Publication number Publication date
JPS57135018U (fr) 1982-08-23

Similar Documents

Publication Publication Date Title
DE2314731C3 (de) Halbleiteranordnung mit höckerartigen Vorsprüngen auf Kontaktflecken und Verfahren zur Herstellung einer solchen Halbleiteranordnung
FR2097133B1 (fr)
JPS6472542A (en) Manufacture of low resistance plane metal contact
DE3781882D1 (de) Zwischenstueck zum diffusionsfuegen mit fluessiger phase.
JPS6230740Y2 (fr)
KR900018407A (ko) 진공 차단기 접점 및 그의 제조방법
JPH02253628A (ja) 半導体装置の製造方法
JP4778615B2 (ja) 溶接可能なアルミニウムスタッド
JP2692990B2 (ja) 気密封止構体
DE2207012C2 (de) Verfahren zur Kontaktierung von Halbleiterbauelementen
KR100826658B1 (ko) 이종금속 접합방법 및 이에 의해 제조된 접합체
JPS628943B2 (fr)
JPS6111483B2 (fr)
JPS6146941B2 (fr)
JPS6050156A (ja) メツキ式溶射方法
JPS5837952B2 (ja) 気密端子の製造方法
JPS55112189A (en) Diffusion welding method of copper and titanium
SU390907A1 (ru) Способ изготовления металлического электрода- инструмента
JPH0323619Y2 (fr)
JPS6032774Y2 (ja) 半導体装置用ステム
Sterling Electroplating Electrical Contacts
DE2546871A1 (de) Verfahren zum aufbringen von kontaktierungsschichten auf nichtleitersubstrate
JPS6462619A (en) Electrochemical element comprising high molecular solid electrolyte and laminated metallic electrode
JPS60148664A (ja) 拡散ロウ付け方法
JPH05175017A (ja) チップ型セラミック電子部品の製造方法