JPS62287640A - Substrate holder for edge reference - Google Patents

Abstract

PURPOSE:To improve the opposing position alignment accuracy of both surfaces of a substrate by a method wherein two each of fixing pins are provided on upper and lower X sides of the substrate while another fixing pin is provided on Y side of the same. CONSTITUTION:Fixing pins 4,5 are provided on the X side 3 end of a substrate holder 2 with vacuum suction holes 1. Another fixing pin 9 is provided on a more distant position than the position 8 bisecting a substrate 7 in the Y direction. The other fixing pins 12, 13 are provided on the Y side 6 opposing to the X side symmetrically with the pins 5, 4 using the line in the X direction passing the fixing pin 9 as a symmetrical axis. The substrate 7 is pressed down onto the fixing pins 4,5 and 9 for masking using a surface photo mask 20 with oblique line part patterns 18 and alignment marks 19 to be exposed. Next, the substrate 7 is made upside-down to press down respective sides onto the fixing pins 9, 12, 13. Finally, the oblique line parts are exposed using another back surface mask 20 provided in the direction reverse to that of the surface.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a printing machine manufactured by Fukimoto Ikuo used for pattern formation of hybrid IC substrates, and particularly relates to a printing machine that is used for forming patterns on hybrid IC substrates. The present invention relates to a holder for a substrate when printing a photoresist edge or paste tt in pattern formation when it is necessary to accurately form a pattern in a facing position.

[Conventional technology]

Generally, when forming all thin film circuit patterns on both sides (front and back) of a ceramic substrate for mixed IC, holes for mask alignment are made in advance along three or four sides of the square ceramic substrate, and then sputtering etc. Apply F Metal Thin M. Next, using a spinner or the like, 7 photoresist' is applied to one side and dried. After that, photoresist is applied again to the other side and dried.

Next, using a photomask for pattern formation on the front side (or back side), align the mark of the same shape with the hole on the ceramic substrate at the same position as the hole on the ceramic substrate previously set on the photomask, and make M, -x. . Thereafter, the entire back surface is subjected to Mr. extraction using a photomask for forming a blood coagulation pattern in the same manner.

In this way, the symmetrical positions of the patterns on the front and back sides can be determined by using the alignment holes on the substrate, or by setting them on the end face of one side of the ceramic substrate and a part of the corner on the photomask in advance. A method is adopted in which alignment patterns such as letter shapes are matched.

At this time, the substrate holder for completely fixing the substrate is fixed by vacuum suction through an L-shaped stopper along one orthogonal side of the holder and a hole on the holder.

[Problems that the invention attempts to solve]

As mentioned above, the conventional alignment method for double-sided pattern formation of ceramic substrates is that for the former, it is necessary to drill holes in the substrate, and alignment is performed one substrate at a time; for the latter, Align each substrate using the edge of the holder, or use all the L-shaped stoppers on the holder, and after aligning the first substrate (or standard plate), fully fix the photomask and substrate holder, and then align the second substrate. Thereafter, it is possible to perform alignment by simply aligning with the stopper, but when forming the surface pattern, the end surface of the substrate that contacts the stopper is different from the same base and end surface used when forming the surface pattern. However, the work efficiency (aligning one sheet at a time) is poor, and the double-sided alignment accuracy is easily affected by the processing accuracy of the ceramic substrate itself.

[Originality of invention]

The substrate holder used in the above-mentioned conventional technology when it is necessary to accurately form a pattern at opposite positions on both sides of the substrate has a stopper (an L-shaped pin) that fixes one orthogonal side of the substrate. In contrast, in the present invention, the substrate holder size is slightly larger, and there is one on each orthogonal side to which the substrate is fixed.

Two fixing pins on other sides? - Contents of ``Germany-1'' in which both sides are aligned using a total of 5 fixing pins, placed at foot spacing, and 2 fixing pins placed parallel to and opposite the 2 fixing pins. has.

[Means for solving problems]

The present invention relates to a method for accurately aligning a hybrid IC pattern to a position opposite to a surface pattern when forming a hybrid IC pattern on both sides of a ceramic substrate, and the present invention relates to a method for accurately aligning a hybrid IC pattern to a position opposite to a surface pattern. Shadow of dimensional accuracy 41: With the aim of minimizing the shadow as much as possible, two fixing pins are set along one orthogonal Y side on the substrate holder that has a vacuum suction hole, and one fixing pin is set along the Y side. Provided at a distance of 9 or more from the center (1/2) of the board, and further along the other side opposite to the Y side in the X direction,
Two pins with the same spacing as the fixing pins of the book, and the same distance from the position of the two fixing pins to the one fixing pin on the Y side in the Y direction, totaling 5 I have a copy of the book.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a plan view and cross-sectional view of an embodiment of the present invention. Two fixing pins 4.5 are attached to one orthogonal side X side three ends on the substrate holder 2 having the vacuum suction hole 1 shown in FIG.
are provided at regular intervals. Next, for example, in the case of the board 7, the 6th end of the Y side is divided into two equal parts in the Y direction on the board, t! i:8
One fixing pin 9 is provided at a distance of 9 or more. Further Y
In the X direction along the other side opposite to the side, the fixing pin 4,
Fixing pins 12.13' are provided at the same intervals as 5 and at a distance 11 that is the same as the distance 10 between fixing pins 4.5 and 9. Note that the fixing pins are made lower than the thickness of the substrate so that the photomask and the substrate can be brought into close contact as shown in FIG. 1(b).

After preparing the substrate holder having the above structure, the metal thin film 15 and the photoresist 16 are adhered to the substrate 7, and a standard plate of the same size as the substrate is pressed onto the fixing pins 4.5 and 9. At this time, the vacuum suction holes other than the area of the substrate are covered with tape 14 or the like. Next, the inside of the holder is evacuated 17 and adsorbed.

After that, the corners of the X and Y sides of the board 7 can be seen in Figure 2 (b).
The mask is aligned using a photomask 20' having a hatched pattern 18 and alignment marks 19 in the transparent portion shown in FIG. Next, make the photomask substrate holder movable only in the vertical direction and fix it so that it does not move in the It costs 9j4 yuan for the ultraviolet light. Next, the photomask and the substrate are separated, the entire substrate is taken out of the substrate holder, and the entire substrate is set on the second substrate fixing pin, and the photomask and the substrate are brought into close contact with each other without alignment, and then the photomask is exposed. After that, repeat the process for the second required number of sheets.

Next, in the process shown in FIG.
When aligning the mask on the board, press each side of the box that touches the fixing pins 4, 5.9 to the fixing pins 9, 12, 13, and position it at the same part of each side that touches the fixing pins 4, 5.9. I can do it.

From now on, as shown in FIG.
The process is performed in the same way as the g element of the surface pattern using 0. In this operation, as in the first factor (f), the back pattern exposure portion 21 can be exposed to the same position facing the front surface pattern exposure portion 21.

After that, the photoresist is developed, the unnecessary metal film is etched, and the photoresist is peeled off.The desired gold Is film is then placed at the same opposing positions on the front and back surfaces of the substrate as shown in FIG. 1(g). is formed.

FIG. 2 is a plan view and a sectional view of a second embodiment of the present invention. Embodiment 2 is an example in which the F pattern is printed at the same position facing each other on both sides of the substrate.

The photomask of Example 1 was fabricated as shown in FIGS. 2A and 2F, with holes 24 in a desired pattern through which the printing paste could pass, and alignment marks 25 on which the edge corners of the substrate could be seen. In place of the printing screen 22, a substrate holder having the same structure as that shown in FIG. 1 is used. Next, when printing the front side and the back side, the same positioning meeting as in Example 1 is performed.

As a result, the same effect as in Example 1 can be obtained in the structure shown in FIG. 2(C). Further, since patterns can be formed on both sides by combining Examples 1 and 2, there is an advantage of versatility.

[The young fruits of invention]

As explained above, the present invention has two fixing pins along the Y side of the straight father on the substrate holder, one fixing pin along the Y side, and another side opposite to the Y side. at the same distance as the two fixing pins in the X direction, and at the same distance as the distance from the blade to the one fixing pin on the Y side in the Y direction from the 0 position of the two fixing pins. By providing the real pins, there is no need to drill holes for alignment marks in the ceramic substrate in advance.

Further, the influence of the accuracy of the external dimensions of the substrate can be minimized. Furthermore, once only the first board is aligned, from then on, simply by successively setting the boards on the fixing pins, both sides of the boards can be aligned relative to each other, improving work efficiency.

[Brief Description of the Drawings] Figure 1 is a plan view and cross-sectional view showing Embodiment 1 of the present invention;
FIG. 2 is a plan view and a cross-sectional view showing a second embodiment of the present invention.

Claims (1)

[Claims] Two fixing pins are provided along the X side of one orthogonal side on the rectangular substrate holder having vacuum suction holes, and one fixing pin is provided along the Y side, and further in the X direction of the other side opposite to the X side. Two pins are provided at the same interval as the two fixing pins, and at the same distance from the position of the two fixing pins in the Y direction to the one fixing pin on the Y side. A substrate holder for end-face reference.