JPS62282994A - Ic card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention Field of Industrial Application The present invention relates to an IC card in which an IC module provided with an IC circuit is built into a plastic IC card, and in particular,
This is a so-called embedded type IC card in which an IC module is embedded in a laminated plastic card with a terminal portion extending 2M, and a manufacturing method that involves a heating and pressing process.
For example, the present invention relates to an IC card suitable for manufacturing by a heat-pressure lamination method.

As shown in FIG. 5, this kind of conventional embedded type IC card has an IC module 2 fitted into a center core l made of vinyl chloride, and a terminal 2a side of the IC module 2. A vinyl chloride sheet 3 provided with terminal holes 3a for exposing the terminals 2a is placed on the side of the I
On the side opposite to the terminals 2a of the C module 2, sheets 4 made of vinyl chloride are also stacked on top of each other to form a laminated structure.

Generally, the thickness of the base body 2b of the IC module 2 is approximately equal to the thickness of the center core 1, while the thickness of the terminal 2b is approximately equal to the thickness of the center core 1.
The thickness of sheet a is approximately 35 μm, and the thickness of sheet 3 is approximately 13 μm.
It is 0 μm. Therefore, the surface of the terminal 2a is approximately 95 μm lower than the surface of the sheet 3.

C. As described above, in the case of an IC card using the conventional IC module 2, there is a recess on the surface of the IC card corresponding to the protruding part of the terminal 2ai. When manufactured by a manufacturing method that includes a heating and pressing step, for example, a heating and pressing lamination method, the upper surface of the terminal 2a and each terminal 2a where the vinyl chloride sheet 3 is recessed due to the influence of heat during the heating and pressing step. In order to prevent the flow from flowing between the holes, it is necessary to install a flow stopper on the terminal 2a that fills the recess (a heat-resistant plastic film is attached to the shell over the terminal 2a), and after the heating and pressurizing process. Since it is necessary to remove the flow stopper, there is a drawback that the installation and removal work is complicated and the manufacturing work is complicated.

It is an object of the present invention to provide an IC card that eliminates these drawbacks.

An IC module is fitted into a plastic center core for releasing the illumination device, and plastic sheets are polymerized on both sides of the center core to form a laminated structure.
In a so-called embedded IC card, in which a sheet corresponding to the terminal installation side of the module is provided with a terminal hole for exposing at least a part of the terminal, there is a hole around the terminal to be exposed. A frame is provided so that it is located at almost the same height as the surface.

Raw - 1 ■ There is a frame whose surface is located at almost the same height as the surface of the IC card, corresponding to the periphery of the recessed part of the IC card, so when the IC card is manufactured by a method that includes a heating and pressing process. Also, plastic sheets do not flow into the dented top surfaces of the terminals or between the terminals due to the influence of heat.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to FIGS. 1 to 4 of the accompanying drawings.

Figure 1 is a schematic vertical cross-sectional view of an IC card, Figure 2 is an IC card.
FIG. 3 is a schematic plan view of the module, FIG. 3 is a schematic plan view of the IC card, and FIG. 4 is a schematic vertical cross-sectional view showing the heating and pressing process when manufacturing the IC card by the heating and pressing lamination method. It is.

As shown in FIG. 1, the IC card 10 includes a center core 11 made of vinyl chloride, a front sheet 12 and a back sheet 13 polymerized on both sides thereof, and further polymerized sheets 12 and 13, respectively. It consists of a five-layer structure of transparent oversheets 121° and 131.

The IC module 14 is fitted into the center core 11 within a predetermined holding frame, and the thicknesses of the base bodies 14b of the center core 11 and the IC module 14 are set to be equal. Further, as shown in FIGS. 1 and 2, around each row of the terminals 14a of the 1c module 14, which are arranged in two rows of three terminals, there are approximately 200. c.
Frames 15 are provided at intervals of am.

These frames 15 are made of the same material as each terminal 14a,
As is clear from FIG.
A top sheet 12 with a thickness of 130 μm, similar to the surface of a.
It is located at the same height as the surface of the oversheet 121.

That is, the height of the frame 15 is 130 μm, and the height of each terminal 14a is also 130 μm. Note that the width of each frame 15 is preferably 300 μm even at the narrowest portion.

Characters, etc. are printed at predetermined positions on the surface of each sheet (12.13) (not shown), while as shown in FIGS. 1 and 3, the terminal 14a side of the IC module 14 In the front sheet 12 and the oversheet 121 located at , rectangular terminal holes 12a are respectively provided along the outer periphery of each frame 15 in order to expose the six terminals 14a.

Next, an example of a method for manufacturing the above-mentioned IC module 14 will be described together with a method for manufacturing the IC card 10 using a heat-pressure lamination method.

First, each sheet 1-12.13 has characters etc. printed on its surface, and then is laminated with an oversheet 121.131 made of transparent vinyl chloride to have a thickness of 130 μm. On the other hand, the center core 11 is formed to match the 1γ of the base 14b of the IC module 14 to be fitted, and in some cases, it may be laminated with a vinyl chloride sheet of an appropriate thickness to adjust the thickness. be done.

On the other hand, regarding the IC module 14, a conductive ftN of 130 μm, which is the same thickness as the top sheet 12 including the oversheet 121, is formed on the base body 14b, and at predetermined portions where the terminals 14a and the frame 15 are to be formed. After the etching prevention process is performed, desired terminals 14a and frame 15 are formed by etching. According to this method, the frame 15 and the terminal 14a can be formed in the same process, which is extremely efficient.

Next, in the front sheet 12 and its oversheet 121, terminal holes 12a are formed in the frame 15 to expose the terminals 14a.
The center core 11 is transparently installed at a predetermined position along the outer periphery of
[A holding frame for fitting the C module 14 is transparently provided at a predetermined position. The top sheet 1 includes the oversheet 121 (thickness and height) of the terminal 14a and the frame 15.
IC module I formed to have the same thickness as 2
Adhesive is applied to both the front and back sides of the IC module 14, except for the terminal 14a and the frame 15, and the IC module 14 is fitted into the holding frame of the center core 11, and an oversheet 121.4 is attached to the center core 11, respectively. 13
A top sheet 12 and a back sheet 13 laminated with No. 1 are polymerized, respectively.

As shown in FIG. 4, the five-layer polymerized sheet is coated with heat-resistant films 16 and 17 each having a thickness of approximately 190 μm and one surface having a rough surface. IC card 10 having a laminated structure with a rough surface on the front and back surfaces by interposing the card 121 and 131 in contact with each other and heating and pressurizing it while sandwiching it between mirror plates 18 and 19.
Create.

Here, each sheet 1 of each heat-resistant film 16.17
Since the contact surfaces with 21.131 are rough, even if air bubbles are formed on these contact surfaces, the air bubbles can escape to the outside through the fine voids formed in the rough surface, and the air bubbles may be caused by the air bubbles. There are no recesses formed on the front and back surfaces of the IC card IO.

In addition, since the frame body 15 is located at the same height as the surface of the oversheet 121 of the front sheet 12, there is no need to fill the terminal hole 12a with a heat-resistant film to prevent thermal deformation as in the conventional case. do not have.

Subsequently, after removing each of the heat-resistant films 16 and 17, the IC card 10 is again held between the mirror plates 18 and 19 and heated and pressurized to finish the front and back surfaces of the IC card 10 to a mirror finish. The manufacturing process is finished.

In the wooden embodiment, the frame 15 and the terminal 14 are connected as described above.
Since the surfaces of a are arranged at the same height, when a magnetic tape is provided on the oversheet 121, the magnetic head of the card reader/writer will touch the magnetic tape exactly one time during reading and writing. You can also
There is an advantage that there is no uneven transfer due to changes in the transfer speed of the transfer roller of the card reader/writer, and read and write operations can be performed smoothly and accurately.

Note that the present invention is not limited to the embodiments described above; for example, the surface of the terminal 143 may be located at a lower position than the surface of the frame 15, and the material of the frame 15 may be lower than the surface of the terminal 14a.
It does not have to be the same material as the material.

Effect Layer As is clear from the above explanation, according to the present invention, a frame whose surface is located at approximately the same height as the surface of the IC card is provided around the terminal surface of the C module to be exposed. Therefore, there is no need to provide a flow stopper to prevent thermal deformation during the heating and pressurizing process in manufacturing the IC card, which simplifies the work process and improves work efficiency.

[Brief explanation of the drawing]

FIG. 1 is a schematic longitudinal sectional view of an IC card showing a preferred embodiment of the present invention, FIG. 2 is a schematic plan view of the same<IC module, and FIG. 3 is a schematic plan view of the same<IC card. The plan view and FIG. FIG. 5 is a schematic vertical cross-sectional view showing a pressurizing process, and FIG. 5 is a schematic vertical cross-sectional view showing a conventional IC card. 10...IC car)' 11...Center core 12...Top sheet 13. ...Back sheet 14...IC module 14a...terminal
15... Frame patent applicant Trapin Moore Co., Ltd. Figure 2

Claims (1)

[Claims] An IC module with terminals on one side is fitted into a plastic center core, and plastic sheets are polymerized on both the front and back sides of the center core to form a laminated structure. In an IC card in which a corresponding sheet is provided with a terminal hole for exposing at least a portion of the terminal, a frame whose surface is located approximately at the same height as the surface of the IC card is provided around the terminal to be exposed of the IC module. An IC card characterized by having a body.