JPS62272167A - Testing device for printed board - Google Patents

Abstract

PURPOSE:To preclude wrong decision making due to a defect in the contacting between a flat lead and a probe by providing contact probes which differ in width to a probe which is made to abut on flat leads of the semiconductor element of a printed board. CONSTITUTION:The 1st contact probes 3A which have wide width B1 and the 2nd contact probes 3B which have narrow width B2 are arrayed alternately in all directions of the probe 3 fixed to an elevation mechanism 12 conveyed by a conveying mechanism 13. Then when the probes 3A and 3B contact flat leads 2A (2A-1-2A-4) and the probe 3 shifts in position as shown by an arrow A, leads 2A-2 and 2A-3 are short-circuited by the probes 3A and the probes 3B are open. Therefore, the direction of the position shift is detected from the position of the lead 2A in the short-circuited state. For the purpose, the probe 3 is moved finely by the mechanism 13 to make a check, and wrong decision making due to a defect in the contacting between the flat lead and contact probe is precluded.

Description

[Detailed Description of the Invention] 3. Detailed Description of the Invention [Summary] Contact probes of different widths are arranged on probes that come into contact with flat leads of semiconductor elements such as LSI elements mounted on a printed circuit board. As a result, positional deviation of the probe during contact is detected, and erroneous determination due to poor contact between the flat lead and the contact probe is prevented.

[Industrial application field]

The present invention relates to a printed circuit board testing device that performs testing by bringing a probe connected to a measuring device into contact with the flat lead of a semiconductor element mounted on a printed circuit board, and in particular,
The present invention relates to a Pudding Nitten test device configured to detect positional deviation when the contact occurs.

Printed boards formed by mounting semiconductor elements such as LSI elements are generally tested during the manufacturing process to check whether there are any incorrect mountings or whether there are any abnormalities in each mounted semiconductor element. It will be done.

Such tests use a probe with an array of contact probes that come into contact with each flat lead of the semiconductor device, move the probes to a predetermined location, connect each flat lead to a measuring device through the corresponding contact, and perform the measurement. Mismounting or abnormality of semiconductor elements is detected based on the results of measurements such as resistance values by the device.

On the other hand, due to the high-density packaging of such semiconductor devices, the flat leads are arranged with minute widths and pinches.
If the contact with the probe is not driven with high precision, the specified flat lead will not be measured due to poor contact or incorrect connection.

Therefore, it is desired that erroneous judgments due to poor contact or erroneous connections do not occur when such probes are brought into contact.

[Conventional technology]

Conventionally, the configuration was as shown in the conventional explanatory diagram of FIG. FIG. 3(a) is a configuration diagram, and FIG. 3(b2) is an enlarged view of the main parts.

As shown in FIG. 3(a), the printed circuit board 1 on which the semiconductor element 2 is mounted is placed on the table 11, and the control unit 1
The moving mechanism 13 and the lifting mechanism 1 driven by the control of 4.
A probe 10 movable in the X, Y (not shown), and Z directions is provided with the semiconductor device 2 to be tested.
A probe 10 is positioned directly above the probe 10, and the measuring device 4 is configured to perform a predetermined measurement.

Further, such a moving mechanism 13 is designed to be able to move with high precision using an optical position detector (not shown) or the like.

Therefore, under the control of the control unit 14, the measurement data D by the measuring instrument 4 and the test data T stored in the output unit 5 in advance are
D is collated by the determination unit 6, and a pass/fail determination S is output based on the collation result.

Therefore, if the semiconductor element 2 is incorrectly mounted or if an abnormality occurs in the semiconductor element 2, it can be determined by comparison, so that it is possible to determine whether the printed board is good or bad.

[Problem that the invention seeks to solve]

In such a configuration, the connection between the probe 10 and the semiconductor element 2 is made using the contact probe IOA provided on the probe 10, as shown in (b1) and (b2) in FIG.
, is performed by the IOB being brought into contact with the flat lead 2A of the semiconductor element 2.

This abutment is good if the mutual positions match, but if a positional deviation occurs due to distortion of the printed circuit board 1, etc.
When the contact probe 10AO width b1 is small as shown in bl), it is not connected to any flat lead 2A, resulting in an oven state.

Further, when the width b2 of the contact probe 10B is large as shown in (b2), it is connected to any flat lead 2A, resulting in a short-circuit state.

If such an open state or short-circuit state occurs, measurement cannot be performed, and therefore it is determined to be defective.

Therefore, in the case of such a defect, there is a problem in that the check must be performed again by retrying.

[Means for solving problems]

FIG. 1 is a diagram explaining the principle of the present invention.

As shown in Figure 1, the probe (3) has a predetermined width (B
1) of the first contact probe (3A) and the width (B
1) A second contact probe (3B) having a smaller width (B2) is mixed.

With this configuration, the above-mentioned problems are solved.

[For production]

In other words, by providing a mixture of wide contact probes and narrow contact probes in the probe, it is possible to detect the direction of positional deviation when it occurs with the flat lead. It is something.

Therefore, the test work can be continued by moving the probe according to the direction of the detected positional deviation without having to retry as in the conventional case.

〔Example〕

The present invention will be explained in detail below with reference to FIG.

FIG. 2 is an explanatory diagram of an embodiment according to the present invention, in which (a) is a side view of the main part, and (bl) and (b2) are enlarged views of the main part.

Throughout the design, like numbers refer to like objects.

As shown in FIG. 2(a), a probe 30 fixed to the lifting mechanism 12, which is transferred by the transfer mechanism 13, has a first contact probe 3A with a wide width B1 and a first contact probe 3A with a narrow width B2 on all sides. It is formed by alternately arranging two contact probes 3B, and the other structure is the same as that described above.

In this way, the first and second contact probes 3A and 3B having different widths are constructed, and as shown in (bl) and (b2), the contact probes 2A-1, 2A-2, 2A-3, and 2A-4 are used. - When the probe 3 comes into contact with the flat leads 2A arranged in the same manner as shown in FIG. A short circuit occurs, and the second contact probe 3B becomes open.

Also, if the probe 3 is displaced in the direction of arrow B as shown in (b2), the first contact probe 3A will move 2A-
1 and 2A-2 become short-circuited, and the second contact probe 3B becomes open.

Therefore, the direction of misalignment can be detected based on the position of the flat lead 2A that is short-circuited.

Therefore, a check can be made by slightly moving the probe 3 in the direction of arrow A or arrow B using the transfer mechanism 13 so as to adjust the detected positional deviation.

Moreover, such first and second contact probes 3A
, 3B do not need to be arranged alternately, and sufficient detection can be achieved by arranging one of them at both ends or in the center.

〔Effect of the invention〕

As described above, according to the present invention, when a connection failure occurs due to misalignment between the flat lead and the contact probe, the direction of the misalignment is detected, making it easy to adjust the misalignment.

Therefore, the conventional failures due to inability to measure are eliminated, the trouble of retrying etc. is eliminated, the number of testing steps can be reduced, and furthermore, by performing adjustment operations, the need for a highly accurate transfer mechanism equipped with an optical system etc. is eliminated. This eliminates this problem, reduces costs, and has great practical effects.

[Brief explanation of drawings]

FIG. 1 is a diagram explaining the principle of the present invention. FIG. 2 is an explanatory diagram of an embodiment according to the present invention, in which (a) is a side view of the main part, and (bl) and (b2) are enlarged views of the main part. FIG. 3 is a conventional explanatory diagram, and (a) is a configuration diagram. (b 1) (b 2) shows enlarged views of the main parts. In the figure, l is a printed circuit board. 2 is a semiconductor element. 3 is a probe. 4 is a measuring device. 5 is the output section. 6 is the judgment section. 2A is a flat lead. 3A is the first contact probe. 3B indicates a second contact probe. , 1ffi [1J11/At Rikan teuvtsu Fig. 1 (a) Δ Mokukin 41-2 U1 banquet example 1 explanatory diagram Fig. 2

Claims (1)

[Claims] A probe (3) that comes into contact with each flat lead (2A) of a semiconductor element (2) mounted on a printed circuit board (1), and a measuring instrument connected to the probe (3). (4)
and an output section (5) that sends out predetermined test data (TD).
) and a determination unit (6) that compares the measurement data (D) of the measuring device (4) with the test data (TD) to determine pass/fail, and tests the semiconductor element (2). The probe (3) includes a first contact probe (3A) having a predetermined width (B1) and a second contact probe (3B) having a width (B2) smaller than the width (B1). ).