JPS6228664A - Method for connecting silicon wafer capillary column with pipe - Google Patents

Method for connecting silicon wafer capillary column with pipe

Info

Publication number
JPS6228664A
JPS6228664A JP16920085A JP16920085A JPS6228664A JP S6228664 A JPS6228664 A JP S6228664A JP 16920085 A JP16920085 A JP 16920085A JP 16920085 A JP16920085 A JP 16920085A JP S6228664 A JPS6228664 A JP S6228664A
Authority
JP
Japan
Prior art keywords
pipe
capillary column
silicon wafer
hole
glass plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16920085A
Other languages
Japanese (ja)
Inventor
Eiichi Yano
矢野 栄一
Chiaki Toyoda
豊田 千暁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sord Computer Corp
Original Assignee
Sord Computer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sord Computer Corp filed Critical Sord Computer Corp
Priority to JP16920085A priority Critical patent/JPS6228664A/en
Publication of JPS6228664A publication Critical patent/JPS6228664A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N30/00Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
    • G01N30/02Column chromatography
    • G01N30/60Construction of the column
    • G01N30/6034Construction of the column joining multiple columns
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N30/00Investigating or analysing materials by separation into components using adsorption, absorption or similar phenomena or using ion-exchange, e.g. chromatography or field flow fractionation
    • G01N30/02Column chromatography
    • G01N30/60Construction of the column
    • G01N30/6095Micromachined or nanomachined, e.g. micro- or nanosize

Abstract

PURPOSE:To easily connect a silicon wafer capillary column with a pipe and, at the same time, to make the connecting pipe exchangeable, by piercing a through hole communicated with the capillary column through a glass plate and inserting the pipe into the through hole. CONSTITUTION:A cappilary column groove is formed in a silicon wafer 1 by etching and a capillary column 1a is formed by joining a glass plate 2 to the surface of the wafer 1. The capillary column 1a is coupled with a pipe 3 by means of a through hole 2a provided through the glass plate 2. By making a bonding agent to flow into the through hole of the glass plate, the pipe is fixed and gas leakage from the coupled section is prevented. In addition, the pipe for the connection can be exchanged attachably and detachably with another one easily.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は、シリコン・ウェハーガス・クロマトグラフに
おけるシリコン・ウェハーキャヒラリイ・カラムへのガ
ス注入または〃ス排出用のパイプの接続方法に関する。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method for connecting a pipe for gas injection or exhaust to a silicon wafer capillary column in a silicon wafer gas chromatograph.

(従来技術及びその問題点) シリコン争つェハー〃ス・クロマトグラフにおけるシリ
コン・ウェハーキャピラリィ・カラムとガス注入または
〃ス排出用のパイプ(以下「パイプ」という。)の接続
は、キャピラリィ・カラム溝を形成したシリコン・ウェ
ハーの背面へ貫通する貫通孔を形成し、その貫通孔へパ
イプを垂直に立てて接続を行なっていた(第2図参照)
。その際、パイプの内径は約0 、5 ll1mからl
l1lIIlと細く、しかも、シリコン・ウェハー面は
鏡面仕上げのため、接続部からがスが漏れないように接
続することは非常に困難であったが、接着剤と接続部材
の改良等により、パイプとシリコン・ウェハーの接続は
可能となった。
(Prior art and its problems) In a silicon wafer chromatograph, a silicon wafer capillary column and a gas injection or gas discharge pipe (hereinafter referred to as "pipe") are connected to each other. A through hole was formed on the back side of a silicon wafer with a groove formed thereon, and a pipe was erected vertically into the through hole for connection (see Figure 2).
. At that time, the inner diameter of the pipe is approximately 0.5 1 m to 1 m.
Because the silicon wafer is as thin as 111IIl and has a mirror-finished surface, it was extremely difficult to connect the pipe without leaking gas from the joint. However, improvements in adhesives and connecting materials have made it possible to connect the pipe with the mirror finish. It became possible to connect silicon wafers.

しかるに、従来は、シリコン・ウェハーに貫通孔を形成
し、その貫通孔にパイプを挿入し、接続部に接着剤を注
入してシリコン・ウェハーとの接続を行なっていたため
、シリコン・ウェハーの厚さが400μmと非常に薄い
ことがら画一的な貫通孔の形成に手数がかがる問題があ
り、また、パイブの外径は、シリコン・ウェハーの貫通
孔の直径より小さいことから、接着用のシールテープそ
の他の接着部材ががス流路内に侵入し、ガス流を妨げ・
ガス・クロマトグラフのガス流量抵抗の増加を招来し、
昇温時のガス・クロマトグラフの性能不安定の原因とな
っていた。
However, in the past, the connection to the silicon wafer was made by forming a through hole in the silicon wafer, inserting a pipe into the through hole, and injecting adhesive into the connection part. Since the pipe is extremely thin at 400 μm, it is difficult to form a uniform through-hole, and the outer diameter of the pipe is smaller than the diameter of the through-hole in the silicon wafer, so it is difficult to form a uniform through-hole. Sealing tape and other adhesive materials may enter the gas flow path and obstruct or hinder the gas flow.
This results in an increase in the gas flow resistance of the gas chromatograph.
This caused the performance of gas chromatographs to become unstable when the temperature was increased.

(発明の目的) 本発明は、このような問題を解消するものであり、パイ
プとシリコン・ウェハーキャピラリィ・カラムを簡便に
接続し、かつ接続用パイプを交換可能にしたシリコン・
ウヱハーキャピラリィ・カラムの接続方法を提供するこ
とを目的とする。
(Purpose of the Invention) The present invention solves these problems by providing a silicon wafer capillary column that easily connects a pipe and a silicon wafer capillary column, and that allows the connecting pipe to be replaced.
The purpose of this invention is to provide a method for connecting wafer capillaries and columns.

(発明の構成) 本発明の構成を概括すると、本発明は、シリコン・ウェ
ハー面に形成されたキャピラリィ・カラム溝と7y5ス
板の接着により形成されるキャピラリィ・カラムと連通
する貫通孔をガラス板に形成し、該ガラス板にパイプを
挿入することにより、キャピラリィ・カラムとのガス注
入または排出を行なうことを特徴とするシリコン・ウェ
ハーキャピラリィ・カラムのパイプ接続方法である。本
発明は、ガラス板の貫通孔に接着剤を流入してパイプの
固定とともに接続部からのガス漏れを防止し、ガラス板
の貫通孔の内径を上段と下段で異なる寸法に形成してい
る。
(Structure of the Invention) To summarize the structure of the present invention, the present invention provides a through-hole that communicates with a capillary column groove formed on a silicon wafer surface and a capillary column formed by adhering a 7y5 plate to a glass plate. This is a method for connecting a silicon wafer capillary column with a pipe, characterized in that gas is injected into or discharged from the capillary column by inserting a pipe into the glass plate. The present invention fixes the pipe and prevents gas leakage from the connection by flowing an adhesive into the through-hole of the glass plate, and the inner diameter of the through-hole of the glass plate is formed to have different dimensions for the upper stage and the lower stage.

(発明の実施例) 本発明の構成及び実施例を図面に基づいて説明する。f
jS1図は、本発明の構造を示す断面図であり、1はシ
リコン・ウェハー、2ハブラス板、3はパイプである。
(Embodiments of the Invention) The configuration and embodiments of the present invention will be described based on the drawings. f
Figure jS1 is a sectional view showing the structure of the present invention, in which 1 is a silicon wafer, 2 is a hub glass plate, and 3 is a pipe.

シリコン・ウェハー1には、エツチングによりキャピラ
リィ・カラム溝を形成し、キャピラリィ・カラム1aは
がラス板2との接着により形成される。キャピラリィ・
カラム1aとパイプ3とは、ガラス板2に穿設した貫通
孔2aを介して接続する。ガラス板2の貫通孔2aの内
径は、上段2bと下段2cとで異なる寸法に形成する。
Capillary column grooves are formed in the silicon wafer 1 by etching, and capillary columns 1a are formed by adhesion to the lath plate 2. Capillary
The column 1a and the pipe 3 are connected through a through hole 2a bored in the glass plate 2. The inner diameter of the through hole 2a of the glass plate 2 is formed to have a different size between the upper stage 2b and the lower stage 2c.

本発明の実施例では、パイプ3の外径は0 、5111
111゜貫通孔2aの下段2cの内径は0 、6 +a
m、上段2bの内径は2++u++である。0 、5 
mn+のパイプ3は、貫通7L2 aの下段2Cに挿入
され、貫通孔2aの上段2bに接着剤4を注入する。接
着剤4の代わりに、パイプ3の先端近傍にシールテープ
を巻回し、耐熱ゴムでさらに包んで接着部材4aを形成
し、貫通孔2aに挿入すると上段2bによって接着部材
4aまたは前記接着剤4ががス流路へ侵入するのを阻止
できる。
In the embodiment of the present invention, the outer diameter of the pipe 3 is 0,5111
111° The inner diameter of the lower stage 2c of the through hole 2a is 0,6 +a
m, and the inner diameter of the upper stage 2b is 2++u++. 0, 5
The mn+ pipe 3 is inserted into the lower stage 2C of the through hole 7L2a, and the adhesive 4 is injected into the upper stage 2b of the through hole 2a. Instead of the adhesive 4, a sealing tape is wound around the tip of the pipe 3 and further wrapped with heat-resistant rubber to form the adhesive member 4a. When inserted into the through hole 2a, the adhesive member 4a or the adhesive 4 is removed by the upper stage 2b. can be prevented from entering the gas flow path.

(発明の効果) 本発明は、以上の構成であるから、パイプとシリコン・
ウェハーの接続部からガス漏れが解消できるとともに、
接続部における接着剤及び接着部材がガス流路に侵入し
てガス・クロマトグラフの測定の妨害を皆無とし、かつ
、接続用パイプの着脱交換を簡便にする効果を奏する。
(Effect of the invention) Since the present invention has the above configuration, the pipe and the silicon
In addition to eliminating gas leaks from the wafer connections,
Adhesives and adhesive members at the connecting portions do not interfere with gas chromatograph measurements due to intrusion into the gas flow path, and the connecting pipes can be easily attached and detached.

【図面の簡単な説明】[Brief explanation of drawings]

11図は、本発明に係るパイプの接続方法の実施状態を
示す断面図、第2図は、従来例を示す断面図である。第
1図及びtllJ2図において同一部分は、同一符号で
表わされている。 1・・・シリコン・ウェハー 1a・・・キャピラリィ・カラム 2・・・〃ラス@2a・・・貫通孔 3・・・パイプ      4・・・接着剤4a・・・
接着部材
FIG. 11 is a sectional view showing an implementation state of the pipe connecting method according to the present invention, and FIG. 2 is a sectional view showing a conventional example. Identical parts in FIG. 1 and tllJ2 are denoted by the same reference numerals. 1...Silicon wafer 1a...Capillary column 2...Rath@2a...Through hole 3...Pipe 4...Adhesive 4a...
Adhesive material

Claims (1)

【特許請求の範囲】[Claims] シリコン・ウェハーの表面にキャピラリィ・カラム溝を
形成し、該キャピラリィ・カラム溝とガラス板を接着す
ることにより形成されるシリコン・ウェハーキャピラリ
ィ・カラムとパイプとの接続方法において、前記ガラス
板にキャピラリィ・カラムと連通する貫通孔を穿設し、
該貫通孔にパイプを挿入したことを特徴とするシリコン
・ウェハーキャピラリィ・カラムとパイプの接続方法。
In a method for connecting a silicon wafer capillary column and a pipe by forming a capillary column groove on the surface of a silicon wafer and bonding the capillary column groove to a glass plate, the capillary column groove is bonded to the glass plate.・Drill a through hole that communicates with the column,
A method for connecting a silicon wafer capillary column and a pipe, the method comprising inserting a pipe into the through hole.
JP16920085A 1985-07-31 1985-07-31 Method for connecting silicon wafer capillary column with pipe Pending JPS6228664A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16920085A JPS6228664A (en) 1985-07-31 1985-07-31 Method for connecting silicon wafer capillary column with pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16920085A JPS6228664A (en) 1985-07-31 1985-07-31 Method for connecting silicon wafer capillary column with pipe

Publications (1)

Publication Number Publication Date
JPS6228664A true JPS6228664A (en) 1987-02-06

Family

ID=15882062

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16920085A Pending JPS6228664A (en) 1985-07-31 1985-07-31 Method for connecting silicon wafer capillary column with pipe

Country Status (1)

Country Link
JP (1) JPS6228664A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000022409A2 (en) * 1998-10-09 2000-04-20 University Of Alberta Microfluidic devices connected to capillaries with minimal dead volume
US6670024B1 (en) * 2002-06-05 2003-12-30 The Regents Of The University Of California Glass-silicon column

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000022409A2 (en) * 1998-10-09 2000-04-20 University Of Alberta Microfluidic devices connected to capillaries with minimal dead volume
WO2000022409A3 (en) * 1998-10-09 2000-07-13 Univ Alberta Microfluidic devices connected to capillaries with minimal dead volume
US6670024B1 (en) * 2002-06-05 2003-12-30 The Regents Of The University Of California Glass-silicon column

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