JPS62299704A - Inspecting instrument for package parts - Google Patents

Abstract

PURPOSE:To accurately detect even a parts which is inferior in color contrast by detecting reflected light obtained by irradiating a printed circuit board with a slit type light beam by a line sensor while swinging the light beam by a galvanomirror. CONSTITUTION:The reflected light l4 obtained by projecting the slit type light beam l3 is swung up and down by the galvanomirror 6 and detected by the line sensor 7 successively to detect the reflected light from different height on a printed board by photodetecting elements. Then, a peak value detecting circuit 13 detects peak values of detection signals obtained by the respective photodetecting elements of the line sensor 7 to obtain height data and brightness data corresponding to the peak values. Then, a CPU 15 compares those data with reference data stored previously in a memory 14 and decides the package state of the parts based on the comparison result. Consequently, even the parts which is inferior in color contrast is accurately detected.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention [Summary] The present invention is a mounting method that inspects the mounting state of components by illuminating a printed board on which components are mounted and detecting the reflected light. Conventionally, in component inspection equipment, the reflected light was detected as a grayscale image, so parts with a color that contrasted poorly with the board could not be accurately detected.In order to solve the problem, we installed a slit on the printed board. The reflected light obtained by irradiating a shaped light beam is detected by a line sensor while being swung by a galvano mirror, height data and brightness data at the peak value of the detection signal are obtained, and based on these data, the parts are determined. By determining the mounting state, it is possible to accurately detect components with poor color contrast as described above, and also to determine various defects such as component height defects and wrong product types. be.

[Industrial application field]

The present invention relates to a mounted component inspection device that automatically optically inspects the mounting state of electronic components (particularly chip components) mounted on a printed board.

BACKGROUND ART Recently, electronic components mounted on printed circuit boards have been becoming smaller and more densely packaged, especially as seen in chip components. For this reason, the conventional visual inspection has become increasingly difficult, and automation of the visual inspection has recently been strongly desired.

[Traditional techniques]

Conventionally, various automatic inspection devices for mounted components have been proposed. All of these devices are based on illuminating the substrate surface in a planar manner, detecting the reflected light as a grayscale image, and comparing the image with a normal image that serves as a reference.

[Problem that the invention seeks to solve]

As mentioned above, the conventional equipment performs inspection based on gray scale images, so it is only possible to inspect parts that can be detected with good color contrast to the board (generally dark green), which is generally common. Black parts could not be inspected. Furthermore, even if a component has good contrast, it is possible to inspect for planar positional deviations, etc., but it is not possible to inspect for abnormalities in the height direction (height defects).

In view of the above-mentioned problems, the present invention is capable of accurately inspecting parts with poor color contrast, and is capable of not only inspecting the presence or absence of parts and misalignment, but also detecting various defects such as defective heights and different types of parts. The purpose of the present invention is to provide a mounted component inspection device that can also inspect.

(Means for Solving the Problems) The present invention is an optical system for detecting the height of a component based on the principle of the optical cutting method. It is equipped with a light irradiation means that irradiates a light beam, and a light detection means that sequentially detects the reflected light with a line sensor while swinging the reflected light in the vertical direction with a galvanometer mirror.

Next, as a signal processing system, a peak detection means is provided which detects the peak value of the detection signal sequentially obtained for each light receiving element of the line sensor and obtains height data and brightness data at this peak value. The device is equipped with a determining means that compares the data with pre-stored reference data and determines the mounting state of the component based on the result.

[For production]

As described above, if the reflected light from irradiation with the slit-shaped light beam is swayed in the vertical direction by the galvano mirror, the reflected light image formed will also be swayed in the vertical direction, that is, in the height direction. By sequentially detecting this with a line sensor, it is possible to sequentially detect reflected light from different heights on the printed board for each light receiving element.

In the plurality of detection signals sequentially obtained for each light-receiving element in this way, the order in which they were obtained corresponds to the height, and the intensity thereof corresponds to the luminance at the height. Further, since the direct reflected light from the top surface of the board or component is stronger than the light that has come around from the surroundings, the plurality of detection signals described above have a peak value somewhere. Therefore, if this peak value is detected, the height data and brightness data at this peak value accurately correspond to the height and brightness at the top surface of the board or component.

By looking at the height data obtained as described above at each position on the printed board, it is possible to know the three-dimensional shape and position of the component on the printed board. Therefore, by comparing the above-mentioned height data with reference data including the reference shape, position, etc., it is possible to inspect the presence or absence of parts, positional deviation, height defects, etc. related to color contrast.

Furthermore, by looking at the luminance data obtained as described above at each position on the printed board, it is possible to know patterns (for example, characters or symbols drawn on the component) that appear due to differences in luminance on the top surface of the component.

Therefore, by comparing the luminance data with reference data including reference characters, symbols, etc., it is also possible to check for differences in the type of parts, differences in direction, etc.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a configuration diagram showing an embodiment of the present invention.

In the figure, the present embodiment first includes a light irradiation means consisting of a semiconductor laser 1, a collimating lens 2, and a cylindrical lens 3. This light irradiation means converts a laser beam 11 output from a semiconductor laser 1 into parallel light I12 with a collimating lens 2, and further converts it into a slit-shaped light beam (hereinafter referred to as a slit beam) 13 with a cylindrical lens 3. This slit beam 13 is irradiated from directly above onto the pudding l-1a P placed on the stage 4 movable in the X and Y directions. The printed board P is
Various components (particularly chip components) Q are mounted on the substrate P, and optical cutting lines are formed on the substrate R and the components Q by irradiation with the slit beam 13.

Furthermore, it is provided with a light detection means consisting of an imaging lens 5, a galvanometer mirror 6, and a line sensor (for example, a COD line sensor, etc.) 7. This light detection means first guides diagonally upwardly reflected light 14 from the printed board P due to the irradiation of the slit beam 13 to the galvanomirror 6 via the imaging lens 5. The galvano mirror 6 is connected to the motor 8
It is fixed to a rotating shaft 8a, and finely reciprocated (vibrates) within a certain angular range. Then, the reflected light p4 guided to the galvanometer mirror 6 is swung up and down along with the vibration. A line sensor 7 sequentially detects this reflected light. Then, the line sensor 7 sequentially detects the reflected light ρ4 from different heights, and by swinging the galvanometer mirror 6 once in one direction, the entire image of the reflected light 14 can be seen. Can be done. Hereinafter, this image will be referred to as a "light-section image."

As shown in FIG. 3(a), this light-cutting image is a substantially slit-shaped image (ml .

m2. m3), and these become multi-tone gradation images corresponding to the luminance of the object.

In Figure 3 (al), images m+, m2, and m3 correspond to high parts, low parts, and boards, respectively.The image obtained by the line sensor 7 in this way can be expressed by an X address and 2 addresses. , X address is line sensor 7
It corresponds to each light receiving element (CCD etc.).

Here, a specific synchronization relationship for sequentially and appropriately obtaining the above-mentioned light section images is shown in FIG. In the same figure, first, the 5YNC of the CCD is the timing at which data is taken into each light receiving element (herein referred to as COD) constituting the line sensor 7.
5YN of galvanometer mirror 6 in synchronization with pulse (C)
A C pulse (bl) is generated.Then, the inclination of the galvano mirror drive signal (al) is changed every 5 YNC pulses (bl).The galvano mirror 6 is swung vertically in proportion to this drive signal (al). In addition, the above 5YN
A feed pulse [d) for the stage 4 is generated in synchronization with the C pulse fc). Each time there is a sending pulse (dl), the stage 4 moves a certain distance (for example, 100 μm) in the y direction.
) will be moved. These signals are generated by the signal processing circuit 9 and supplied to the line sensor drive circuit 10, galvano mirror drive circuit 11, and stage drive circuit 12, so that the line sensor 7, galvano mirror 6, and stage 4 are synchronized with each other. It is driven by

When a two-dimensional image is obtained using the galvanometer mirror 6 and one-dimensional line sensor 7 as described above,
Generally, compared to using a two-dimensional CCD sensor or a TV left camera having a pixel count of about 500 x 500, for example, there is an advantage that the measurement speed is significantly improved. The reason for this will be explained below.

In order to detect the positional deviation of chip components, Q, lim
A certain degree of positional resolution is required. Further, the height of the lowest chip component is about 0.5B, and in order to distinguish this from a substrate, a height measurement resolution of about 0.2W is required. On the other hand, the height measurement range needs to be about 10 m, including the height range of the chip components and the warpage of the substrate. From these facts, the vertical size of the light section image is 50 (
= 1010.2) pixels are required. However,
When a two-dimensional CCD sensor as described above is used, the vertical size is 500 pixels, which is larger than necessary, resulting in poor signal processing efficiency. For example, it takes about 33 m5ec to measure the height of 500 points. On the other hand, in this embodiment, for example, the line sensor 7 with 2048 pixels is
If it is operated with a Hz clock, it will take only about 1Qmsec to measure the heights of 2048 points. Therefore, according to this embodiment, a measurement speed approximately 13 times faster than when using a two-dimensional sensor can be obtained.

Next, a peak detection circuit 13 is provided as a processing system for detection signals sequentially obtained by the line sensor 7. Figure 3 f8
In the light-cut image shown in Figure 3 (b )).

The peak detection circuit 13 is a circuit that processes the detection signal of each light-receiving element in real time to detect the peak, and obtains height data and brightness data at this peak. Since the height data and brightness data at the peak accurately correspond to the height and brightness of the detection target surface, highly accurate component detection is possible. Specifically, the peak detection circuit 13 is
As shown in the figure.

In FIG. 4, first, each detection signal (COD detection signal) obtained from all the light receiving elements (herein referred to as COD) in the line sensor 7 is sequentially sampled by the A/DiiM circuit 21 according to the COD data clock. death,
For example, it is converted into 8-bit gradation digital data. On the other hand, the above COD data clock is sequentially counted by the X counter 22, and this count value is 5YN of COD.
Cleared by C pulse. This count value corresponds to the X address of the data taken in by the A/D conversion circuit 21.

Next, the newly obtained data from the A/D conversion circuit 21 is applied to one input terminal of the comparator 23, and
The data written in the address specified by the X counter 22 of the brightness memory 24 is applied to the other input terminal of the comparator 23 via the path selector 25, and these two data are compared. Here, when the former data is larger than the latter data, the former data is newly written to the same address in the brightness memory 24 via the path selector 25 according to an instruction from the timing circuit 26, and
The value of the 2 counter 28 is written to the same address in the height memory 27. This process is performed every time new data is obtained from the A/D conversion circuit 21. The two counters 28 sequentially count the 5YNC pulses of the same CCD as shown in FIG. 2, and are cleared by the 5YNC pulses of the galvanometer mirror. This count value corresponds to two addresses of data taken in by the A/D conversion circuit 21.

In addition, in the brightness memory 24 and the height memory 27, rOJ is written in all addresses and returned to the initial state every time the galvanometer mirror 3 YNC pulse is output.

Therefore, by the time the next galvano mirror 3YNC pulse is output, the maximum brightness data in two directions for each X position is stored in the brightness memory 24 in, for example, 8-bit gradation.
The height memory 27 stores height data (2 addresses) corresponding to the maximum brightness for each X position. This height data corresponds to an xz image at a certain X position, for example as shown in FIG. 3 (bl).

2 When the counter 28 reaches the specified value, the brightness memo IJ24
The luminance data stored in the memory 1 and the height data stored in the height memory 27 are stored in the memory 1 of the system shown in FIG.
4 by DMA. When the next galvanometer mirror 3 YNC pulse is output, rOJ is written to all addresses of the memories 24 and 27 as described above, and the stage feed pulse shown in FIG. 2 is output to move the stage 4. It is moved a certain distance in the y direction, and brightness data and height data are created again at this new X position. In this way, the above process is repeated for each X position in sequence.

Since the galvanometer mirror 6 is used in a reciprocating manner, the method of counting two addresses by the two counter 28 is switched between a count amplifier and a countdown depending on the scanning direction.

Next, a means for determining the mounting state of components based on the height data and luminance data for each position of the printed board P obtained by the above processing in the peak detection circuit 13 will be explained.

Processing for this purpose is mainly performed by the CPU 15. This procedure is schematically shown in FIG. In this embodiment, data such as the mounting position, mounting direction, type, etc. (hereinafter referred to as reference data), which serve as a reference for the component to be inspected, are stored in advance in the memory 14.

In FIG. 5, height data is first input in step S+. Next, in step S2, the height data is binarized,
Processing is performed to distinguish between parts and boards. However, since the board has a warp of about ±2 fl,
It cannot be valued. For this purpose, the following processing is performed.

First, as shown in FIG. 6fa), an area including the part Q to be inspected is set as a window W with respect to the height data. Then, as shown in FIG. 6(b), a histogram of heights within the window W is created. Pay attention to this histogram in order from the lowest height to the highest height, find the height at which the frequency has a peak at a predetermined specific value a or more, and set this height ha as the substrate height. Next, the value hs;Ir is the height slice level obtained by adding, for example, a percentage of the general height of the component to the substrate height ha, and the height data is binarized at this slice level hs. .

By binarizing the height data as described above, even if the board is warped, it is possible to accurately distinguish between the component and the board. Note that the above value may be an allowable value for the height of the component.

Next, the process proceeds to step S3, and the binarized pattern obtained in step S2 is compared with the pattern of the reference data stored in advance. In step S4, the comparison result is checked, and when the degree of mismatch of the reference data (mounting position) 7 is greater than or equal to a certain large value, it is determined that the component is a "missing defect". When the degree of mismatch is smaller than the large value, the process moves to step S5. In step S5, the difference (X and y) between the matched address and the correct address is
It is checked whether or not the value is greater than a certain value, and if it is greater than that, it is determined that the component is "misaligned."

If the difference between the addresses is smaller than the value, it is determined that the component position is normal, and the process proceeds to the next step s6. Note that it is also possible to obtain the relative height of the component with respect to the board from the height data and determine whether it is "height defective".

In step S6, the luminance data is binarized in the same manner as step S2. That is, first, for the luminance data, a histogram as shown in Fig. 6 (fb) is created after setting the window W as shown in Fig. 6 (al), and the slice level is calculated from the distribution. The brightness data is then binarized. The binarized pattern obtained in this way includes a pattern (for example, a character or a symbol drawn on the part to indicate the type of the part) that is visible due to the difference in brightness on the top surface of the part.

Therefore, in step S7, the pattern of product type data in the reference data is compared with the binarized pattern.

In addition, at this time, the mutual positional relationship was rotated by 18°, and 2
Compare degrees. This is to determine the mounting direction of the component. So, check this comparison result with Steer and PuS8, and if the patterns do not match both times, it is determined that the product is different.
It is determined that If the patterns match in an incorrect direction, it is determined in step S9 that the direction is incorrect.

By repeating the above process while sequentially moving and setting the windows W, components on the entire surface of the board can be inspected.

According to this embodiment, height data and brightness data can be obtained at high speed, and parts with poor color contrast can be accurately detected without being affected by board warping (and parts with poor color contrast can be accurately detected). It becomes possible to easily determine various defects such as "" and "wrong product."

Next, other embodiments of the present invention will be described.

In this embodiment, as shown by the broken line in FIG. 1, another set of light detection systems (lens 50, galvanometer mirror, 60° line sensor 70, motor 80) is provided to detect reflected light from two directions, left and right. It is something. By detecting from two directions in this way, invisible parts due to shadows can be eliminated.

A signal processing system for this purpose is shown in FIG. In the same figure,
This signal processing system is a peak detection circuit that processes the respective images obtained by the line sensors 7 and 70 by scanning the galvanometer mirrors 6 and 60 to obtain the maximum brightness in two directions and the corresponding height (2 addresses). 31.32, a data selection circuit 33 that selects either of the data obtained by these two peak detections 31.32, and two buffers that store the selected data (luminance data and height data). It is composed of memories 34 and 35, and a determination circuit 36 that compares a pattern obtained by binarizing this data with a reference pattern stored in advance in a reference data storage section 37 to determine the mounting state of the component. ing.

The peak detection circuit 31 is specifically shown in FIG. In the figure, buffer memories 311 and 312 are mainly
This is a memory for storing maximum brightness data in two directions for each position and height data (two addresses) corresponding thereto, and data is read and written to the address specified by the address controller 313. The arithmetic circuit 314 is connected to the 111 light receiving element (COD) of the line sensor 7.
) and the buffer memory 311 (detection signal) corresponding to the X address of this data.
or 312) is a circuit that calculates the difference with the previous data stored in 312). Another arithmetic circuit 315
is a circuit that compares the above difference with a predetermined value (Δ) and outputs the comparison result. The determination circuit 316 determines whether new CCD data stored in the pipeline register 317 should be written to the buffer memory 312 (or 311) based on the comparison result and the direction of movement of the galvanometer mirror 6. This is the circuit.

The operation of the above circuit will now be explained. Sofa memory 3
11 contains the previous information obtained by COD. When new CCD data enters, it is temporarily held in the pipeline register 317, the data in the buffer memory 311 corresponding to the X address of the data is called, and the difference with the new CCD data is calculated by arithmetic calculation. Calculated by circuit 314. This difference is then set to a predetermined value (
An arithmetic circuit 315 compares whether it is greater than or equal to Δ). This comparison result is checked by the discrimination circuit 316, and if the above difference is Δ or more, the C stored in the pipeline register 317 is
The brightness data and height data (2 addresses) in the CD data (detection signal) are input to the buffer memory 312 and sent to the data selection circuit 33 shown in FIG. Note that if there are two or more peaks in one two-address direction, it is desirable to select the one with the lower height.

Next, specific processing when the determination circuit 316 takes into consideration the vertical vibration direction of the galvanometer mirror 6 will be described based on the flowchart of FIG. In the figure, a write flag F1 is used to indicate whether or not data can be written to the buffer memory 312, and a mirror flag F2 is used to indicate whether the direction of vibration of the galvanometer mirror 6 is upward or downward. First, in step T1, write flag F! Set it to "OoK" to make it possible to write data. Next, the process proceeds to step T2, where the input new CCD data is stored in the buffer memory 3.
It is checked whether the data is larger than the previous data written in 11, that is, whether the data is rising, and if it is rising, the process advances to the next step T3. In step T3,
It is checked whether the write flag F+ is OoK, and if it is O, the new CCD data is written as is into the buffer memory 312 in step T4, and if it is not O, the process returns to step 2 again. That is, until the CCD data reaches its peak, the data in the buffer memory 312 is rewritten with new CCD data.

If the data is falling in step T2, it means that the data has passed its peak, so step T5
It is checked whether the data difference is greater than or equal to a predetermined value Δ, that is, whether it has fallen below the peak by more than Δ. If the difference is smaller than Δ, the process returns to step T2 again, and if the difference is greater than Δ, the mirror flag F2 is checked in step T5 to determine whether the direction of vibration of the galvano mirror is upward (↑) or downward (1). .

When the vibration direction is upward, the current peak is the lowest peak in the two directions, so the write flag F+ is set to O in step T7.
, K to make data writing impossible. On the other hand, when the moving direction is downward, the process returns to step T2 to further search for the next peak. As a result, if there are two or more peaks in one two-address direction, the peak with the lowest height is selected, and the luminance data and height data (two addresses) for this peak are determined.

In order to perform the above processing in real time, the buffer memory 3 is
The roles of 11 and 312 are exchanged and written alternately.

Further, the configuration of the peak detection circuit 31 shown in FIG. 8 and its processing operation shown in FIG. 9 are similarly applicable to the other peak detection circuit 32.

Next, the data selection circuit 33 shown in FIG. 7 is specifically shown in FIG. In the same figure, the peak detection circuit 31.3
The brightness data at the peak obtained in step 2 is sent to the arithmetic circuit 33.
1, and also sends the luminance data and its height data to the pipeline register 334. The arithmetic circuit 331 compares the two sent data and outputs the difference. Next, another arithmetic circuit 332 compares the above difference with a predetermined value Δ. The comparison result is checked by the discrimination circuit 333, and if the above-mentioned difference is Δ or more, the data in the pipeline register 33a, the luminance data and the height data from the peak detection circuit 31 are taken out, and the address controller 335 The address of the sofa memory 336 specified by is corrupted. This result is sent to buffer memories 34 and 35 shown in FIG.

Next, the processing of data in the buffer memories 34 and 35 will be specifically explained below. This process includes the process of reading out the contents of the sofa memory 34, 35 and the judgment circuit 3.
In order to perform the judgment process in step 6 in real time,
The usage of the two buffer memories 34 and 35 mentioned above is unique.

First, data obtained by the data selection circuit 33 is basically read and written sequentially by alternately and repeatedly using the two buffer memories 34 and 35. At this time, if there is a component (more precisely, a portion of the brightness data and height data that corresponds to the component) at the joint between the buffer memories 34 and 35, that component is stored in the two buffer memories 34 and 35. There is a fear that the determination circuit 36 will not be able to make an appropriate determination.

Therefore, in this embodiment, as shown in FIG. 11, next-day buffers 34a and 35a are provided at the beginning of each of the buffer memories 34 and 35, each having a space large enough to completely write one component. Then, the parts existing at the seam are written twice. That is, first, data is sequentially written into the buffer memory 34, and when it approaches the end, the same data is simultaneously written into the next day's buffer 35a in the other buffer memory 35.

Thereafter, when writing to the buffer memory 35 approaches the end, the same data is simultaneously written to the next day's buffer 34a in the buffer memory 34. In this way, data is written alternately and repeatedly into the buffer memories 34 and 35. Therefore, in FIG. 11, even if the component Q+ is cut off at the rear end of the buffer memory 34, it is completely contained in the other buffer memory 35.

On the other hand, the data read process and the determination process by the determination circuit 36 proceed simultaneously with the write process.

That is, the data written to the buffer memory 34 is
The data is read out during a period t1 when only the buffer memory 35 is used for writing the next data, and is processed by the determination circuit 36. The data written in the other buffer memory 35 is similarly read out during period t2, and the determination process is performed.

In this determination process, it is sufficient to ignore interrupted parts among the data read out from the buffer memories 34 and 35 and to target only complete parts for determination.

The specific determination process is the same as the process shown in FIG. 5 described above.

In this way, processing can be performed in real time and without the influence of stitches.

For reference, FIG. 12 shows an example of the correspondence between the addresses used above and the surface to be detected (printed board). For example, when a line sensor with 2048 pixels is used, this one line corresponds to 200H of an actual printed board. Due to the reciprocation of the galvano mirror and the accompanying movement of the stage, the buffer memory stores data (51m x 200m) corresponding to one block (51m x 200m) on the printed board.
For height data, two addresses are written for each x and y position, and for brightness data, two addresses are written for each x and y position (detected signal strength for each x and y position). Considering that the length of the chimbu part is about 2 cranes, it overlaps with the next block by 3 tl in order to eliminate the above-mentioned joint effect.

〔Effect of the invention〕

According to the present invention, it is possible to accurately inspect even parts with poor color contrast, and it is also possible to inspect not only the presence or absence of parts and misalignment, but also various defects such as poor height of parts and wrong product type. .

[Brief explanation of drawings]

Fig. 1 is a configuration diagram showing an embodiment of the present invention, Fig. 2 is a waveform diagram showing the synchronization relationship in the same embodiment, and Fig. 3 (al is an example of a light cut image obtained by detection with a line sensor. Figure 3 (G)) is a diagram showing the highest brightness points in two directions of the image shown in Figure (al), and Figure 4 shows the peak detection circuit 13 in Figure 1 in more detail. A circuit diagram, FIG. 5 is a flowchart showing the processing of the determination means according to the same embodiment, and FIG. (b) is a diagram showing histogram processing for determining the slice level when performing binarization processing of height data; FIG. 7 is a block diagram showing a signal processing system according to another embodiment of the present invention; Fig. 8 is a circuit diagram showing more specifically the three components of the peak detection circuit shown in Fig. 7, Fig. 9 is a flowchart showing the processing operation of the circuit shown in Fig. 8, and Fig. 10 is the data selection shown in Fig. 7. A circuit diagram showing the circuit 33 in more detail, FIG. 11 is a diagram schematically showing the processing of writing and reading data in the buffer memory 34 and 35, and FIG. 12 shows the address of the obtained data and the surface to be detected. FIG. DESCRIPTION OF SYMBOLS 1... Semiconductor laser, 2... Collimating lens, 3... Cylindrical lens, 6... Galvano mirror 1 7... Line sensor, 13... Peak detection circuit, 31.32... Peak Detection circuit, 33... Data selection circuit, 34.35... Buffer memory, 36... Judgment circuit, 60... Galvano mirror 1 70... Line sensor.

Claims (1)

[Scope of Claims] 1) Light irradiation means (1, 2, 3) for irradiating a slit-shaped light beam onto a printed board on which components are mounted; and irradiating the printed board with the light beam. Galvano mirror (6) to reflect light in a direction different from the direction
The light detection means (5, 6, 7,
8); and peak detection means (13) for detecting a peak value of a detection signal sequentially obtained for each light receiving element of the line sensor according to the swing of the galvanometer mirror, and obtaining height data and brightness data at the peak value. The height data and luminance data for each position of the printed board obtained by the peak detection means are compared with pre-stored reference data, and various mounting states of the components are determined based on the comparison results. A mounted component inspection device characterized by comprising: a determining means. 2) The light irradiation means includes a semiconductor laser (1) that outputs a laser beam, a collimating lens (2) that converts the laser beam obtained by the semiconductor laser into parallel light, and a collimating lens that converts the parallel light obtained by the collimating lens. The mounted component inspection apparatus according to claim 1, further comprising a cylindrical lens (3) that converts the light beam into a slit-shaped light beam. 3) The light detection means includes two sets (6, 7; 60, 70) of the galvanometer mirror and the line sensor, and detects the reflected light from two different directions. The mounted component inspection device according to item 1 or 2. 4) The mounted component inspection apparatus according to any one of claims 1 to 3, wherein the line sensor is a CCD line sensor. 5) The mounted component inspection apparatus according to any one of claims 1 to 4, wherein the processing by the peak detection means and the determination means is performed in real time. 6) The determining means binarizes the height data and compares it with the component position of the reference data to determine the presence or absence of the component and positional deviation, and also determines the presence or absence of the component and the positional deviation of the print obtained from the height data. By comparing the relative height of the component with respect to the board of the board with the component height of the reference data, a determination is made as to whether the height of the component is defective, and furthermore, the characters on the component obtained by binarizing the luminance data are According to any one of claims 1 to 5, a determination is made as to a difference in type and direction of the parts by comparing a symbol with a character/symbol of the reference data. mounted parts inspection equipment.