JPS62273359A - Wiring floor structure - Google Patents

Wiring floor structure

Info

Publication number
JPS62273359A
JPS62273359A JP11435486A JP11435486A JPS62273359A JP S62273359 A JPS62273359 A JP S62273359A JP 11435486 A JP11435486 A JP 11435486A JP 11435486 A JP11435486 A JP 11435486A JP S62273359 A JPS62273359 A JP S62273359A
Authority
JP
Japan
Prior art keywords
semi
cylindrical object
wiring
floor structure
floor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11435486A
Other languages
Japanese (ja)
Other versions
JPH0519628B2 (en
Inventor
清 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oyo Kikaku KK
Original Assignee
Oyo Kikaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oyo Kikaku KK filed Critical Oyo Kikaku KK
Priority to JP11435486A priority Critical patent/JPS62273359A/en
Publication of JPS62273359A publication Critical patent/JPS62273359A/en
Publication of JPH0519628B2 publication Critical patent/JPH0519628B2/ja
Granted legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 3、発明の詳細な説明 〔産業上の利用分野〕 この発明は配線床構造に関する。[Detailed description of the invention] 3. Detailed description of the invention [Industrial application field] This invention relates to wiring floor structures.

〔従来の技術〕[Conventional technology]

発明者は床板を隙間をあけて格子状に並べ、床板間に蓋
を架設して配線スペースを形成する方法を提案してきた
The inventor has proposed a method of forming a wiring space by arranging floorboards in a grid pattern with gaps between them and installing a lid between the floorboards.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記の方法では、床板に蓋を架設する場合、蓋の厚み分
だけ床板の縁を切欠くなどの手間が面倒である。
In the above method, when installing the lid on the floorboard, it is troublesome to cut out the edge of the floorboard by the thickness of the lid.

〔問題点を解決する手段〕[Means to solve problems]

この問題を解決するため、この発明では、方形の床板を
、隙間をあけて、床面上に敷き並べ、半筒状物を、開口
を下方に向け、上面が床板上面と同一レベルになるよう
に、隙間に設置し、半筒状物の中空部を配線スペースと
するものである。
In order to solve this problem, in this invention, rectangular floorboards are laid out on the floor with gaps between them, and the semi-cylindrical object is placed so that the opening faces downward and the top surface is on the same level as the top surface of the floorboard. It is installed in a gap, and the hollow part of the semi-cylindrical object is used as a wiring space.

〔作用〕[Effect]

このように構成すると、床板の縁を切欠くなどの必要も
なくなる。
With this configuration, there is no need to cut out the edge of the floorboard.

〔実施例〕〔Example〕

以下、本発明の実施例を図面に基づき詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

第1図に示すように一辺60cm・厚さ5 cmの正方
形のセメント板からなる床板1を、床面2上に10(2
)の隙間3をおいて格子状に敷き並べる。床板の四隅の
下にはゴム板からなる支持板4を板側からはみ出すよう
に敷く。
As shown in FIG.
) Lay them out in a grid pattern with 3 gaps between them. Support plates 4 made of rubber plates are laid under the four corners of the floorboard so as to protrude from the plate side.

第2図に示すのは軽ミゾ形鋼からなる短冊状の半筒状物
5である。その長さ・厚さは床板1と同一で60印・5
 cm、巾は10口である。
What is shown in FIG. 2 is a rectangular semi-cylindrical object 5 made of light grooved steel. Its length and thickness are the same as floorboard 1, with 60 marks and 5
cm, width is 10 pieces.

第3図に示すのはコード引出し用の蓋6である。What is shown in FIG. 3 is a lid 6 for pulling out cords.

−辺10cmの正方形の鋼板の中央に円形の引出しロア
が付設され、コードが引き出せるように形成されている
。鋼板の底面四隅に支柱8を付設し、床板・半筒状物と
同じ5 cmの高さに形成する。
- A circular drawer lower is attached to the center of a square steel plate with sides of 10 cm, so that the cord can be pulled out. Supports 8 are attached to the four corners of the bottom of the steel plate, and are formed at the same height of 5 cm as the floorboard/semi-cylindrical object.

このような部材を第1図に示すように、床板と床板の間
の隙間3に、半筒状物5を、床板からはみ出した支持板
上に、開口を下方に向けて設置する。隙間の交差点に蓋
6を設置する。
As shown in FIG. 1, a semi-cylindrical member 5 is installed in the gap 3 between the floorboards on a support plate protruding from the floorboards, with the opening facing downward. A lid 6 is installed at the intersection of the gaps.

床板・半筒状物・蓋は同じ厚さに形成されているので、
上面は自ずから同一レベルに形成される。
Since the floorboard, semi-cylindrical object, and lid are formed to the same thickness,
The upper surfaces are naturally formed at the same level.

第4図に示すように、床板の上にはカーペットタイル・
ビニールタイルなどの仕上げ材9を敷き詰める。半筒状
物の中空部を配線スペース10とする。蓋・半筒状物を
動かすことにより、床板本体を移動しないでも配線替え
が可能となる。
As shown in Figure 4, carpet tiles and
Lay finishing material 9 such as vinyl tiles. The hollow part of the semi-cylindrical object is defined as a wiring space 10. By moving the lid/semi-cylindrical object, wiring can be changed without moving the floorboard itself.

尚、床板の素材はコンクリート製品に限定されることな
く、床板としての強度さえあれば、例えば、木質・プラ
スチック・金属製品などであってもよい。又、その形状
も表面が全体として平面をしていれば、ムクの平板でな
く、脚が付設されたり中空板であったりしてもよい。
Note that the material for the floorboard is not limited to concrete products, and may be made of wood, plastic, metal products, etc., as long as it has enough strength to be used as a floorboard. Further, as long as the surface is flat as a whole, the shape is not a solid flat plate, but may have legs or be a hollow plate.

半筒状物は配線スペースの形成が目的であるから、その
大きさ・形状は通常中20cm以下の短冊状である。
Since the purpose of the semi-cylindrical object is to form a wiring space, its size and shape are usually a rectangular shape of 20 cm or less.

又、支持板は厚さの調節可能なものとしたり、重ね合わ
せて床面の不陸に適応出来るように構成してもよい。
Further, the thickness of the support plate may be adjustable, or the support plate may be stacked to adapt to uneven floor surfaces.

〔効果〕〔effect〕

この発明はこのように構成されているので、次のような
特長を有する。
Since the present invention is configured as described above, it has the following features.

■ 床板は縁に切欠きを付設するなどの必要がなく、単
なる平板でよいから、コストが安い。
■ Floorboards do not require cutouts on the edges and can be simply flat plates, so the cost is low.

■ 蓋・半筒状物の開閉のみで、床板本体を動かさずに
配線が可能。
■ Wiring can be done by simply opening and closing the lid or semi-cylindrical object without moving the floorboard itself.

■ 半筒状物の中空部を配線スペースとして利用出来る
ので、配線床構造全体の総高は極めて薄く形成出来る。
■ Since the hollow part of the semi-cylindrical object can be used as a wiring space, the total height of the entire wiring floor structure can be made extremely thin.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は施工手順を示す平面図、第2図は半筒状物の正
面断面図、第3図は引出し用蓋の正面断面図、第4図は
施工された状況を示す正面断面図である。 1・・床板、2・・床面、3・・隙間、4・・支持板、
5・・半筒状物、6・・引出し用蓋、7・・引出し口、
8・・支柱、9・・仕上げ材、10・・配線スペース。
Figure 1 is a plan view showing the construction procedure, Figure 2 is a front sectional view of the semi-cylindrical object, Figure 3 is a front sectional view of the drawer lid, and Figure 4 is a front sectional view showing the construction situation. be. 1. Floor board, 2. Floor surface, 3. Gap, 4. Support plate,
5. Semi-cylindrical object, 6. Drawer lid, 7. Drawer opening,
8. Support, 9. Finishing material, 10. Wiring space.

Claims (3)

【特許請求の範囲】[Claims] (1)方形の床板を、隙間をあけて、床面上に敷き並べ
、 半筒状物を、開口を下方に向け、上面が床板上面と同一
レベルになるように、隙間に設置し、半筒状物の中空部
を配線スペースとする配線床構造。
(1) Lay out square floorboards on the floor with gaps between them, place a semi-cylindrical object in the gap with the opening facing downward, and place the half-cylindrical object in the gap so that the top surface is on the same level as the top of the floorboards. A wiring floor structure that uses the hollow part of a cylindrical object as wiring space.
(2)床板と半筒状物の下に、共通の支持板を敷設した
ことを特徴とした、特許請求の範囲第(1)項記載の配
線床構造。
(2) The wiring floor structure according to claim (1), characterized in that a common support plate is laid under the floor plate and the semi-cylindrical object.
(3)床板と半筒状物の厚さが同一であることを特徴と
した、特許請求の範囲第(1)項ないし第(2)項記載
の配線床構造。
(3) The wiring floor structure according to claims (1) and (2), characterized in that the thickness of the floor plate and the semi-cylindrical member are the same.
JP11435486A 1986-05-19 1986-05-19 Wiring floor structure Granted JPS62273359A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11435486A JPS62273359A (en) 1986-05-19 1986-05-19 Wiring floor structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11435486A JPS62273359A (en) 1986-05-19 1986-05-19 Wiring floor structure

Publications (2)

Publication Number Publication Date
JPS62273359A true JPS62273359A (en) 1987-11-27
JPH0519628B2 JPH0519628B2 (en) 1993-03-17

Family

ID=14635638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11435486A Granted JPS62273359A (en) 1986-05-19 1986-05-19 Wiring floor structure

Country Status (1)

Country Link
JP (1) JPS62273359A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298140U (en) * 1989-01-20 1990-08-06
JPH0329640U (en) * 1989-07-31 1991-03-25
JPH03260260A (en) * 1990-03-09 1991-11-20 P C Planning:Kk Method for laying tile

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989512A (en) * 1982-11-11 1984-05-23 東洋リノリユ−ム株式会社 Method of laying conductor of floor surface

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5989512A (en) * 1982-11-11 1984-05-23 東洋リノリユ−ム株式会社 Method of laying conductor of floor surface

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0298140U (en) * 1989-01-20 1990-08-06
JPH0329640U (en) * 1989-07-31 1991-03-25
JPH03260260A (en) * 1990-03-09 1991-11-20 P C Planning:Kk Method for laying tile

Also Published As

Publication number Publication date
JPH0519628B2 (en) 1993-03-17

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