JPS62274734A - Method for removal of resin refuse on resin-sealed electron parts - Google Patents
Method for removal of resin refuse on resin-sealed electron partsInfo
- Publication number
- JPS62274734A JPS62274734A JP11947586A JP11947586A JPS62274734A JP S62274734 A JPS62274734 A JP S62274734A JP 11947586 A JP11947586 A JP 11947586A JP 11947586 A JP11947586 A JP 11947586A JP S62274734 A JPS62274734 A JP S62274734A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- punch
- lead frame
- lead
- scum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 70
- 229920005989 resin Polymers 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000007789 sealing Methods 0.000 claims abstract description 18
- 238000004080 punching Methods 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 abstract 2
- 238000005299 abrasion Methods 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は樹脂封止型の集積回路（以下ＩＣと呼ぶ）等の
電子部品の製造方法に関し、特に樹脂封止後の余剰樹脂
カスの除去方法に関する。Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing electronic components such as resin-sealed integrated circuits (hereinafter referred to as ICs), and particularly relates to a method for manufacturing electronic components such as resin-sealed integrated circuits (hereinafter referred to as ICs). The present invention relates to a method for removing surplus resin scum afterward.
従来、 ＤＩＰ （デュアルインラインパッケージ）
等の樹脂封止型ＩＣの場合、リードフレーム上に組み立
てられたＩＣは、トランスファーモールド法等によって
樹脂封止される。この時樹脂封止金型のキャビティ部へ
注入された樹脂は、第４図に示すように樹脂封止部６０
からリードフレーム５４のリードとリード間を連結する
タイバー５５で構成される樹脂ダム部５６内へ流出する
。こ９樹脂ダム部５６へ流出した余剰の樹脂カスは、第
５図（第４図のＢ−Ｂ断面図を含む）に示すように後工
程で櫛歯形状をしたポンチ５８およびダイ５９を有する
打抜き金型を用いて、打抜き除去されていた。Conventionally, DIP (Dual Inline Package)
In the case of a resin-sealed IC such as, the IC assembled on a lead frame is resin-sealed by a transfer molding method or the like. At this time, the resin injected into the cavity part of the resin sealing mold is transferred to the resin sealing part 60 as shown in FIG.
The resin flows out into a resin dam portion 56 formed of tie bars 55 that connect the leads of the lead frame 54. The surplus resin scum flowing into the resin dam portion 56 is removed by a comb-shaped punch 58 and die 59 in a subsequent process, as shown in FIG. 5 (including the BB sectional view in FIG. 4). It was removed by punching out using a punching die.
上述した従来の樹脂カス除去方法の場合、微細な櫛歯形
状のポンチを樹脂カス打抜きに使用するので、櫛歯形状
ポンチの摩耗が激しく、また櫛歯部が折損しやすいとい
う欠点がある。In the case of the conventional resin scum removal method described above, since a fine comb-shaped punch is used for punching out resin scum, there is a drawback that the comb-shaped punch is subject to severe wear and the comb-teeth portion is easily broken.
又この櫛歯形状ポンチは高精度を要求される為その価格
も高価である。Furthermore, this comb-shaped punch requires high precision and is therefore expensive.
更にこの方式の欠点として、との櫛歯ポンチはリードフ
レームに接触しない様にダム部寸法より小さく製作され
るので、このポンチにより樹脂カスが分断されて、その
小片がリードに付着して残るという問題がある。この樹
脂カス残り問題はエツチング製リードフレームを使用す
る場合、その断面形状がサイドエッチによる凹凸を有す
る為特に顕著に現われる。このリードに付着して残る樹
脂カス片はその除去が困難であり、又これを除去しない
と後のリード成形工程でリードへの樹脂カス打込みや金
型破損を発生することがある。Another disadvantage of this method is that the comb punch is made smaller than the dam size so as not to contact the lead frame, so the punch breaks up the resin scum and leaves small pieces attached to the lead. There's a problem. This problem of remaining resin residue becomes particularly noticeable when an etched lead frame is used because its cross-sectional shape has irregularities due to side etching. It is difficult to remove the resin scum that remains attached to the lead, and if it is not removed, the resin scum may be implanted into the lead or the mold may be damaged in the subsequent lead molding process.
そしてパッケージのリード成形形状がＤＩＰ からＱＦ
Ｐ （クワッド−フラット・パッケージ）、ＰＬＣＣ
（プラスチック・リーデツド１チツプ・キャリア）と複
雑になるに従って複雑で段階的なリード成形工程が必要
となるので、この樹脂カス付着と金型破損については重
要な問題となっている。And the package lead molding shape is from DIP to QF.
P (quad-flat package), PLCC
(Plastic Leaded Single Chip Carrier) As the lead molding process becomes more complex, a complicated and step-by-step lead molding process becomes necessary, so resin scum adhesion and mold breakage are important problems.
本発明の樹脂封止型電子部品の樹脂カス除去法は、樹脂
ダム部の上面に樹脂カスを突出させる窪みを具備した樹
脂封止金型によって樹脂封止した電子部品から、前記樹
脂カスに当接して前記電子部品を含む平坦な面を有する
ポンチと前記電子部品を坦持するダイとによって、前記
樹脂カスを打抜き除去することＫよりて実現される。The method for removing resin scum from a resin-sealed electronic component according to the present invention is to remove resin scum from an electronic component resin-sealed using a resin encapsulation mold having a depression on the upper surface of a resin dam portion for causing resin scum to protrude. This is realized by punching out and removing the resin waste using a punch having a flat surface that contacts the electronic component and a die that supports the electronic component.
次に１本発明について図面を参照して説明する。 Next, one embodiment of the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の樹脂封止金型の断面図であ
シ、第２図は第１図の封止金型による樹脂封止後のＤＩ
Ｐ ＩＪ−ドフレームの状態を示す斜視図である。樹
脂封止金型１の窪み３に対厄するリードフレーム４の樹
脂ダム部６において、樹脂封止部ｌＯから流出した樹脂
は上方へ突出して樹脂突出部７を形成する。FIG. 1 is a sectional view of a resin sealing mold according to an embodiment of the present invention, and FIG. 2 is a DI after resin sealing with the sealing mold of FIG. 1.
FIG. 3 is a perspective view showing the state of the PIJ-de frame. In the resin dam part 6 of the lead frame 4 that is in contact with the depression 3 of the resin sealing mold 1, the resin flowing out from the resin sealing part 1O protrudes upward to form a resin projection part 7.
第３図は樹脂封止後の樹脂ダム部６の樹脂カス（樹脂突
出部７）の打抜き工程を示す断面図（第２図のＡ−Ａ断
面を含む）である。樹脂突出部７上面が打抜き金型の平
坦なポンチ８で加圧され下方に固定したダイ９によって
リードフレーム４から分離して除去される。この平坦な
ポンチ８はリード部を必要以上に加圧して損傷させない
ようＫ、たとえばスプリングにより一定以上の力が加わ
らない様な方式もしくはストッパーにより一定位置以下
へは下降しない様な方式に製作される。FIG. 3 is a cross-sectional view (including the AA cross section in FIG. 2) showing the process of punching out the resin scum (resin protrusion 7) of the resin dam portion 6 after resin sealing. The upper surface of the resin protrusion 7 is pressed by a flat punch 8 of a punching die, and is separated from the lead frame 4 and removed by a die 9 fixed below. This flat punch 8 is manufactured in such a way that it does not pressurize the reed part more than necessary and damage it, for example, by using a spring to prevent the force from exceeding a certain level from being applied, or by using a stopper to prevent it from descending below a certain position. .
この樹脂突出部７の高さは、リードフレーム４の板厚の
１〜３倍が実用的である。又、この樹脂突出部７の根本
の寸法は、樹脂封止時の封止金型１とリードフレーム４
の相対的な位置ズレを考慮してリードフレーム４の樹脂
ダム部６の寸法より少し小さくする必要がある。但し、
この隙間が大き過ぎると、平坦ポンチ８での加圧時に、
樹脂が分断してリードフレーム４に残りやすくなるので
、例えば台形の様な突出形状が望ましい。The height of the resin protrusion 7 is practically 1 to 3 times the thickness of the lead frame 4. Also, the dimensions of the base of this resin protrusion 7 are the same as those of the sealing mold 1 and lead frame 4 during resin sealing.
It is necessary to make the size a little smaller than the size of the resin dam part 6 of the lead frame 4 in consideration of the relative positional deviation of the lead frame 4. however,
If this gap is too large, when pressing with the flat punch 8,
A protruding shape such as a trapezoid, for example, is desirable because the resin is likely to be divided and remain on the lead frame 4.
なおこの樹脂突出部７の高さ寸法によっては、打抜き工
程でリードフレームから樹脂カスが完全に分離されずに
樹脂ダム部６内に残るが、これは後のドライホーニング
又はウォーターホーニングで簡単に除去出来る。Depending on the height of the resin protrusion 7, resin residue may not be completely separated from the lead frame during the punching process and may remain in the resin dam part 6, but this can be easily removed by dry honing or water honing later. I can do it.
以上説明した様Ｋ、本発明の樹脂カス除去法によれば単
純な形状の平坦な面を有するポンチを使用できるので、
櫛歯形状ポンチの摩耗及び折損の問題と、櫛歯ポンチに
より樹脂カスが分断され小片がリードフレームに付着し
て残り次工程で障害となる問題とを解決出来、かつ精密
・高価な櫛歯ポンチの代わりに単純で安価な平坦のポン
チで樹脂カスを除去することが出来る。As explained above, according to the resin scum removal method of the present invention, a punch with a simple shape and a flat surface can be used.
A precise and expensive comb-shaped punch that solves the problem of wear and breakage of the comb-shaped punch, as well as the problem of resin waste being divided by the comb-shaped punch, resulting in small pieces adhering to the lead frame and remaining as obstacles in the next process. Instead, resin scum can be removed using a simple and inexpensive flat punch.
特に近年ＩＣの高集積度化と基板への実装の高密度化の
要請からパッケージ形状及びリードフレームの微細化、
複雑化が進んでいる。したがって上述の問題が深刻化し
ているので、この問題の解決効果は大きい。In particular, in recent years, demands for higher integration of ICs and higher density mounting on substrates have led to miniaturization of package shapes and lead frames.
Things are becoming more complex. Therefore, since the above-mentioned problem is becoming more serious, the effect of solving this problem is significant.
第１図は本発明による樹脂封止型電子部品の樹脂カス除
去法の機能を示す断面図、第２図は第１図の樹脂封止金
型による樹脂封止後のＤＩＰＩＪ−ドフレームの斜視図
、第３図は樹脂カス除去工程を示す第２図のＡ−Ａ断面
図、第４図は従来の樹脂封止金型による樹脂封止後のリ
ードフレームの斜視図、第５図は従来の樹脂カス除去工
程を示す第４図のＢ−Ｂ断面図である。
１・・・・・・樹脂封止金型、２・・・・・・キャビテ
ィ、３・・・・・・！窪み、４・・・・・・リードフレ
ーム、５・・・・・・タイバー、６・・・・・・樹脂ダ
ム部、７・・・・・・樹脂突出部、８・・・・・・樹脂
打抜きポンチ、９・・・・・・樹脂打抜きグイ、１０・
・・・・・樹脂封止部。Fig. 1 is a cross-sectional view showing the function of the resin scum removal method for resin-sealed electronic components according to the present invention, and Fig. 2 is a perspective view of the DIPIJ-deframe after being resin-sealed with the resin-sealing mold of Fig. 1. Figure 3 is a sectional view taken along the line A-A in Figure 2 showing the resin scum removal process, Figure 4 is a perspective view of the lead frame after resin sealing using a conventional resin sealing mold, and Figure 5 is a conventional FIG. 5 is a sectional view taken along line BB in FIG. 4, showing the resin scum removal process. 1... Resin sealing mold, 2... Cavity, 3...! Hollow, 4...Lead frame, 5...Tie bar, 6...Resin dam part, 7...Resin protrusion, 8... Resin punching punch, 9...Resin punching guide, 10.
...Resin sealing part.
Claims (1)
た樹脂封止金型によって樹脂封止した電子部品から、前
記樹脂カスに当接して前記電子部品を含む平坦な面を有
するポンチと前記電子部品を坦持するダイとによって、
前記樹脂カスを打抜き除去することを特徴とする樹脂封
止型電子部品の樹脂カス除去法。A punch having a flat surface that abuts the resin scum and contains the electronic component from an electronic component resin-sealed using a resin-sealing mold having a depression on the upper surface of the resin dam portion for protruding resin scum; By means of a die that supports the parts,
A method for removing resin scum from a resin-sealed electronic component, comprising removing the resin scum by punching out the resin scum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11947586A JPS62274734A (en) | 1986-05-23 | 1986-05-23 | Method for removal of resin refuse on resin-sealed electron parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11947586A JPS62274734A (en) | 1986-05-23 | 1986-05-23 | Method for removal of resin refuse on resin-sealed electron parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62274734A true JPS62274734A (en) | 1987-11-28 |
Family
ID=14762223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11947586A Pending JPS62274734A (en) | 1986-05-23 | 1986-05-23 | Method for removal of resin refuse on resin-sealed electron parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62274734A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01241829A (en) * | 1988-03-24 | 1989-09-26 | Sony Corp | Manufacture of semiconductor device and metal mold used therefor |
| US6410883B1 (en) * | 1999-05-26 | 2002-06-25 | Nec Corporation | Cleaning device and method for cleaning resin sealing metal mold |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60251634A (en) * | 1984-05-28 | 1985-12-12 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device |
| JPS61283136A (en) * | 1985-06-10 | 1986-12-13 | Sharp Corp | Manufacture of resin-sealed semiconductor device |
-
1986
- 1986-05-23 JP JP11947586A patent/JPS62274734A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60251634A (en) * | 1984-05-28 | 1985-12-12 | Oki Electric Ind Co Ltd | Manufacture of semiconductor device |
| JPS61283136A (en) * | 1985-06-10 | 1986-12-13 | Sharp Corp | Manufacture of resin-sealed semiconductor device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01241829A (en) * | 1988-03-24 | 1989-09-26 | Sony Corp | Manufacture of semiconductor device and metal mold used therefor |
| US6410883B1 (en) * | 1999-05-26 | 2002-06-25 | Nec Corporation | Cleaning device and method for cleaning resin sealing metal mold |
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