JPS62275267A - Photosensitive lithographic plate having improved ink sticking property and developing property - Google Patents
Photosensitive lithographic plate having improved ink sticking property and developing propertyInfo
- Publication number
- JPS62275267A JPS62275267A JP11720086A JP11720086A JPS62275267A JP S62275267 A JPS62275267 A JP S62275267A JP 11720086 A JP11720086 A JP 11720086A JP 11720086 A JP11720086 A JP 11720086A JP S62275267 A JPS62275267 A JP S62275267A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- water
- acid
- photosensitive lithographic
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000007639 printing Methods 0.000 claims description 36
- 229920000642 polymer Polymers 0.000 claims description 22
- 239000000203 mixture Substances 0.000 claims description 20
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 38
- 239000000463 material Substances 0.000 abstract description 4
- 238000005520 cutting process Methods 0.000 abstract description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 16
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- -1 BF4 Chemical class 0.000 description 10
- 239000000976 ink Substances 0.000 description 10
- 238000005498 polishing Methods 0.000 description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000003960 organic solvent Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 8
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 8
- 239000007864 aqueous solution Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 239000002244 precipitate Substances 0.000 description 7
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- 239000004115 Sodium Silicate Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 6
- 229910052911 sodium silicate Inorganic materials 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- 239000003513 alkali Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000005238 degreasing Methods 0.000 description 5
- 238000005227 gel permeation chromatography Methods 0.000 description 5
- 150000002576 ketones Chemical class 0.000 description 5
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical class CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 235000011121 sodium hydroxide Nutrition 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000003746 surface roughness Effects 0.000 description 5
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 4
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- LSNNMFCWUKXFEE-UHFFFAOYSA-L sulfite Chemical class [O-]S([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-L 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WMFOQBRAJBCJND-UHFFFAOYSA-M Lithium hydroxide Chemical compound [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- UAOMVDZJSHZZME-UHFFFAOYSA-N diisopropylamine Chemical compound CC(C)NC(C)C UAOMVDZJSHZZME-UHFFFAOYSA-N 0.000 description 3
- 238000005868 electrolysis reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 235000006408 oxalic acid Nutrition 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- KUIZKZHDMPERHR-UHFFFAOYSA-N 1-phenylprop-2-en-1-one Chemical compound C=CC(=O)C1=CC=CC=C1 KUIZKZHDMPERHR-UHFFFAOYSA-N 0.000 description 2
- DPBJAVGHACCNRL-UHFFFAOYSA-N 2-(dimethylamino)ethyl prop-2-enoate Chemical compound CN(C)CCOC(=O)C=C DPBJAVGHACCNRL-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- QCDWFXQBSFUVSP-UHFFFAOYSA-N 2-phenoxyethanol Chemical compound OCCOC1=CC=CC=C1 QCDWFXQBSFUVSP-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- 206010012442 Dermatitis contact Diseases 0.000 description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 238000002048 anodisation reaction Methods 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- QUKGYYKBILRGFE-UHFFFAOYSA-N benzyl acetate Chemical compound CC(=O)OCC1=CC=CC=C1 QUKGYYKBILRGFE-UHFFFAOYSA-N 0.000 description 2
- 235000019445 benzyl alcohol Nutrition 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- FUSUHKVFWTUUBE-UHFFFAOYSA-N buten-2-one Chemical compound CC(=O)C=C FUSUHKVFWTUUBE-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- NHOGGUYTANYCGQ-UHFFFAOYSA-N ethenoxybenzene Chemical compound C=COC1=CC=CC=C1 NHOGGUYTANYCGQ-UHFFFAOYSA-N 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- QNVRIHYSUZMSGM-UHFFFAOYSA-N hexan-2-ol Chemical compound CCCCC(C)O QNVRIHYSUZMSGM-UHFFFAOYSA-N 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- UCUUFSAXZMGPGH-UHFFFAOYSA-N penta-1,4-dien-3-one Chemical class C=CC(=O)C=C UCUUFSAXZMGPGH-UHFFFAOYSA-N 0.000 description 2
- 229960005323 phenoxyethanol Drugs 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 239000011541 reaction mixture Substances 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 description 2
- 235000019795 sodium metasilicate Nutrition 0.000 description 2
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- NIUHGYUFFPSEOW-UHFFFAOYSA-N (4-hydroxyphenyl) prop-2-enoate Chemical compound OC1=CC=C(OC(=O)C=C)C=C1 NIUHGYUFFPSEOW-UHFFFAOYSA-N 0.000 description 1
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 1
- HMLSBRLVTDLLOI-UHFFFAOYSA-N 1-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)C(C)OC(=O)C(C)=C HMLSBRLVTDLLOI-UHFFFAOYSA-N 0.000 description 1
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 description 1
- XXCVIFJHBFNFBO-UHFFFAOYSA-N 1-ethenoxyoctane Chemical compound CCCCCCCCOC=C XXCVIFJHBFNFBO-UHFFFAOYSA-N 0.000 description 1
- OVGRCEFMXPHEBL-UHFFFAOYSA-N 1-ethenoxypropane Chemical compound CCCOC=C OVGRCEFMXPHEBL-UHFFFAOYSA-N 0.000 description 1
- HMNZROFMBSUMAB-UHFFFAOYSA-N 1-ethoxybutan-1-ol Chemical compound CCCC(O)OCC HMNZROFMBSUMAB-UHFFFAOYSA-N 0.000 description 1
- WAPNOHKVXSQRPX-UHFFFAOYSA-N 1-phenylethanol Chemical compound CC(O)C1=CC=CC=C1 WAPNOHKVXSQRPX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- UZXLOVYBQPDQCA-UHFFFAOYSA-N 2-butylnaphthalene-1-sulfonic acid;sodium Chemical compound [Na].C1=CC=CC2=C(S(O)(=O)=O)C(CCCC)=CC=C21 UZXLOVYBQPDQCA-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical class ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- CUZKCNWZBXLAJX-UHFFFAOYSA-N 2-phenylmethoxyethanol Chemical compound OCCOCC1=CC=CC=C1 CUZKCNWZBXLAJX-UHFFFAOYSA-N 0.000 description 1
- LBBOQIHGWMYDPM-UHFFFAOYSA-N 2-tert-butylphenol;formaldehyde Chemical compound O=C.CC(C)(C)C1=CC=CC=C1O LBBOQIHGWMYDPM-UHFFFAOYSA-N 0.000 description 1
- REEBWSYYNPPSKV-UHFFFAOYSA-N 3-[(4-formylphenoxy)methyl]thiophene-2-carbonitrile Chemical compound C1=CC(C=O)=CC=C1OCC1=C(C#N)SC=C1 REEBWSYYNPPSKV-UHFFFAOYSA-N 0.000 description 1
- JSGVZVOGOQILFM-UHFFFAOYSA-N 3-methoxy-1-butanol Chemical compound COC(C)CCO JSGVZVOGOQILFM-UHFFFAOYSA-N 0.000 description 1
- KFDVPJUYSDEJTH-UHFFFAOYSA-N 4-ethenylpyridine Chemical compound C=CC1=CC=NC=C1 KFDVPJUYSDEJTH-UHFFFAOYSA-N 0.000 description 1
- SBVKVAIECGDBTC-UHFFFAOYSA-N 4-hydroxy-2-methylidenebutanamide Chemical compound NC(=O)C(=C)CCO SBVKVAIECGDBTC-UHFFFAOYSA-N 0.000 description 1
- YKXAYLPDMSGWEV-UHFFFAOYSA-N 4-hydroxybutyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCO YKXAYLPDMSGWEV-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- FSWHSYHYMTVSEL-UHFFFAOYSA-N 4-methoxypentan-1-ol Chemical compound COC(C)CCCO FSWHSYHYMTVSEL-UHFFFAOYSA-N 0.000 description 1
- 101710118399 50S ribosomal protein L24, chloroplastic Proteins 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- ISBWNEKJSSLXOD-UHFFFAOYSA-N Butyl levulinate Chemical compound CCCCOC(=O)CCC(C)=O ISBWNEKJSSLXOD-UHFFFAOYSA-N 0.000 description 1
- 101100012567 Caenorhabditis elegans fat-1 gene Proteins 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- DWBXLPVFYFOPIW-UHFFFAOYSA-N ClC(Cl)COC(=O)C=C Chemical compound ClC(Cl)COC(=O)C=C DWBXLPVFYFOPIW-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229920000084 Gum arabic Polymers 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 239000004111 Potassium silicate Substances 0.000 description 1
- 241000978776 Senegalia senegal Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-N Sulfurous acid Chemical compound OS(O)=O LSNNMFCWUKXFEE-UHFFFAOYSA-N 0.000 description 1
- SLINHMUFWFWBMU-UHFFFAOYSA-N Triisopropanolamine Chemical compound CC(O)CN(CC(C)O)CC(C)O SLINHMUFWFWBMU-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical group ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000205 acacia gum Substances 0.000 description 1
- 235000010489 acacia gum Nutrition 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 150000003926 acrylamides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- XPNGNIFUDRPBFJ-UHFFFAOYSA-N alpha-methylbenzylalcohol Natural products CC1=CC=CC=C1CO XPNGNIFUDRPBFJ-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical compound [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229940072049 amyl acetate Drugs 0.000 description 1
- PGMYKACGEOXYJE-UHFFFAOYSA-N anhydrous amyl acetate Natural products CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000010407 anodic oxide Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000013040 bath agent Substances 0.000 description 1
- 229940007550 benzyl acetate Drugs 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- HJZGNWSIJASHMX-UHFFFAOYSA-N butyl acetate;ethane-1,2-diol Chemical compound OCCO.CCCCOC(C)=O HJZGNWSIJASHMX-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229940005460 butyl levulinate Drugs 0.000 description 1
- UDHMTPILEWBIQI-UHFFFAOYSA-N butyl naphthalene-1-sulfonate;sodium Chemical compound [Na].C1=CC=C2C(S(=O)(=O)OCCCC)=CC=CC2=C1 UDHMTPILEWBIQI-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 1
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- OIWOHHBRDFKZNC-UHFFFAOYSA-N cyclohexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCCCC1 OIWOHHBRDFKZNC-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- IJKVHSBPTUYDLN-UHFFFAOYSA-N dihydroxy(oxo)silane Chemical compound O[Si](O)=O IJKVHSBPTUYDLN-UHFFFAOYSA-N 0.000 description 1
- LVTYICIALWPMFW-UHFFFAOYSA-N diisopropanolamine Chemical compound CC(O)CNCC(C)O LVTYICIALWPMFW-UHFFFAOYSA-N 0.000 description 1
- 229940043279 diisopropylamine Drugs 0.000 description 1
- BBLSYMNDKUHQAG-UHFFFAOYSA-L dilithium;sulfite Chemical compound [Li+].[Li+].[O-]S([O-])=O BBLSYMNDKUHQAG-UHFFFAOYSA-L 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- XJELOQYISYPGDX-UHFFFAOYSA-N ethenyl 2-chloroacetate Chemical compound ClCC(=O)OC=C XJELOQYISYPGDX-UHFFFAOYSA-N 0.000 description 1
- MEGHWIAOTJPCHQ-UHFFFAOYSA-N ethenyl butanoate Chemical compound CCCC(=O)OC=C MEGHWIAOTJPCHQ-UHFFFAOYSA-N 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 1
- MNWFXJYAOYHMED-UHFFFAOYSA-M heptanoate Chemical compound CCCCCCC([O-])=O MNWFXJYAOYHMED-UHFFFAOYSA-M 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 125000001165 hydrophobic group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- NIQQIJXGUZVEBB-UHFFFAOYSA-N methanol;propan-2-one Chemical compound OC.CC(C)=O NIQQIJXGUZVEBB-UHFFFAOYSA-N 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- POVITWJTUUJBNK-UHFFFAOYSA-N n-(4-hydroxyphenyl)prop-2-enamide Chemical compound OC1=CC=C(NC(=O)C=C)C=C1 POVITWJTUUJBNK-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- PMJFVKWBSWWAKT-UHFFFAOYSA-N n-cyclohexylprop-2-enamide Chemical compound C=CC(=O)NC1CCCCC1 PMJFVKWBSWWAKT-UHFFFAOYSA-N 0.000 description 1
- BNTUIAFSOCHRHV-UHFFFAOYSA-N n-ethyl-n-phenylprop-2-enamide Chemical compound C=CC(=O)N(CC)C1=CC=CC=C1 BNTUIAFSOCHRHV-UHFFFAOYSA-N 0.000 description 1
- SWPMNMYLORDLJE-UHFFFAOYSA-N n-ethylprop-2-enamide Chemical compound CCNC(=O)C=C SWPMNMYLORDLJE-UHFFFAOYSA-N 0.000 description 1
- FYCBGURDLIKBDA-UHFFFAOYSA-N n-hexyl-2-methylprop-2-enamide Chemical compound CCCCCCNC(=O)C(C)=C FYCBGURDLIKBDA-UHFFFAOYSA-N 0.000 description 1
- BPCNEKWROYSOLT-UHFFFAOYSA-N n-phenylprop-2-enamide Chemical compound C=CC(=O)NC1=CC=CC=C1 BPCNEKWROYSOLT-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-M naphthalene-1-sulfonate Chemical compound C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-M 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- GYDSPAVLTMAXHT-UHFFFAOYSA-N pentyl 2-methylprop-2-enoate Chemical compound CCCCCOC(=O)C(C)=C GYDSPAVLTMAXHT-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229940093932 potassium hydroxide Drugs 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- NNHHDJVEYQHLHG-UHFFFAOYSA-N potassium silicate Chemical compound [K+].[K+].[O-][Si]([O-])=O NNHHDJVEYQHLHG-UHFFFAOYSA-N 0.000 description 1
- 229910052913 potassium silicate Inorganic materials 0.000 description 1
- 235000019353 potassium silicate Nutrition 0.000 description 1
- BHZRJJOHZFYXTO-UHFFFAOYSA-L potassium sulfite Chemical compound [K+].[K+].[O-]S([O-])=O BHZRJJOHZFYXTO-UHFFFAOYSA-L 0.000 description 1
- 235000019252 potassium sulphite Nutrition 0.000 description 1
- NHARPDSAXCBDDR-UHFFFAOYSA-N propyl 2-methylprop-2-enoate Chemical compound CCCOC(=O)C(C)=C NHARPDSAXCBDDR-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- PNXMTCDJUBJHQJ-UHFFFAOYSA-N propyl prop-2-enoate Chemical compound CCCOC(=O)C=C PNXMTCDJUBJHQJ-UHFFFAOYSA-N 0.000 description 1
- 239000008262 pumice Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910001388 sodium aluminate Inorganic materials 0.000 description 1
- 229940083608 sodium hydroxide Drugs 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- 235000019794 sodium silicate Nutrition 0.000 description 1
- 235000010265 sodium sulphite Nutrition 0.000 description 1
- FGXAXWOAJVOILP-UHFFFAOYSA-M sodium;2-[methyl(pentadecyl)amino]acetate Chemical compound [Na+].CCCCCCCCCCCCCCCN(C)CC([O-])=O FGXAXWOAJVOILP-UHFFFAOYSA-M 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229940062627 tribasic potassium phosphate Drugs 0.000 description 1
- 229940001496 tribasic sodium phosphate Drugs 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- LWIHDJKSTIGBAC-UHFFFAOYSA-K tripotassium phosphate Chemical compound [K+].[K+].[K+].[O-]P([O-])([O-])=O LWIHDJKSTIGBAC-UHFFFAOYSA-K 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
- B41N1/083—Printing plates or foils; Materials therefor metallic for lithographic printing made of aluminium or aluminium alloys or having such surface layers
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
Description
【発明の詳細な説明】
3発明の詳細な説明
〔産業上の利用分野〕
本発明は、アルミニウム支持体上に感光性組成物が塗設
された感光性平版印刷版に関し、更に詳しくは、インキ
着肉性と、現像性の改良さnfc感元性平版印刷版に関
する。Detailed Description of the Invention 3 Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a photosensitive lithographic printing plate in which a photosensitive composition is coated on an aluminum support, and more specifically, This invention relates to an NFC-sensitive lithographic printing plate with improved ink receptivity and developability.
平版印刷版は、感脂性の画像部と親水性の非画像部から
構成され、その使用時には水に湿されて非画像部がこの
水に良くぬらされ、画像部がこの水をはじくことにょジ
後続の感脂性のインキが画像部のみに付着し、これが被
転写物に転写され印刷されるようにしたものである。し
たがって、良好な印刷物を得るには、画像部の感脂性と
非画像部の親水性が良くなくてはならない。A lithographic printing plate is composed of an oil-sensitive image area and a hydrophilic non-image area, and when used, it is moistened with water so that the non-image area is well wetted with this water and the image area is designed to repel this water. The subsequent oil-sensitive ink adheres only to the image area, and this is transferred to the object to be printed. Therefore, in order to obtain good printed matter, the image area must have good oil sensitivity and the non-image area must have good hydrophilicity.
平版印刷版は、支持体上に感光層を有する感光性平版印
刷版(ps版)から作成することが広く行われている。A lithographic printing plate is widely produced from a photosensitive lithographic printing plate (PS plate) having a photosensitive layer on a support.
感光性印刷版の感光層を原稿に従って露光し、非画像部
の感光層を現像液で除去することにより、平版印刷版が
得られ、その後非画像部及び画像部を保護することを目
的としてガム液を塗り、乾燥(ガム引き)した後、印刷
機に取付けて使用される。A lithographic printing plate is obtained by exposing the photosensitive layer of the photosensitive printing plate according to the original and removing the photosensitive layer in the non-image area with a developer. After applying liquid and drying (gumming), it is attached to a printing machine and used.
感光性平版印刷版の現像は、自動現像機にて行うことが
一般的になっている。このとき現像液は自動現像機のタ
ンクの中に貯えられ、繰返し使用され、版を現像するに
つれてその現像能力を低下させ、最後には現像不可能と
なる。2. Description of the Related Art Photosensitive lithographic printing plates are generally developed using an automatic developing machine. At this time, the developer is stored in the tank of the automatic processor and used repeatedly, and as the plate is developed, its developing ability decreases until it becomes impossible to develop.
近年、公害の面から少ない現像液でよシ多くの版を現像
すること及び処理能力を高めることが要望されている。In recent years, from the viewpoint of pollution, it has been desired to develop more plates with less developer and to increase processing capacity.
その1つの解決手段としては、感光層の膜厚を小さくす
ることを挙げることができる。感光層の膜厚を小さくす
ることにより、現像液の感光層内への浸透が早くなシ、
現像性が向上し、現像液へ溶出する感光層の量が小さく
なることにより現像液の活性低下が小さくなることは容
易に子側できる。One solution to this problem is to reduce the thickness of the photosensitive layer. By reducing the thickness of the photosensitive layer, the developer can penetrate into the photosensitive layer quickly.
It is easy to see that the developability is improved and the amount of the photosensitive layer eluted into the developer is reduced, thereby reducing the activity of the developer.
しかし、この手段は次の様な不都合が生じる。However, this method has the following disadvantages.
感光性平版印刷版のアルミニウム支持体は、その親水性
、保水性、あるいは感光層との接着性を向上させること
を目的として、粗面化(砂目立て)されておp1感元層
を薄くすると、砂目の先端部が表面に露出しやすく、画
像部の感脂性が不十分となりやすく、塗設されたガム液
が、印刷のスタート時に除去されに<<、シたがってイ
ンキの着肉が悪い。特にこの現像Fi置版(一度印刷に
使用した版を、インキを除去し、ガム引きを行い、数日
から数カ月保存)した後に使用したときに顕著に現われ
る。The aluminum support of a photosensitive lithographic printing plate is roughened (grained) to make the p1 sensitive layer thinner in order to improve its hydrophilicity, water retention, or adhesion to the photosensitive layer. , the tips of the grains tend to be exposed on the surface, the oil sensitivity of the image area tends to be insufficient, and the applied gum liquid is removed at the start of printing, resulting in ink build-up. bad. This is especially noticeable when using the developed Fi plate (a plate that has been used once for printing is removed from the ink, gummed, and stored for several days to several months).
印刷スタート時のインキ着肉を改良する手段としては、
疎水性基を持ち印刷インキに親和力を持つ種々の化合物
を感光性組成物中に添加する技術、又は感光層の表面は
どよフ親油性にする技術等が開示されている。例えば、
特開昭50−125806号公報には、O−キノンジア
ジドとノボラック型のクレゾール・ホルムアルデヒド樹
脂からなる感光層に親油性の強いノボラック型t−ブチ
ルフェノール−ホルムアルデヒド樹脂を含有させた技術
、特開昭55−527号公報には、親油性で、かつ、主
となる高分子化合物と相溶性の悪い高分子化合物を添加
させ、表面はど親油性に富む層構成にした技術等が開示
されている。As a means to improve ink deposition at the start of printing,
Techniques have been disclosed in which various compounds having hydrophobic groups and having affinity for printing inks are added to photosensitive compositions, or techniques in which the surface of the photosensitive layer is rendered lipophilic. for example,
JP-A-50-125806 discloses a technique in which a highly lipophilic novolac-type t-butylphenol-formaldehyde resin is contained in a photosensitive layer composed of O-quinonediazide and a novolak-type cresol-formaldehyde resin, JP-A-55-1989. No. 527 discloses a technique in which a polymer compound that is lipophilic and has poor compatibility with the main polymer compound is added to create a layer structure that is highly lipophilic on the surface.
しかしこれらの技術は、印刷スタート時のインキ着肉の
改良には効果が認められるが、置版後のインキ着肉には
表面の感脂成分が印刷時に除去されてしまうために、そ
の効果は十分ではない。However, although these techniques are effective in improving ink adhesion at the start of printing, their effectiveness is limited due to the fact that the oil-sensitive components on the surface are removed during printing. Not enough.
本発明の目的は、前記の欠点を解決し、少ない現像液で
多くの面積を現像処理することが可能である、インキ着
肉性、特に置版後のインキ着肉性(置版適性)が改良さ
れた感光性平版印刷版を提供することにある。The purpose of the present invention is to solve the above-mentioned drawbacks, to develop a large area with a small amount of developer, and to improve ink receptivity, especially ink receptivity after plate placement (plate suitability). An object of the present invention is to provide an improved photosensitive lithographic printing plate.
本発明を概説すれば、本発明は感光性平版印刷版に関す
る発明であって、アルミニウム支持体上に感光性組成物
が塗設された感光性平版印刷版において、該アルミニウ
ム支持体が、中心線平均粗さく Ra )の3倍の深さ
におけるアボット負荷的殊による非空隙率(tpmi
)が50%以上の粗面を有し、かつ核感元性組成物が、
該支持体上に14η/dm2以下塗設されていることを
特徴とする。To summarize the present invention, the present invention relates to a photosensitive lithographic printing plate, and the invention relates to a photosensitive lithographic printing plate in which a photosensitive composition is coated on an aluminum support. Abbott load-specific non-porosity (tpmi) at a depth three times the average roughness (Ra)
) has a rough surface of 50% or more, and the nuclear sensitive composition has a rough surface of 50% or more,
It is characterized in that it is coated on the support at a rate of 14η/dm2 or less.
本発明者らは、鋭意研究を重ねた結果、特定の表面形状
を有する支持体上に、特定の膜厚を有する感光層を塗設
することにより、前記目的が達成されることを見出し、
本発明を完成したものである。As a result of extensive research, the present inventors have discovered that the above object can be achieved by coating a photosensitive layer with a specific thickness on a support with a specific surface shape,
This completes the present invention.
本発明において上記の非空隙率(tpmi )とは、粗
さプロファイル只の測定長さAmと切lT深さCの切断
線によりできた当り面の長さとの比で、第1図に示され
た1m5Ll 、L2 、L3・・・にて下記式で求め
られる。In the present invention, the above-mentioned non-porosity (tpmi) is the ratio of the measured length Am of the roughness profile alone to the length of the contact surface created by the cutting line of the cut lT depth C, as shown in Fig. 1. 1m5Ll, L2, L3... is determined by the following formula.
基準線はフィルターによフ得られた中心線に平行で粗さ
プロファイル只のピークに触れる直線である。The reference line is a straight line parallel to the center line obtained by the filter and touching the peak of the roughness profile.
C=RaX3におけるtpmiの値は50以上でろり、
好1しくは60以上、更に好ましくは65以上である。The value of tpmi in C=RaX3 is 50 or more,
It is preferably 60 or more, more preferably 65 or more.
上記の基材の表面の粗略プロファイルRとは、表面粗さ
を触針式表面粗さ計で測定した際のドイツ規格り工N
4768に示されるM−システムで規定されたもので、
トレースされたプロファイルと中心線の差を基準線とし
て表した曲線のことである。The rough profile R of the surface of the base material mentioned above is the German standard roughness profile R when the surface roughness is measured using a stylus type surface roughness meter.
It is defined by the M-system shown in 4768,
A curve that represents the difference between the traced profile and the center line as a reference line.
また、本発明に用いられる本材表面の中心線平均粗さく
Ra )としては、[lL1〜2.0μmが好ましく
、より好ましくは02へ1.5μmであり、特にCL3
〜CL9μmの場合が保水性の点で最も好ましい。ここ
で中心線平均粗さく Ra )とは、ドイツ規格DIN
4768に示されているように粗さプロファイルにお
ける中心線からの該プロファイル上の各点への距離の絶
対値の相加平均であジ、横方向の中心線全X軸とし、縦
方向をY軸とし、粗さプロファイル上の点を(x、y)
で表したとき、測定長さムについて下記式で求められる
Ra@f’eμm単位で表したものである。In addition, the centerline average roughness (Ra) of the surface of the material used in the present invention is preferably 1 to 2.0 μm, more preferably 02 to 1.5 μm, and especially CL3
The case of ~CL9 μm is most preferable in terms of water retention. Here, the center line average roughness (Ra) is the German standard DIN
4768, it is the arithmetic mean of the absolute values of the distances from the center line of the roughness profile to each point on the profile. The axis is the point on the roughness profile (x, y)
When expressed as , it is expressed in units of Ra@f'e μm, which is determined by the following formula for the measured length μm.
上記の中心線平均粗さく Ra ) 、非を隙率(tp
mi)は例えばペルテy(pθrthen ) 社製
、触針式表面粗さ計、ベルトメーター(Perthom
eter ) 85Pで測定できる。The above center line average roughness (Ra), non-porosity (tp
mi) is, for example, a stylus type surface roughness meter manufactured by Pθrthen, a belt meter (Perthom), etc.
eter) Can be measured at 85P.
本発明で使用するアルミニウム支持体としてハ、純アル
ミニウムあるいはアルミニウム合金の板又は箔、箔と他
の金属、紙、プラスチック等とを貼9合せた複合材、鋼
板等の金属板に浴融アルミニウムメッキしてアルミニウ
ム層を有する板等が好適である。アルミニウム合金とし
ては、種々のものが使用でき、例えばケイ素、鉄、銅、
マンガン、マグネシウム、クロム、亜鉛、鉛、ビスマス
、ニッケルなどの金属との合金が用いられる。Aluminum supports used in the present invention include (c) pure aluminum or aluminum alloy plates or foils, composite materials made by laminating foils with other metals, paper, plastics, etc., and bath-melted aluminum plating on metal plates such as steel plates. A plate having an aluminum layer or the like is suitable. Various aluminum alloys can be used, such as silicon, iron, copper,
Alloys with metals such as manganese, magnesium, chromium, zinc, lead, bismuth, and nickel are used.
上記特性の粗面fc有する支持体は研磨処理更には陽極
酸化処理の条件を適宜選択組合せることによって得るこ
とができる。A support having a rough surface fc having the above characteristics can be obtained by appropriately selecting and combining the conditions of polishing treatment and further anodic oxidation treatment.
研磨方法としては、ボール研磨、ブラシ研磨、化学研磨
、電解研磨、液体ホーニングによる研磨法、パフ研磨法
及びそれらの組合せ等、種々の方法が適用できる。機械
的研磨法において用いられる研磨材としてはアルミナ、
シリコンカーバイド、酸化クロム、ベンガラ、タングス
テンカーバイド、ボロンカーバイド、砂、ケイ石、鋼球
等が挙げられる。As the polishing method, various methods can be applied, such as ball polishing, brush polishing, chemical polishing, electrolytic polishing, liquid honing, puff polishing, and combinations thereof. Abrasives used in mechanical polishing include alumina,
Examples include silicon carbide, chromium oxide, red iron, tungsten carbide, boron carbide, sand, silica, and steel balls.
具体的には、アルミニウム合金板(材質1100等)を
1〜10%苛注ソーダ液を用いて軽く表面処理し、酸化
層や付着した油脂、汚染物等金除去した後、ナイロン製
ブラシ等で上記研磨材例えば研磨砂を用いてブラシ研磨
し、表面を粗面化する。Specifically, an aluminum alloy plate (material: 1100, etc.) was lightly surface-treated using a 1-10% caustic soda solution to remove the oxidized layer, adhering oils, and contaminants, and then polished with a nylon brush or the like. Brush polishing is performed using the above-mentioned abrasive material such as abrasive sand to roughen the surface.
電解によりエツチングする方法としては、塩酸、クエン
酸、硝酸、ホウ酸、シュウ酸又はそれらの混合物の11
〜10%の水浴液中で印加電圧10〜100v、電流密
度1,100A/dm” 、浴温度10〜50℃、電解
時間5〜500秒の範囲から選択する。Etching by electrolysis includes hydrochloric acid, citric acid, nitric acid, boric acid, oxalic acid, or a mixture thereof.
-10% water bath solution, an applied voltage of 10 to 100 V, a current density of 1,100 A/dm'', a bath temperature of 10 to 50 DEG C., and an electrolysis time of 5 to 500 seconds.
特に好ましいのは、硝酸又は塩酸を主成分とする浴であ
る。Particularly preferred are baths based on nitric acid or hydrochloric acid.
研磨処理を行う際には、前もって脱脂、洗浄を行うこと
が望ましい。脱脂処理の例としては、石油系溶剤又はト
リクロロエチレン、ノく−クロロエチレン等の塩素化炭
化水素を使用して汚れを除去する溶剤脱脂、非イオン系
界面活性剤とトリクロロエチレン、ケロシン等の浴剤と
水とを乳化させた溶液を用いるエマルジョン脱脂、アル
カリ性の薬品を含む処理液で煮沸するアルカリ脱脂、電
解脱脂等が挙げられる。When performing polishing treatment, it is desirable to degrease and clean the surface in advance. Examples of degreasing include solvent degreasing, which uses petroleum-based solvents or chlorinated hydrocarbons such as trichloroethylene and chloroethylene to remove stains, and nonionic surfactants and bath agents such as trichlorethylene and kerosene. Examples include emulsion degreasing using a solution emulsified with water, alkaline degreasing using boiling in a treatment solution containing an alkaline chemical, and electrolytic degreasing.
粗面化された基板には、表面にスマットが生成している
ので、酸又はアルカリにより表面をエツチングしてスマ
ット除去を行うことが望ましい。Since smut is generated on the surface of a roughened substrate, it is desirable to remove the smut by etching the surface with acid or alkali.
酸としては、硫酸、リン酸、フッ酸、硝酸、塩酸等が用
いられる。As the acid, sulfuric acid, phosphoric acid, hydrofluoric acid, nitric acid, hydrochloric acid, etc. are used.
アルカリとしては、水酸化ナトリウム、水酸化カリウム
、第三リン酸ナトリウム、第三リン酸カリウム、アルミ
ン酸ナトリウム、メタケイ酸ナトリウム、炭酸ナトリウ
ムなどが用いられる。As the alkali, sodium hydroxide, potassium hydroxide, tribasic sodium phosphate, tribasic potassium phosphate, sodium aluminate, sodium metasilicate, sodium carbonate, etc. are used.
次いで、アルミニウム板には陽極酸化処理が施される。Next, the aluminum plate is anodized.
陽極酸化処理は、硫酸、リン酸、シュウ酸、クロム酸等
の単独又は二徨以上を組合せた水溶液中でアルミニウム
に直流又は交流の電流を流すことによル行われる。この
時の!層液の濃度は1〜70%、液温10〜65℃、電
流密度1〜6 CI A/dm’ 、印加電圧1〜10
0V、電解時間10秒〜10分め範囲から選択する。The anodizing treatment is carried out by passing a direct or alternating current through aluminum in an aqueous solution of sulfuric acid, phosphoric acid, oxalic acid, chromic acid, etc., alone or in combination. At this time! The concentration of the layer liquid is 1 to 70%, the liquid temperature is 10 to 65°C, the current density is 1 to 6 CI A/dm', and the applied voltage is 1 to 10.
Select from the range of 0V and electrolysis time of 10 seconds to 10 minutes.
特にリン酸又はリン酸を主成分とする電解液中で陽極酸
化処理する場合が保存安定性、耐刷力、耐薬品性(印刷
時に使用する薬品、例えばプレートクリーナ等に対する
安定性)に良好な結果を与える。例えば、アルミニウム
板を10〜50重量%、好ましくは、20〜40重量%
のリン酸を含む水溶液中、又は、かかるリン酸と全酸中
25重量−以下、好ましくは、10重量−以下の他の酸
、例えば、硫酸、シュウ酸等との混酸を含む水溶液中、
浴温10〜50℃、好ましくは、25〜45℃で、電#
、@度α2へ10 A/dm” 、好ましくは、1〜7
A/dnt”で、10秒〜10分、好ましくfi、2
0秒〜5分の&囲で、得られる陽極酸化層の平均ボア径
が200〜900大、好ましくは、300〜? OOA
。In particular, anodizing in phosphoric acid or an electrolyte containing phosphoric acid as a main component provides good storage stability, printing durability, and chemical resistance (stability against chemicals used during printing, such as plate cleaners, etc.). Give results. For example, the aluminum plate is 10 to 50% by weight, preferably 20 to 40% by weight.
in an aqueous solution containing phosphoric acid, or in an aqueous solution containing a mixed acid of such phosphoric acid and another acid, such as sulfuric acid, oxalic acid, etc., in an amount of 25% by weight or less, preferably 10% by weight or less of the total acid,
At a bath temperature of 10 to 50°C, preferably 25 to 45°C,
, @10 A/dm to degree α2”, preferably 1 to 7
A/dnt” for 10 seconds to 10 minutes, preferably fi, 2
The average bore diameter of the anodized layer obtained is 200-900, preferably 300-? OOA
.
特に好壕しくは400〜900Aで、ボア密度がloo
〜1,000個/ μm2、好ましくは、100〜50
0個/ Jim” 、特に好ましくは100〜350個
/μ−となるように陽極酸化処理したものを使用する。Particularly preferable trenches are 400 to 900A, and the bore density is loo.
~1,000 pieces/μm2, preferably 100-50
0 pieces/Jim", particularly preferably 100 to 350 pieces/μ-, is used.
陽極酸化皮膜tは、非画像部の耐摩耗性、及び感光層と
の接着性、すなわち耐刷力と耐薬品性の観点から、5〜
35mq/13x”が好ましく、8〜30 q7’a−
が更に好ましい。The anodic oxide film t has a rating of 5 to 5 in terms of abrasion resistance in non-image areas and adhesion with the photosensitive layer, that is, printing durability and chemical resistance.
35mq/13x" is preferable, 8-30q7'a-
is even more preferable.
陽極酸化されたアルミニウム板は、通常、更に水又は弱
酸又は弱アルカリ水溶液中において、10〜100℃、
10〜600秒の範囲の条件で処理される。その後、親
水化処理が施される。The anodized aluminum plate is usually further heated at 10 to 100°C in water or a weak acid or weak alkali aqueous solution.
Processing is performed under conditions ranging from 10 to 600 seconds. After that, a hydrophilic treatment is performed.
親水化処理としては熱水封孔やケイ酸ソーダ処理が挙げ
られるが接着性や現像性の点からは、ケイ酸ソーダ処理
が好ましい。ケイ酸ソーダ処理の条件としては譲iQl
〜5%のメタケイ醒ンーダ浴液中に、温度50℃へ95
℃で10秒間〜5分間浸漬して行われる。好ましくは、
その後に60℃〜100cの水に10秒間〜5分間浸漬
して処理される。Examples of the hydrophilic treatment include hot water sealing and sodium silicate treatment, but sodium silicate treatment is preferred from the viewpoint of adhesiveness and developability. The conditions for sodium silicate treatment are:
~ 5% metasilicate in a sodium bath solution to a temperature of 50°C at 95°C.
℃ for 10 seconds to 5 minutes. Preferably,
Thereafter, it is treated by immersing it in water at 60° C. to 100° C. for 10 seconds to 5 minutes.
上記支持体上に塗設する感光層は、親油性高分子化合物
とジアゾ樹脂を主成分としたものが最も適しており、塗
膜量としては1419/d−以下であり、好ましくは6
’9/dm” 〜12119/d−の範囲から選ばれ
る。The photosensitive layer coated on the above support is most suitably one containing a lipophilic polymer compound and a diazo resin as main components, and the coating weight is 1419/d- or less, preferably 6
'9/dm' to 12119/d-.
ジアゾ樹脂としては、置換又は非置換のp−ジアゾジフ
ェニルアミンとアルデヒド類との縮合物であって、保存
安定性の点からアニオンがPF、又はBF4等のハロゲ
ン化ルイス酸であるものが好ましく、特に下記一般式■
で示され、かつ該式におけるnが5以上である樹脂を2
0モルチ以上、好ましくは、20〜60モルチ含有する
ジアゾ樹脂が好ましい。The diazo resin is preferably a condensation product of substituted or unsubstituted p-diazodiphenylamine and aldehydes, and from the viewpoint of storage stability, the anion is PF or a halogenated Lewis acid such as BF4, and particularly General formula below■
A resin represented by the formula and where n is 5 or more is 2
A diazo resin containing 0 molti or more, preferably 20 to 60 molti is preferred.
(式中 Hl 、 R2及びR”Vi水素、アルキル基
又はアルコキシ基を示し、Rは水素、アルキル基又ij
フェニル基を示し、XはPF、又はBF4を示し、nは
1〜200の数を示す)
その他、例えば特公昭47−1167号公報又は米国特
許第3300309号明細書に記載のアニオンが有機酸
であるものも使用することができる。(In the formula, Hl, R2 and R"Vi represent hydrogen, an alkyl group or an alkoxy group, and R represents hydrogen, an alkyl group or ij
(represents a phenyl group, X represents PF or BF4, and n represents a number from 1 to 200). You can also use some.
親油性高分子化合物としては、保存安定性の点から水酸
基を有する親油性高分子化合物が好適である。この目的
に使用しりろ水酸基を有する親油性高分子化合物として
は、例えば、下記の様な水酸基を有するアクリルアミド
類、メタクリルアミド類、アクリル酸エステル類又はメ
タクリル酸エステル類等の単量体から訪導される構成単
位を含有する通常2万〜20万の分子量をもつ共重合体
が挙げられる。As the lipophilic polymer compound, a lipophilic polymer compound having a hydroxyl group is suitable from the viewpoint of storage stability. The lipophilic polymer compounds having hydroxyl groups used for this purpose include, for example, monomers such as acrylamides, methacrylamides, acrylic esters, or methacrylic esters having hydroxyl groups as shown below. Examples include copolymers containing structural units having a molecular weight of usually 20,000 to 200,000.
(1)芳香族性水酸基を有するモノマー、例えばN−(
4−ヒドロキシフェニル)アクリルアミド又1jN−(
4−ヒドロキシフェニル)メタクリルアミド、o−、m
−、p−ヒドロキシスチレン、o−、m−、p−ヒドロ
キシフェニル−アクリレート又はメタクリレート(2)
脂肪族水酸基を有するモノマー、例えば2−ヒドロ
キシエチルアクリレート又は2−ヒドロキシエチルメタ
クリレート
共重合する他の七ツマ−としては、
(1) アクリル酸、メタクリル酸、無水マレイン酸
等のα、β−不飽和カルボン酸
(2) アクリル酸メチル、アクリル酸エチル、アク
リル酸プロピル、アクリル酸ブチル、アクリル酸アミル
、アクリル酸ヘキシル、アクリル酸オクチル、アクリル
酸−2鴫クロロエチル、2−ヒドロキシエチルアクリレ
ート、グリシジルアクリレート、N−ジメチルアミノエ
チルアクリレート等の(wL換)アルキルアクリレート
(3) メチルメタクリレート、エチルメタクリレー
ト、プロピルメタクリレート、ブチルメタクリレート、
アミルメタクリレート、シクロヘキシルメタクリレート
、2−ヒドロキシエチルメタクリレート、4−ヒドロキ
シブチルメタクリレート、グリシジルメタクリレート、
N−ジメチルアミノエチルメタクリレート等の(を換)
アルキルメタクリレート
(4) アクリルアミド、メタクリルアミド、N−メ
チロールアクリルアミド、N−メチロールメタクリルア
ミド、N−エチルアクリルアミド、N−へキシルメタク
リルアミド、N−シクロヘキシルアクリルアミド、N−
ヒドロキシエチルアクリルアミド、N−フェニルアクリ
ルアミド、N−ニトロフェニルアクリルアミド、N−エ
チル−N−フェニルアクリルアミド等のアクリルアミド
若しくはメタクリルアミド類
(51エチルビニルエーテル、2−クロロエチルビニル
エーテル、とドロキシエチルビニルエーテル、プロピル
ビニルエーテル、フチルビニルエーテル、オクチルビニ
ルエーテル、フェニルビニルエーテル等のビニルエーテ
ル類(6) ビニルアセテート、とニルクロロアセテ
ート、ビニルブチレート、安息香酸ビニル等のビニルエ
ステル類
(7) スチレン、α−メチルスチレン、メチルスチ
レン、クロロメチルスチレン等のスチレン類
(8) メチルビニルケトン、エチルビニルケトベブ
ロビルビニルケトン、フェニルビニルケトン等のビニル
ケトン類
(9) エチレン、フロピレン、インフチレン、フタ
ジエン、インプレン等のオレフィン類C1ON−ビニル
ピロリドン、N−ビニルカルバゾール、4−ビニルピリ
ジン、アクリロニトリル、メタクリレートリル等
が挙けられるが、その他、水酸基を含有するモノ!−と
共重合しうるモノマーであれば良く、これに限定される
ものではない。また、これ以外にも必賛に応じて、ポリ
ビニルブチラール樹脂、ポリアミド樹脂、ポリアミド樹
脂、エポキシ樹脂、ノボラック樹脂、天然樹脂等を添加
してもよい。(1) Monomers having aromatic hydroxyl groups, such as N-(
4-hydroxyphenyl)acrylamide or 1jN-(
4-hydroxyphenyl) methacrylamide, o-, m
-, p-hydroxystyrene, o-, m-, p-hydroxyphenyl-acrylate or methacrylate (2)
Monomers having aliphatic hydroxyl groups, such as 2-hydroxyethyl acrylate or 2-hydroxyethyl methacrylate, are copolymerized with other monomers such as (1) α, β-unsaturated monomers such as acrylic acid, methacrylic acid, maleic anhydride, etc. Carboxylic acid (2) Methyl acrylate, ethyl acrylate, propyl acrylate, butyl acrylate, amyl acrylate, hexyl acrylate, octyl acrylate, dichloroethyl acrylate, 2-hydroxyethyl acrylate, glycidyl acrylate, N -(wL-converted) alkyl acrylate such as dimethylaminoethyl acrylate (3) Methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate,
amyl methacrylate, cyclohexyl methacrylate, 2-hydroxyethyl methacrylate, 4-hydroxybutyl methacrylate, glycidyl methacrylate,
(replacement) of N-dimethylaminoethyl methacrylate, etc.
Alkyl methacrylate (4) Acrylamide, methacrylamide, N-methylol acrylamide, N-methylol methacrylamide, N-ethyl acrylamide, N-hexyl methacrylamide, N-cyclohexyl acrylamide, N-
Acrylamides or methacrylamides such as hydroxyethyl acrylamide, N-phenylacrylamide, N-nitrophenyl acrylamide, N-ethyl-N-phenylacrylamide (51 ethyl vinyl ether, 2-chloroethyl vinyl ether, droxyethyl vinyl ether, propyl vinyl ether, Vinyl ethers such as phtyl vinyl ether, octyl vinyl ether, and phenyl vinyl ether (6) Vinyl esters such as vinyl acetate, vinyl chloroacetate, vinyl butyrate, and vinyl benzoate (7) Styrene, α-methylstyrene, methylstyrene, chloro Styrenes such as methylstyrene (8) Vinyl ketones such as methylvinylketone, ethylvinylketobebrovir vinylketone, and phenylvinylketone (9) Olefins such as ethylene, flopylene, inftylene, phtadiene, imprene, etc.C1ON-vinylpyrrolidone, Examples include N-vinylcarbazole, 4-vinylpyridine, acrylonitrile, methacrylatetrile, etc., but any other monomer that can be copolymerized with a hydroxyl group-containing monomer may be used, and the present invention is not limited thereto. In addition, polyvinyl butyral resin, polyamide resin, polyamide resin, epoxy resin, novolak resin, natural resin, etc. may be added as required.
本発明に用いられる水酸基を有する親油性の高分子化合
物は、感光性組成物の固形分中に通常40〜99重t%
、好ましくは50〜95重量%含有させる。また、ジア
ゾ樹脂は通常1〜60i量チ、好ましくは3〜30重量
%含有させる。The lipophilic polymer compound having a hydroxyl group used in the present invention is usually 40 to 99% by weight in the solid content of the photosensitive composition.
, preferably 50 to 95% by weight. The diazo resin is usually contained in an amount of 1 to 60% by weight, preferably 3 to 30% by weight.
本発明の感光性組成物には、更に性能を向上させるため
に以下に示し次ネ々の公知の添加剤を加えることができ
る。The following known additives can be added to the photosensitive composition of the present invention in order to further improve its performance.
(1) 画像を可視画化することを目的とした染料(
2) 塗布性を改良するためのフッ素系界面活性剤や
アルキルエーテル類
(3) 塗膜の柔軟性、耐摩耗性を付与するための可
塑剤
(4) 感脂化剤
(5) 安定剤
これらの添加量は一般に全固形分に対し101〜30重
′!#、%である。(1) Dye for the purpose of visualizing images (
2) Fluorine surfactants and alkyl ethers to improve coating properties (3) Plasticizers to impart flexibility and abrasion resistance to the coating film (4) Sensitizers (5) Stabilizers The amount of addition is generally 101 to 30% by weight based on the total solid content! #,%.
本発明に係る感光性平版印刷版の現像処理に用いられる
現像液は公知のいずれのものであっても良いが、好まし
くは以下のものがよい。すなわち本発明に係るgI元性
印刷版を現像する現像液は、水、あるいfi特定の有機
溶媒及び/又はアルカリ剤を含む水溶液が挙げられる。The developer used in the development of the photosensitive lithographic printing plate according to the present invention may be any known developer, but the following are preferred. That is, the developer for developing the gI-based printing plate according to the present invention may be water or an aqueous solution containing a fi-specific organic solvent and/or an alkaline agent.
ここに特定の有機溶媒とは、現像液中に含有させたとき
上述の感光性組成物層の非露光部(非画像部)を溶解又
は膨潤することができ、しかも常温(20℃)において
水に対する溶解度が10重t%以下の有機溶媒をいう。Here, the specific organic solvent is one that can dissolve or swell the non-exposed area (non-image area) of the above-mentioned photosensitive composition layer when contained in the developer, and that is resistant to water at room temperature (20°C). Refers to an organic solvent having a solubility of 10% by weight or less.
このような有機溶媒としては上記のような特性を有する
ものでありさえすればよく、以下のもののみに限定され
るものではないが、これらを例示するならば、例えば酢
酸エチル、酢酸プロピル、酢酸ブチル、酢酸アミル、酢
酸ベンジル、エチレングリコールモノブチルアセテート
、乳酸ブチル、レブリン酸ブチルのようなカルボン酸エ
ステル;エテルブチルケトン、メチルイソブチルケトン
、シクロヘキサノンのようなケトン類;エチレングリコ
ールモノブチルエーテル、エチレングリコールベンジル
エーテル、エチレングリコールモノフェニルエーテル、
ベンジルアルコール、メチルフェニルカルビノール、n
−アミルアルコール、メチルアミルアルコールのような
アルコール類;キシレンのようなアルキル置換芳香族炭
化水素;メチレンジクロライド、エチレンジクロライド
、モノクロロベンゼンのよつ7にハロゲン化炭化水素な
どがある。これら有機溶媒は一株以上用いてもよい。こ
れら有機溶媒の中では、エチレングリコールモノフェニ
ルエーテルとベンジルアルコールが特に有効である。ま
た、これら有機溶媒の現像液中における含有量はおおむ
ね1へ20重量%であり、特に2〜10重t%のときよ
り好ましい結果fd:得る。Such organic solvents only need to have the above-mentioned characteristics, and are not limited to the following, examples of which include ethyl acetate, propyl acetate, and acetic acid. Carboxylic acid esters such as butyl, amyl acetate, benzyl acetate, ethylene glycol monobutyl acetate, butyl lactate, butyl levulinate; ketones such as ethyl butyl ketone, methyl isobutyl ketone, cyclohexanone; ethylene glycol monobutyl ether, ethylene glycol benzyl ether, ethylene glycol monophenyl ether,
Benzyl alcohol, methylphenyl carbinol, n
- Alcohols such as amyl alcohol and methyl amyl alcohol; alkyl-substituted aromatic hydrocarbons such as xylene; halogenated hydrocarbons such as methylene dichloride, ethylene dichloride, and monochlorobenzene. One or more of these organic solvents may be used. Among these organic solvents, ethylene glycol monophenyl ether and benzyl alcohol are particularly effective. Further, the content of these organic solvents in the developing solution is approximately 1 to 20% by weight, and particularly when the content is 2 to 10% by weight, a more preferable result fd is obtained.
他方、現像液中に含有されるアルカリ剤としては、
(4) ケイ酸ナトリウム、ケイ酸カリウム、水酸化カ
リウム、水酸化ナトリウム、水酸化リチウム、第二又ハ
第三リン酸のナトリウム又はアンモニウム塩、メタケイ
酸ナトリウム、炭酸ナトリウム、アンモニア等の無機ア
ルカリ剤
CB) モノ、ジ又はトリメチルアミン、モノ、ジ又
にトリエチルアミン、モノ又はジイソプロピルアミン、
n−ブチルアミン、モノ、ジ又はトリエタノールアミン
、モノ、ジ又はトリイソプロパツールアミン、エチレン
イミン、エチレンジアミン等の有機アミン化合物等が挙
げられる。On the other hand, the alkaline agents contained in the developer include (4) sodium silicate, potassium silicate, potassium hydroxide, sodium hydroxide, lithium hydroxide, sodium or ammonium salts of di- or tertiary phosphoric acid; , sodium metasilicate, sodium carbonate, ammonia and other inorganic alkali agents CB) mono-, di- or trimethylamine, mono-, di- or triethylamine, mono- or diisopropylamine,
Examples include organic amine compounds such as n-butylamine, mono-, di-, or triethanolamine, mono-, di-, or triisopropanolamine, ethyleneimine, and ethylenediamine.
これらアルカリ剤の現像液中における含有量は通常α0
5〜4重重チで、好ましくは(lL5〜2重@チである
。The content of these alkaline agents in the developer is usually α0
5 to 4 layers, preferably (1L5 to 2 layers).
また、保存安定性、耐刷性等をより以上に高めるために
は、水浴性亜硫酸塩を現像液中に含有させることが好ま
しい。このような水浴性亜硫酸塩としては、亜硫酸のア
ルカリ又はアルカリ土類金属塩が好1しく、例えば亜*
酸す) +7ウム、亜硫酸カリウム、亜硫酸リチウム、
亜誠酸マグネシウムなどがある。これらの亜硫酸塩の現
像液組成物における含有量は通常α05〜4 ff19
%で、好ましくは11〜1重量係である。Further, in order to further improve storage stability, printing durability, etc., it is preferable to include a water-bathable sulfite in the developer. As such water bathable sulfites, alkali or alkaline earth metal salts of sulfites are preferable, such as sulfites.
+7um, potassium sulfite, lithium sulfite,
Examples include magnesium truesite. The content of these sulfites in the developer composition is usually α05~4ff19.
%, preferably 11 to 1% by weight.
また、上述の有機溶媒の水への磐解を助けるために一定
の可溶化剤を含有させることもできる。このような可溶
化剤としては、本発明の所期の効果を実現するため、用
いる有機溶媒より水易溶性で、低分子のアルコール、ケ
トン類を用いるのがよい。また、アニオン活性剤、両性
活性剤等も用いることができる。このようなアルコール
、ケトン類としては、例えばメタノール、エタノール、
プロパツール、ブタノール、アセトン、メチルエチルケ
トン、エチレングリコールモノメチルエーテル、エチレ
ングリコールモノエチルエーテル、メトキシブタノール
、エトキシブタノール、4−メトキシ−4−メチルプタ
ノール、N−メチルピロリドン筒金用いることが好まし
い。また、活性剤としては例えばイングロビルナフタレ
ンスルホン酸ナトリウム、n−ブチルナフタレンスルホ
ン酸ナトリウム、N−メチル−N−ペンタデシルアミノ
酢酸ナトリウム、ラウリルサルフェートナトリウム塩等
が好ましい。これらアルコール、ケトン類等の可溶化剤
の使用量については特に制限はないが、一般に現像液全
体に対し約30M量%以下とすることが好ましい。Certain solubilizers may also be included to aid in the dissolution of the organic solvents mentioned above into the water. As such a solubilizing agent, in order to achieve the desired effects of the present invention, it is preferable to use low-molecular alcohols and ketones that are more water-soluble than the organic solvent used. Furthermore, anionic activators, amphoteric activators, etc. can also be used. Examples of such alcohols and ketones include methanol, ethanol,
It is preferable to use propatool, butanol, acetone, methyl ethyl ketone, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, methoxybutanol, ethoxybutanol, 4-methoxy-4-methylbutanol, and N-methylpyrrolidone cylinder. Preferred examples of the activator include sodium inglovir naphthalene sulfonate, sodium n-butylnaphthalene sulfonate, sodium N-methyl-N-pentadecylaminoacetate, and sodium lauryl sulfate. There is no particular restriction on the amount of solubilizers such as alcohols and ketones used, but it is generally preferable to use the amount of solubilizers, such as alcohols and ketones, at about 30 M% or less based on the entire developer.
本発明に係る感光性平版印刷版は、像様露光した後、上
述の現像液に接触させたり、あるいはこすったりすれば
、おおむね常@〜40℃にて10〜60秒後には、感光
性組成物層の露光部に悪影響を及ぼすことなく、非露光
部の感光性組成物が完全に除去されることになる。After the photosensitive lithographic printing plate according to the present invention has been imagewise exposed, if it is brought into contact with the above-mentioned developer or rubbed, the photosensitive lithographic printing plate will be able to form a photosensitive composition after 10 to 60 seconds at a temperature of ~40°C. The photosensitive composition in the non-exposed areas is completely removed without adversely affecting the exposed areas of the layer.
以下、本発明で使用する支持体、ジアゾ樹脂及びポリマ
ーの裂造例を示す。Examples of fabrication of the support, diazo resin, and polymer used in the present invention are shown below.
(支持体−1)
厚さf124mのアルミ板を3%水散化ナトリウムf6
敵に浸漬して、脱脂し、水洗し、1%塩酸、1%ホウ酸
の水鼎液を用い、15 A/dm”において1分間り流
で′TFL解エツチングし、水洗し、5%水水酸化ナト
リウム液液浸漬してデスマット処理を行い、水洗した。(Support-1) An aluminum plate with a thickness of f124m is coated with 3% sodium f6 aqueous dispersion.
Immerse it in water, degrease it, wash it with water, use a dipping solution of 1% hydrochloric acid and 1% boric acid, and perform TFL decomposition etching at 15 A/dm for 1 minute, rinse it with water, and dilute it with 5% water. Desmut treatment was performed by immersion in a sodium hydroxide solution, followed by washing with water.
史に30%硫酸水溶液30℃で五0 A/ am”で3
0秒間陽極酸化全行い、水洗し、1%メタケイ酸す)
IJウム水溶液に85℃で37秒間浸漬し、引続き90
℃の水に25秒間62潰し水洗乾燥して、支持体−1を
得た。30% sulfuric acid aqueous solution at 50 A/am” at 30°C
Complete anodization for 0 seconds, rinse with water, and rinse with 1% metasilicic acid)
Immersed in IJum aqueous solution at 85°C for 37 seconds, and then heated at 90°C.
It was crushed in water at a temperature of 62° C. for 25 seconds, washed with water, and dried to obtain Support-1.
(支持体−2)
陽極酸化を40%リン酸水浴故60℃で4.0に76m
”、30秒間行った以外は支持体−1と同様にして、支
持体−2を得た。(Support-2) Anodized in a 40% phosphoric acid water bath at 60°C to 4.0 m
"Support-2 was obtained in the same manner as Support-1 except that the reaction was carried out for 30 seconds.
(支持体−3)
厚さCL24簡のアルミ板金、ナイロンブラシと400
メツシユのパミストンー水u濁y *用いその表面を砂
目立てした後、よく水で洗い、10%水酸化ナトIJウ
ム水に浸漬し、水洗した。(Support-3) Aluminum sheet metal with thickness CL24, nylon brush and 400
Mesh pumice stone - water turbidity * After graining the surface, it was thoroughly washed with water, immersed in 10% sodium hydroxide water, and washed with water.
以下支持体−1と同様に陽極酸化、ケイ酸処理全行い、
支持体−3全得t0
次に、これらの支持体の表面粗さを測定した。Below, all anodization and silicic acid treatment were carried out in the same manner as for support-1.
Support-3 Total Obtained t0 Next, the surface roughness of these supports was measured.
表面粗さ計はペルテン(Perthen ) 社M
、ベルトメータ(perthometsr ) S 5
P k用いて、以下の測定条件で行った。The surface roughness meter is from Perthen M.
, belt meter (perthometsr) S 5
The measurement was carried out using P k under the following measurement conditions.
針のカートリッジ:RT−5DC(ダイヤモンド針、針
の先端の半径5μm)
針の感度調整; Pen−10−1,9,0μmを基準
に調整
プロファイル;粗さプロファイルR
縦 倍 率;2.5μm
横 倍 率:250μm
測定長さ;4.0鰭
カットオフ値;(18調
得られた支持体の切断線深さC=RaX5のときの非空
隙率(、tpmi ) 、切断深さ及び中心線平均粗さ
RaQ値を表1に示す。Needle cartridge: RT-5DC (diamond needle, needle tip radius 5 μm) Needle sensitivity adjustment; Adjustment profile based on Pen-10-1, 9,0 μm; Roughness profile R Vertical Magnification; 2.5 μm Horizontal Magnification: 250 μm Measurement length: 4.0 Fin cutoff value: (18 scales Non-porosity (, tpmi), cut depth and center line average when the cut line depth C = RaX5 of the obtained support Table 1 shows the roughness RaQ values.
表1の値は10回測定を行った平均値である。The values in Table 1 are the average values of 10 measurements.
表 1
(ポリマー1の合成)
N−(4−ヒトoキシフェニル)メタクリルアミド11
02、アクリロニトリル25v1エテルアクリレ−)
60 ?、メタクリル酸52及びアゾビスインブチロニ
トリル1.642 f iアセトン−メタノール1:1
混合浴媒112−に溶解し、窒素直換した俊60℃で8
時間加熱した0
反応終了後反応液を水5tIlijにかくはん下注ぎ、
生じた白色沈殿全f取乾燥してポリマー1を90?得た
。Table 1 (Synthesis of Polymer 1) N-(4-human oxyphenyl) methacrylamide 11
02, acrylonitrile 25v1 ether acrylate)
60? , methacrylic acid 52 and azobisinbutyronitrile 1.642 fi acetone-methanol 1:1
Dissolved in mixed bath medium 112- and heated at 60°C under direct nitrogen exchange.
After heating for 0 hours, the reaction solution was poured into 5 t of water with stirring.
The resulting white precipitate was completely removed and dried to give Polymer 1 at 90? Obtained.
このポリマー全ゲルパーミェーションクロマトグラフィ
ー(以下()PCと略a己する)により分子量の制定を
したところ、3(檻平均分子油はa5万であった。When the molecular weight of this polymer was determined by total gel permeation chromatography (hereinafter abbreviated as PC), the molecular weight was determined to be 3 (cage average molecular oil: a50,000).
(ポリマー2の合成)
2−ヒドロキシエチルメタクリレート452、アクリロ
ニトリル10f1エテルメタクリレ−)45f、メタク
リル酸2fと1.22の過酸化ベンゾイルの混合液を、
100℃に加熱したエチレングリコールモノメチルエー
テル300tに2時間かけて滴下した。滴下終了後エチ
レングリコールモノメチルエーテル300fと過酸化ベ
ンゾイル[L3fを加えてその筐ま4時間反応させた。(Synthesis of Polymer 2) A mixed solution of 2-hydroxyethyl methacrylate 452, acrylonitrile 10f1 ethyl methacrylate 45f, methacrylic acid 2f and 1.22 benzoyl peroxide,
The mixture was added dropwise over 2 hours to 300 tons of ethylene glycol monomethyl ether heated to 100°C. After the dropwise addition was completed, 300f of ethylene glycol monomethyl ether and benzoyl peroxide [L3f] were added, and the mixture was allowed to react for 4 hours.
反応終了後メタノールで希釈して水5を中にかくはん下
注ぎ生じた白色沈殿kP取乾燥してポリマー2を93F
得た。After the reaction was completed, diluted with methanol, poured water 5 into it while stirring, collected the white precipitate, and dried it to give Polymer 2 to 93F.
Obtained.
このポリマーをGPCにより分子量の測定を。Measure the molecular weight of this polymer using GPC.
したところ、重量平均分子itは&5万であった。As a result, the weight average molecule it was &50,000.
(ポリマー3の合成)
メタクリル酸メチル60f1アクリロニトリル302、
メタクリル酸10?及びアゾビスインフチロニトリル1
.5 f iメチルセロソルブ2002に溶解し、窒素
を通じながら80℃において4時間重合させた。この反
応混合物を5tの水中に晒下し、生じた白色沈殿を沢取
乾燥してポリマー5fL−70?得た。(Synthesis of Polymer 3) Methyl methacrylate 60f1 acrylonitrile 302,
Methacrylic acid 10? and azobisinftyronitrile 1
.. 5 f i was dissolved in methyl cellosolve 2002 and polymerized for 4 hours at 80° C. while passing nitrogen through. This reaction mixture was exposed to 5 tons of water, and the resulting white precipitate was collected and dried to obtain a polymer 5fL-70? Obtained.
このポリマーt−GPcによシ分子量の測定をした所、
Mf[平均分子量は6万であった。When the molecular weight of this polymer t-GPc was measured,
Mf [average molecular weight was 60,000.
(ポリマー4の合成)
2−ヒドロキシエチルメタクリレート452、アクリロ
ニトリル202、メチルメタクリレ−)309、メタク
リル酸5fをポリマー3の合成例と同様な方法で重合さ
せポリマー4を得た。(Synthesis of Polymer 4) Polymer 4 was obtained by polymerizing 2-hydroxyethyl methacrylate 452, acrylonitrile 202, methyl methacrylate 309, and methacrylic acid 5f in the same manner as in the synthesis example of Polymer 3.
このポリマーをGPCにより分子量の測定をした所、重
量平均分子tは&3万であった。When the molecular weight of this polymer was measured by GPC, the weight average molecular weight t was &30,000.
(ジアゾ樹脂−1の合成)
p−ジアゾジフェニルアミン硫酸塩14.5P(50ミ
リモル)を氷冷下で4cL99のm硫酸に@濁した。こ
の反応液に1.29 (40ミリモル)のパラホルムア
ルデヒドをゆつ<9滴下した。この際、反応温度が10
℃を超えないように添加していった。その後、2時間水
冷下かくはんを続けた。(Synthesis of Diazo Resin-1) 14.5 P (50 mmol) of p-diazodiphenylamine sulfate was suspended in 4 cL99 m-sulfuric acid under ice cooling. <9 drops of 1.29 (40 mmol) of paraformaldehyde were added to the reaction solution. At this time, the reaction temperature was 10
The temperature was added so as not to exceed ℃. Thereafter, stirring was continued for 2 hours under water cooling.
この反応混合物を水冷下、500−のエタノールに滴下
し、生じた沈殿をf過した。エタノールで洗浄後、この
沈殿物を100−の純水に溶解し、この液に&81の塩
化亜鉛を溶解した冷濃厚水浴液を加えた。生じた沈殿を
沢過した後エタノールで洗浄し、これを150−の純水
に溶解した。この液に82のへキサフルオロリン酸アン
モニウムを溶解した冷濃厚水溶gを加えた。生じた沈殿
をP取し水洗し次後、30℃、1昼夜乾燥してジアゾm
脂−1を得た。This reaction mixture was added dropwise to 500 mL of ethanol under water cooling, and the resulting precipitate was filtered. After washing with ethanol, this precipitate was dissolved in 100-m pure water, and a cold concentrated water bath solution in which &81 zinc chloride was dissolved was added to this solution. The resulting precipitate was filtered, washed with ethanol, and dissolved in 150-pure water. To this liquid was added g of a cold concentrated aqueous solution in which 82 ammonium hexafluorophosphate was dissolved. The resulting precipitate was collected and washed with water, and then dried at 30°C for 1 day to obtain diazo m
Fat-1 was obtained.
このジアゾ樹脂−1をGPCによシ分子量の測定をし次
ところ、5蓋体以上が約55モルチ含まれていた。The molecular weight of this diazo resin-1 was measured by GPC, and it was found that it contained about 55 moles of 5 or more caps.
(ジアゾ樹脂−2の合成)
ジアゾ樹脂−1と同様にして合成し、最後のへキサフル
オロリン酸アンモニウムの代りに2−ヒドロキシ−4−
メトキシ−ベンゾフェノン−5−スルホン酸152を溶
解した水浴液で処理しジアゾ樹脂−2を得た。(Synthesis of diazo resin-2) Synthesis was performed in the same manner as diazo resin-1, and instead of the final ammonium hexafluorophosphate, 2-hydroxy-4-
Diazo resin-2 was obtained by treatment with a water bath solution in which methoxy-benzophenone-5-sulfonic acid 152 was dissolved.
このジアン°−1月旨−2をGPC’によりσ出足した
とCろ、5楡体以上が約62モル11れでいた。When this dian°-1 month-2 was analyzed by GPC', it was found that there were about 62 moles and 11 of more than 5 molecules.
以下、本発明全実施例により更に具体的に説明するが、
本発明はこれら実施例に限定されない。Hereinafter, the present invention will be explained in more detail with reference to all examples,
The invention is not limited to these examples.
実施例1〜8、比較例1S4
上記製造例で得次支持体−1〜3に下記表2に示された
組成を有する感光液−1〜4をホヮラーを用いて塗布し
次。その後85℃の温度で3分間乾燥し、後記表3に示
す実施例1〜8、比較例1〜4の感光性平版印刷版を得
た。Examples 1 to 8, Comparative Example 1S4 Photosensitive liquids 1 to 4 having the compositions shown in Table 2 below were coated on the supports 1 to 3 obtained in the above production example using a wheeler. Thereafter, it was dried at a temperature of 85° C. for 3 minutes to obtain photosensitive lithographic printing plates of Examples 1 to 8 and Comparative Examples 1 to 4 shown in Table 3 below.
得られた感光性平版印刷版について次の方法で処理能力
、置版適性について試験を行った。The resulting photosensitive lithographic printing plate was tested for processing ability and plate placement suitability using the following method.
(処理能力)
次に示す組成の現像H−1と、PS版用自動現像機PS
P−860(小西六写真工業(株)製〕を使用し、絵柄
面積率10%の原稿にて3 kWの超高圧水銀灯で露光
された感光性平版印刷版を、現保温展25℃、現像時間
20秒にて良好に現像できる現像g1を当ジの面積にて
試験した。(Processing capacity) Developing H-1 with the following composition and automatic developing machine PS for PS plates
Using P-860 (manufactured by Konishiroku Photo Industry Co., Ltd.), a photosensitive lithographic printing plate exposed to a 3 kW ultra-high pressure mercury lamp with an original with a picture area ratio of 10% was developed at 25° C. Development g1, which can be developed well in 20 seconds, was tested on the same area.
現像液−1
ベンジルアルコール
502トリエタノールアミン
15?亜硫酸ソーダ
52ブチルナフタレンスルホン酸ソーダ
252水
1000F(置版適性)
現像液−1を用いて製版した印刷版をハイデルベルグ社
、IQ C)To印刷家にて2000枚印刷した後、
ガム液−1にてカム引き全行い、7日間性版し、再び2
000枚印刷を行うこと全1回として、何回インキ着肉
が悪化せずに印511できるかにて試験した。Developer-1 Benzyl alcohol
502 triethanolamine
15? Sodium sulfite
52 Butylnaphthalene sulfonic acid sodium 252 water
1000F (platform suitability) After printing 2000 sheets of printing plates made using developer-1 at Heidelberg Co., IQ C) To printer,
Complete cam pulling with gum solution 1, sex for 7 days, and then 2 again.
A test was conducted to determine how many times the mark 511 could be made without deteriorating the ink adhesion, assuming that 1,000 sheets were printed once.
ガム液−1
酵素変性デキストリン ゴロ02
アラビアガム 102リ
ンFJ
2f水
1000?以上の製版東件及び各試験の結果を、まと
めて下記表3に示す。Gum liquid-1 Enzyme-modified dextrin Goro 02
Gum Arabic 102 Lin FJ
2f water
1000? The above plate making test results and the results of each test are summarized in Table 3 below.
表 3
〔発明の効果〕
以上説明したように、本発明の感光性平版印刷版は、感
度、現像性、画像再現性及び印刷適性を低下させること
なく、その置版適性を改良することができるという顕著
な効果を奏するものである。Table 3 [Effects of the Invention] As explained above, the photosensitive lithographic printing plate of the present invention can improve its suitability for plate placement without reducing sensitivity, developability, image reproducibility, and printability. This has a remarkable effect.
第1図は非空隙″4Aを説明するグラフである。 FIG. 1 is a graph explaining the non-void "4A".
Claims (1)
感光性平版印刷版において、該アルミニウム支持体が、
中心線平均粗さ(Ra)の3倍の深さにおけるアボツト
負荷曲線による非空隙率(tpmi)が50%以上の粗
面を有し、かつ該感光性組成物が、該支持体上に14m
g/dm^2以下塗設されていることを特徴とする感光
性平版印刷版。 2、該感光性組成物が、ジアゾ樹脂及び親油性高分子化
合物を主成分とする感光性の組成物である特許請求の範
囲第1項記載の感光性平版印刷版。[Claims] 1. A photosensitive lithographic printing plate in which a photosensitive composition is coated on an aluminum support, the aluminum support comprising:
The photosensitive composition has a rough surface having a non-porosity ratio (TPMI) of 50% or more according to the abort load curve at a depth of 3 times the centerline average roughness (Ra), and the photosensitive composition is spread over the substrate for 14 m.
A photosensitive lithographic printing plate characterized by being coated with a coating of g/dm^2 or less. 2. The photosensitive lithographic printing plate according to claim 1, wherein the photosensitive composition is a photosensitive composition containing a diazo resin and a lipophilic polymer compound as main components.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11720086A JPS62275267A (en) | 1986-05-23 | 1986-05-23 | Photosensitive lithographic plate having improved ink sticking property and developing property |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11720086A JPS62275267A (en) | 1986-05-23 | 1986-05-23 | Photosensitive lithographic plate having improved ink sticking property and developing property |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62275267A true JPS62275267A (en) | 1987-11-30 |
Family
ID=14705868
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11720086A Pending JPS62275267A (en) | 1986-05-23 | 1986-05-23 | Photosensitive lithographic plate having improved ink sticking property and developing property |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62275267A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0461672A2 (en) * | 1990-06-15 | 1991-12-18 | Canon Kabushiki Kaisha | Image forming apparatus. |
EP0820840A2 (en) * | 1996-07-22 | 1998-01-28 | Fuji Photo Film Co., Ltd. | Method and apparatus for manufacturing sensitized printing plate |
US6672193B2 (en) | 1999-01-22 | 2004-01-06 | Fuji Photo Film Co., Ltd. | Method and apparatus for manufacturing sensitized printing plate |
-
1986
- 1986-05-23 JP JP11720086A patent/JPS62275267A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0461672A2 (en) * | 1990-06-15 | 1991-12-18 | Canon Kabushiki Kaisha | Image forming apparatus. |
EP0820840A2 (en) * | 1996-07-22 | 1998-01-28 | Fuji Photo Film Co., Ltd. | Method and apparatus for manufacturing sensitized printing plate |
EP0820840A3 (en) * | 1996-07-22 | 1998-08-12 | Fuji Photo Film Co., Ltd. | Method and apparatus for manufacturing sensitized printing plate |
US6258410B1 (en) | 1996-07-22 | 2001-07-10 | Fuji Photo Film Co., Ltd. | Method and apparatus for manufacturing sensitized printing plate |
US6672193B2 (en) | 1999-01-22 | 2004-01-06 | Fuji Photo Film Co., Ltd. | Method and apparatus for manufacturing sensitized printing plate |
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