JPS6226615A - Thin film magnetic head - Google Patents

Abstract

PURPOSE:To prevent the leakage of the electric current at the edge part of the lower part magnetic film and to execute the satisfactory magnetic recording by preventing the forming of the first electric conductor layer at the edge part of the lower part magnetic film, forming the second electric conductor layer through the insulating layer and executing the electrical connection. CONSTITUTION:A lower part magnetic film 8 pattern-formed by a sputtering method, etc., on a substrate 7 is formed by having an edge part 6 at a part of the substrate 7. On the substrate 7 to pattern-form the lower part magnetic film 8, the first insulating layer 9 is depositedly formed on the wholesurface, and on the first insulating layer 9, the first electric conductors 1 and 3 are divided into parts and pattern-formd at the upper part area of the edge part 6 of the lower part magnetic film. For such a reason, the film thickness of the first insulating layer 9 comes to be thin at an angle part A, etc., of the lower part magnetic film 8, therefore, the phenomenon such as the short-circuit of the lower part magnetic film 8 and the first electric conductor layer 1 can be prevented. Next, the second electric conductor layer 2 to connect the first electric conductor layers 1 and 3 divided into pieces at the edge part 6 is pattern-formed and in such a case, since the second electric conductor layer 2 is depositedly formed on the second insulating layer 10, the bad influence of the difference in level of the edge part 6 will not be given and the first electric conductor layers 1 and 3 can be connected.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thin film magnetic head, and more particularly to a thin film magnetic head of a type in which a magnetic film having a high saturation magnetic flux density is formed on a substrate.

[Summary of the invention]

This invention includes a lower magnetic film and a first conductor layer on a substrate.

In a thin film magnetic head having a second conductive layer, an insulating layer, etc., the first conductive layer is not formed at the end of the lower magnetic film, but the second conductive layer is formed via the insulating layer to establish electrical connection. Wiring is done to prevent current leakage, etc.

[Conventional technology]

Generally, a thin film magnetic head is known as a device for recording information signals on a magnetic recording medium such as a magnetic tape or a magnetic disk.

In this thin-film magnetic head, for example, a lower magnetic film serving as a core material is formed on a ferrite substrate via an insulating layer, and a coil conductor consisting of a first conductor layer and a second conductor layer is insulated in an upper region of the lower magnetic film. An upper magnetic film serving as a core material is formed on the coil conductor with an insulating layer interposed therebetween.

As a transmission path for electric signals to the coil conductor made up of the first conductor layer and the second conductor layer of such a thin film magnetic head, electric signals are transmitted from a bonding portion where the first conductor layer is extended. It looks like this. That is, the first conductor layer is formed by depositing a metal such as Cu on a substrate with a constant thickness through an insulating layer, and patterning it by ion milling or the like to form a bonding part and a part that functions as a coil conductor. are formed at the same time, and the bonding portion is an extended portion of the coil conductor.

Further, as thin film magnetic heads become multichannel and thin film magnetic head chips become smaller, a plurality of thin film magnetic heads are formed according to recording tracks. For this reason, coil conductors are formed in correspondence to the number of thin film magnetic heads, and the bonding portions, which are extensions of the portions of the first conductor layer that function as coil conductors, are formed in accordance with the number of recording tracks. ing.

[Problem that the invention seeks to solve]

The thin film magnetic head described above has the risk of current leakage.

As shown in FIG. 3, the lower magnetic film 32 formed on the fumolite substrate 31 is formed into a band shape to prevent problems such as warpage and cracking of the substrate during the manufacturing process. It has an end portion 32a. Then, on this lower magnetic film 32, an insulator M33 for separating the glabella and a first conductor layer 34 for serving as a coil conductor are laminated.

However, since the insulating layer 33 has a steep rise at the end 32a of the lower magnetic film 32, it is not possible to sufficiently adhere the insulating layer 33 at this end 32a. Therefore, for example, at the corner C, the film thickness becomes thinner, and the insulation N33 becomes thinner.
the first conductor layer 34 deposited on the lower magnetic film 3;
2 are electrically connected, causing current leakage, which impedes good magnetic recording. In addition, since the end portion 32a of the lower magnetic film 32 is steep, there is a risk that the first conductor N34 may be broken at a corner or the like, and the connection with the bonding portion may be broken.

Further, as described above, in accordance with the trend toward multi-channel and miniaturization of thin film magnetic heads, conductor layers connected to a plurality of bonding portions are arranged at regular intervals even at the end 32a of the lower magnetic film 32. However, AEON
Since the end portion 32a is not flat during milling, the material forming the conductor layer remains even in the portion to be removed.

Therefore, there is a possibility that current leakage occurs between each channel, making it impossible to control the magnetic heads corresponding to each recording trunk.

SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a thin film magnetic head that prevents current leakage at the ends of the lower magnetic film and enables good magnetic recording.

[Means for solving problems]

The present invention provides a thin film magnetic head in which a lower magnetic film, a coil conductor consisting of at least a first conductor layer and a second conductor layer, and an upper magnetic film are sequentially laminated on a substrate with an insulating layer interposed therebetween. The lower magnetic film is formed in a part of the lower magnetic film, and the first conductor layer is separated in the upper region of the end of the lower magnetic film and is electrically connected by at least a second conductor layer formed through the insulating layer. The above-mentioned problems are solved by a thin film magnetic head characterized by the following.

[Effect]

In the thin film magnetic head of the present invention, the first conductor layer does not extend in the upper region of the end of the lower magnetic film, but is separated in the upper region of the end. Then, at least the second conductor layer is formed by reducing the level difference by interposing the insulating layer. This reduction in level difference is contributed not only by the insulating layer formed between the lower magnetic film and the first conductor layer but also by the insulating layer formed between at least the first conductor layer and the second conductor layer. Therefore, the second conductor layer can be deposited on a flattened region with reduced steps, thereby preventing current leakage to the lower magnetic film, step breakage, or current leakage between channels. be able to.

〔Example〕

A preferred embodiment of the present invention will be described with reference to FIGS. 1 and 2.

The thin film magnetic head of this embodiment uses a ferrite substrate such as Mn-Zn ferrite or Ni-Zn ferrite, and a strip of, for example, Fe-Al-3 conductive alloy (Sendust) or Fe-Ni alloy is coated on the substrate. A lower magnetic film made of a ferromagnetic material such as (permalloy) is formed as a core material. A coil conductor is formed on the lower magnetic film by a first conductor layer and a second conductor layer with an insulating layer interposed therebetween. Note that the glabella between the first conductor layer and the second conductor layer is also separated by the insulating layer.

As shown in FIG. 1, the fourteenth body 751 extends from the coil conductor corresponding to each channel, and is attached to the upper region of the lower magnetic film 8 via an insulating layer (not shown). It is formed up to this side of the end portion 6 of the magnetic film 8. and,
Even in areas where the lower magnetic film 8 is not formed, each first conductor layer 3 is patterned so as to be connected to or integrated with each bonding portion formed for each channel.

These first conductor layers 1.3 are simultaneously patterned using, for example, photolithography, and have a shape divided at the end portion 6 of the lower magnetic film 8.

Contact portions 4.5 are formed in the divided ends of the first conductor layer 1 and the first conductor layer 3 so as to correspond to the respective channels. Then, the second conductor layer 2 is patterned so as to connect the contact portion 4 formed on the first conductor layer 1 for each channel and the contact portion 5 formed on the first conductor layer 3. has been done.

The area where the second conductor layer 2 connecting the contact parts 4 and 5 is patterned is flattened by a plurality of insulating layers to reduce the level difference at the end 6 of the lower magnetic film 8, as will be described later. It has become a territory.

Therefore, the second conductor layer can electrically connect the first conductor layer 1 and the first conductor layer 3 while preventing adverse effects such as current leakage. The second conductor layer 2, like the first conductor layer 1.3, is also simultaneously deposited and patterned (not shown) on the portion that will become the coil conductor. The portion has a function of exciting the lower i-type film 8, which is a core material.

In the thin film magnetic head having the above-described structure at the end 6 of the lower magnetic film 8, the step difference at the end 6 is relaxed, so that it is possible to prevent adverse effects such as current leakage.

That is, the structure at the end portion 6 will be described in detail with reference to FIG. 2. First, the lower magnetic film 8 is deposited and patterned on the substrate 7 by, for example, a sputtering method.
is formed with an end 6 on a part of the substrate 7 in order to cut each chip and to reduce warping of the substrate. On the substrate 7 on which the lower magnetic film 8 is patterned, a first insulating material r
ri9 is deposited on the entire surface. On the first insulating layer N9, a first conductor layer 1 and a first conductor layer 3 are patterned so as to be separated in the upper region of the end portion 6 of the lower magnetic film 8. For this reason, although the film thickness of the first insulating layer 9 becomes thinner at the corner A of the lower magnetic film 15!8, short circuits between the lower magnetic film 8 and the first conductor ml occur at the corner A, etc. This phenomenon can be prevented.

Next, the first conductor Fil is separated at the end 6.

In this case, since the second conductor layer 2 is formed on the second insulating layer 2, there is no adverse effect of the step at the end 6. The first conductor layers 1 and 3 can be connected. The second conductor layer 2, which is connected to the first conductor 3 through the contact portions 4 and 5, is connected to the lower magnetic film 8.
The end portion 6 of the insulating layer 9 is deposited on the first insulating layer 9 and the second insulating layer N10. Therefore, the first insulating layer 9 and the second insulating layer 9
The lower magnetic film 8 is formed with a sufficiently thick film thickness by the insulating layer 10.
The lower magnetic film 8 and the second conductor layer 2
There is no risk of electrical continuity. Similarly, the step difference is reduced by the first insulating layer 9 and the second insulating layer 10 at the end portion 6, and the second conductor N2 is deposited in the region where the step difference is reduced. Therefore, during pattern etching, the second conductor N2 can be effectively removed even at the step portion, and, for example, patterns corresponding to each channel can be formed without conduction between the channels. Also, because the level difference has been alleviated, the second
There is no risk of breakage at corners B of the conductor layer 2, etc.
Electrical connection can be made reliably.

As described above, the thin film magnetic head of this embodiment alleviates the step difference at the end portion 6 of the lower magnetic film 8 formed on a portion of the substrate 7, so that adverse effects such as current leakage can be prevented.

In the above-mentioned embodiment, the step difference is alleviated by the first conductor layer, the second conductor layer, and the insulating layer. Good too.

〔Effect of the invention〕

In the thin film magnetic head of the present invention, the step difference at the end of the lower magnetic film is reduced and electrical connection is made by the second conductor layer, etc.
It is possible to prevent current leakage and stage breakage between the lower magnetic film and the conductor layer, as well as current leakage between channels. Therefore, it is possible to perform good magnetic recording.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an embodiment of the thin film magnetic head according to the present invention, FIG. 2 is a sectional view taken along the line T-1' in FIG. 1, and FIG. 3 is a plan view of a conventional thin film magnetic head. It is a schematic sectional view. l...First conductor layer 2...Second conductor layer 3...First conductor layer 4.5...Contact portion 6...End portion 7...Substrate 8...Lower magnetic film 9... First insulating layer 10... Second insulating layer

Claims (1)

[Scope of Claims] A thin film magnetic head in which a lower magnetic film, a coil conductor consisting of at least a first conductor layer and a second conductor layer, and an upper magnetic film are sequentially laminated on a substrate with an insulating layer interposed therebetween, comprising: The lower magnetic film is formed on a part of the substrate,
A thin-film magnetic head characterized in that the first conductor layer is divided in an upper region of the end of the lower magnetic film and electrically connected by at least a second conductor layer formed through the insulating layer.