JPS62265740A - Height and lateral displacements detector for lead frame - Google Patents
Height and lateral displacements detector for lead frameInfo
- Publication number
- JPS62265740A JPS62265740A JP61109946A JP10994686A JPS62265740A JP S62265740 A JPS62265740 A JP S62265740A JP 61109946 A JP61109946 A JP 61109946A JP 10994686 A JP10994686 A JP 10994686A JP S62265740 A JPS62265740 A JP S62265740A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- frame
- lead
- inner lead
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000006073 displacement reaction Methods 0.000 title claims abstract description 35
- 230000003287 optical effect Effects 0.000 claims abstract description 6
- 238000001514 detection method Methods 0.000 claims description 8
- 238000003384 imaging method Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Control Of Position Or Direction (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、リードフレームの高さく厚さ）方向のバラツ
キを測定、選別、検出する装置に関するもので、特にリ
ードフレームのインナーリード先端の高さ方向の変位及
び横方向（ＸＹ方向うの変位を高速に、且つ高梢度に１
ｉｌｌ定、選別、検出する装置に関するものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a device for measuring, sorting, and detecting variations in the height and thickness directions of a lead frame. Displacement in the horizontal direction and displacement in the lateral direction (XY direction) at high speed and with a high degree of
The present invention relates to a device for identifying, sorting, and detecting illumination.
半導体装置の製造工程の一つに、ワイヤーボンディング
工程があり、半導体素子ベレットの電極バットとリード
フレームのインナーリードとの間にワイヤを接続して両
者の導通を七っている。そのリードフレームのインナー
リード部の高さ及びＸＹ方向にバラツキがあると、超音
波ボンディング法によるボンデ・インクにおいてはワイ
ヤ（アルミニュウム細線）が位置ずれを起こしたり高さ
の違いでボンディング荷重が変化しポンディング性を劣
化させるという事態が生じ、歩留まりを低下させるなど
の問題があった。One of the manufacturing processes for semiconductor devices is a wire bonding process, in which a wire is connected between an electrode butt of a semiconductor element pellet and an inner lead of a lead frame to establish electrical continuity between the two. If there are variations in the height of the inner lead part of the lead frame and in the X and Y directions, the wire (thin aluminum wire) may become misaligned in the bonding ink using the ultrasonic bonding method, and the bonding load may change due to the difference in height. There were problems such as deterioration of bonding properties and a decrease in yield.
従来、リードフレームのインナーリードの高さ方向、及
びＸＹ方向のバラツキの選別は作業者の目視による外観
チェックによジ行われている。Conventionally, variations in the height direction and the XY direction of the inner leads of a lead frame have been sorted out by visually checking the appearance by an operator.
そのため、作業者の熟練度合により選別に誤差が生じて
しまうという問題があった。Therefore, there is a problem in that errors occur in sorting depending on the skill level of the operator.
この問題を解決するものとして光学式の非接触変位測定
器の利用が考えられるが、インナーＩＪ −ド先端の表
面光沢の状態の微小なる違いや、リードフレーム材の圧
延方向のシマ目による反射光量【より変位量の測定で＋
３００μ〜３００μの繰り返し誤差があることや、高速
で多数のリードを測定、検出、選別する方法をとること
が困難であるという欠点がある。The use of an optical non-contact displacement measuring device may be considered as a solution to this problem, but it may be difficult to measure the amount of light reflected by minute differences in the state of surface gloss at the tip of the inner IJ-de and the stripes in the rolling direction of the lead frame material. [+ for measuring displacement amount]
The disadvantages are that there is a repeatability error of 300μ to 300μ and that it is difficult to use a method to measure, detect, and select a large number of leads at high speed.
本発明の目的は上述した欠点を除去し、インナーリード
先端の高さ変位及びＸＹ方向の変位を測定、選別、検出
するリードフレーム高さ変位及び横方向変位検出装置を
提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to eliminate the above-mentioned drawbacks and provide a lead frame height displacement and lateral displacement detection device that measures, sorts, and detects height displacement and XY direction displacement of the tip of an inner lead.
〔問題点を解決するための手段〕
本発明はリードフレームをＸＹ方向に移動制御する移動
部と、微小直径の光ビームをリードフレーム表面に照射
する発光部と、リードフレームのインナーリードでの反
射光を結像させる光学系と、その結像スポット光の結像
位置の変化によりインナーリードの２方向の位置を検出
するＺ方向センサーと、リードフレームのインナーリー
ドの間を通過するビームによりインナーリードのＸＹ方
向の位置を検出するＸＹ方向センサーと、ＸＹ方向セン
サー及びＺ方向センサーからの出力信号と基準信号とを
比較演算し、リードフレームのインナーリードのＸ、Ｙ
、Ｚ方向への変位量を算出する信号処理回路とを有する
ことを特徴とするリードフレーム高さ変位及び横方向変
位検出装置である。[Means for Solving the Problems] The present invention includes a moving unit that controls the movement of the lead frame in the X and Y directions, a light emitting unit that irradiates a light beam with a minute diameter onto the lead frame surface, and a light beam that is reflected by the inner lead of the lead frame. An optical system that forms an image of light, a Z-direction sensor that detects the position of the inner lead in two directions by changing the imaging position of the focused spot light, and a beam that passes between the inner leads of the lead frame to detect the inner lead. The output signals from the XY direction sensor, which detects the XY direction position of the lead frame, and the output signals from the XY direction sensor and Z direction sensor are compared with the reference signal, and the
, and a signal processing circuit that calculates the amount of displacement in the Z direction.
次に、本発明の一実施例について図面を参照して説明す
る。Next, an embodiment of the present invention will be described with reference to the drawings.
第１図は本発明の装置の一実施例の概略構成図である。FIG. 1 is a schematic diagram of an embodiment of the apparatus of the present invention.
リードフレーム１をＸＹ方向に移動制御する移動部は、
リードフレームをセットするＸＹテーブル１３と、リー
ドフレーム１をテーブル１３上に吸着固定する固定装置
である真空ポンプ１６と、テーブル１３を駆動するモー
タ駆動回路１５とにより構成される。微小直径の光ビー
ム３をリードフレームｌ上に照射する発光部８は光源２
と、それから出力される光ビームを微小な光スポットに
するための照射し／ズととからなる。さらに投射された
細い光ビーム３がリードフレーム１のインナーリード１
α、ｌｂの先端部（第２図参照）等の表面で散乱した反
射光５を結像させるための集光レンズ（光学系）６と、
レンズ６により集束されたビーム兄を受はインナーリー
ド先端部１ｃＬ、１ｂのＺ方向への変位を検出するＺ方
向センサー（受光素子、 ＰＳＤ ）７とを有する。The moving unit that controls the movement of the lead frame 1 in the XY directions is
It is composed of an XY table 13 for setting a lead frame, a vacuum pump 16 which is a fixing device for suctioning and fixing the lead frame 1 onto the table 13, and a motor drive circuit 15 for driving the table 13. A light emitting unit 8 that irradiates a light beam 3 with a minute diameter onto a lead frame l is a light source 2.
and an irradiation/splash for turning the light beam outputted from the light beam into a minute light spot. Furthermore, the projected thin light beam 3 is the inner lead 1 of the lead frame 1.
a condenser lens (optical system) 6 for imaging the reflected light 5 scattered on the surface of the tips of α, lb (see Figure 2), etc.;
The beam receiving unit 6 is provided with a Z-direction sensor (light receiving element, PSD) 7 that detects the displacement of the inner lead tips 1cL and 1b in the Z direction.
又、Ｘ方向、Ｙ方向の変位を検出するためにインナーリ
ードｌ ａ ＋ １ ｂの間を抜けたビーム４をＸＹテ
ーブル１３の下で受けるＸＹ方向センサー１２を有する
。It also has an XY direction sensor 12 which receives the beam 4 passing between the inner leads la + 1b under the XY table 13 in order to detect displacements in the X and Y directions.
センサー７．１２からの出力信号と基準信号とを比較演
算し、インナーリードのＸ、Ｙ、Ｚ方向への変位量を算
出する信号処理回路１１は、増幅部９と演算回路１０と
で構成され、操作パネル１４と、モータ８駆動回路１５
と、真空ポンプ１６と、表示部１７と、データを記憶す
る記憶部１８と、結果を出力するプリンタ１９は全体の
制御をコントロールするコントロール部２０に信号伝達
するためのパスライン２１を介して接続される。コント
ロール部２０はＸＹテーブルの移動部と信号処理回路１
１とを同期させて動作指令を発する。A signal processing circuit 11 that compares and calculates the output signal from the sensor 7.12 with a reference signal and calculates the amount of displacement of the inner lead in the X, Y, and Z directions is composed of an amplifier section 9 and an arithmetic circuit 10. , operation panel 14, and motor 8 drive circuit 15
, the vacuum pump 16, the display section 17, the storage section 18 for storing data, and the printer 19 for outputting the results are connected via a path line 21 for transmitting signals to a control section 20 that controls the overall control. be done. The control section 20 includes an XY table moving section and a signal processing circuit 1.
The operation command is issued in synchronization with 1.
次に、以上の構成によるリードフレーム高さ変位、横方
向変位検出装置の動作を説明する。Next, the operation of the lead frame height displacement and lateral displacement detection device having the above configuration will be explained.
先ず、変位量を検出されるべきリードフレームｌはＸＹ
テーブル１３の所定の位置に固定装置１６によりセット
される。一方、テーブル１３にセットされ変位量を検出
されるべきインナーリードｌα、ｔｂ等の照射光ビーム
３に対するＸ方向、Ｙ方向の動作軌跡はあらかじめ操作
パネル１４を通してコントロール部２０へ記憶されてお
９、その動作指令により操作を開始する。First, the lead frame l whose displacement amount is to be detected is XY
It is set at a predetermined position on the table 13 by a fixing device 16. On the other hand, the movement trajectories in the X and Y directions of the inner leads lα, tb, etc. set on the table 13 whose displacements are to be detected with respect to the irradiation light beam 3 are stored in advance in the control unit 20 through the operation panel 14. The operation is started based on the operation command.
次にインナーリード部のＺ方向及びＸ方向、Ｙ方向の変
位量の検出方法であるが、これ・；ま先ず、光源２から
でた光ビーム３は照射レンズとで収束されて細かい照射
光ビーム３となり、Ｘ方向、及びＹ方向に移動している
フレーム１のインナーリード部１α、ｌｂ等に順次投射
される。インナーリ−ド部に照射された光ビームは、そ
のＸ方向、Ｙ方向への駆動に対応して表面で散乱する光
５と、そのインナーリード間を抜けるビーム４とが交互
に出ることとなる。ここで、光ビーム４はＸＹ方向変位
検出センサー１２に入りそのインナーリードのＸ方向、
Ｙ方向の位置を指示する信号となり演算部９に入る。Next, there is a method for detecting the amount of displacement of the inner lead part in the Z direction, X direction, and Y direction. 3, and is sequentially projected onto the inner lead parts 1α, lb, etc. of the frame 1 moving in the X direction and the Y direction. The light beam irradiated onto the inner lead portion alternately emits light 5 scattered on the surface and beam 4 passing between the inner leads corresponding to the driving in the X direction and the Y direction. Here, the light beam 4 enters the XY direction displacement detection sensor 12 and the inner lead in the X direction.
It becomes a signal indicating the position in the Y direction and enters the calculation section 9.
信号処理回路１１ではＸＹテーブルの送り量（移動量）
をＸＹ方向変位検出センサー１２の信号により現状の位
置を読み出しして演算し、その演算値とあらかじめ操作
パネルより与えられている正規の位置関係寸法とを比較
しＸ方向とＹ方向の変位量を算出しパスライン２１によ
り記憶部１８に転送するＯ
又、インナーリード部のＺ方向変位検出方法については
、次の通りである。センサー（ＰＳＤ） ７の表面は均
一な抵抗層であり光電効果をもち、表面に結像するスポ
ット像と受光素子の左右である電極７α、７ｂとの間の
各々の距離に対応する光電流１１゜１２が電極７ａ、
７ｂから流れ、且つこの光電流１１＋１２がそのスポッ
ト像の位置に応じて異なり、演算回路部１０によって
Ｚ’＝ Ｋｔ［（ｔｌ−ｉ２）／ Ｃｔｌ＋１２）］−
Ｋｚ［（Ｌ２−Ｌｌ）／ （Ｌｌ”Ｌ２） ］ （Ｋ
ｌ ｐ定数１．に２；定数２）を計算すると、センサー
７の中心点からスポット像（光点）の位置までの距離Ｚ
′が求められる。このようにＺ′は入射エネルギーに関
係なく、スポット像とセンサー７の左右の位置にある電
極７α、７ｂ迄の各々の距離の違いによる１１＋ｊ２の
違いのみでＺ′が測定できる。インナーリードｌＣＬ、
ｌｂの表面からの散乱、反射する反射光５を集光レンズ
６で集められ収束ビーム喫として上述したセンサー７０
表面にスポット像を作る。このスポット像の位置は第３
図でもわかるようにリードフレーム１のインナーリード
１α、ｌｂ等の２方向の位置はリードフレーム１を原点
に取り、この点がセンサー７の中心点に合わせると、イ
ンナーリード１α、ｌｂの各位置はＺα、Ｚｂとなり、
その各点のセンサー面上のスポット像位置とは１対１に
対応したもので、そのかあるいはｚｂによって決まる。The signal processing circuit 11 determines the feed amount (travel amount) of the XY table.
The current position is read and calculated based on the signal of the XY direction displacement detection sensor 12, and the calculated value is compared with the regular positional relationship dimensions given in advance from the operation panel to calculate the amount of displacement in the X and Y directions. O is calculated and transferred to the storage unit 18 via the pass line 21. Also, the method for detecting the Z-direction displacement of the inner lead portion is as follows. The surface of the sensor (PSD) 7 is a uniform resistive layer and has a photoelectric effect, and photocurrents 11 are generated corresponding to the respective distances between the spot image formed on the surface and the electrodes 7α and 7b on the left and right sides of the light receiving element. °12 is the electrode 7a,
7b, and this photocurrent 11+12 differs depending on the position of the spot image, and the arithmetic circuit section 10 calculates Z'=Kt[(tl-i2)/Ctl+12)]-
Kz[(L2-Ll)/(Ll”L2)] (K
l p constant 1. 2; constant 2) is calculated, the distance Z from the center point of the sensor 7 to the position of the spot image (light point)
′ is required. In this way, Z' can be measured with only a difference of 11+j2 due to the difference in distance between the spot image and the electrodes 7α and 7b on the left and right positions of the sensor 7, regardless of the incident energy. Inner lead lCL,
The above-mentioned sensor 70 collects the reflected light 5 scattered and reflected from the surface of the lb by the condensing lens 6 and converts it into a convergent beam.
Create a spot image on the surface. The position of this spot image is 3rd
As can be seen in the figure, the positions of the inner leads 1α, lb, etc. of the lead frame 1 in two directions are determined by taking the lead frame 1 as the origin and aligning this point with the center point of the sensor 7. Zα becomes Zb,
There is a one-to-one correspondence with the spot image position of each point on the sensor surface, which is determined by zb.
結局中心点からスポット像の位置までの距離をインナー
リード部の順次の通過ごとにその時間内に信号処理回路
１１により高速演算することにより、インナーリード１
ｃＬ＊１ｂ等のＺ方向の変位を知ることができる。In the end, the distance from the center point to the position of the spot image is calculated at high speed by the signal processing circuit 11 each time the inner lead portion passes through the inner lead portion.
It is possible to know the displacement in the Z direction such as cL*1b.
このように演算されたデータはパスライン２１により記
憶部１８に送られ、１つのリードフレームが終了すると
、必要なデータを表示部１７やプリンタ１９に出力する
。The data calculated in this manner is sent to the storage section 18 via the pass line 21, and when one lead frame is completed, the necessary data is output to the display section 17 and printer 19.
以上説明したように不発Ｅ３Ａは、リードフレームのＸ
Ｙ移動部と、Ｚ方向の変位検出部と、ＸＹ方向の変位検
出部を組み合わせ、高速でその信号を処理することによ
り、リードフレームのインナーリード部全部の各変位量
（Ｘ、Ｙ、Ｚ方向〕を高速に検出できるという効果があ
る。As explained above, the unexploded E3A is caused by
By combining the Y moving section, the Z direction displacement detection section, and the XY direction displacement detection section and processing the signals at high speed, each displacement amount (X, Y, Z direction) of the entire inner lead section of the lead frame is detected. ) can be detected at high speed.
第１図は本発明のリードフレーム高さ変位、横方向変位
検出装置の概略構成図、第２図はリードフレームのイン
ナーリード部を表す部分斜図、第３図は第１図のリード
フレームの変位と受光素子スポット像の関係を示す説明
である。
１・・・リードフレーム ｌα、ｌｂ・・・インナ
ーリード先端部２・・・光源 丞・・・照
射レンズ３・・・照射光ビーム ４・・・リー
ドの間を抜けた光ビーム５・・・反射光 ６
・・・集光レンズ７・・・Ｚ方向センサー（ＰＳＤ）
８・・・発光部９・・・増幅部 １０・
・・演算回路１１・・・信号処理回路 １２・・・
ＸＹ方向センサー１３・・・ＸＹテーブル １４・
・・操作パネル１５・・・モータ駆動回路 １６・・
・真空ポンプ１７・・・表示部 １８・・・
記憶部１９・・・プリンタ ２０・・・コント
ロール部２１・・・バスラインFIG. 1 is a schematic configuration diagram of the lead frame height displacement and lateral displacement detection device of the present invention, FIG. 2 is a partial perspective view showing the inner lead portion of the lead frame, and FIG. This is an explanation showing the relationship between displacement and a light receiving element spot image. 1...Lead frame lα, lb...Inner lead tip 2...Light source 丞...Irradiation lens 3...Irradiation light beam 4...Light beam passing through between the leads 5... Reflected light 6
...Condensing lens 7...Z direction sensor (PSD)
8... Light emitting section 9... Amplifying section 10.
...Arithmetic circuit 11...Signal processing circuit 12...
XY direction sensor 13...XY table 14.
...Operation panel 15...Motor drive circuit 16...
・Vacuum pump 17...Display section 18...
Storage section 19...Printer 20...Control section 21...Bus line
Claims (1)
と、微小直径の光ビームをリードフレーム表面に照射す
る発光部と、リードフレームのインナーリードでの反射
光を結像させる光学系と、その結像スポット光の結像位
置の変化によりインナーリードのＺ方向の位置を検出す
るＺ方向センサーと、リードフレームのインナーリード
の間を通過するビームによりインナーリードのＸＹ方向
の位置を検出するＸＹ方向センサーと、ＸＹ方向センサ
ー及びＺ方向センサーからの出力信号と基準信号とを比
較演算し、リードフレームのインナーリードのＸ、Ｙ、
Ｚ方向への変位量を算出する信号処理回路とを有するこ
とを特徴とするリードフレーム高さ変位及び横方向変位
検出装置。(1) A moving unit that controls the movement of the lead frame in the X and Y directions, a light emitting unit that irradiates the surface of the lead frame with a micro-diameter light beam, an optical system that forms an image of the light reflected from the inner leads of the lead frame, and A Z-direction sensor detects the Z-direction position of the inner lead by changing the imaging position of the imaging spot light, and an XY-direction sensor detects the XY-direction position of the inner lead by a beam passing between the inner leads of the lead frame. The output signals from the sensor, XY direction sensor, and Z direction sensor are compared with the reference signal, and the X, Y,
A lead frame height displacement and lateral displacement detection device comprising a signal processing circuit that calculates a displacement amount in the Z direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61109946A JPS62265740A (en) | 1986-05-14 | 1986-05-14 | Height and lateral displacements detector for lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61109946A JPS62265740A (en) | 1986-05-14 | 1986-05-14 | Height and lateral displacements detector for lead frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62265740A true JPS62265740A (en) | 1987-11-18 |
Family
ID=14523125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61109946A Pending JPS62265740A (en) | 1986-05-14 | 1986-05-14 | Height and lateral displacements detector for lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62265740A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08320715A (en) * | 1995-05-24 | 1996-12-03 | Nec Corp | Tcp mounted device |
| US20140203391A1 (en) * | 2012-05-11 | 2014-07-24 | Nxp B.V. | Integrated circuit including a directional light sensor |
| US9331219B2 (en) | 2012-05-11 | 2016-05-03 | Nxp, B.V. | Integrated circuit with directional light sensor, device including such an IC and method of manufacturing such an IC |
-
1986
- 1986-05-14 JP JP61109946A patent/JPS62265740A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08320715A (en) * | 1995-05-24 | 1996-12-03 | Nec Corp | Tcp mounted device |
| US20140203391A1 (en) * | 2012-05-11 | 2014-07-24 | Nxp B.V. | Integrated circuit including a directional light sensor |
| US9331219B2 (en) | 2012-05-11 | 2016-05-03 | Nxp, B.V. | Integrated circuit with directional light sensor, device including such an IC and method of manufacturing such an IC |
| US9419043B2 (en) * | 2012-05-11 | 2016-08-16 | Nxp B.V. | Integrated circuit including a directional light sensor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10816322B2 (en) | Bonding apparatus and method for detecting height of bonding target | |
| JPS60205212A (en) | Optical system surface approach-degree measuring device | |
| US6111649A (en) | Thickness measuring apparatus using light from slit | |
| US20210202432A1 (en) | Bonding apparatus | |
| JPH11326040A (en) | Sensor having wide divergence optical system and detector | |
| JPS6383886A (en) | Bar code detector | |
| JPH0447976B2 (en) | ||
| JPS62265740A (en) | Height and lateral displacements detector for lead frame | |
| JPH11190616A (en) | Surface shape measuring device | |
| JP2003215149A (en) | Optical shift detector, and conveying system | |
| JP2005049131A (en) | Led chip optical characteristic measuring instrument and led chip optical characteristic measuring method | |
| JPS63314403A (en) | Detecting apparatus for inclination and distance of flat surface | |
| JPS6316892A (en) | Distance measuring instrument for laser beam machine | |
| JPH06300541A (en) | Lead pin inspection device and position control device | |
| JPH0255907A (en) | Shape recognition device | |
| JPS62287107A (en) | Center position measuring instrument | |
| JPH11243113A (en) | Wire bonding device | |
| JPH01202608A (en) | Inspecting device for bending of ic lead | |
| JPS58155304A (en) | Size measuring device | |
| JPS6275309A (en) | Displacement convertor | |
| JPH06265332A (en) | Mounting accuracy measuring method for semiconductor chip | |
| JPH02103404A (en) | Lead inspection apparatus | |
| JPH02276908A (en) | Three-dimensional position recognizing device | |
| JPH01286324A (en) | Wafer prober | |
| JP3149570B2 (en) | Non-contact shape measuring device |