JPS62273719A - Data verification in charged particle beam exposure equipment - Google Patents

Data verification in charged particle beam exposure equipment

Info

Publication number
JPS62273719A
JPS62273719A JP11606986A JP11606986A JPS62273719A JP S62273719 A JPS62273719 A JP S62273719A JP 11606986 A JP11606986 A JP 11606986A JP 11606986 A JP11606986 A JP 11606986A JP S62273719 A JPS62273719 A JP S62273719A
Authority
JP
Japan
Prior art keywords
data
figures
displayed
charged beam
data verification
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11606986A
Other languages
Japanese (ja)
Inventor
Osamu Ikenaga
修 池永
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP11606986A priority Critical patent/JPS62273719A/en
Publication of JPS62273719A publication Critical patent/JPS62273719A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To efficiently verify data by dividing an LSI data into figure groups which can be solely emitted by a charged particle beam, and displaying the figure containing a short side less than the minimum length allowable for the beam distinctly from other figure when displaying the figure group to enhance the verifying accuracy of the data. CONSTITUTION:In order to verify whether a basic figure is correctly generated or not, a basic figure and a lithography unit figure obtained by dividing the basic figure by a host computer are graphically displayed as a pattern display unit from the computer. In this case, the figures gl-g4 that the width and the height of the figure are larger than the length epsilon allowable by an electron beam lithography equipment are displayed by first color (e.g., green). the figures gamma1-gamma3 that one of the width an the height of the figure contains a side less than the length epsilon is displayed by hatching with second color (e.g., red) or solidly coating. Thus, a fine figure which causes the lithography accuracy to decrease can be readily identified. As a result, an electron beam lithography equipment can be operated efficiently.

Description

【発明の詳細な説明】 3、発明の詳細な説明 〔発明の目的〕 (産業上の利用分野) 本発明は、荷電ビーム露光装置に於いて、集積回路等の
設計パターンデータから生成した露光ずべき単位図形を
検証するための荷電ビーム亀光装置におけるデータ検証
方法に関する。
Detailed Description of the Invention] 3. Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention provides an exposure solution that is generated from design pattern data of an integrated circuit, etc. in a charged beam exposure apparatus. This invention relates to a data verification method in a charged beam camera for verifying power unit figures.

(従来の技術) LSIのパターンは、近年益々微細かつ板体になってお
り、このようなパターン’f−q’−;、5 Ifう装
置としては、荷電ビーム露光装置の1つとじζ二例えば
電子ビーム露光装置が用いられている。ここでは、この
電子ビーム麹光装置を例にパ・“)説明を行なう。
(Prior art) In recent years, LSI patterns have become increasingly fine and plate-like, and one device that can produce such patterns is a charged beam exposure device with one ζ2 For example, an electron beam exposure device is used. Here, an explanation will be given using this electron beam koji optical device as an example.

上記電子ビーム露光装置を用いて所望パターンを露光す
る場合、設計ツール(例えばCAD)で生成される図形
データは通常そのままの形式では上記露光装置の描画デ
ータとして用いることができない。
When exposing a desired pattern using the electron beam exposure apparatus, the graphic data generated by a design tool (for example, CAD) cannot normally be used in its original format as drawing data for the exposure apparatus.

その理由は、設計データは一般に多角形で表現されてい
るのに対し電子ビーム露光に用いるデータは台形若しく
は矩形データしか許容されない事と、図形間に重なりが
あると多重露光となってし才い描画データとして適さな
いという事に起因している。
The reason for this is that while design data is generally expressed in polygons, only trapezoidal or rectangular data is allowed for data used in electron beam exposure, and if there is overlap between shapes, multiple exposure may occur. This is due to the fact that it is not suitable as drawing data.

従って、上記設計データに例えば輪郭化処理を施して多
重露光の除去を行ない、その後矩形・台形等の基本図形
や描画単位図形に分割し電子ビーム露光装置にとって許
容し得る図形データとしている。
Therefore, the design data is subjected to, for example, contouring processing to remove multiple exposures, and then divided into basic figures such as rectangles and trapezoids or drawing unit figures to obtain figure data acceptable to the electron beam exposure apparatus.

この場合、電子ビーム露光装置で効率良く所望パターン
を露光するためには分割パターン数が最小となるよう図
形分割を施すことが必須となり、一般には第2図体)に
示す多角形を(b)に示す如くX方向に存在する頂点P
l乃至P6に基づいて図形分割する方法が知られている
。そして、この各図形を更にパターン創成の単位図形で
ある描画単位図形に分割して該データに基づいて描画処
理が行なわれる。
In this case, in order to efficiently expose a desired pattern using an electron beam exposure device, it is essential to divide the figure so that the number of divided patterns is minimized, and generally the polygon shown in Figure 2) is Vertex P existing in the X direction as shown
A method of dividing figures based on l to P6 is known. Then, each figure is further divided into drawing unit figures which are unit figures for pattern creation, and drawing processing is performed based on the data.

しかし、少なくとも2枚のビーム成形用アパーチャを組
み合わせて電子光学的重なりlこより成形ビームを生成
し該ビームを用いて描画処理を行なう成形ビーム露光方
式では、電子光学系の収差により電流密度分布の不均一
が存在し、この不均一は特にビームの周辺部において著
しい。(以下上記不均一を「ぼけ」と呼称する) この「ぼけ」の影響により第2図(b)に示す図形を描
画した場合は上記「ぼけ」と同程度あるいはそれ以下の
図形C以下微小図形と呼称する)である第2図(c)に
示す81,82.83のような図形を描画するには厳密
かつ複雑な制御が必要になるという欠点がある。
However, in the shaped beam exposure method in which at least two beam shaping apertures are combined to generate a shaped beam through electro-optical overlapping, and the beam is used to perform drawing processing, the current density distribution may vary due to aberrations in the electron optical system. There is a uniformity, and this non-uniformity is particularly pronounced at the periphery of the beam. (Hereinafter, the above-mentioned non-uniformity will be referred to as "blur") When the figure shown in Figure 2 (b) is drawn due to the influence of this "blur", a figure C or smaller with the same degree of blur or less than the above-mentioned "blur" will be drawn. There is a drawback that strict and complicated control is required to draw figures such as 81, 82, and 83 shown in FIG. 2(c), which are referred to as .

近年、上記問題を回避する図形分割方法が、特開昭57
−122525号公報に開本されているが実用パターン
で上記微小図形を皆無にするものではない。
In recent years, a figure division method that avoids the above problem has been proposed in Japanese Patent Application Laid-open No. 57.
Although it is disclosed in Japanese Patent No. 122525, it does not completely eliminate the above-mentioned minute figures in practical patterns.

上述の状況で発生する上記微小図形の有無を検証する手
段としては描画して得られたLSIパターンを人間が観
察し、図形の寸法詔よぴ分割図形間の「つなぎ」部分等
に対する精度を評価し、その劣化要因を解析し、更に必
要に応じて所望の領域の描画データをプリンタやディス
プレイ等の出力装置に出力して確認する方法や、描画デ
ータに基づいてそのパターン図形をグラフィック装置へ
第3図の如く表示し人間が該パターンを注意深く観察し
て上記微小図形を5判定するという極めて原始的な方法
であり、データ検証の精度および効率を高める上で問題
があった。
As a means of verifying the presence or absence of the above-mentioned minute figures that occur in the above-mentioned situation, a human observes the LSI pattern obtained by drawing and evaluates the precision of the figure's dimensions, the "connection" parts between divided figures, etc. Then, we analyze the causes of the deterioration, and if necessary, output the drawing data of the desired area to an output device such as a printer or display for confirmation, or output the pattern figure to a graphic device based on the drawing data. This is an extremely primitive method in which the pattern is displayed as shown in Figure 3, and a human carefully observes the pattern and makes a 5 judgment on the minute figure, which poses a problem in improving the accuracy and efficiency of data verification.

また、上記の如く問題は今後LSIの急速な進歩でパタ
ーンの微細化詔よびL8Iチップパターンの図形数の増
加により、上記電子ビーム露光装置の効率的な運用およ
び描画積度を高めていく上で大きな問題となる。
In addition, as mentioned above, the problem will be solved in the future due to the rapid progress of LSI, which will lead to finer patterns and an increase in the number of L8I chip patterns. It becomes a big problem.

(発明の鱗形しようとする問題点) 本発明は荷電ビーム露光装置の従来のデータ検証方法に
おける上記のような問題を解決するためになされたもの
で、その目的はデータの検証精度を高めかつ効率的なデ
ータ検証をはかり得る荷電ビーム露光装置におけるデー
タ検証方法を提供することにある。
(Problems to which the invention is directed) The present invention was made to solve the above-mentioned problems in the conventional data verification method for charged beam exposure equipment, and its purpose is to improve data verification accuracy and efficiency. An object of the present invention is to provide a data verification method in a charged beam exposure apparatus that can perform data verification based on the data quality.

〔発明の構成〕[Structure of the invention]

(問題点を解決するための手段) 本発明の骨子は、上記「ぼけ」の影響により電子ビーム
の照射位置や照射時間を厳密かつ複雑に制御する必要の
ある微小図形と他の図形とを容易に識別せられる形式で
パターン表示して装置を効率良く運用することにある。
(Means for Solving the Problems) The gist of the present invention is to facilitate the processing of minute figures and other figures that require precise and complex control of the electron beam irradiation position and irradiation time due to the above-mentioned "blur" effect. The objective is to efficiently operate the device by displaying patterns in a format that can be identified.

すなわち、本発明は少なくとも2枚のビーム成形用アパ
ーチャを有するマスクを備え、これらのマスクの各アパ
ーチャの電子光学的重なりを偏向器により制御して荷電
ビームの寸法及び形状を成形し、この成形ビームを試料
上に照射してこの試料に所望パターンを露光する荷電ビ
ーム露光装置において、前記荷電ビームで単一照射可能
な図形群にLSIパターンを分割し、該図形群を図形表
示手段により図形表示する場合に、前記荷電ビームに許
容し得る最小長に満たない短辺を含む図形を他の図形と
色違い若しくはハツチングして図形表示するというもの
である。
That is, the present invention includes a mask having at least two beam-shaping apertures, and controls the electro-optical overlap of each aperture of these masks by a deflector to shape the size and shape of a charged beam. In a charged beam exposure device that exposes a desired pattern to a sample by irradiating it onto a sample, the LSI pattern is divided into a group of figures that can be single-irradiated with the charged beam, and the group of figures is graphically displayed by a figure display means. In this case, a figure including a short side shorter than the minimum length allowable for the charged beam is displayed in a different color from other figures or by hatching.

(作用) 本発明によれば、CADなどの設計システムから出力さ
れるLSIのパターンデータから電子ビーム描画装置で
用いるデータを生成する際に発生する微小図形を極めて
容易に判別することが可能となり、描画精度の低下要因
を解析する上で有効であると共にパターンデータの検証
精度を高める事ができる。また、上記微小図形の発生を
防止すべく図形分割方法を検証することが容易となり、
その開発を短縮する事ができ、その結果として極めて効
率良く電子ビーム描画装置を運用することができる。
(Function) According to the present invention, it is possible to very easily identify minute figures generated when generating data used in an electron beam lithography device from LSI pattern data output from a design system such as CAD. This is effective in analyzing factors that reduce drawing accuracy, and can also improve pattern data verification accuracy. In addition, it becomes easy to verify the figure division method to prevent the occurrence of the above-mentioned minute figures,
The development time can be shortened, and as a result, the electron beam lithography system can be operated extremely efficiently.

(実施例) 以下本発明を実施例に沿って説明する。第1図は本実施
例で用いられる装置の概略構成を示すブロック図である
(Example) The present invention will be described below with reference to Examples. FIG. 1 is a block diagram showing a schematic configuration of an apparatus used in this embodiment.

描画パターンを示すセルデータ1はセルデータバッファ
2に格納される。描画位置とセルデータをさすポインタ
で構成される描画データ3は描画データデコーダ9で解
釈されセルデータ各7がセルデータバッファ2に送られ
て指定のセルデータがセルデータバッファ2から読み出
される。サブフィールド番号10は主偏向器コントロー
ラ11ζこ送られ、オフセットデータ14は副偏向器コ
ントローラ15に送られる。パターンデータデコーダ4
はパターンデータ3を解釈しサブフィールドの位置決め
データを主偏向器ドライバ12に送る。
Cell data 1 indicating a drawing pattern is stored in a cell data buffer 2. Drawing data 3 consisting of a pointer pointing to a drawing position and cell data is interpreted by a drawing data decoder 9, each piece of cell data 7 is sent to a cell data buffer 2, and designated cell data is read from the cell data buffer 2. Subfield number 10 is sent to the main deflector controller 11ζ, and offset data 14 is sent to the sub deflector controller 15. Pattern data decoder 4
interprets the pattern data 3 and sends subfield positioning data to the main deflector driver 12.

電子ビームは主偏向器13で指定のサブフィールド位置
に偏向走査される。
The electron beam is deflected and scanned by the main deflector 13 to a designated subfield position.

副偏向器コントローラ15は描画データデコーダ9から
オフセットデータ14を、またセルデータバッファ2か
らセルサイズ18を受は取り副偏向器走査のコントロー
ル信号を発生し、これを受けた副偏向器ドライバ16は
副偏向信号を発生し、副偏向器17によりサブフィール
ドでの図形描画位置の位置決めを行なうというものであ
る。
The sub-deflector controller 15 receives the offset data 14 from the drawing data decoder 9 and the cell size 18 from the cell data buffer 2, and generates a sub-deflector scanning control signal. A sub-deflection signal is generated, and the sub-deflector 17 determines the graphic drawing position in the sub-field.

第4図は上述の電子ビーム描画装置を運用する際に用い
る描画パターンデータの生成工程を示す模式図である。
FIG. 4 is a schematic diagram showing a process of generating drawing pattern data used when operating the above-mentioned electron beam drawing apparatus.

CADシステムで設計されたLSIデータは第5図(a
)に示す如く多角形データA、B。
The LSI data designed with the CAD system is shown in Figure 5 (a
) as shown in polygon data A and B.

Cにより構成されており、上記データ形式を電子ビーム
描画装置で許容しつる形式とするため、上記LSIデー
タを磁気テープを介してホスト計算機に転送する。そし
て、ホスト計算機では電子ビームで多重露光となる領域
a1 、a2を除去するため第5図(b)の如く輪郭化
処理を施し多角形りを得て、更に該図形りを矩形tよび
台形で表現される基本図形とするため多角形りの各頂点
に対しY方向(紙面上下方向)で図形分割を行ないセル
データS1乃至S7を生成し、該データが電子ビーム描
画装置に送出され描画単位図形に展開され、このデータ
に基づいて電子ビーム描画装置が制御計算機で制御され
て描画処理されるものとなっている。
The LSI data is transferred to the host computer via a magnetic tape in order to convert the data format into a format that can be accepted by the electron beam lithography system. Then, in the host computer, in order to remove areas a1 and a2 that will be exposed multiple times by the electron beam, a polygonal shape is obtained by performing contouring processing as shown in FIG. In order to obtain the basic figure to be expressed, each vertex of the polygon is divided into figures in the Y direction (vertical direction on the paper) to generate cell data S1 to S7, and the data is sent to the electron beam lithography system to form a drawing unit figure. Based on this data, the electron beam lithography system is controlled by a control computer to perform the lithography process.

上記工程で上記基本図形が正しく生成されているかを検
証するため、上記基本図形および基本図形をホスト計算
機で図形分割して得られる描画単位図形をホスト計算機
からパターン表示装置としてグラフィックディスプレイ
に表示するに際して第6図に示す如く図形の幅および高
さが電子ビーム描画装置で許容しうる長さεより大きな
図形gl乃至g4を第1の色(例えば緑色)で表示し、
図形の幅および高さの少なくとも一方が上記εに満たな
い辺を含む図形γ1乃至r3を第2の色(例えば赤色)
若しくは塗り潰し等のハツチング表示することにより、
描画精度の低下を招く微小図形を極めて容易に識別する
ことができた′。
In order to verify whether the above basic figures are correctly generated in the above process, the above basic figures and the drawing unit figures obtained by dividing the basic figures into figures on the host computer are displayed on the graphic display as a pattern display device from the host computer. As shown in FIG. 6, graphics gl to g4 whose width and height are larger than the allowable length ε of the electron beam lithography device are displayed in a first color (for example, green);
Figures γ1 to r3 that include sides whose width and/or height are less than the above ε are colored in a second color (for example, red).
Or by displaying hatching such as filling out,
It was possible to very easily identify minute figures that would cause a decline in drawing accuracy.

以上の結果として極めて効率良く電子ビーム描画装置を
運用することができた。
As a result of the above, we were able to operate the electron beam lithography system extremely efficiently.

なお、本発明は上述した実施例に限定されるものではな
い。例えば電子ビーム光学系の構造も何ら実施例に限定
されるものでなく適宜変更可能である。また、本実施例
では電子ビームを例にとり説明したが、ビームも電子ビ
ームに限定される事なく、イオンビームを含む荷電ビー
ムに対し適用可能であり、更にパターン表示装置として
静電プロッタ若しくはペンプロッタでもよい。また、パ
ターン表示装置への表示は制御計算機で行なってもよく
、その他、本発明の要旨を逸脱しない範囲で種々変形し
て実施することができる。
Note that the present invention is not limited to the embodiments described above. For example, the structure of the electron beam optical system is not limited to the embodiment and can be modified as appropriate. Furthermore, although this embodiment has been explained using an electron beam as an example, the beam is not limited to electron beams, and can be applied to charged beams including ion beams, and furthermore, an electrostatic plotter or a pen plotter can be used as a pattern display device. But that's fine. Further, the display on the pattern display device may be performed by a control computer, and various other modifications may be made without departing from the gist of the present invention.

〔発明の効果〕〔Effect of the invention〕

本発明によれば高精度で、効率的にデータ検証を行うこ
とができる。
According to the present invention, data verification can be performed efficiently with high accuracy.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例で使用する装置を示すブロッ
ク図、第2図および第3図は従来の問題点を説明するた
めの図、第4図は上記装置に係わる描画データを生成す
る工程を示す模式図、第5図は基本図形を生成する過程
を示す模式図、第6図は描画パターンを検証するための
パターン表示の一例を示す説明図である。 1・・・セルデータ、2・・・セルデータバッファ、3
・・・パターンデータ、4・・・パターンデータデコー
ダ、5・・・可変ビーム成形缶ドライバ、6・・・可変
ビーム成形器、7・・・セルデータ名、8・・・描画デ
ータ、9・・・描画データデコーダ、10・・・サブフ
ィールド番号、11・・・主偏向器コントローラ、12
・・・主偏、内器ドライバ、13・・・主偏向器、14
・・・オフセットデータ、15・・・副偏向器コントロ
ーラ、16・・・副偏向器ドライバ、17・・・副偏向
器、18・・・セルサイズ。 代理人 弁理士 則 近 憲 佑 同    竹 花 喜久男 第  8 図
Fig. 1 is a block diagram showing a device used in an embodiment of the present invention, Figs. 2 and 3 are diagrams for explaining conventional problems, and Fig. 4 generates drawing data related to the above device. FIG. 5 is a schematic diagram showing the process of generating a basic figure, and FIG. 6 is an explanatory diagram showing an example of a pattern display for verifying a drawing pattern. 1... Cell data, 2... Cell data buffer, 3
... Pattern data, 4... Pattern data decoder, 5... Variable beam forming can driver, 6... Variable beam former, 7... Cell data name, 8... Drawing data, 9... ...Drawing data decoder, 10...Subfield number, 11...Main deflector controller, 12
...Main deflector, internal driver, 13...Main deflector, 14
... Offset data, 15... Sub-deflector controller, 16... Sub-deflector driver, 17... Sub-deflector, 18... Cell size. Agent Patent Attorney Noriyuki Chika Yudo Kikuo Takehana Figure 8

Claims (3)

【特許請求の範囲】[Claims] (1)少なくとも2枚のビーム成形用アパーチャを有す
るマスクを備え、これらのマスクの各アパーチャの電子
光学的重なりを偏向器により制御して荷電ビームの寸法
及び形状を成形し、この成形ビームを試料上に照射して
この試料に所望パターンを露光する荷電ビーム露光装置
において、前記荷電ビームで単一照射可能な図形群にL
SIパターンを分割し、該図形群を図形表示手段により
図形表示する場合に、前記荷電ビームに許容し得る最小
長に満たない短辺を含む図形を他の図形と区別して表示
することを特徴とする荷電ビーム露光装置におけるデー
タ検証方法。
(1) A mask having at least two beam shaping apertures is provided, the electron-optical overlap of each aperture of these masks is controlled by a deflector to shape the size and shape of the charged beam, and this shaped beam is applied to the sample. In a charged beam exposure device that exposes a desired pattern to the sample by irradiating the sample, L is applied to a group of figures that can be single-irradiated with the charged beam.
When the SI pattern is divided and the group of figures is graphically displayed by a graphic display means, the figure including a short side shorter than the minimum length allowable for the charged beam is displayed separately from other figures. Data verification method for charged beam exposure equipment.
(2)特許請求の範囲第1項記載のデータ検証方法にお
いて、前記荷電ビームに許容し得る最小長に満たない短
辺を含む図形を他の図形と色違いにして表示することを
特徴とする荷電ビーム露光装置におけるデータ検証方法
(2) In the data verification method according to claim 1, a figure including a short side shorter than a minimum length allowable for the charged beam is displayed in a different color from other figures. Data verification method for charged beam exposure equipment.
(3)特許請求の範囲第1項記載のデータ検証方法にお
いて、前記荷電ビームに許容し得る最小長に満たない短
辺を含む図形をハッチング表示して他の図形と識別する
ことを特徴とする荷電ビーム露光装置におけるデータ検
証方法。
(3) The data verification method according to claim 1, characterized in that a figure including a short side shorter than a minimum length allowable for the charged beam is displayed by hatching to distinguish it from other figures. Data verification method for charged beam exposure equipment.
JP11606986A 1986-05-22 1986-05-22 Data verification in charged particle beam exposure equipment Pending JPS62273719A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11606986A JPS62273719A (en) 1986-05-22 1986-05-22 Data verification in charged particle beam exposure equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11606986A JPS62273719A (en) 1986-05-22 1986-05-22 Data verification in charged particle beam exposure equipment

Publications (1)

Publication Number Publication Date
JPS62273719A true JPS62273719A (en) 1987-11-27

Family

ID=14677939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11606986A Pending JPS62273719A (en) 1986-05-22 1986-05-22 Data verification in charged particle beam exposure equipment

Country Status (1)

Country Link
JP (1) JPS62273719A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084421A (en) * 2001-09-13 2003-03-19 Dainippon Printing Co Ltd Confirmation device for pattern data for plotting device in mask data for plotting device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712520A (en) * 1980-06-26 1982-01-22 Nippon Telegr & Teleph Corp <Ntt> Dividing method of figure by exposing in electron beam radiation
JPS58218118A (en) * 1982-06-11 1983-12-19 Fujitsu Ltd Inspection of light exposure pattern

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5712520A (en) * 1980-06-26 1982-01-22 Nippon Telegr & Teleph Corp <Ntt> Dividing method of figure by exposing in electron beam radiation
JPS58218118A (en) * 1982-06-11 1983-12-19 Fujitsu Ltd Inspection of light exposure pattern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084421A (en) * 2001-09-13 2003-03-19 Dainippon Printing Co Ltd Confirmation device for pattern data for plotting device in mask data for plotting device

Similar Documents

Publication Publication Date Title
JP3454983B2 (en) Charged beam drawing method
JPS63199421A (en) Charged-beam lithography method
US11774860B2 (en) Writing data generating method, multi charged particle beam writing apparatus, pattern inspecting apparatus, and computer-readable recording medium
TW201539117A (en) Method and system for forming a pattern on a surface using multi-beam charged particle beam lithography
JP7392805B2 (en) Drawing data generation program, multi-charged particle beam drawing program, and computer-readable recording medium
JP2004304031A (en) Mask scanning lithography method
JPH1167648A (en) Preparation of pattern data for charged particle beam lithography
JPS62273719A (en) Data verification in charged particle beam exposure equipment
JPH08236428A (en) Method for exposing charged particle beam and mask used therefor
JPS63150919A (en) Verification of data in charged particle beam exposure device
JP2894746B2 (en) Charged beam drawing method
JP5576458B2 (en) Electron beam exposure apparatus and electron beam exposure method
JPH09293669A (en) Charged particle-beam drawing device and method
JPH05226235A (en) Data conversion method of electron-beam lithography
JPH01152726A (en) Charged particle beam lithography
JP2005166928A (en) Electron beam lithography system
JPH01175737A (en) Charged beam lithography
Newman et al. Raster-shaped beam pattern generation for 70-nm photomask production
JPH01297823A (en) Exposure with electron beam
JPH0624181B2 (en) Electronic beam exposure method and electronic beam exposure apparatus
JPH02186620A (en) Pattern formation by electron beam rithography
JPH04302413A (en) Charged particle beam lithography equipment
JPS63155725A (en) Charged particle beam lithography method
JPH05217869A (en) Electron beam lighography apparatus
JPH11186151A (en) Proximity effect correcting method and reticle for correction used therefor