JPS62273359A - Wiring floor structure - Google Patents
Wiring floor structureInfo
- Publication number
- JPS62273359A JPS62273359A JP11435486A JP11435486A JPS62273359A JP S62273359 A JPS62273359 A JP S62273359A JP 11435486 A JP11435486 A JP 11435486A JP 11435486 A JP11435486 A JP 11435486A JP S62273359 A JPS62273359 A JP S62273359A
- Authority
- JP
- Japan
- Prior art keywords
- semi
- cylindrical object
- wiring
- floor structure
- floor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 3、発明の詳細な説明 〔産業上の利用分野〕 この発明は配線床構造に関する。[Detailed description of the invention] 3. Detailed description of the invention [Industrial application field] This invention relates to wiring floor structures.
発明者は床板を隙間をあけて格子状に並べ、床板間に蓋
を架設して配線スペースを形成する方法を提案してきた
。The inventor has proposed a method of forming a wiring space by arranging floorboards in a grid pattern with gaps between them and installing a lid between the floorboards.
上記の方法では、床板に蓋を架設する場合、蓋の厚み分
だけ床板の縁を切欠くなどの手間が面倒である。In the above method, when installing the lid on the floorboard, it is troublesome to cut out the edge of the floorboard by the thickness of the lid.
この問題を解決するため、この発明では、方形の床板を
、隙間をあけて、床面上に敷き並べ、半筒状物を、開口
を下方に向け、上面が床板上面と同一レベルになるよう
に、隙間に設置し、半筒状物の中空部を配線スペースと
するものである。In order to solve this problem, in this invention, rectangular floorboards are laid out on the floor with gaps between them, and the semi-cylindrical object is placed so that the opening faces downward and the top surface is on the same level as the top surface of the floorboard. It is installed in a gap, and the hollow part of the semi-cylindrical object is used as a wiring space.
このように構成すると、床板の縁を切欠くなどの必要も
なくなる。With this configuration, there is no need to cut out the edge of the floorboard.
以下、本発明の実施例を図面に基づき詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
第1図に示すように一辺60cm・厚さ5 cmの正方
形のセメント板からなる床板1を、床面2上に10(2
)の隙間3をおいて格子状に敷き並べる。床板の四隅の
下にはゴム板からなる支持板4を板側からはみ出すよう
に敷く。As shown in FIG.
) Lay them out in a grid pattern with 3 gaps between them. Support plates 4 made of rubber plates are laid under the four corners of the floorboard so as to protrude from the plate side.
第2図に示すのは軽ミゾ形鋼からなる短冊状の半筒状物
5である。その長さ・厚さは床板1と同一で60印・5
cm、巾は10口である。What is shown in FIG. 2 is a rectangular semi-cylindrical object 5 made of light grooved steel. Its length and thickness are the same as floorboard 1, with 60 marks and 5
cm, width is 10 pieces.
第3図に示すのはコード引出し用の蓋6である。What is shown in FIG. 3 is a lid 6 for pulling out cords.
−辺10cmの正方形の鋼板の中央に円形の引出しロア
が付設され、コードが引き出せるように形成されている
。鋼板の底面四隅に支柱8を付設し、床板・半筒状物と
同じ5 cmの高さに形成する。- A circular drawer lower is attached to the center of a square steel plate with sides of 10 cm, so that the cord can be pulled out. Supports 8 are attached to the four corners of the bottom of the steel plate, and are formed at the same height of 5 cm as the floorboard/semi-cylindrical object.
このような部材を第1図に示すように、床板と床板の間
の隙間3に、半筒状物5を、床板からはみ出した支持板
上に、開口を下方に向けて設置する。隙間の交差点に蓋
6を設置する。As shown in FIG. 1, a semi-cylindrical member 5 is installed in the gap 3 between the floorboards on a support plate protruding from the floorboards, with the opening facing downward. A lid 6 is installed at the intersection of the gaps.
床板・半筒状物・蓋は同じ厚さに形成されているので、
上面は自ずから同一レベルに形成される。Since the floorboard, semi-cylindrical object, and lid are formed to the same thickness,
The upper surfaces are naturally formed at the same level.
第4図に示すように、床板の上にはカーペットタイル・
ビニールタイルなどの仕上げ材9を敷き詰める。半筒状
物の中空部を配線スペース10とする。蓋・半筒状物を
動かすことにより、床板本体を移動しないでも配線替え
が可能となる。As shown in Figure 4, carpet tiles and
Lay finishing material 9 such as vinyl tiles. The hollow part of the semi-cylindrical object is defined as a wiring space 10. By moving the lid/semi-cylindrical object, wiring can be changed without moving the floorboard itself.
尚、床板の素材はコンクリート製品に限定されることな
く、床板としての強度さえあれば、例えば、木質・プラ
スチック・金属製品などであってもよい。又、その形状
も表面が全体として平面をしていれば、ムクの平板でな
く、脚が付設されたり中空板であったりしてもよい。Note that the material for the floorboard is not limited to concrete products, and may be made of wood, plastic, metal products, etc., as long as it has enough strength to be used as a floorboard. Further, as long as the surface is flat as a whole, the shape is not a solid flat plate, but may have legs or be a hollow plate.
半筒状物は配線スペースの形成が目的であるから、その
大きさ・形状は通常中20cm以下の短冊状である。Since the purpose of the semi-cylindrical object is to form a wiring space, its size and shape are usually a rectangular shape of 20 cm or less.
又、支持板は厚さの調節可能なものとしたり、重ね合わ
せて床面の不陸に適応出来るように構成してもよい。Further, the thickness of the support plate may be adjustable, or the support plate may be stacked to adapt to uneven floor surfaces.
この発明はこのように構成されているので、次のような
特長を有する。Since the present invention is configured as described above, it has the following features.
■ 床板は縁に切欠きを付設するなどの必要がなく、単
なる平板でよいから、コストが安い。■ Floorboards do not require cutouts on the edges and can be simply flat plates, so the cost is low.
■ 蓋・半筒状物の開閉のみで、床板本体を動かさずに
配線が可能。■ Wiring can be done by simply opening and closing the lid or semi-cylindrical object without moving the floorboard itself.
■ 半筒状物の中空部を配線スペースとして利用出来る
ので、配線床構造全体の総高は極めて薄く形成出来る。■ Since the hollow part of the semi-cylindrical object can be used as a wiring space, the total height of the entire wiring floor structure can be made extremely thin.
第1図は施工手順を示す平面図、第2図は半筒状物の正
面断面図、第3図は引出し用蓋の正面断面図、第4図は
施工された状況を示す正面断面図である。
1・・床板、2・・床面、3・・隙間、4・・支持板、
5・・半筒状物、6・・引出し用蓋、7・・引出し口、
8・・支柱、9・・仕上げ材、10・・配線スペース。Figure 1 is a plan view showing the construction procedure, Figure 2 is a front sectional view of the semi-cylindrical object, Figure 3 is a front sectional view of the drawer lid, and Figure 4 is a front sectional view showing the construction situation. be. 1. Floor board, 2. Floor surface, 3. Gap, 4. Support plate,
5. Semi-cylindrical object, 6. Drawer lid, 7. Drawer opening,
8. Support, 9. Finishing material, 10. Wiring space.
Claims (3)
、 半筒状物を、開口を下方に向け、上面が床板上面と同一
レベルになるように、隙間に設置し、半筒状物の中空部
を配線スペースとする配線床構造。(1) Lay out square floorboards on the floor with gaps between them, place a semi-cylindrical object in the gap with the opening facing downward, and place the half-cylindrical object in the gap so that the top surface is on the same level as the top of the floorboards. A wiring floor structure that uses the hollow part of a cylindrical object as wiring space.
ことを特徴とした、特許請求の範囲第(1)項記載の配
線床構造。(2) The wiring floor structure according to claim (1), characterized in that a common support plate is laid under the floor plate and the semi-cylindrical object.
した、特許請求の範囲第(1)項ないし第(2)項記載
の配線床構造。(3) The wiring floor structure according to claims (1) and (2), characterized in that the thickness of the floor plate and the semi-cylindrical member are the same.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11435486A JPS62273359A (en) | 1986-05-19 | 1986-05-19 | Wiring floor structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11435486A JPS62273359A (en) | 1986-05-19 | 1986-05-19 | Wiring floor structure |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62273359A true JPS62273359A (en) | 1987-11-27 |
JPH0519628B2 JPH0519628B2 (en) | 1993-03-17 |
Family
ID=14635638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11435486A Granted JPS62273359A (en) | 1986-05-19 | 1986-05-19 | Wiring floor structure |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62273359A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0298140U (en) * | 1989-01-20 | 1990-08-06 | ||
JPH0329640U (en) * | 1989-07-31 | 1991-03-25 | ||
JPH03260260A (en) * | 1990-03-09 | 1991-11-20 | P C Planning:Kk | Method for laying tile |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5989512A (en) * | 1982-11-11 | 1984-05-23 | 東洋リノリユ−ム株式会社 | Method of laying conductor of floor surface |
-
1986
- 1986-05-19 JP JP11435486A patent/JPS62273359A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5989512A (en) * | 1982-11-11 | 1984-05-23 | 東洋リノリユ−ム株式会社 | Method of laying conductor of floor surface |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0298140U (en) * | 1989-01-20 | 1990-08-06 | ||
JPH0329640U (en) * | 1989-07-31 | 1991-03-25 | ||
JPH03260260A (en) * | 1990-03-09 | 1991-11-20 | P C Planning:Kk | Method for laying tile |
Also Published As
Publication number | Publication date |
---|---|
JPH0519628B2 (en) | 1993-03-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU585021B2 (en) | Access floor construction | |
EP0305505B1 (en) | Elevated floor plate | |
US5363560A (en) | Device for maintaining proper spacing and levelling of tiles during laying thereof | |
US4825603A (en) | Elevated floor plate | |
US3852928A (en) | Elevated flooring system and panel therefor | |
GB2564104A (en) | Flooring | |
JPS62273359A (en) | Wiring floor structure | |
JPS62264254A (en) | Wiring floor structure | |
JPH0349343B2 (en) | ||
JPS62233371A (en) | Wiring floor structure | |
JP2589234B2 (en) | Access path formation method for free access floor | |
JPS62129456A (en) | Construction method of double floor | |
JP2510159Y2 (en) | Auxiliary floor member | |
JPH043066Y2 (en) | ||
JPH0211936U (en) | ||
JPS62220647A (en) | Floor apparatus | |
JPS62258053A (en) | Floor substrate structure | |
JP2576272B2 (en) | Floor member connection device | |
JPS62107160A (en) | Floor substrate for wiring | |
JPH0416846Y2 (en) | ||
JPH05248072A (en) | Double floor structure | |
JPS6223927U (en) | ||
JPH0584783B2 (en) | ||
JPH0423147Y2 (en) | ||
JP2816113B2 (en) | Floor structure |