JPS62277735A - Hydro-extracting drier - Google Patents
Hydro-extracting drierInfo
- Publication number
- JPS62277735A JPS62277735A JP12304786A JP12304786A JPS62277735A JP S62277735 A JPS62277735 A JP S62277735A JP 12304786 A JP12304786 A JP 12304786A JP 12304786 A JP12304786 A JP 12304786A JP S62277735 A JPS62277735 A JP S62277735A
- Authority
- JP
- Japan
- Prior art keywords
- tank
- nozzle
- rotor
- fog
- semiconductor wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 claims abstract description 15
- 239000002245 particle Substances 0.000 claims abstract description 6
- 239000003595 mist Substances 0.000 claims 2
- 230000018044 dehydration Effects 0.000 claims 1
- 238000006297 dehydration reaction Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 16
- 235000012431 wafers Nutrition 0.000 abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 229920006395 saturated elastomer Polymers 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 2
- 241000257465 Echinoidea Species 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 241000277269 Oncorhynchus masou Species 0.000 description 1
- 206010044565 Tremor Diseases 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【発明の詳細な説明】
3、発明の詳細な説明
〔産業上の利用分野〕
この発明は、半導体ウェハ等の薄肉状の被処理体を水切
乾燥させる場合に使用する水切乾燥装置に関するもので
ある。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] This invention relates to a draining and drying device used for draining and drying thin-walled objects such as semiconductor wafers. .
半導体ウェハを水洗いした後に水切乾燥する場合に使用
する乾燥装置として従来使用されているものを第2図に
示す。即ちタンク1内にテーブル状のロークー2を描え
、このローター 2に複数のカセット収納箱3を固定し
、この収納箱3内に乾燥すべき半導体ウェハ4などが収
納されたかご状のカセッ1−5がセットされろ。この状
態でロークー駆動用のモーター6・2作動し、ロークー
2を例えば100Or、 p、 m前後で高速回転させ
ろと、半導体ウェハ4に付着していた水滴等が遠心力に
よって飛ばされて水切が?−jわれろ。FIG. 2 shows a conventional drying device used when semiconductor wafers are drained and dried after being washed with water. That is, a table-shaped rotor 2 is drawn inside the tank 1, a plurality of cassette storage boxes 3 are fixed to this rotor 2, and a basket-shaped cassette 1 containing semiconductor wafers 4 to be dried is stored in the storage boxes 3. -5 should be set. In this state, the low-coupling drive motor 6.2 is activated and the low-coupling motor 2 is rotated at a high speed of, for example, around 100 Or, p, m, and the water droplets adhering to the semiconductor wafer 4 are blown off by the centrifugal force and drained. -j Get away.
また一方カセ・ソト収納箱3の回転によっ−C1中心部
に発生する負圧を利用して上部の蓋7の吸気口8から吸
引された気体Aが半導体ウェハ4の表面を乾燥させろ。On the other hand, by utilizing the negative pressure generated at the center of -C1 by the rotation of the cassette/soto storage box 3, the gas A sucked in from the air intake port 8 of the upper lid 7 dries the surface of the semiconductor wafer 4.
なお図中9.10はタンク1に設けられた排水バイ゛7
°と排気1」である。In addition, 9.10 in the figure is the drainage pipe 7 installed in the tank 1.
° and exhaust 1''.
〔発明が解決しようとする問題区、す、〕9、上のよう
に構成された従来の水切乾燥装置では、ローターと共に
高速回転する半導体ウニ凸表面に付着している極小(例
えば10011m前後)の水滴は、高速回転に到達する
時間内に蒸発するため(遠心力によって飛ばされていな
い)、上記半導体ウニ凸表面にシミ等が残り、製品の歩
留り低下や品質を劣化させていた。[Problem to be solved by the invention] 9. In the conventional drain drying device configured as above, extremely small particles (for example, around 10011 m) attached to the convex surface of semiconductor sea urchins rotating at high speed together with the rotor. Since the water droplets evaporate within the time it takes to reach high speed rotation (they are not blown away by centrifugal force), stains remain on the convex surface of the semiconductor sea urchin, resulting in a decrease in product yield and quality.
この発明は上記のような問題点を解消するためになされ
たもので、簡単な構造で全ての半導体ウェハ表面の水滴
を遠心力により水切乾燥し得ろ乾燥装置を提供すること
を目的とする。The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a drying apparatus that has a simple structure and can remove and dry all water droplets on the surface of a semiconductor wafer by centrifugal force.
乙の発明に係る水切乾燥装置は、ローターを収納するタ
ンク内に平均粒子径が例えば10.umJJ下の超微震
を噴霧できるノズルを配設したものである。In the drain drying device according to the invention of B, the average particle diameter is, for example, 10. It is equipped with a nozzle that can spray ultra-microtremors under umJJ.
この発明におけろ水切乾燥装置は、ロータ二が回転する
ことにより、吸気口より気体がタンク内に吸引され、超
eNにより気体を飽和状態にすることにより、タンク内
で半導体ウェハ表面の水滴が蒸発することなく遠心力で
水切乾燥する。In the draining and drying device of this invention, as the rotor 2 rotates, gas is sucked into the tank from the intake port, and by bringing the gas into a saturated state with super eN, water droplets on the surface of the semiconductor wafer are removed in the tank. Drains and dries using centrifugal force without evaporation.
以下この発明の一実施例を第1図について説明する。第
1図において、1〜10は上記第2図のものと同様であ
るので説明を省略する。蓋7の吸気口8を通して上方か
らタンク1内にパイプ11によりノズル12が装備され
、このノズルより微震13が噴霧できるようになされて
いる。なおこのWl’FA 13は物体を濡らさぬよう
平均粒子径が例丸ば10μm以下の超徹宵とする。An embodiment of the present invention will be described below with reference to FIG. In FIG. 1, numerals 1 to 10 are the same as those in FIG. 2 above, so their explanation will be omitted. A nozzle 12 is installed by a pipe 11 into the tank 1 from above through an inlet 8 of the lid 7, and is configured to spray microseismic particles 13 from this nozzle. In addition, this Wl'FA 13 is made to be ultra-long-lasting with an average particle diameter of, for example, 10 μm or less so as not to wet objects.
次に動作について説明する。11−ター6が回転するこ
とにより、このロークーの回転中心側が負”圧となり、
清浄な空気あるいはN2ガス等の乾燥用気体Aが吸気口
8よりタンク1内に入り、ここでノズル12より噴霧さ
れた微震13によりタンク1内を飽和状態にする。この
ようにタンク内が飽和状態であれば、半導体ウェハ4の
表面に付着している極小の水滴でも蒸発することなく、
遠心力により水切することができる。Next, the operation will be explained. As the 11-tor 6 rotates, the rotation center side of this loco becomes negative pressure,
Clean air or a drying gas A such as N2 gas enters the tank 1 through the intake port 8, where the inside of the tank 1 is brought into a saturated state by the tremors 13 sprayed from the nozzle 12. If the inside of the tank is saturated in this way, even the smallest water droplets attached to the surface of the semiconductor wafer 4 will not evaporate.
Water can be drained by centrifugal force.
以上dようにこの発明によれば、タンク内にノズルを配
設するという簡単な構造で、自然乾燥することなく全て
の半導体ウェハ表面に付着した水滴等を水切乾燥できろ
ことになり、製品の歩留り低下や品質の劣化を防ぐこと
ができる効果がある。As described above, according to the present invention, water droplets adhering to the surface of all semiconductor wafers can be drained and dried with a simple structure of arranging a nozzle in a tank without drying them naturally. This has the effect of preventing a decrease in yield and deterioration in quality.
第1図はこの発明の一実施例を示す断面図、第2図は従
来の半導体ウェハの水切乾燥装置を示す断面図である。
図中、1はタンク、2はローター、3はカセット収納箱
、4は半導体ウェハ、5はカセット、6はモーター、1
1はパイプ、12はノズル、13は徹宵である。
尚、図中同一符号は同−又は相当部分を示す。
代理人 大 岩 増 雄
1:クシ7
2:0−ター
J : rrtyトルζ石5に−
4−+4俸り;I\
12:/スパルFIG. 1 is a sectional view showing an embodiment of the present invention, and FIG. 2 is a sectional view showing a conventional semiconductor wafer draining and drying apparatus. In the figure, 1 is a tank, 2 is a rotor, 3 is a cassette storage box, 4 is a semiconductor wafer, 5 is a cassette, 6 is a motor, 1
1 is a pipe, 12 is a nozzle, and 13 is a pipe. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Masu Oiwa 1: Kushi 7 2: 0-Tar J: rrty Tor ζ stone 5- 4-+4 pay; I\ 12:/Spar
Claims (3)
て水切乾燥させるようにした水切乾燥装置において、上
記タンク内に超微霧を発生するためのノズルを装備し、
タンク内を高湿度に保つようにしたことを特徴とする水
切乾燥装置。(1) In a dehydration drying device that holds an object to be dried in a rotor built in a tank and drains and dries the object, the tank is equipped with a nozzle for generating ultra-fine mist,
A drain drying device that is characterized by keeping the inside of the tank at high humidity.
垂下して設け、このパイプの下端にノズルを取付け、こ
のノズルをローターの中心部に臨ませてなる特許請求の
範囲第1項記載の水切乾燥装置。(2) A pipe is provided hanging down into the tank from the intake port of the upper lid of the tank, and a nozzle is attached to the lower end of this pipe, and this nozzle is made to face the center of the rotor as claimed in claim 1. Draining and drying equipment.
噴射されるようになされている特許請求の範囲第1項ま
たは第2項記載の水切乾燥装置。(3) The drain drying device according to claim 1 or 2, wherein ultrafine mist having an average particle diameter of 10 μm or less is sprayed from the nozzle.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12304786A JPS62277735A (en) | 1986-05-26 | 1986-05-26 | Hydro-extracting drier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12304786A JPS62277735A (en) | 1986-05-26 | 1986-05-26 | Hydro-extracting drier |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62277735A true JPS62277735A (en) | 1987-12-02 |
Family
ID=14850892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12304786A Pending JPS62277735A (en) | 1986-05-26 | 1986-05-26 | Hydro-extracting drier |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62277735A (en) |
-
1986
- 1986-05-26 JP JP12304786A patent/JPS62277735A/en active Pending
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