JPH0519628B2 - - Google Patents
Info
- Publication number
- JPH0519628B2 JPH0519628B2 JP61114354A JP11435486A JPH0519628B2 JP H0519628 B2 JPH0519628 B2 JP H0519628B2 JP 61114354 A JP61114354 A JP 61114354A JP 11435486 A JP11435486 A JP 11435486A JP H0519628 B2 JPH0519628 B2 JP H0519628B2
- Authority
- JP
- Japan
- Prior art keywords
- floor
- semi
- cylindrical object
- wiring
- floorboards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は配線床構造に関する。[Detailed description of the invention] [Industrial application field] This invention relates to wiring floor structures.
〔従来の技術〕
発明者は床板を〓間をあけて格子状に並べ、床
板間に蓋を架設して配線スペースを形成する方法
を提案してきた。[Prior Art] The inventor has proposed a method of forming a wiring space by arranging floorboards in a lattice shape with spaces between them and installing a cover between the floorboards.
上記の方法では、床板に蓋を架設する場合、蓋
の厚み分だけ床板の縁を切欠くなどの手間が面倒
である。
In the above method, when installing the lid on the floorboard, it is troublesome to cut out the edge of the floorboard by the thickness of the lid.
この問題を解決するため、この発明では、主体
となる方形の床板を、〓間をあけて、床面上に敷
き並べ、断面形状が型の半筒状物を、開口を下
方に向け、上面が床板上面と同一レベルになるよ
うに、〓間に設置し、上記型の半筒状物の中空
部を配線スペースとするものである。
In order to solve this problem, in the present invention, the main square floorboards are laid out on the floor with gaps in between, and semi-cylindrical objects with a shaped cross section are placed with the opening facing downward and the upper surface facing downward. The semi-cylindrical body is installed between the two sides so that it is at the same level as the top surface of the floorboard, and the hollow part of the semi-cylindrical body of the above type is used as the wiring space.
このように構成すると、床板の縁を切欠くなど
の必要もなくなる。
With this configuration, there is no need to cut out the edge of the floorboard.
以下、本発明の実施例を図面に基づき詳細に説
明する。
Hereinafter, embodiments of the present invention will be described in detail based on the drawings.
第１図に示すように一辺60cm・厚さ５cmの正方
形のセメント板からなる床板１を、床面２上に10
cmの隙間３をおいて格子状に敷き並べる。床板の
四隅の下にはゴム板からなる支持板４を板側から
はみ出すように敷く。 As shown in Figure 1, a square cement board 1 with a side of 60 cm and a thickness of 5 cm is placed on the floor surface 2 for 10
Lay them out in a grid pattern with 3cm gaps between them. Support plates 4 made of rubber plates are laid under the four corners of the floorboard so as to protrude from the plate side.
第２図に示すのは軽ミゾ軽鋼からなる。断面形
状が型の半筒状物５である。その長さ・厚さは
床板１と同一で60cm・５cm、幅は10cmである。 The one shown in Figure 2 is made of light grooved light steel. It is a semi-cylindrical object 5 whose cross-sectional shape is a mold. Its length and thickness are the same as floorboard 1, 60cm x 5cm, and its width is 10cm.
第３図に示すのはコード引出し用の蓋６であ
る。一辺10cmの正方形の鋼板の中央に円形の引出
し口７が付設され、コードが引き出せるように形
成されている。鋼板の底面四隅に支柱８を付設
し、床板・型の半筒状物と同じ５cmの高さに形
成する。 What is shown in FIG. 3 is a lid 6 for pulling out cords. A circular drawer opening 7 is attached to the center of a square steel plate measuring 10 cm on each side, so that a cord can be pulled out. Supports 8 are attached to the four corners of the bottom of the steel plate, and are formed at the same height of 5 cm as the semi-cylindrical part of the floor plate/mold.
このような部材を第１図に示すように、床板と
床板の間の隙間３に、半筒状物５を、床板の縁か
らはみ出した支持板上に、開口を下方に向けて設
置する。隙間の交差点に蓋６を設置する。 As shown in FIG. 1, a semi-cylindrical member 5 is installed in the gap 3 between the floorboards on a support plate protruding from the edges of the floorboards, with the opening facing downward. A lid 6 is installed at the intersection of the gaps.
床板・半筒状物・蓋は同じ厚さに形成されてい
るので、上面は自ずから同一レベルに形成され
る。 Since the floor plate, semi-cylindrical object, and lid are formed to have the same thickness, their upper surfaces are naturally formed at the same level.
第４図に示すように、床板の上にはカーペツト
タイル・ビニールタイルなどの仕上げ材９を敷き
詰める。型の半筒状物の中空部は配線スペース
１０とする。蓋・半筒状物を動かすことにより、
床板本体を移動しないでも配線替えが可能とな
る。 As shown in FIG. 4, a finishing material 9 such as carpet tile or vinyl tile is laid on the floorboard. The hollow part of the semi-cylindrical mold is used as a wiring space 10. By moving the lid/semi-cylindrical object,
Wiring can be changed without moving the floorboard itself.
尚、床板の素材はコンクリート製品に限定され
ることなく、床板としての強度さえあれば、例え
ば、木質・プラスチツク・金属製品などであつて
もよい。又、その形状も三角形、四角形など直線
状の辺を持つ多角形であればよく、表面が全体と
して平面をしていれば、ムクの平板でなく、脚が
付設された中空板であつたりしてもよい。 The material for the floorboard is not limited to concrete products, and may be made of wood, plastic, metal, etc., as long as it has enough strength to be used as a floorboard. Also, the shape may be any polygon with straight sides, such as a triangle or quadrilateral, and as long as the surface is flat as a whole, it may be a hollow plate with legs attached instead of a solid flat plate. It's okay.
型の半筒状物は配線スペースの形成が目的で
あるから、その大きさ・形状は通常巾20cm以下の
短冊状である。 The purpose of the semi-cylindrical part of the mold is to form a wiring space, so its size and shape are usually rectangular with a width of 20 cm or less.
又、支持板は厚さの調節可能なものとしたり、
重ね合わせて床面の不陸に適応出来るように構成
してもよい。 In addition, the thickness of the support plate can be adjusted,
They may be stacked one on top of the other to adapt to uneven floor surfaces.
この発明はこのように構成されているので、次
のような特長を有する。
Since the present invention is configured as described above, it has the following features.
床板は縁に切欠きを付設するなどの必要がな
く、単なる平板でよいから、コストが安い。 There is no need to add notches to the edges of the floorboards, and the cost is low because they can be simply flat plates.
蓋・半筒状物の開閉のみで、床板本体を動か
さずに配線が可能。 Wiring can be done by simply opening and closing the lid or semi-cylindrical object without moving the floorboard itself.
半筒状物の中空部を配線スペースとして利用
出来るので、配線床構造全体の総高は極めて薄
く形成出来る。 Since the hollow part of the semi-cylindrical object can be used as a wiring space, the total height of the entire wiring floor structure can be made extremely thin.
第１図は施工手順を示す平面図、第２図は半筒
状物の正面断面図、第３図は引出し用蓋の正面断
面図、第４図は施工された状況を示す正面断面図
である。
１……床板、２……床面、３……隙間、４……
支持板、５……半筒状物、６……引出し用蓋、７
……引出し口、８……支柱、９……仕上げ材、１
０……配線スペース。
Figure 1 is a plan view showing the construction procedure, Figure 2 is a front sectional view of the semi-cylindrical object, Figure 3 is a front sectional view of the drawer lid, and Figure 4 is a front sectional view showing the construction situation. be. 1...floorboard, 2...floor surface, 3...gap, 4...
Support plate, 5... Semi-cylindrical object, 6... Drawer lid, 7
...Drawer opening, 8... Support, 9... Finishing material, 1
0...Wiring space.
Claims (1)
敷き並べ、 断面型の半筒状物を、開口を下方に向け、上
面が床面と同一レベルになるように、上記〓間に
設置し、 上記半筒状物の中空部を配線スペースとする配
線床構造。 ２ 床板と断面型の半筒状物の厚さが同一であ
ることを特徴とした、特許請求の範囲第１項記載
の配線床構造。 ３ 多角形状の床板を、〓間をあけて、床面上に
敷き並べ、 断面型の半筒状物を、開口を下方に向け、上
面が床面と同一レベルになるように、上記〓間に
設置し、 上記半筒状物の中空部を配線スペースとすると
共に、 床材と半筒状物の下に、両者に共通の支持板を
敷設したことを特徴とした、配線床構造。 ４ 支持板は高さの調節が可能なものであること
を特徴とした、特許請求の範囲第３項記載の配線
床構造。[Scope of Claims] 1. Polygonal floorboards are laid out on the floor with gaps between them, and the cross-sectional semi-cylindrical object is made with the opening facing downward so that the top surface is at the same level as the floor surface. As shown in FIG. 2. The wiring floor structure according to claim 1, wherein the thickness of the floor plate and the cross-sectional semi-cylindrical object are the same. 3 Lay polygonal floorboards on the floor with gaps between them, and place a cross-sectional semi-cylindrical object with the opening facing downward and the top surface on the same level as the floor. A wiring floor structure characterized in that the hollow part of the semi-cylindrical object is used as a wiring space, and a support plate common to both the floor material and the semi-cylindrical object is laid under the floor material and the semi-cylindrical object. 4. The wiring floor structure according to claim 3, wherein the support plate is height adjustable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11435486A JPS62273359A (en) | 1986-05-19 | 1986-05-19 | Wiring floor structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11435486A JPS62273359A (en) | 1986-05-19 | 1986-05-19 | Wiring floor structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62273359A JPS62273359A (en) | 1987-11-27 |
| JPH0519628B2 true JPH0519628B2 (en) | 1993-03-17 |
Family
ID=14635638
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11435486A Granted JPS62273359A (en) | 1986-05-19 | 1986-05-19 | Wiring floor structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62273359A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0743344Y2 (en) * | 1989-01-20 | 1995-10-09 | タキロン株式会社 | Free access floor material |
| JPH0329640U (en) * | 1989-07-31 | 1991-03-25 | ||
| JPH03260260A (en) * | 1990-03-09 | 1991-11-20 | P C Planning:Kk | Method for laying tile |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989512A (en) * | 1982-11-11 | 1984-05-23 | 東洋リノリユ−ム株式会社 | Method of laying conductor of floor surface |
-
1986
- 1986-05-19 JP JP11435486A patent/JPS62273359A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5989512A (en) * | 1982-11-11 | 1984-05-23 | 東洋リノリユ−ム株式会社 | Method of laying conductor of floor surface |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62273359A (en) | 1987-11-27 |
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