JPS6228472U - - Google Patents
Info
- Publication number
- JPS6228472U JPS6228472U JP12006285U JP12006285U JPS6228472U JP S6228472 U JPS6228472 U JP S6228472U JP 12006285 U JP12006285 U JP 12006285U JP 12006285 U JP12006285 U JP 12006285U JP S6228472 U JPS6228472 U JP S6228472U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounting
- wiring board
- insertion hole
- immersed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000007654 immersion Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12006285U JPS6228472U (zh) | 1985-08-05 | 1985-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12006285U JPS6228472U (zh) | 1985-08-05 | 1985-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6228472U true JPS6228472U (zh) | 1987-02-20 |
Family
ID=31008027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12006285U Pending JPS6228472U (zh) | 1985-08-05 | 1985-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228472U (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0287694A (ja) * | 1988-09-26 | 1990-03-28 | Nippon Chemicon Corp | 電子部品の実装構造および実装方法 |
| JP2019096687A (ja) * | 2017-11-21 | 2019-06-20 | ファナック株式会社 | 樹脂成型基板及びコンデンサの実装構造 |
-
1985
- 1985-08-05 JP JP12006285U patent/JPS6228472U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0287694A (ja) * | 1988-09-26 | 1990-03-28 | Nippon Chemicon Corp | 電子部品の実装構造および実装方法 |
| JP2019096687A (ja) * | 2017-11-21 | 2019-06-20 | ファナック株式会社 | 樹脂成型基板及びコンデンサの実装構造 |
| US10984949B2 (en) | 2017-11-21 | 2021-04-20 | Fanuc Corporation | Resin molded substrate and mounting structure for capacitor |