JPS6227546B2 - - Google Patents
Info
- Publication number
- JPS6227546B2 JPS6227546B2 JP7647478A JP7647478A JPS6227546B2 JP S6227546 B2 JPS6227546 B2 JP S6227546B2 JP 7647478 A JP7647478 A JP 7647478A JP 7647478 A JP7647478 A JP 7647478A JP S6227546 B2 JPS6227546 B2 JP S6227546B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- hole
- solder
- lead
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 36
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 6
- 101700004678 SLIT3 Proteins 0.000 description 5
- 102100027339 Slit homolog 3 protein Human genes 0.000 description 5
- 238000007598 dipping method Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7647478A JPS554919A (en) | 1978-06-26 | 1978-06-26 | Method of form solder film on perforrated base material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7647478A JPS554919A (en) | 1978-06-26 | 1978-06-26 | Method of form solder film on perforrated base material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS554919A JPS554919A (en) | 1980-01-14 |
| JPS6227546B2 true JPS6227546B2 (enrdf_load_stackoverflow) | 1987-06-15 |
Family
ID=13606169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7647478A Granted JPS554919A (en) | 1978-06-26 | 1978-06-26 | Method of form solder film on perforrated base material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS554919A (enrdf_load_stackoverflow) |
-
1978
- 1978-06-26 JP JP7647478A patent/JPS554919A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS554919A (en) | 1980-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5120577A (en) | Method of performing metal coating on metallized surfaces of electronic component chips with an electronic component chip holder | |
| DE2050958B2 (de) | Verfahren zum Angießen von Bleiplattengittern an eine Polbrücke | |
| US3141753A (en) | Process of making glass-to-metal seals | |
| JPS6227546B2 (enrdf_load_stackoverflow) | ||
| US3020635A (en) | Soldering methods | |
| US3145126A (en) | Method of making diffused junctions | |
| US4499120A (en) | Method for solder tinning of component leads | |
| JPS6131629B2 (enrdf_load_stackoverflow) | ||
| US3942705A (en) | Protection for aluminum tubing during ultrasonic soldering | |
| GB1567397A (en) | Diptinning apparatus | |
| KR910009839B1 (ko) | 금속부품의 염욕질화처리방법 | |
| JPS6348435B2 (enrdf_load_stackoverflow) | ||
| JPS6156623B2 (enrdf_load_stackoverflow) | ||
| JPS572536A (en) | Semiconductor device | |
| JPH0213809B2 (enrdf_load_stackoverflow) | ||
| JPH028603Y2 (enrdf_load_stackoverflow) | ||
| JPS572537A (en) | Semiconductor device | |
| JPH01122660A (ja) | 半田付け方法 | |
| JPS63310147A (ja) | 半導体装置の製造方法 | |
| JPH0671650B2 (ja) | 回転式半田処理法での半田溶融液補給兼酸化膜除去方法および装置 | |
| JPS5942981B2 (ja) | リフロ−方法 | |
| US4897766A (en) | Composite type circuit parts | |
| JP4057940B2 (ja) | 太陽電池素子の製造装置 | |
| JPH0714956A (ja) | 電子部品の半田付け方法 | |
| JPH01211910A (ja) | 電子部品の製造方法 |