JPS62274089A - Method for controlling concentration of silver in silver plating solution - Google Patents

Abstract

PURPOSE:To simply and rapidly control the concn. of silver in a silver plating soln. by introducing a fixed quantity of a plating soln. contg. silver at the desired concn. into a flow cell fitted with a silver ion electrode any by measuring the concn. of the silver with an ion meter. CONSTITUTION:A prescribed quantity of pure water is poured into a beaker 4, a fixed quantity of a silver plating soln. 1 having a prescribed concn. is also poured into the beaker 4 with a constant-rate pump 3 and they are uniformly stirred with a stirrer. The resulting soln. is introduced into a flow cell 5 with a peristal pump 8 and the concn. of the silver in the soln. is measured with an ion meter 2 through a silver ion electrode 6. Thus, the concn. of silver is easily controlled during silver plating without requiring a skilled hand.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Field of Industrial Application] This invention relates to a method for controlling the silver concentration of a silver plating solution containing silver.

[Summary of the invention]

Using a metering pump, add a silver plating solution containing silver at the desired concentration.
Introduce a certain amount of silver ion into a flow cell equipped with an electrode,
This invention is a method for directly reading and managing silver concentration using an ion meter.

[Conventional technology]

Conventionally, the silver concentration control method for silver plating solutions containing silver is as follows:
A method of calculating and controlling silver concentration by taking a certain amount of silver plating solution and titrating it with a standard ammonium thiocyanate solution, etc. A method of calculating and controlling silver concentration by taking a certain amount of silver plating solution and titrating it with standard ammonium thiocyanate solution, etc. A method of calculating and controlling silver concentration by taking a certain amount of silver plating solution, diluting it, and using atomic absorption spectrometry, etc. Methods such as measuring silver concentration, calculating silver concentration, and managing silver 1 degree were used.

[Problem that the invention seeks to solve]

However, these methods only measure 1 degree.

It has disadvantages such as it takes time to calculate and requires skill to measure. ! It was not suitable for rapid concentration control.

[Means for solving problems]

This invention was made to improve the above-mentioned drawbacks, and aims to provide a simple and quick method for controlling the concentration of roots in a silver plating solution.

The feature of this invention is that a liquid containing silver at a desired concentration is introduced into a flow cell equipped with a constant 1I1 ion electrode using a metering pump, and the 1I concentration is directly read and controlled using an ion meter.

In the method for controlling silver concentration in a silver plating solution according to the present invention, the m concentration can be measured immediately even while silver plating is in progress.
It is possible to easily and quickly manage the concentration of silver in the silver plating solution, such as by immediately replenishing the missing amount of silver.

〔Example〕

The present invention will be described in detail below with reference to embodiments shown in the drawings.

1 is a silver plating bath containing the desired concentration of silver, 2 is an ion meter, 3 is a metering pump for collecting a fixed amount of silver plating solution, and 4 is a fixed amount of pure silver plating solution for diluting the collected silver plating solution. A beaker filled with water, 5 a flow cell equipped with a silver ion electrode 6 and a reference electrode 7, a peristaltic pump 8,
9 is a waste liquid reservoir.

In this apparatus, a beaker 4 is filled with IIl of pure water, and a metering pump 3 is used to collect 1 mN of a silver plating solution with a silver concentration of about 3 g/l, which is poured into the beaker 4 and stirred using a Starcy. After making it uniform, it was introduced into a flow cell 5 using a peristaltic pump 8, and the W& concentration was measured using a silver ion electrode 6, and it was found to be 2.8 .mu./l.

Using this silver plating solution, silver plating was started, and after one day had passed, similarly put pure water in step 11 into beaker 4.
1 mj of the silver plating solution was collected using the metering pump 3, placed in a beaker 4, stirred using a Starcy to make it uniform, and then introduced into the flow cell 5 using the peristaltic pump 8, and the sI concentration was measured using the silver ion electrode 6. However, 1.9w
/ 1, so when a calculated amount of potassium silver cyanide was added to the silver plating solution and silver plating was continued, good plating could be obtained.

〔Effect of the invention〕

As described above, according to the present invention, unlike conventional methods, it is possible to easily and quickly manage the silver concentration in a silver plating solution, and even non-experts can easily manage the concentration. The effect is that it can be done.

[Brief explanation of the drawing]

The figure is a sectional view of an apparatus for controlling silver concentration in a silver plating solution according to the present invention. l...Silver plating bath 2...Ion meter 3...
Metering pump 4...Beaker 5...Flow cell 6
... Silver ion electrode 7 ... Reference electrode 8 ... Peristaltic pump 9 ... Above the waste liquid reservoir

Claims (1)

[Claims] A method for controlling the silver concentration in a silver plating solution, in which a fixed amount of silver plating solution containing silver at a desired concentration is introduced into a flow cell equipped with a silver ion electrode using a pump, and the silver concentration is measured and controlled using an ion meter.