JPS62284074A - Continuous sputtering device - Google Patents

Abstract

PURPOSE:To inhibit sputtering particles from being deposited on the wall or the like in a vacuum tank and to eliminate the need of control for removing a film in the tank and to enhance productibity by trapping the sputtering particles which are passed through the vicinity of a tray and straightly advanced to the fixed part of the vacuum tank. CONSTITUTION:The undesirable deposition and film formation of sputtering particles on the fixed part such as the upper wall 4a of a vacuum tank 4, the side walls 4c thereof and rollers 5 are inhibited by providing a means for trapping the sputtering particles with are generated in a target 3 and passed through the vicinity of a tray 1 and straightly advanced toward the above-mentioned fixed part. Further the above-mentioned means preferably is a lengthened part 1b overlapped with adjacent trays 1 or a shielding plate 1a between the rollers 5 and the target 3 and furthermore the lengthened leg part 1c of the tray 1.

Description

[Detailed description of the invention] 3 Detailed explanation of the invention [Industrial application field] The present invention relates to a continuous sputtering device.

[Conventional technology]

Continuous sputtering equipment advances a number of trays carrying substrates through a tunnel-shaped vacuum chamber, and deposits sputtered particles generated from targets placed at appropriate locations in the chamber onto the substrates on the trays to a predetermined thickness. It forms a film of

Conventional continuous sputtering equipment is shown in Fig. 1, for example, Figures a and b.
As shown in FIG.
'b, 4/-cVc, it is formed into a tunnel shape, and a large number of trays 1 placed on the substrate 2 are continuously conveyed in the direction of the arrow by rollers attached to the side wall≠C.

A target 3 is installed on the lower wall, and generates ivy particles and deposits them on the substrates 2 on the many trays 1 that have been transported to form a film.

[Problem that the invention seeks to solve]

In the above-mentioned apparatus, sputtered particles are deposited on the substrate on the tray to form a film of a predetermined thickness, but the sputtered particles are also deposited on the top and bottom and side walls of the tank and on the rollers for a long period of time. In particular, on clay walls, ivy particles can directly reach the slats through gaps between adjacent trays, and the rollers are located at approximately the same height and close to the target, which is the source of spatter particles, so Particularly large amounts of sputtered particles traveling straight tend to accumulate, and the film tends to be thicker than in other parts of the vacuum chamber.

By the way, no matter what the composition of this formed film, as it gets thicker it generates an internal force, and when the film thickness exceeds a certain level for the composition, it begins to peel off. . This peeled film is present in the vacuum chamber as a scrap, and if it floats in the vacuum chamber and adheres to the substrate on which the film is to be formed, it will cause defects such as pinholes in the product.

Therefore, in order to remove this dust and the film formed on the rollers, walls, etc., the vacuum chamber of the skidding device often needs to be shut down to clean the inside and replace parts.

The present invention provides a sputtering device that suppresses the accumulation of sputtered particles on the walls, rollers, etc. of the vacuum chamber by capturing the sputtered particles that pass through the vicinity of the tray and try to go straight toward the fixed part of the vacuum chamber. is intended to provide.

[Means for solving problems]

The present invention is a means to solve the above problems.

A large number of trays carrying substrates are continuously transported through a tunnel-shaped vacuum chamber, and the particles generated from targets placed at appropriate locations in the chamber are deposited on the substrates to form a film. The present invention provides a continuous sputtering apparatus characterized in that the tray is equipped with a means for capturing sputtered particles passing through the vicinity of the tray and attempting to go straight toward a fixed part in a vacuum chamber.

[Effect]

In the present invention, sputtered particles generated at the target and attempting to pass through the vicinity of the tray and proceed straight toward the fixed part of the vacuum chamber are removed from the overlapping ends of the trays.

Alternatively, the sputter particles can be further restricted from reaching the walls or rollers by trapping them by a trapping means such as a shielding plate provided on the tray or an extended leg of the tray, and undesirable spatter particles in those parts can be further restricted. Suppresses particle deposition and film formation.

〔Example〕

FIG. 1a and FIG. 1A show an embodiment of the present invention, and the device has upper and lower walls, side walls +a,
It is a tunnel-like thing surrounded by 4Lb and 4Ac, and there are rollers on the left and right side walls 4Ac! is attached, and the tray l with the substrate ji placed on it is mounted on the legs /c at both ends, and the rollers are mounted! transported by. A target 3 is installed below the tray 1 on the lower wall 1/-c, and the generated sputter particles are supplied onto the substrate to form a film to a predetermined thickness.

In order to capture sputtered particles that are about to go straight from the target 3 toward the upper wall through the gap between the adjacent trays before reaching the upper wall l/-a, there is a portion /b at the end of the adjacent tray l that overlaps with each other. A roller is provided along the bottom of the tray from target 3! In order to capture the sputtered particles that are about to go straight towards the target before they reach the roller j, the tray l is placed between its both end legs lc and the target 3 (roller j and the target 3 are at approximately the same height). Skirt (shielding plate)/ai is hanging down. Further, the target 3 and the tray I are installed at a high position from the lower wall while keeping the distance between them constant.
The sputtered particles reaching the lower wall are reduced (the height H of the target 30 from the lower wall is 10
0. or more).

FIG. 2 shows another embodiment, in which the vacuum tunnel is in the form of a tunnel surrounded by upper and lower walls and side walls ta, ridge, and ridge C, and a roller j is attached to the side wall Fc.

A tray/with a substrate λ placed thereon is transported.

The roller j is driven by a motor 6 installed below the vacuum chamber φ.
It is driven via a belt transmission 7.

A target 3 is installed below the tray 1 on the lower wall, and supplies the generated ivy particles onto the substrate λ.

In this embodiment, unlike the embodiment of FIG. 1, the tray 10 legs/c are extended downwardly, and the rollers correspondingly extend downwardly. is attached to the lower part of the side wall 4tc of the vacuum chamber. Therefore, since the roller j does not directly face the target 3, the sputtered particles that try to go straight from the target 3 toward the rotor collide with the legs/c of the tray 10 and are captured.

roller! will never be reached.

FIG. 3 shows yet another embodiment, which is an oblique transfer type in which the vacuum chamber is installed at an angle, as opposed to the horizontal transfer type shown in FIG. So, from motor 6 to roller! One of the belt transmission devices 7.7r for transmitting rotation to the belt is provided with a long belt tracker 7'.

In this embodiment as well, the leg part IC of the tray l is extended downward, the roller j does not directly oppose the target 3, and the sputtered particles trying to go straight toward the roller collide with the leg part C of the tray. captured.

In addition, each of the above embodiments is a so-called eaves attachment type provided on the lower wall of the target, but the target wall attachment type is a so-called vertical type, or the upper surface mounting is a horizontal type. For example, this can be implemented by changing the position of the shielding plate.

When forming a film on a semiconductor using the continuous sputtering apparatus of the present invention, a large number of trays carrying substrates are continuously conveyed by rollers through a tunnel-shaped vacuum chamber.
Sputtered particles generated from the target are deposited on the substrate.
A film is formed. At that time, sputtered particles adhere to the top, bottom, left and right walls of the vacuum chamber.

Deposition is suppressed by the trapping device, and most of the sputtered particles are deposited only on moving parts such as the substrate and tray, and almost never on walls and fixed parts (films formed on moving parts are not exposed to the outside). (This is a problem because it can be removed every time it is taken out.)

〔Effect of the invention〕

In the present invention, since the tray is equipped with a means for capturing snow ivy particles that try to pass straight toward the fixed part of the vacuum chamber through the tray, all the fixed parts of the vacuum chamber from which the target can be seen are shielded. In particular, since almost no sputtered particles are deposited in those areas, there is no need for maintenance related to film removal inside the vacuum chamber, which was required in the past.

Maintaining a clean high vacuum, which is an inherent advantage of continuous sputtering equipment, can be achieved by not exposing the inside of the equipment to the atmosphere, which greatly contributes to improving productivity and reducing costs.

[Brief explanation of drawings]

Fig. 1a, b and c are a sectional front view and a sectional side view of a sectional front view device according to an embodiment of the present invention. l...Tray /a...-Skirt (shielding plate)
/b... Extension part /c... Leg part... Board
3...Target...Vacuum device F
a... Earthen wall ≠ b... Lower wall ≠ C... Left and right walls! ...Roller 650. Motor 7.7'...
Belt transmission device procedure correction port (Rei) June 24, 1986

Claims (1)

[Claims] 1. A large number of trays carrying substrates are continuously conveyed through a tunnel-shaped vacuum chamber, and sputtered particles generated from targets placed at appropriate locations within the chamber are transferred to the substrate. A continuous sputtering apparatus for depositing and forming a film on a vacuum chamber, characterized in that the tray is equipped with a means for capturing sputtered particles passing through the tray and attempting to proceed straight toward a fixed part in a vacuum chamber. Device. 2. The continuous sputtering apparatus according to claim 1, wherein the means for capturing the sputtered particles is formed by overlapping the ends of adjacent trays. 3. The continuous sputtering apparatus according to claim 1 or 2, wherein the means for capturing the sputtered particles is a shielding plate between the roller and the target. 4. The continuous sputtering apparatus according to claim 1 or 2, wherein the means for capturing the sputtered particles is an extended leg of a tray.