JPS62279691A - Activation energy beam cured type solder and plating maskingagent - Google Patents
Activation energy beam cured type solder and plating maskingagentInfo
- Publication number
- JPS62279691A JPS62279691A JP12429486A JP12429486A JPS62279691A JP S62279691 A JPS62279691 A JP S62279691A JP 12429486 A JP12429486 A JP 12429486A JP 12429486 A JP12429486 A JP 12429486A JP S62279691 A JPS62279691 A JP S62279691A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- plating
- meth
- alcohol
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims description 9
- 229910000679 solder Inorganic materials 0.000 title claims description 7
- 230000004913 activation Effects 0.000 title 1
- 239000003795 chemical substances by application Substances 0.000 claims description 25
- 150000001993 dienes Chemical class 0.000 claims description 17
- -1 methacryloyl group Chemical group 0.000 claims description 14
- 239000003999 initiator Substances 0.000 claims description 11
- 239000000178 monomer Substances 0.000 claims description 11
- 239000004014 plasticizer Substances 0.000 claims description 11
- 239000002562 thickening agent Substances 0.000 claims description 9
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 description 16
- 238000000034 method Methods 0.000 description 10
- 238000002156 mixing Methods 0.000 description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 7
- 238000001723 curing Methods 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 238000010894 electron beam technology Methods 0.000 description 5
- 235000019441 ethanol Nutrition 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical group CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- HZVFRKSYUGFFEJ-YVECIDJPSA-N (2r,3r,4s,5r)-7-phenylhept-6-ene-1,2,3,4,5,6-hexol Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=CC1=CC=CC=C1 HZVFRKSYUGFFEJ-YVECIDJPSA-N 0.000 description 3
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- BBMCTIGTTCKYKF-UHFFFAOYSA-N 1-heptanol Chemical compound CCCCCCCO BBMCTIGTTCKYKF-UHFFFAOYSA-N 0.000 description 2
- QSOMQGJOPSLUAZ-UHFFFAOYSA-N 2-ethenylbuta-1,3-dienylbenzene Chemical compound C=CC(C=C)=CC1=CC=CC=C1 QSOMQGJOPSLUAZ-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- 241000282472 Canis lupus familiaris Species 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- NIQCNGHVCWTJSM-UHFFFAOYSA-N Dimethyl phthalate Chemical compound COC(=O)C1=CC=CC=C1C(=O)OC NIQCNGHVCWTJSM-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical class CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- BXWNKGSJHAJOGX-UHFFFAOYSA-N hexadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCO BXWNKGSJHAJOGX-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 239000000391 magnesium silicate Substances 0.000 description 2
- 229910052919 magnesium silicate Inorganic materials 0.000 description 2
- 235000019792 magnesium silicate Nutrition 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 229960004029 silicic acid Drugs 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 2
- HLZKNKRTKFSKGZ-UHFFFAOYSA-N tetradecan-1-ol Chemical compound CCCCCCCCCCCCCCO HLZKNKRTKFSKGZ-UHFFFAOYSA-N 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- 150000003672 ureas Chemical class 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- FMZUHGYZWYNSOA-VVBFYGJXSA-N (1r)-1-[(4r,4ar,8as)-2,6-diphenyl-4,4a,8,8a-tetrahydro-[1,3]dioxino[5,4-d][1,3]dioxin-4-yl]ethane-1,2-diol Chemical compound C([C@@H]1OC(O[C@@H]([C@@H]1O1)[C@H](O)CO)C=2C=CC=CC=2)OC1C1=CC=CC=C1 FMZUHGYZWYNSOA-VVBFYGJXSA-N 0.000 description 1
- PJAKWOZHTFWTNF-UHFFFAOYSA-N (2-nonylphenyl) prop-2-enoate Chemical compound CCCCCCCCCC1=CC=CC=C1OC(=O)C=C PJAKWOZHTFWTNF-UHFFFAOYSA-N 0.000 description 1
- UMJOLBQCILNLDC-UHFFFAOYSA-N 1-(2-tert-butylphenyl)-2,2,2-trichloroethanone Chemical compound CC(C)(C)C1=CC=CC=C1C(=O)C(Cl)(Cl)Cl UMJOLBQCILNLDC-UHFFFAOYSA-N 0.000 description 1
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- QZKVUSSYPPWURQ-UHFFFAOYSA-N 1-methylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C QZKVUSSYPPWURQ-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- HLCPWBZNUKCSBN-UHFFFAOYSA-N 2-aminobenzonitrile Chemical class NC1=CC=CC=C1C#N HLCPWBZNUKCSBN-UHFFFAOYSA-N 0.000 description 1
- ZCDADJXRUCOCJE-UHFFFAOYSA-N 2-chlorothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3SC2=C1 ZCDADJXRUCOCJE-UHFFFAOYSA-N 0.000 description 1
- SJEBAWHUJDUKQK-UHFFFAOYSA-N 2-ethylanthraquinone Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC=C3C(=O)C2=C1 SJEBAWHUJDUKQK-UHFFFAOYSA-N 0.000 description 1
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 1
- WOYWLLHHWAMFCB-UHFFFAOYSA-N 2-ethylhexyl acetate Chemical compound CCCCC(CC)COC(C)=O WOYWLLHHWAMFCB-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- NACPTFCBIGBTSJ-UHFFFAOYSA-N 2-hydroxy-2-phenyl-1-(2-propan-2-ylphenyl)ethanone Chemical compound CC(C)C1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 NACPTFCBIGBTSJ-UHFFFAOYSA-N 0.000 description 1
- RIWRBSMFKVOJMN-UHFFFAOYSA-N 2-methyl-1-phenylpropan-2-ol Chemical compound CC(C)(O)CC1=CC=CC=C1 RIWRBSMFKVOJMN-UHFFFAOYSA-N 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical class O1C(=NCC1)* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- BUZICZZQJDLXJN-UHFFFAOYSA-N 3-azaniumyl-4-hydroxybutanoate Chemical compound OCC(N)CC(O)=O BUZICZZQJDLXJN-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 241001391944 Commicarpus scandens Species 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- QSJXEFYPDANLFS-UHFFFAOYSA-N Diacetyl Chemical group CC(=O)C(C)=O QSJXEFYPDANLFS-UHFFFAOYSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- XTJFFFGAUHQWII-UHFFFAOYSA-N Dibutyl adipate Chemical compound CCCCOC(=O)CCCCC(=O)OCCCC XTJFFFGAUHQWII-UHFFFAOYSA-N 0.000 description 1
- PYGXAGIECVVIOZ-UHFFFAOYSA-N Dibutyl decanedioate Chemical compound CCCCOC(=O)CCCCCCCCC(=O)OCCCC PYGXAGIECVVIOZ-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical class OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 235000015847 Hesperis matronalis Nutrition 0.000 description 1
- 240000004533 Hesperis matronalis Species 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 241001272720 Medialuna californiensis Species 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 description 1
- GAMPNQJDUFQVQO-UHFFFAOYSA-N acetic acid;phthalic acid Chemical compound CC(O)=O.OC(=O)C1=CC=CC=C1C(O)=O GAMPNQJDUFQVQO-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- CEGOLXSVJUTHNZ-UHFFFAOYSA-K aluminium tristearate Chemical compound [Al+3].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CEGOLXSVJUTHNZ-UHFFFAOYSA-K 0.000 description 1
- 229940063655 aluminum stearate Drugs 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- WLLASMDMMUPSMP-UHFFFAOYSA-N benzoic acid;copper Chemical compound [Cu].OC(=O)C1=CC=CC=C1 WLLASMDMMUPSMP-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ZFMQKOWCDKKBIF-UHFFFAOYSA-N bis(3,5-difluorophenyl)phosphane Chemical compound FC1=CC(F)=CC(PC=2C=C(F)C=C(F)C=2)=C1 ZFMQKOWCDKKBIF-UHFFFAOYSA-N 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- MSZJEPVVQWJCIF-UHFFFAOYSA-N butylazanide Chemical compound CCCC[NH-] MSZJEPVVQWJCIF-UHFFFAOYSA-N 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- 150000003950 cyclic amides Chemical class 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- 229940087101 dibenzylidene sorbitol Drugs 0.000 description 1
- JBSLOWBPDRZSMB-BQYQJAHWSA-N dibutyl (e)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C\C(=O)OCCCC JBSLOWBPDRZSMB-BQYQJAHWSA-N 0.000 description 1
- 229940100539 dibutyl adipate Drugs 0.000 description 1
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- FBSAITBEAPNWJG-UHFFFAOYSA-N dimethyl phthalate Natural products CC(=O)OC1=CC=CC=C1OC(C)=O FBSAITBEAPNWJG-UHFFFAOYSA-N 0.000 description 1
- 229960001826 dimethylphthalate Drugs 0.000 description 1
- TVWTZAGVNBPXHU-FOCLMDBBSA-N dioctyl (e)-but-2-enedioate Chemical compound CCCCCCCCOC(=O)\C=C\C(=O)OCCCCCCCC TVWTZAGVNBPXHU-FOCLMDBBSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- LRCFXGAMWKDGLA-UHFFFAOYSA-N dioxosilane;hydrate Chemical compound O.O=[Si]=O LRCFXGAMWKDGLA-UHFFFAOYSA-N 0.000 description 1
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 1
- 229910000397 disodium phosphate Inorganic materials 0.000 description 1
- 235000019800 disodium phosphate Nutrition 0.000 description 1
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- PFBWBEXCUGKYKO-UHFFFAOYSA-N ethene;n-octadecyloctadecan-1-amine Chemical compound C=C.CCCCCCCCCCCCCCCCCCNCCCCCCCCCCCCCCCCCC PFBWBEXCUGKYKO-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 150000002314 glycerols Chemical class 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 1
- VHHHONWQHHHLTI-UHFFFAOYSA-N hexachloroethane Chemical compound ClC(Cl)(Cl)C(Cl)(Cl)Cl VHHHONWQHHHLTI-UHFFFAOYSA-N 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 229920000126 latex Polymers 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229940095102 methyl benzoate Drugs 0.000 description 1
- YLHXLHGIAMFFBU-UHFFFAOYSA-N methyl phenylglyoxalate Chemical compound COC(=O)C(=O)C1=CC=CC=C1 YLHXLHGIAMFFBU-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical class [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical class OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- DVQHRBFGRZHMSR-UHFFFAOYSA-N sodium methyl 2,2-dimethyl-4,6-dioxo-5-(N-prop-2-enoxy-C-propylcarbonimidoyl)cyclohexane-1-carboxylate Chemical compound [Na+].C=CCON=C(CCC)[C-]1C(=O)CC(C)(C)C(C(=O)OC)C1=O DVQHRBFGRZHMSR-UHFFFAOYSA-N 0.000 description 1
- YMPPRYJBYFNJTO-UHFFFAOYSA-M sodium;diethoxy-oxido-sulfanylidene-$l^{5}-phosphane Chemical compound [Na+].CCOP([O-])(=S)OCC YMPPRYJBYFNJTO-UHFFFAOYSA-M 0.000 description 1
- ZKDDJTYSFCWVGS-UHFFFAOYSA-M sodium;diethoxy-sulfanylidene-sulfido-$l^{5}-phosphane Chemical compound [Na+].CCOP([S-])(=S)OCC ZKDDJTYSFCWVGS-UHFFFAOYSA-M 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000003549 soybean oil Substances 0.000 description 1
- 235000012424 soybean oil Nutrition 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- MUTNCGKQJGXKEM-UHFFFAOYSA-N tamibarotene Chemical compound C=1C=C2C(C)(C)CCC(C)(C)C2=CC=1NC(=O)C1=CC=C(C(O)=O)C=C1 MUTNCGKQJGXKEM-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 125000005590 trimellitic acid group Chemical group 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
3、発明の詳細な説明
〔発明の利用分野〕
本発明は、活性エネルギー線硬化型ハンダ及びメッキマ
スク剤(以下マスク剤と称す)に関するものである。さ
らに詳しくは、スクリーン印刷可能で、剥離可能な活性
エネルギー線硬化型マスク剤に関するものである・
〔従来の技術〕
従来・剥離型や溶剤洗浄型マスク剤として、テープ類、
ゴム系ラテックス、熱硬化型樹脂・あるいは、セルロー
ス系樹脂を主成分としたものが使用されてきた。Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Application of the Invention] The present invention relates to an active energy ray-curable solder and a plating masking agent (hereinafter referred to as masking agent). More specifically, it relates to active energy ray-curable masking agents that are screen printable and peelable.
Rubber latexes, thermosetting resins, or those whose main components are cellulose resins have been used.
従来の剥離型や溶剤洗浄型マスク剤は、いずれも、必要
な部分に手で張り付ける必要があったり、乾燥あるいは
・硬化に高温・長時間の加熱を必要とし、ハンダやメッ
キ工程合理化の大きな障害となっている。Conventional peel-off and solvent-cleaning mask agents both require manual application to the required areas and require high temperatures and long periods of time for drying and curing, making it difficult to streamline the soldering and plating process. It has become an obstacle.
また、特にテープ類は、スクリーン印刷ができないため
、プリント基板の細かいパターンに対応できないという
欠点を有していた。さらにテープ類は接着剤が残渣とし
て、プリント基板上に残り、プリント基板の電気特性を
悪化させるという大キな欠点があり、また、溶剤洗浄タ
イプは、洗浄不良をなくすため・長時間洗浄する必要が
あるという欠点がある。In addition, tapes in particular cannot be screen printed, so they have the disadvantage of not being able to be applied to fine patterns on printed circuit boards. Furthermore, tapes have a major drawback in that adhesive residue remains on the printed circuit board and deteriorates the electrical characteristics of the printed circuit board.Also, solvent cleaning types require long cleaning to avoid cleaning defects. There is a drawback that there is.
本発明者らは、これらの欠点を改良すべく研究を重ねた
結果、本発明に到達した。即ち、本発明は、少なくとも
1個のアクリロイル基または、メタクリロイル基を分子
内に有する、活性エネルギー線硬化型ジエン系オリゴマ
ー;10〜80重量部。The present inventors have conducted repeated research to improve these drawbacks, and as a result, they have arrived at the present invention. That is, the present invention provides an active energy ray-curable diene oligomer having at least one acryloyl group or methacryloyl group in the molecule; 10 to 80 parts by weight.
エチレン性不飽和基を有するモノマー;20〜90重量
部・光重合開始剤;0〜15重量部・可塑剤;0〜80
重量部及び増粘剤;0.1〜16重量部よりなるスプレ
ッドメーター降伏値80〜86QQ dyne/ ad
のハンダ及びメッキマスク剤である、
本発明に使用される、少なくとも1個のエチレン性不飽
和基を分子内に有する活性エネルギー線硬化型ジエン系
オリゴマー(以下ジエン系オリゴマーと略す)としては
、各種ジエン系オリゴマーの(メタ)アクリレート変性
物がある。Monomer having ethylenically unsaturated group; 20 to 90 parts by weight Photoinitiator; 0 to 15 parts by weight Plasticizer; 0 to 80
Spread meter yield value 80-86QQ dyne/ad consisting of parts by weight and thickener: 0.1-16 parts by weight
The active energy ray-curable diene oligomer (hereinafter abbreviated as diene oligomer) having at least one ethylenically unsaturated group in the molecule used in the present invention is a solder and plating mask agent. There are (meth)acrylate modified products of diene oligomers.
ジエン系オリゴマーの(メタ)アクリレート変性方法と
して・例えば以下の方法があげられる。Examples of methods for modifying diene oligomers with (meth)acrylates include the following methods.
アト。キラエチル(メタ)アクリレートなどの水酸基含
有モノ(メタ)アクリレートと、有機ジイソシアネート
あるいは、イソシアネート基を2個含有するオリゴウレ
タンとを、1個のイソシアネート基が分子内に残るよう
に反応させた化合物と、少なくとも1個の水酸基を分子
内に有するオリゴブタジェン(例、1.4−シス結合、
1.4−1−ランス結合あるいは、1.2−ビニル結合
の単独結合からなるもの、あるいは、これらの混合結合
よりなるオリゴブタジェン誘導体)とを、化学量論的に
反応させたもの。(例えば、Po1y bd凡−45A
C凡(出光石油化学■) 、 TE−2000(日本曹
達■)、ミケロンuV°Bu−A(早用ゴム■))ある
いは、オリ−17” ウレタンに無水マレイン酸を付加
させたのち、ヒドロ岑ジエチル(メタ)アクリレートな
どの水酸基含有モノ(メタ)アクリレートにて、エステ
ル変性したもの。(例えば、胚AO−1000−80、
MM−1ooo −go (日本石油化学■)、フィン
ビーム101(日本セオン■))、あるいは、オリゴブ
タジェン中の二重結合の一部をエポキシ化した後(メタ
)アクリル酸などのカルボキシル基含有のモノ(メタ)
アクリレートにて、エステル変性したものなどがあげら
れる。また、上記方法において、オリゴブタジェンの代
わりに1オリゴイソプレンあるいはオリゴクロロプレン
を用いることもできるに
れらの重量平均分子量は、500〜too、oooで、
好ましくは、700〜50,000である。分子量が5
00未満では、引張強度が低くなり、また、IQo、0
00より犬では活性エネルギー線による硬化性が悪くな
り好ましくない。Ato. A compound obtained by reacting a hydroxyl group-containing mono(meth)acrylate such as chiraethyl(meth)acrylate with an organic diisocyanate or an oligourethane containing two isocyanate groups so that one isocyanate group remains in the molecule; Oligobutadiene having at least one hydroxyl group in the molecule (e.g., 1,4-cis bond,
A product obtained by stoichiometrically reacting a 1.4-1-lance bond or a 1.2-vinyl bond, or an oligobutadiene derivative consisting of a mixed bond. (For example, Po1y bd-45A
After adding maleic anhydride to Cbon (Idemitsu Petrochemical ■), TE-2000 (Nippon Soda ■), Michelon uV°Bu-A (early use rubber ■), or Oly-17" urethane, hydrochloride Ester-modified with hydroxyl group-containing mono(meth)acrylate such as diethyl(meth)acrylate. (For example, embryo AO-1000-80,
MM-1ooo-go (Nippon Petrochemical ■), Finnbeam 101 (Nippon Seon ■)), or after epoxidizing a part of the double bond in oligobutadiene, containing carboxyl groups such as (meth)acrylic acid. things (meta)
Examples include ester-modified acrylates. In addition, in the above method, oligoisoprene or oligochloroprene may be used instead of oligobutadiene.The weight average molecular weight of these is 500 to too, ooo,
Preferably, it is 700 to 50,000. molecular weight is 5
If it is less than 00, the tensile strength will be low, and IQo, 0
00 is not preferable for dogs because it has poorer curing properties with active energy rays.
なお、ジエン系オリゴマーの構造は、シス、トランスの
いずれでもよく、また、同一分子内に各々を含んでいて
もよい。Note that the structure of the diene oligomer may be either cis or trans, and each may be contained in the same molecule.
本発明における、エチレン性不飽和基を有するモノマー
(以下モノマーと略す)のうち、モノ(メタ)アクリ1
/−ト類としては、メチルアルコール。In the present invention, among the monomers having an ethylenically unsaturated group (hereinafter abbreviated as monomers), mono(meth)acrylic 1
The /- group includes methyl alcohol.
エチルアルコール、プロピルアルコール、n−ブチルア
ルコール、 fso−ブチルアルコ−A/ 、 ter
t−ブチルアルコ−/I/、ネオペンチルグリコール。Ethyl alcohol, propyl alcohol, n-butyl alcohol, fso-butyl alcohol-A/, ter
t-Butyl alcohol-/I/, neopentyl glycol.
ヘキシルアルコ−/L/lヘプチルアルコール、オクチ
ルアルコ−/l/、2−エチルへキシルアルコ−/I/
。Hexyl alcohol/L/l heptyl alcohol, octyl alcohol/l/, 2-ethylhexyl alcohol/I/
.
ラウリルアルコール、テトラデシルアルコール。lauryl alcohol, tetradecyl alcohol.
ヘキサデシルアルコール、2−ヒドロキシエチルアルコ
−/l/、ノニルフェノール、シクロヘキンルアルコー
ル、テトラヒドロフルフリρアルコ−/1/。Hexadecyl alcohol, 2-hydroxyethyl alcohol/l/, nonylphenol, cyclohexyl alcohol, tetrahydrofurfuryl alcohol/1/.
ジシクロペンチルアルコール、グリシドール、ベンジル
アルコールなどの1価アルコール類から誘導される(メ
タ)アクリル酸エステρ;並びに、これら1価アルコー
ル類のエチレンオキサイドまタハ、プロピレンオキサイ
ド付加物から誘導される(メタ)アクリル酸エステル;
ポリ(メタ)アクリレート類としては、1.8−ブタン
ジオール。(meth)acrylic acid esters derived from monohydric alcohols such as dicyclopentyl alcohol, glycidol, and benzyl alcohol; and (meth)acrylic acid esters derived from ethylene oxide, ethylene oxide, and propylene oxide adducts of these monohydric alcohols. Acrylic acid ester;
As poly(meth)acrylates, 1,8-butanediol.
1.4−ブタンジオ−/l/11.5−ベンタンジオー
ル。1.4-butanedio-/l/11.5-bentanediol.
ネオペンチルグリコ−/L’e1.6−へ一+?ンジオ
ール、ジエチレングリコール、トリエチレングリコール
、ポリエチレングリコール、トリプロピレングリコール
、トリメチロールプロパン、ペンタエリヌリトール、ジ
ペンタエリスリトール、テトラメチロールメタン、ビヌ
フェノールAなどの多価アルコール類から誘導されるぼ
り(メタ)アクリ/L/ 酸x ヌチル;並びにこれら
多価アルコール類のエチレンオキサイドまたはプロピレ
ンオキサイド付加物から誘導されるポリ(メタ)アクリ
ル酸エステル;その他スチレン、ジビニルスチレン、N
−ビニル−2−ピロリドン、ビニルトルエン、酢酸ビニ
ルなどのビニル化合物;ジアリルフタレートなどのアリ
ル化合物などがあげられる。Neopentyl glyco-/L'e1.6- to 1+? (meth)acrylates derived from polyhydric alcohols such as diol, diethylene glycol, triethylene glycol, polyethylene glycol, tripropylene glycol, trimethylolpropane, pentaerynurritol, dipentaerythritol, tetramethylolmethane, and binuphenol A; L/acid x nutyl; and poly(meth)acrylic acid esters derived from ethylene oxide or propylene oxide adducts of these polyhydric alcohols; other styrene, divinylstyrene, N
Examples include vinyl compounds such as -vinyl-2-pyrrolidone, vinyltoluene, and vinyl acetate; and allyl compounds such as diallylphthalate.
これらのうち、ゴム状の硬化膜が得られる点。Among these, a rubber-like cured film can be obtained.
硬化性、ジエン系オリゴマーとの相溶性の点からみて好
ましいものは、2−エチルへキシルアクリレート、ノニ
ルフェノールアクリレート、テトラヒドロフリフリルア
クリレート、グリシジルメタクリレートなどのモノ(メ
タ)アクリレート類。Preferred in terms of curability and compatibility with diene oligomers are mono(meth)acrylates such as 2-ethylhexyl acrylate, nonylphenol acrylate, tetrahydrofurfuryl acrylate, and glycidyl methacrylate.
グリコール系ジ(メタ)アクリレート類およびジビニル
スチレン+N−2ニル−2−ピロリドンなどのビニル化
合物である。These are glycol-based di(meth)acrylates and vinyl compounds such as divinylstyrene+N-2yl-2-pyrrolidone.
これらのモノマーは、単独あるいは、2種以上を併用す
ることができる。These monomers can be used alone or in combination of two or more.
本発明に使用される可塑剤としては、ジメチルフタレー
ト、ジブチルフタレート、ジブチルフタレートのような
フタル酸エステル類;ジブチルアジペート、ジオクチル
アジペート、ジブチルセバケートのような脂肪酸(二塩
基性)エヌテル類;クリセロールアセテートのようなグ
リセリンエステル類;ジエチルマレエート、ジオクチル
マレエートのようなマレイン酸エヌテル類;ジブチルフ
マレートのようなフマル酸エステル類;アジピンfi−
1,8−ブチレングリコールのようなポリエヌテル類;
エポキシ化大豆油のようなエポキシ化エステル類;トリ
ス−β−カルボキシエチルイソシアヌレートのようなシ
ック酸エステl類: ト’)オクチルトリメリテート、
ノニルトリメリテートのようなトリメリット酸エヌテル
類;トリメチルホスフェート、トリオクチルホヌフェー
ト、トリフェニルホスフェート、トリラウリルホヌフエ
ートノヨうな正燐酸エヌテル類;トリフェニルホスファ
イトのような亜燐酸エステル類ニジブチル・ブチルホス
ホネートのようなホヌホン酸エステル類;メチルアシツ
ドホヌフエート、オクチルアシツドホヌフエート、ジブ
チルホヌフェートのような酸性燐酸エステル類;セルロ
ーヌアセテートフタレートのようなセルローヌエステル
類:珪酸テトラメチルのような珪酸エステ/’ 類;
ヘ:/ セ:/ :xルホン酸ブチルアミドのようなア
ミド類;2−エチルヘキシルアセテートなどがあげられ
る。Plasticizers used in the present invention include phthalate esters such as dimethyl phthalate, dibutyl phthalate, and dibutyl phthalate; fatty acid (dibasic) enethers such as dibutyl adipate, dioctyl adipate, and dibutyl sebacate; and chrycerol. Glycerin esters such as acetate; maleic acid esters such as diethyl maleate and dioctyl maleate; fumaric acid esters such as dibutyl fumarate; adipine fi-
Polyesters such as 1,8-butylene glycol;
Epoxidized esters such as epoxidized soybean oil; chic acid esters such as tris-β-carboxyethyl isocyanurate: g') octyl trimellitate;
trimellitic acids such as nonyl trimellitate; orthophosphoric acids such as trimethyl phosphate, trioctyl phonufate, triphenyl phosphate, trilauryl phonufate; phosphites such as triphenyl phosphite, nidibutyl and butyl Honufonic acid esters such as phosphonates; acidic phosphoric acid esters such as methylacidophonufate, octylacidhonufate, dibutylhonufate; cellulone esters such as cellulone acetate phthalate: tetramethyl silicate; Silicic acid esthetics such as;
He: / C: / :x Amides such as sulfonic acid butylamide; 2-ethylhexyl acetate, etc.
これらのうち、硬化膜に可撓性及び離型性を付与し、他
成分との相溶性を有する点で、好ましいものは、フタル
酸エステル類・脂肪酸(二塩基性)エヌテル類を正燐酸
エステル類である。これらの可塑剤は、単独または、2
種以上を併用することができる。Among these, preferable ones are phthalate esters/fatty acid (dibasic) ethers and orthophosphate esters in terms of imparting flexibility and mold release properties to the cured film and having compatibility with other components. It is a kind. These plasticizers may be used alone or in combination.
More than one species can be used together.
本発明に使用される、増粘剤としては、酸化ワックス;
ポリビニルピロリドン;エチレンビスステアリルアミド
ジアルキル置換アミド(例えば、ヘンケル白水社のデヒ
ゾー/I/)などのアミド類;モノベンジリデンソルビ
トール、ジベンジリデンソルビトール、トリベンジリデ
ンソルビトール等のベンジリデンソルビトール類(例え
ば、新日本理化株式会社のゲルオールD);水添加ヒマ
シ油:金属石ケン類(例えば、アルミニウムステアレー
ト);ケイ酸マグネシウム、ケイ酸アルミニウム・微粒
子無水シリカ・微粒子含水シリカ、ベントナイト、マイ
カ粉−炭酸カルシウム讐酸化チタン等の無機系増粘剤な
どがあげられる。これらのうち、マスク剤の流動特性よ
り、好ましいものは、ポリビニルピロリドン、ベンジリ
デンソルビトール類量ケイ酸マグネシウム、ケイ酸アル
ミニウム。The thickener used in the present invention includes oxidized wax;
Polyvinylpyrrolidone; amides such as ethylene bisstearylamide dialkyl-substituted amide (e.g. Dehyzo/I/ from Henkel Hakusuisha); benzylidene sorbitol such as monobenzylidene sorbitol, dibenzylidene sorbitol, tribenzylidene sorbitol (e.g. Shin Nippon Rika Co., Ltd.); Company's Gelol D); Hydrogenated castor oil: Metal soaps (e.g. aluminum stearate); Magnesium silicate, aluminum silicate, fine particle anhydrous silica, fine particle hydrated silica, bentonite, mica powder - calcium carbonate, titanium oxide, etc. Examples include inorganic thickeners. Among these, polyvinylpyrrolidone, benzylidene sorbitol, magnesium silicate, and aluminum silicate are preferred in terms of the flow characteristics of the masking agent.
含水または、無水の微粒子シリカである。Hydrous or anhydrous fine particle silica.
本発明に使用される光重合開始剤としては、p−ter
t−ブチルトリクロロアセトフェノン、 2.2−ジェ
トキシアセトフェノン、ベンジルジメチルケタ−/L/
(例えば、チバガイギー社のlrgacure 6st
)。As the photopolymerization initiator used in the present invention, p-ter
t-Butyltrichloroacetophenone, 2.2-jethoxyacetophenone, benzyl dimethyl ket-/L/
(For example, Ciba Geigy's lrgacure 6st
).
2−ヒドロキシ−2−メチルプロピオフェノン(例えば
メルク社のDarocur 1173 )、1−ヒドロ
キシシクロヘキシルフェニルケトン(例工ば、チバガイ
ギー社のIrgacure 184 )のようなアセト
フェノン類;ヘンシフエノン、ミヒラーケトン、O−ベ
ンゾイル−メチルベンゾエートのようなベンゾフェノン
類:イソプロビルベンゾインエーテルのようなペンゾイ
ンアルキルエーテに類:2−クロロチオキサントン、2
−メチルチオキサントンのようなチオキサントン類;ベ
ンジル:2−エチルアントラキノン;メチルベンゾイル
フォーメート(例えば、ストウファーケミカルカンパニ
ーのVLCuRE5δ)ニジアセチル;テトラメチルチ
ウラムモノサルファイド;アリルジアゾニウム塩のよう
なアゾ化合物などがあげられる。これらの光重合開始剤
は、単独または、2種以上を併用することができる。Acetophenones such as 2-hydroxy-2-methylpropiophenone (e.g. Darocur 1173 from Merck & Co.), 1-hydroxycyclohexylphenylketone (e.g. Irgacure 184 from Ciba Geigy); hensifhenone, Michler's ketone, O-benzoyl- Benzophenones such as methyl benzoate: Penzoin alkyl ethers such as isopropylbenzoin ether: 2-chlorothioxanthone, 2
-thioxanthone such as methylthioxanthone; benzyl: 2-ethylanthraquinone; methylbenzoyl formate (e.g. VLCuRE5δ from Stouffer Chemical Company) diacetyl; tetramethylthiuram monosulfide; azo compounds such as allyl diazonium salt, etc. . These photopolymerization initiators can be used alone or in combination of two or more.
さらに光重合開始剤の効果を高めるため、増感剤を併用
することもできる。増感剤としては、トリエチルアミン
、トリエタノールアミン、N−ジメチルジェタノールア
ミンのような脂肪族アミン類;芳香族アミン類;ピペリ
ジンのような窒素複素環化合物: 0−ト!Jルチオ尿
素のような尿素類;ナトリウムジエチルジチオホスフェ
ート、芳香族スルフィン酸の可溶性塩のようなイオウ化
合物:N、N−ジメチル−p−アミノベンゾニトリルの
ようなN、N−ジ置換−p−アミノベンゾニトリル系化
合物ニトリ−n−ブチルホスフィン、ナトリウムジエチ
ルチオホスフェートのようなリン化合物;N−ニトロソ
ヒドロキンルアミン誘s体;オキサゾリン化合物;四塩
化炭素・ヘキサクロロエタンのような塩素化合物などが
あげられる。Furthermore, in order to enhance the effect of the photopolymerization initiator, a sensitizer can also be used in combination. As a sensitizer, aliphatic amines such as triethylamine, triethanolamine, and N-dimethyljetanolamine; aromatic amines; nitrogen heterocyclic compounds such as piperidine: 0-t! Ureas such as J-ruthiourea; Sulfur compounds such as sodium diethyldithiophosphate, soluble salts of aromatic sulfinic acids: N,N-disubstituted-p- such as N,N-dimethyl-p-aminobenzonitrile Examples include aminobenzonitrile compounds, phosphorus compounds such as nitri-n-butylphosphine, and sodium diethylthiophosphate; N-nitrosohydroquine derivatives; oxazoline compounds; chlorine compounds such as carbon tetrachloride and hexachloroethane. .
また貯蔵安定性を高めるために、第4級アンモニウムク
ロライド;ジエチルヒドロキシアミン;環状アミド;ニ
トリル化合物;尿素誘導体;ベンゾチアゾール;ハイド
ロキノン;ハイドロキノンモノメチルエーテル;乳酸;
シュウ酸;安息香酸;ナフテン酸銅などを添加すること
ができる。In addition, in order to improve storage stability, quaternary ammonium chloride; diethyl hydroxyamine; cyclic amide; nitrile compound; urea derivative; benzothiazole; hydroquinone; hydroquinone monomethyl ether; lactic acid;
Oxalic acid; benzoic acid; copper naphthenate, etc. can be added.
さらにマスク剤に色を付は識別を容易にするため、染料
や顔料を添加することもできる。Furthermore, dyes or pigments can be added to the masking agent to make it easier to identify.
ヌクリーン印刷時の泡かみの防止やレベリング性付与の
ために、シリコーン系、フッ素系等の消泡剤や、ポリ(
メタ)アクリレート、オリゴ(メタ)アクリレート、シ
リコーンなどのレベリング剤を添加することもできる。In order to prevent foam formation and provide leveling properties during Nuclean printing, antifoaming agents such as silicone and fluorine-based agents and poly(
Leveling agents such as meth)acrylates, oligo(meth)acrylates, silicones, etc. can also be added.
本発明のマスク剤が好ましいスクリーン印刷適性を有す
るためには、JIS K5701−1980にて規定さ
れているスプレッドメータによって測定したスプレッド
メーター降伏値が通常80〜8.600dyne/d、
好ましくは、100〜6,000 dyne/m 、さ
らに好ましくは、120〜3,000 dyne膚であ
ることが必要である。スプレッドメーター降伏値が80
dyne/c1未満の場合には、マスク剤が流れ易く
、細かい・くターンを描くことが困難となり、また、8
,600 dyne/ 7よりも大きい場合には、ヌク
リーンの通りが悪くなり、スクリーン印刷適性が悪化す
るため好ましくない。In order for the masking agent of the present invention to have preferable suitability for screen printing, the spread meter yield value measured by a spread meter specified in JIS K5701-1980 is usually 80 to 8.600 dyne/d,
It is preferably 100 to 6,000 dyne/m2, more preferably 120 to 3,000 dyne/m2. Spread meter yield value is 80
If the dyne/c is less than 1, the mask agent will flow easily and it will be difficult to draw fine turns.
, 600 dyne/7, it is not preferable because the NuClean passage becomes difficult and suitability for screen printing deteriorates.
本発明のマスク剤のスプレッドメーター降伏値を80〜
8,600 dyne/cmに調整し、好ましい流動適
性とするためには、ジエン系オリゴマー、モノマー。The spread meter yield value of the mask agent of the present invention is 80~
In order to adjust to 8,600 dyne/cm and achieve preferable flowability, diene oligomers and monomers are used.
可塑剤か増粘剤・光重合開始剤及びその他の添加剤等の
使用割合を、以下のような範囲で使用することが必要で
ある。It is necessary to use the proportions of plasticizers, thickeners, photopolymerization initiators, and other additives within the following ranges.
ジエン系オリゴマーとモノマーとの使用割合(重量比)
は、ジエン系オリゴマー:モノマー=90:10〜10
: 9Qであり、好ましくは、80 : 20〜go
: 70である。ジエン系オリゴマーが10未満の場
合には、剥離に適したゴム状の皮膜特性が得られない、
また、90より大の場合には、粘度が高くなり、好まし
い流動特性が得られない。Usage ratio of diene oligomer and monomer (weight ratio)
is diene oligomer:monomer=90:10-10
:9Q, preferably 80:20~go
: 70. If the number of diene oligomers is less than 10, rubber-like film characteristics suitable for peeling cannot be obtained.
Moreover, if it is larger than 90, the viscosity becomes high and favorable flow characteristics cannot be obtained.
可塑剤は、硬化皮膜の離型性を向上させ、可撓性を付与
するために併用することが望ましい・使用量ハ・ジエン
系オリゴマーに対して、0〜100重量%、好ましくは
、10〜50重量%である。The plasticizer is preferably used in combination to improve the mold releasability of the cured film and impart flexibility.Amount used: 0 to 100% by weight, preferably 10 to 100% by weight, based on the diene oligomer. It is 50% by weight.
100重量%より犬の場合には、皮膜強度が低下し、剥
離が困難となる。また、マスク剤の耐熱性が低下する。If the amount is 100% by weight or more in the case of dogs, the film strength decreases and peeling becomes difficult. Moreover, the heat resistance of the masking agent decreases.
さらに、可塑剤の一部が、剥離後、残渣として残る場合
があり、好ましくない。Furthermore, a part of the plasticizer may remain as a residue after peeling, which is not preferable.
増粘剤は、ジエン系オリゴマー、モノマー、必要により
添加された可塑剤、その他添加剤の合計に対し、通常0
.1〜15重量%、好ましくは、0.5〜12重量%・
さらに好ましくは、1.0〜10重量幅使用される。0
.1重量%未満の場合には、スプレッドメーター降伏値
が小さくなり、また、15重it%二す大の場合には、
スプレッドメーター降伏値が大きくなりすぎ、いずれの
場合にもスクリーン印刷適性が不良となってくる。また
、特に無機系増粘剤の使用量が15重量%以上の場合に
は、活性エネルギー線硬化が困難となり好ましくない。The thickener is usually 0% of the total of the diene oligomer, monomer, plasticizer added if necessary, and other additives.
.. 1 to 15% by weight, preferably 0.5 to 12% by weight.
More preferably, a weight range of 1.0 to 10 is used. 0
.. If it is less than 1% by weight, the spread meter yield value will be small, and if it is 15% by weight, the yield value will be small.
The spread meter yield value becomes too large, and in either case, suitability for screen printing becomes poor. Further, in particular, if the amount of inorganic thickener used is 15% by weight or more, curing with active energy rays becomes difficult, which is not preferable.
本発明の組成物は、紫外線や電子線のような活性エネル
ギー線により硬化させることができる。The composition of the present invention can be cured by active energy rays such as ultraviolet rays and electron beams.
このうち、紫外線照射によって硬化させる場合は、あら
かじめ、光重合開始剤または、光重合開始剤と増感剤と
の組み合わせを添加しておく必要がある。これらの使用
量は、ジエン系オリゴマー、モノマー、必要により添加
された可塑剤その他添加剤の合計に対し、通常0.1〜
15重量%を好ましくは、1〜10重量%である。0.
1重量%未満では、紫外線硬化が困難となす、15重量
%より大の場合には、余分な量が多くなる。また、電子
線照射によって、硬化させる場合は、これらの光重合開
始剤や増感剤は、特に必要としない。Among these, when curing by ultraviolet irradiation, it is necessary to add a photopolymerization initiator or a combination of a photopolymerization initiator and a sensitizer in advance. The amount of these used is usually 0.1 to 0.1 to the total of the diene oligomer, monomer, plasticizer and other additives added as necessary.
15% by weight, preferably 1-10% by weight. 0.
If it is less than 1% by weight, UV curing will be difficult, and if it is more than 15% by weight, there will be a large amount of excess. Moreover, when curing by electron beam irradiation, these photopolymerization initiators and sensitizers are not particularly required.
本発明のマスク剤の製造方法としては、任意の方法をと
ることができる。例えば、ジエン系オリゴマー、七ツマ
−を混合溶解後、増粘剤を添加して、攪拌混合する方法
や、これらの各成分を一度に攪拌混合する方法などがあ
げられる。可塑剤や、光重合開始剤などの必要に応じて
、添加される成分は、任意の段階で添加できる。混合の
温度は、ゲル化を防ぐために常温〜6Q’Oが望ましい
、また混合時間は、均一に混合できるまでで、特に、限
定されないが通常10分〜8時間である。混合攪拌設備
としては、通常、羽根型攪拌機、ディゾル・5−、ボー
ルミル、ニーダ−、サンドミル、二本ロール・三本ロー
ル・超音波分散機等が使用できる。Any method can be used to produce the masking agent of the present invention. Examples include a method of mixing and dissolving a diene oligomer and a hexamer, then adding a thickener and stirring and mixing, and a method of stirring and mixing these components at once. Components such as a plasticizer and a photopolymerization initiator can be added at any stage as required. The mixing temperature is preferably room temperature to 6Q'O to prevent gelation, and the mixing time is not limited, but is usually 10 minutes to 8 hours until uniform mixing is achieved. As the mixing/stirring equipment, a vane type stirrer, a dissol 5-mill, a ball mill, a kneader, a sand mill, a two-roll/three-roll mill, an ultrasonic dispersion machine, etc. can be used.
本発明のマスク剤は、通常スクリーン印刷法によって、
プリント基板に塗布し、ついで活性エネルギー線硬化さ
せ使用される。活性エネルギー線としては、紫外線及び
電子線などがあり、いずれを用いてもよいが、紫外線の
場合には、光重合開始剤が必要となる。紫外線の光源と
しては、高圧水銀灯、キセノンランプ、メタルハライド
ランプなどが使用される。照射条件は、紫外線、電子線
ともに特に制限はない、硬化後の膜厚は通常10μ〜2
ヌ冨で、充分なハンダ耐熱性及びメッキ液耐性を有して
いるが、使用されるハンダ温度その他の条件により変化
させてもよい。膜厚が10μ未満の場合は、硬化膜が切
れ易くなるために剥離が困難となシ、また2正を越える
と、深部が硬化しにくくなるため、好ましくない。The masking agent of the present invention is usually prepared by a screen printing method.
It is applied to a printed circuit board and then cured with active energy rays before use. Examples of active energy rays include ultraviolet rays and electron beams, and either of them may be used, but in the case of ultraviolet rays, a photopolymerization initiator is required. As the ultraviolet light source, a high-pressure mercury lamp, a xenon lamp, a metal halide lamp, etc. are used. There are no particular restrictions on the irradiation conditions for both ultraviolet rays and electron beams, and the film thickness after curing is usually 10 μ to 2
Although it has sufficient solder heat resistance and plating solution resistance, it may be changed depending on the solder temperature used and other conditions. If the film thickness is less than 10 μm, the cured film becomes easy to break, making peeling difficult. If it exceeds 2, it becomes difficult to harden deep parts, which is not preferable.
本発明のマスク剤は、スクリーン印刷以外の塗布法、例
えば、ディヌベンサー、ヘラ、ビン転写法、ハケ塗υ・
メタルマスク印刷等によっても塗布することが可能であ
わ、用途、対象とする被塗物によυ、最も適した塗布方
法を選ぶことができる0本発明のノ・ンダマスク剤は、
通常、プリント基板に塗布し、活性エネルギー線硬化後
、フラックス処理を行ない、さらに・・ンダ付けした後
剥離除去される。The masking agent of the present invention can be applied by coating methods other than screen printing, such as dinuvencer, spatula, bottle transfer method, brush coating,
The non-damask agent of the present invention can also be applied by metal mask printing, etc., and the most suitable application method can be selected depending on the application and the object to be coated.
Usually, it is applied to a printed circuit board, cured with active energy rays, subjected to flux treatment, soldered, and then peeled off.
以下実施例により、本発明を説明するが、本発明は、こ
れらの実施例に限定されるわけではない。The present invention will be explained below with reference to Examples, but the present invention is not limited to these Examples.
製造例及び比較製造例
高粘度用の羽根型攪拌機を備えた混合溶解釜に表1に示
すジエン系オリゴマー、モノマー、可塑剤・増粘剤、光
重合開始剤、その他添加剤を仕込み、常温で8時間混合
溶解して、均一なマスク剤を得た。得られたマスク剤の
スプレッドメーター降伏値をJIS K5701−19
80に従って測定した。Production Examples and Comparative Production Examples The diene oligomers, monomers, plasticizers/thickeners, photopolymerization initiators, and other additives shown in Table 1 were charged into a mixing and dissolving vessel equipped with a blade-type stirrer for high viscosity, and the mixture was heated at room temperature. The mixture was mixed and dissolved for 8 hours to obtain a uniform masking agent. The spread meter yield value of the obtained mask agent was determined according to JIS K5701-19.
80.
*1.出光石油化学■集
*20日本ゼオン■製
*30日本石油化学■屡
*4.半月ゴム■I
実施例及び比較例
製造例及び比較製造例のマスク剤を、乳剤厚250μの
70メツシユポリエステル製ヌクリーンと硬g 65
Oシリコーンゴム製スキージを用いて銅ヌルーホール・
ガラスエポキシ基板に塗布した一続いて、出力160W
/cIrLの高圧水銀灯で、5秒間照射し、硬化させた
。ただし、実施例2については、紫外線照射の代わシに
B M radの電子線照射で硬化させた。このとき硬
化膜厚は、200μであつ九フラックスを塗布した後、
ついで、260″Cの溶融ハンダ槽に3秒間浸漬し、ハ
ンダ付けを行なった後、マスク剤を剥離除去した。一方
、同様の方法で、マスク剤を塗布、硬化した銅スルーホ
ール・ガラス、エポキシ樹脂基板をシアン化金、 KC
N・Na2HPO4よシなる55°Cの普通メッキ浴に
10分間浸漬した。ついで、マスク剤を剥離除去した。*1. Idemitsu Petrochemical ■ Collection *20 Nippon Zeon ■ *30 Nippon Petrochemical ■ Collection *4. Half-moon rubber ■I Examples and comparative examples The masking agents of the manufacturing examples and comparative manufacturing examples were mixed with 70 mesh polyester Nuclean with an emulsion thickness of 250μ and hard g 65
Copper null hole using silicone rubber squeegee
After coating on a glass epoxy board, the output is 160W.
/cIrL high pressure mercury lamp for 5 seconds to cure. However, in Example 2, instead of UV irradiation, BM rad electron beam irradiation was used for curing. At this time, the cured film thickness was 200μ, and after applying the flux,
Then, after soldering by immersing in a molten solder bath at 260"C for 3 seconds, the masking agent was peeled off. Meanwhile, in the same manner, the masking agent was applied and cured copper through-hole glass, epoxy Gold cyanide resin substrate, KC
It was immersed in a normal plating bath of N.Na2HPO4 at 55°C for 10 minutes. Then, the masking agent was peeled off.
結果を表2に示す。The results are shown in Table 2.
本発明のマスク剤は、ヌクリーン印刷力S可能であシ、
細かいパターンを正確に印刷できる。充分なブラックス
耐性、ノ・ンダ耐熱性及びメッキ液耐性を有し、さらに
、ノ・ンダまたはメッキ処理後、容易に剥離除去でき、
残渣が残らないため、基板の電気特性を悪化させない等
の効果を有している。The masking agent of the present invention is capable of Nuclean printing force,
Capable of printing fine patterns accurately. It has sufficient blacks resistance, no-da heat resistance, and plating solution resistance, and can be easily peeled off and removed after no-da or plating treatment.
Since no residue remains, it has the effect of not deteriorating the electrical characteristics of the substrate.
Claims (1)
イル基を分子内に有する、ジエン系オリゴマー:10〜
80重量部、エチレン性不飽和基を有するモノマー:2
0〜90重量部、可塑剤:0〜80重量部、光重合開始
剤:0〜15重量部、及び増粘剤:0.1〜15重量部
、よりなるスプレッドメーター降伏値80〜8600d
yne/cm^2のハンダ及びメッキマスク剤。Diene oligomer having at least one acryloyl group or methacryloyl group in the molecule: 10-
80 parts by weight, monomer having ethylenically unsaturated group: 2
0 to 90 parts by weight, plasticizer: 0 to 80 parts by weight, photopolymerization initiator: 0 to 15 parts by weight, and thickener: 0.1 to 15 parts by weight, spread meter yield value 80 to 8600 d.
yne/cm^2 solder and plating mask agent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12429486A JPS62279691A (en) | 1986-05-28 | 1986-05-28 | Activation energy beam cured type solder and plating maskingagent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12429486A JPS62279691A (en) | 1986-05-28 | 1986-05-28 | Activation energy beam cured type solder and plating maskingagent |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62279691A true JPS62279691A (en) | 1987-12-04 |
Family
ID=14881769
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12429486A Pending JPS62279691A (en) | 1986-05-28 | 1986-05-28 | Activation energy beam cured type solder and plating maskingagent |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62279691A (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54133585A (en) * | 1978-04-10 | 1979-10-17 | Hitachi Ltd | Photo-setting adhesive composition having excellent resistance to plating |
JPS5575291A (en) * | 1978-12-01 | 1980-06-06 | Hitachi Ltd | Photosensittve resin composition for coating hybrid integrated circuit |
JPS5934692A (en) * | 1982-08-20 | 1984-02-25 | 住友電気工業株式会社 | Method of producing flexible printed circuit board |
-
1986
- 1986-05-28 JP JP12429486A patent/JPS62279691A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54133585A (en) * | 1978-04-10 | 1979-10-17 | Hitachi Ltd | Photo-setting adhesive composition having excellent resistance to plating |
JPS5575291A (en) * | 1978-12-01 | 1980-06-06 | Hitachi Ltd | Photosensittve resin composition for coating hybrid integrated circuit |
JPS5934692A (en) * | 1982-08-20 | 1984-02-25 | 住友電気工業株式会社 | Method of producing flexible printed circuit board |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US8425790B2 (en) | Ink-jet ink composition for etching resist | |
JP5255307B2 (en) | Inkjet ink composition for etching resist | |
JP3190251B2 (en) | Photocurable and thermosetting resin composition for alkali-developed flexible printed wiring boards | |
DE2904649A1 (en) | RESIN COMPOSITION AND METHOD OF FIXING COMPONENTS ON CIRCUIT BOARDS | |
TW200422356A (en) | Process | |
US8758986B2 (en) | Printed wiring board and method for producing the same | |
WO1996011239A1 (en) | Photosolder resist ink, printed circuit board, and process for producing the same | |
DE112017003006T5 (en) | EPOXY (METH) ACRYLATE RESIN AND RESISTANT | |
JP5518311B2 (en) | Inkjet ink composition for etching resist | |
JP6524579B2 (en) | UV curable composition for inkjet etching resist | |
US9453139B2 (en) | Hot melt compositions with improved etch resistance | |
JPS62279691A (en) | Activation energy beam cured type solder and plating maskingagent | |
JPS59170165A (en) | Ultraviolet curing composition | |
TWI317251B (en) | A plating process for making an electronic device | |
JP3217126B2 (en) | Photosensitive resin composition | |
JPH0655794B2 (en) | UV curable resin composition | |
JPS5825371A (en) | Ultraviolet-curing ink composition for printed circuit | |
JP2003221420A (en) | Active radiation-curing composition and cured film | |
JPH01278585A (en) | Ultraviolet ray curable resist ink | |
JPS63312375A (en) | Resin composition and solder resist resin composition therefrom | |
JP4261635B2 (en) | UV curable through-hole filler | |
JP6339925B2 (en) | UV curable composition for inkjet etching resist | |
JP3678922B2 (en) | Resist composition | |
JP4497610B2 (en) | Photocurable resin composition | |
JPH06157714A (en) | Epoxy @(3754/24)meth)acrylate, polymerizable resin composition and its cured product |