JPS6230355A - Lead frame for ic - Google Patents
Lead frame for icInfo
- Publication number
- JPS6230355A JPS6230355A JP16762185A JP16762185A JPS6230355A JP S6230355 A JPS6230355 A JP S6230355A JP 16762185 A JP16762185 A JP 16762185A JP 16762185 A JP16762185 A JP 16762185A JP S6230355 A JPS6230355 A JP S6230355A
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- lead frame
- lead
- die
- throttling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明はIC用リードフレームの改良に係わる。[Detailed description of the invention] <Industrial application field> The present invention relates to improvements in lead frames for ICs.
〈従来の技術〉
■C用リードフレーム中央のダイパット上にグイポンド
されたICチップ周−T2の端子とリード詳と金線等で
ワイヤポンディングする際、ワイヤポンディング用金線
使用量の削減、金線同志の接触による不良率の低減を図
るため、リードフレームのダイパット支持片にDP(デ
ィンプル)加工を施してリード面よりダイパット面を低
めて段差をつけることが行なわれる。第2図(a)はこ
のようなIC用リードフレームの平面図であり、第2図
(b)は第2図(a)に示すもののダイパット部分の側
面図である。7fS2図(a)において、■はリードフ
レーム外枠、2aはインナーリード、2bはアウターリ
ード、3はリードを保持するタイ/ヘー。<Conventional technology> ■When wire bonding the circumference of the IC chip on the die pad in the center of the C lead frame - T2 terminals and lead details with gold wire, etc., the amount of gold wire used for wire bonding can be reduced. In order to reduce the defective rate due to contact between gold wires, the die pad support piece of the lead frame is subjected to DP (dimple) processing to lower the die pad surface below the lead surface to form a step. FIG. 2(a) is a plan view of such an IC lead frame, and FIG. 2(b) is a side view of a die pad portion of the lead frame shown in FIG. 2(a). In Figure 7fS2 (a), ■ is the outer frame of the lead frame, 2a is the inner lead, 2b is the outer lead, and 3 is the tie/hook that holds the lead.
4はダイパット、5はダイパットを支持する支持片であ
る。第2図 (b)はダイパットとリードフレームとの
関係を示す、ダイパット部分の側面図である。第2図(
b)に示す如く、リードフレームの外枠1から突出した
ダイパット支持片5は、a、C及びd、b間でDP加工
の絞り加工が施され、ダイパット4の上面はインナーリ
ード2aの上面に対しHの段差が与えられ、低くなって
いる。尚、DP加工の絞り加工をダイパット支持片に施
すと、絞り加工部の肉の一部が両側へ逃る結果、加工治
具を外すとダイパット支持片にそりを生ずる。これを防
止するため、a、c、d、bの肩の部分に第3図に示す
ようにたたきA、C。4 is a die pad, and 5 is a support piece that supports the die pad. FIG. 2(b) is a side view of the die pad portion showing the relationship between the die pad and the lead frame. Figure 2 (
As shown in b), the die pad support piece 5 protruding from the outer frame 1 of the lead frame is drawn by DP processing between a, C, d, and b, so that the upper surface of the die pad 4 is on the upper surface of the inner lead 2a. On the other hand, a height difference of H is given, making it lower. Note that when the die pad support piece is subjected to the drawing process of the DP process, a portion of the flesh of the drawn portion escapes to both sides, and as a result, when the processing jig is removed, the die pad support piece is warped. To prevent this, tap A and C on the shoulders of a, c, d, and b as shown in Figure 3.
D、Bを入れることによって絞り加工によるそりを矯正
している。By adding D and B, the warp caused by the drawing process is corrected.
〈発明が解決しようとする問題点)
第3図に示す如く、IC用リードフレームのダイパット
4をリード2の高さに対しHだけ段差をつけるため、絞
り加工とこれによるそりを矯iEするたたきを加えて加
工していたが、リードフレームの多ビン化に伴ない、ダ
イパット4を支えるダイパット支持片の長さ、即ち絞り
加工間の距離りが、ダイパットの長さ[]yに比べて相
当に長くなり、第3図に示すようなa、c、d、b部分
だけのたたきでは絞り加工によるそりが第4図に示すよ
うに、とり切れず、ダイパット4のリード2aに対する
所望の段差Hが得られないことが分った。このようにダ
イパット支持片の長さがダイパットの支持片の方向の長
さDYに比べて特に長いものに対して、改良が必要とな
った。<Problems to be Solved by the Invention> As shown in Fig. 3, in order to make the die pad 4 of the IC lead frame step by an amount H with respect to the height of the lead 2, a drawing process and a beating process are performed to correct the warpage caused by the drawing process. However, as the number of bins for lead frames increases, the length of the die pad support piece that supports the die pad 4, that is, the distance between drawing operations, is considerably larger than the length of the die pad []y. If only the parts a, c, d, and b as shown in FIG. It turned out that I couldn't get it. As described above, it has become necessary to improve the die pad support piece which is particularly long compared to the length DY of the die pad support piece in the direction of the die pad support piece.
本発明はかかる従来技術の問題点に鑑みてなされたもの
で、IC用リードフレームのグイバントのDP加工によ
るそりを取り除く、有効なたたきを施した。IC用リー
ドフレームを提供することを目的としている。The present invention has been made in view of the problems of the prior art, and provides effective beating to remove the warpage caused by DP processing of the lead frame for IC. Its purpose is to provide lead frames for ICs.
〈問題点を解決するための手段〉
かかる目的を達成した本発明によるIC用リードフレー
ムの構成は、IC用リードフレームのダイパット上面を
リード上面に対して段差をつけて低めたIC用リードフ
レームにおいて、」二足IC用リードフレームのダイパ
ットをつなぐダイパット支持片に、上記段差を与えるた
めのDY絞り加工を施すとともに、該絞り加工部の両端
部ならびに、該絞り加工部と上記ダイパットの間にたた
きを入れたことを特徴とするものである。<Means for Solving the Problems> The structure of the IC lead frame according to the present invention which achieves the above object is that the IC lead frame has a die pad upper surface lowered by a step with respect to the lead upper surface. , "A die pad support piece that connects the die pads of a bipedal IC lead frame is subjected to a DY drawing process to provide the above-mentioned step, and a DY drawing process is applied to both ends of the drawn part and between the drawn part and the die pad. It is characterized by the inclusion of.
〈実施例)
本発明によるIC用リードフレームの一実施例を図面に
よって説明する。第1図(a)は本発明によるIC用リ
ードフレームのダイパットとダイパット支持片部分の平
面図である。第1図(b)は第1図(a)に示すものの
側面図である。<Example> An example of an IC lead frame according to the present invention will be described with reference to the drawings. FIG. 1(a) is a plan view of a die pad and a die pad support piece portion of an IC lead frame according to the present invention. FIG. 1(b) is a side view of what is shown in FIG. 1(a).
特に多ピン用ICのリードフレームにおいては、ダイパ
ット4の長さoyがダイパット支持片5の絞り加工間の
距#、、Lに比べて著しく短かくなる。このような場合
、DY絞り加工によってダイパットをリードに対して段
差Hを与えて低くする場合、第4図で説明した通り、従
来のものでは、絞り加工の両端、a、c及びd、bのみ
にたたき、A、C及びり、Bを施しただけでは、絞り加
工によって生じたそりを充分に取り除くことができなか
った。そこで更に、絞り加工の端部c、dとダイパット
4の間のただきE、Fを施した所、第1図(a)に示す
如く絞り加工によるそりは充分に矯正され、ダイパット
上面とリード上面との間に精度の高い段差HをもつIC
用リードフレームを得ることができた0本発明によるI
C用リードフレームの実験例を以下に示す。Particularly in the lead frame of a multi-pin IC, the length oy of the die pad 4 is significantly shorter than the distance #, L between the drawing processes of the die pad support piece 5. In such a case, when lowering the die pad by giving a step H to the lead by DY drawing, as explained in Fig. 4, in the conventional method, only the ends a, c, d, and b of the drawing process are used. It was not possible to sufficiently remove the warpage caused by the drawing process only by pounding, A, C, drilling, and B. Then, the warpage caused by the drawing process was sufficiently corrected, and the warpage caused by the drawing process was sufficiently corrected at the places where the edges E and F were applied between the ends c and d of the drawing process and the die pad 4, as shown in FIG. 1(a). IC with a highly accurate step H between the top surface and the top surface
According to the present invention, it was possible to obtain a lead frame for
An experimental example of a lead frame for C is shown below.
IC用リードフレームの素材は厚さ0.25awwの4
2合金が用いられた。IC用リードフレームの絞り加工
間の距#Lは、L=15mm、タイパントのRさDYは
、Qy=6閣、リードとDP加工されたグイ±0.03
バットの段差HはH=0.3 mと規定されたもの
に対し、次表のたたき寸法のものが第1図(a)。The material of the IC lead frame is 4 with a thickness of 0.25 aww.
Two alloys were used. The distance #L between the drawing processes of the IC lead frame is L = 15 mm, the radius DY of the tie pant is Qy = 6 mm, the lead and the DP processed guide are ±0.03, and the step H of the butt is H = 0. In contrast to those specified as 3 m, those with the dimensions shown in the table below are shown in Figure 1 (a).
(b)に示す6箇所A、B、C,D、E、Fに施された
。It was applied to six locations A, B, C, D, E, and F shown in (b).
表
この結果、ダイパット上面とリード上面との段差Hは
H= 0.28〜0.32m+となり、与えられたHの
許容範囲に納まった。As a result, the height difference H between the top surface of the die pad and the top surface of the leads was H=0.28 to 0.32 m+, which was within the given tolerance range of H.
参考までにただきE、Fを施さない場合の段差H°を示
すと、
H’ =0.23〜0.30+ll11で、所望の段差
が得られないことが分る。For reference, the level difference H° in the case where E and F are not applied shows that H'=0.23 to 0.30+ll11, and the desired level difference cannot be obtained.
〈発明の効果〉
本発明によるIC用リードフレームによれば、グイパン
ト部を支持するダイパット支持片がとくに長いものにお
いて、DP絞り加工によるそりを矯正するためのたたき
を、絞り加工端部の外に更に、絞り加工端部とダイパッ
トとの間に施したことによって、そりが矯正され、精度
の高いダイパットの段差をもつIC用リードフレームが
得られた。これによって、IC用リードフレームのダイ
パットの段差のばらつきが少なくなり、ダイパット」ユ
のICチップの端子群とリードとのワイヤポンディング
の作業の信頼性が一段と向−ヒされ、優れた品質のIC
製品が得られるようになった。<Effects of the Invention> According to the IC lead frame according to the present invention, when the die pad support piece that supports the guide pant part is particularly long, the beating for correcting the warp due to the DP drawing process is not applied to the outside of the drawing process end. Furthermore, by applying the drawing process between the end of the drawing process and the die pad, the warpage was corrected, and an IC lead frame with highly accurate die pad steps was obtained. As a result, variations in the steps of the die pad of the IC lead frame are reduced, and the reliability of the wire bonding work between the terminal group and the lead of the IC chip on the die pad is further improved.
The product is now available.
第1図(a)は本発明によるIC用リードフレームのダ
イパット部分の平面図、第1図(b)は第1図(a)に
示すものの側面図、第2図(a)はIC用リードフレー
ムの平面図、第2図(b)は第2図(a)に示すものの
ダイパット部分の側面図、第3図及び第4図は従来のI
C用、リードフレームのダイパット支持片のDP絞り加
工を説明する図である・
図面中。
4はダイパット、5はダイノくット支持片、A、BB、
C,D、E、Fはたたき加工部分である。FIG. 1(a) is a plan view of the die pad portion of the IC lead frame according to the present invention, FIG. 1(b) is a side view of the die pad part shown in FIG. 1(a), and FIG. 2(a) is the IC lead. A plan view of the frame, FIG. 2(b) is a side view of the die pad part of the frame shown in FIG. 2(a), and FIGS. 3 and 4 are the conventional I
This is a diagram illustrating the DP drawing process of the die pad support piece of the lead frame for C. 4 is a die pad, 5 is a die pad support piece, A, BB,
C, D, E, and F are the pounded parts.
Claims (1)
対して段差をつけて低めたIC用リードフレームにおい
て、上記IC用リードフレームのダイパットをつなぐダ
イパット支持片に上記段差を与えるためのDP絞り加工
を施すとともに、該絞り加工部の両端部ならびに、該絞
り加工部と上記ダイパットの間にたたきを入れたことを
特徴とするIC用リードフレーム。In an IC lead frame in which the top surface of the die pad of the IC lead frame is lowered by creating a step with respect to the top surface of the lead, a DP drawing process is applied to the die pad support piece that connects the die pad of the IC lead frame to provide the step. A lead frame for an IC, characterized in that a punch is provided at both ends of the drawn portion and between the drawn portion and the die pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16762185A JPS6230355A (en) | 1985-07-31 | 1985-07-31 | Lead frame for ic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16762185A JPS6230355A (en) | 1985-07-31 | 1985-07-31 | Lead frame for ic |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6230355A true JPS6230355A (en) | 1987-02-09 |
Family
ID=15853181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16762185A Pending JPS6230355A (en) | 1985-07-31 | 1985-07-31 | Lead frame for ic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6230355A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01130551A (en) * | 1987-11-17 | 1989-05-23 | Toshiba Corp | Manufacture of lead frame for semiconductor device |
-
1985
- 1985-07-31 JP JP16762185A patent/JPS6230355A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01130551A (en) * | 1987-11-17 | 1989-05-23 | Toshiba Corp | Manufacture of lead frame for semiconductor device |
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