JPS62267463A - Method for depositing film - Google Patents

Abstract

PURPOSE:To increase the bonding strength of an amorphous or metallic film to a substrate by depositing a base film of Cr on the surface of the substrate by ion plating and by forming the amorphous or metallic film on the base film. CONSTITUTION:A base film of Cr is formed on the surface of a ceramic or glass substrate by ion plating. An amorphous or metallic film is then formed on the base film. Thus, the bonding strength of the amorphous or metallic film to the substrate is increased.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a method for forming a film, particularly a thick film, on the surface of a substrate to form a device, in which the film adheres more firmly to the substrate.
This is a method of forming a film with the aim of making it a stable film, and particularly relates to a method of manufacturing a magnetic head in which the thickness of the film is increased.

Conventional technology In recent years, in various industries, materials suitable for the purpose of use are used as films on the surfaces of various substrates using vacuum evaporation techniques such as resistance heating evaporation, electron beam evaporation, and sorrel/vine evaporation. There are many. In the field of electronics as well, film formation methods are appropriately selected and used depending on the device to be created. For example, as magnetic heads used for magnetic recording become higher density recording, there is a tendency to use a film-based type instead of the conventional bulk type. This is to reduce core erosion at high frequencies. Materials used in magnetic heads, such as cobalt (CO)-based amorphous magnetic materials, are often formed into films by sputter deposition, which can easily make them amorphous. Further, the sendust material is formed into a film using sputter deposition, electron beam deposition, resistance heating deposition, or the like.

Problems to be Solved by the Invention When a film is deposited on the surface of a substrate, it is necessary to match the thermal expansion coefficients of the substrate and the film as much as possible to reduce internal stress generated in the deposited film. If the film is a magnetic material, the magnetic properties of the film will change due to the strain effect when internal stress is generated, and the film will no longer be the desired film, but deterioration of the properties can be prevented by reducing the magnetostriction constant as much as possible. However, when using a thicker membrane, the internal stress increases.
The adhesion force to the substrate becomes stronger and it peels off.

The structures of films formed by the various vapor deposition methods mentioned above are complex;
Even if the thermal expansion coefficients are matched, it is difficult to eliminate internal stress, and peeling cannot be completely eliminated.

Conventionally, as a means to solve this kind of peeling problem,
By resistance heating evaporation, electron beam evaporation, sputter evaporation, etc.
Chromium (Cr) was deposited as a base film, and the target film was deposited on top of it. That is, the relatively strong adhesion of chromium (Cr) to the substrate was utilized. However, in this case, the substrate and chromium (Cr) film are only attached at the interface, and if the desired film is made thicker, the adhesion strength becomes a problem.
Peeling occurs.

Means for Solving the Problems The present invention aims to make such adhesion stronger, and is aimed at increasing the strength of such adhesion by reducing the amount of chromium (Cr) in the underlying film deposited on the surface of the substrate.
) A film is deposited by an ion plating method, and a portion of the chromium (Cr) base film is embedded within the surface of the substrate, thereby further increasing the adhesion strength between the substrate and the Cr film.

Chromium (C) is removed by an ion beam in a high vacuum.
evaporate r). This evaporated chromium (Cr) is ionized by electric discharge. By applying a high voltage to this, chromium (C
r) By accelerating ions to collide with the substrate and precipitate it on the surface, a portion of the chromium is embedded in the substrate to further strengthen the adhesion strength. The substrate is made of ceramic, glass, or the like. The ceramic may be any one such as alumina, ferrite, other composite oxides, tinides, and carbides. The glass may be any of borosilicate glass, lead glass, and barium-boron glass.

However, it is desirable that the coefficient of thermal expansion of both of them be relatively matched to that of the film deposited on these surfaces.

EXAMPLE An example of the present invention will be specifically described below with reference to the drawings.

(1) In FIG. 1, chromium (Cr) 2 as an evaporation source was provided in a vacuum chamber 1 and evaporated with an electron beam 3. After ionizing the evaporated chromium vapor 4 in an electric field 5, it is accelerated by a DC high voltage 7 provided between it and the ferrite substrate 6 and enters the ferrite substrate 6, forming a chromium (Cr) film 8 on the surface of the ferrite substrate 6. 1000 people were deposited. Next, a target 10 made of a magnetic material mainly composed of cobalt (co) and a ferrite substrate 6 on which a chromium (Cr) film 8 was deposited were placed in a vacuum chamber 9 shown in FIG. −
Sputtered in argon (Ar) gas at 3 Torr,
An amorphous magnetic film 11 mainly composed of cobalt (Co) with a thickness of 20 microns was deposited.

(2) The substrate 6 of Example (1) was made of glass, and 500 chromium (Cr) films were deposited in the same manner.
A 100 micron thick Sendust magnetic film containing e) as the main component was deposited.

In the above embodiment, a chromium (Cr) film 8 is formed on the surface of the substrate 6.
In order to investigate the adhesion strength to the substrate 6 of the amorphous magnetic film mainly composed of cobalt (CO) and the Sendust magnetic film 11 precipitated through the amorphous magnetic film mainly composed of cobalt (CO) and A chromium (Cr) film was deposited on the surface of the Sendust magnetic film 11 again to a thickness of 1000 mm using the same method as in Example (11), and then the same substrate 6 used in the example was bonded using glass, and then to 2
A peel test was performed on the adhesion strength of the interface by cutting into one square chip. As a result, there was no separation from the interface and the gas was broken.

Incidentally, after depositing chromium (Cr) using a conventional method, the magnetic film 11 shown in the example was deposited to a thickness of 60 micrometers, and a similar test was conducted. There was no damage to the board.

Effects of the Invention By the method of the present invention, if a chromium (Cr) film is deposited as a base film on the substrate surface and then the desired film is deposited thickly, the adhesion strength becomes stronger, and for example, magnetic heads etc. can be manufactured with a thick film structure. It is very effective in some cases.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of an apparatus showing an embodiment of the method of depositing a chromium (Cr) film on a substrate surface according to the present invention, and FIG.
1 is a schematic diagram of an apparatus showing an example of a method for depositing a target film on a chromium (Cr) film deposited by the method of the present invention. ■...Vacuum chamber, 2...Evaporation # (chromium), 3...Electron beam, 4...Chromium vapor, 5... Ionization source, 6...Substrate, 7...Chromium (Cr) ion acceleration voltage, 8.
...Chromium (Cr) film, 9 ... Vacuum chamber,
10... Raw material (target) for the desired film 11.
...Target membrane. Figure 2

Claims (4)

[Claims] (1) A method for depositing a film, which comprises forming a ground film on the surface of a substrate by an ion plating method, and then forming a film overlying the surface to increase the adhesion strength between the substrate and the film. (2) Claim (1) characterized in that the film deposited on the base film is made of amorphous or metal.
The method for depositing the film described in section. (3) The method for depositing a film according to claim (1), wherein the substrate is ceramic or glass. (4) The method for depositing a film according to claim (1), wherein the base film is chromium (Cr).