JPH06300541A - Lead pin inspection device and position control device - Google Patents

Abstract

PURPOSE:To provide a lead pin inspection device having the capability to inspect such a defect as lead pin dislocation, unequal pin height, pin disappearance and and collective pin inclination quickly, highly precisely, inexpensively and stably, and further provide a position control device having the capability to control a relative position between two opposite faces quickly, highly precisely, inexpensively and stably. CONSTITUTION:A brush 11 with a plurality of lead pins 10i (i=1, 2..., n) led out, is moved at a constant speed along the array direction of the lead pins 10i with a uniform motion drive mechanism. Concurrently, light is irradiated to the tips of the lead pins 10i with an oblique projector 13a at the prescribed angle with the arrayed plane thereof, and spot light passing between the lead pins 10i is received with an oblique light receiver 14. Furthermore, arithmetic operation is performed on the basis of the on/off time or the like of output signals from the light receiver 14, thereby measuring the extent of unequal lead pin height or the like, and making judgement about the existence of a defect in the lead pins 10i.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead pin inspection device and a position control device, and more particularly to a component having a plurality of lead pins pulled out from the side, for example, a lead pin such as a brush or an IC package for transmitting a signal to a rotating body. Misalignment,
The present invention relates to a lead pin inspection device that determines the presence or absence of defects such as height deviation, disappearance, and collective inclination, and a position control device that is used for automatic focusing of optical systems such as microscopes and highly accurate arrangement of members.

[0002]

2. Description of the Related Art A conventional IC package lead pin inspection method using a CCD camera will be described with reference to FIG. 29 (a) and 29 (b) are schematic views showing the arrangement of the CCD camera when the IC package is viewed from the side and the top, and FIG. 29 (c) shows an image captured by the CCD camera of the lead pin of the IC package. FIG.

A plurality of lead pins 80i (i =
IC package 8 in which 1, 2, ..., N) are extracted
A CCD camera 82 is installed beside 1. Then, light is applied from a light projector (not shown) to the alignment surface of the lead pins 80i, and an image is taken by the CCD camera 82. The CCD camera 82 is connected to a predetermined display device (not shown), and the lead pin 80i of the IC package 81 is inspected from the captured image displayed on the display device.

For example, like the lead pin 80i (i = 3), a plurality of lead pins 80i are displaced in the alignment direction (hereinafter referred to as "positional displacement"), or the lead pin 80i (i =).
In the case where there is a deviation in the direction perpendicular to the alignment direction (hereinafter referred to as “height deviation”) as in 2), FIG.
The position shift amount ΔX and the height shift amount ΔZ can be obtained from the captured image shown in (c) (“IC package lead inspection technology”; magazine “Electro packaging technology”, 199).
2, 5 (vol.8 No.5)).

A conventional method of inspecting a lead pin of an IC package using a displacement sensor will be described with reference to FIG. Here, FIG. 30A is a schematic view showing the arrangement of the displacement sensor when the IC package is viewed from the side, FIG.
(B) is a graph showing an output waveform of the displacement sensor. I
The displacement sensor 83 is installed below the plurality of lead pins 80i drawn out from the side surface of the C package 81.
The IC package 81 is moved at a constant speed in the alignment direction of the lead pins 80i while the moving lead pins 80i move.
The displacement sensor 83 irradiates the lower surface of the tip with laser light,
The reflected light is detected again by the displacement sensor 83, and the lead pin 80i of the IC package 81 is detected from the time-varying output waveform.
Conduct an inspection.

[0006] For example, in the case where the lead pins 80i (i = 2, 3) have a positional deviation or a height deviation, as shown in FIG.
As shown in (b), in the output waveform with respect to the time change of the displacement sensor 83, the height of the waveform and the interval between the waveforms change. Therefore, the height deviation and the position deviation of the lead pins 80i (i = 2, 3) can be obtained from the displacement of these heights and the displacement of the intervals (“IC package lead inspection technology”; magazine “Electronic mounting technology”). , 1992,5 (vo
See l.8 No.5)).

A conventional method for inspecting a lead pin of an IC package using a light emitter and a light receiver will be described with reference to FIG. Here, FIG. 31 (a) is a schematic view showing the arrangement of the tip of the lead pin and the light emitting device and the light receiving device when the IC package is viewed from the side surface, and FIG. 31 (b) is a schematic plan view thereof. A set of a light emitter 84 and a light receiver 85 is installed at a predetermined angle with respect to the alignment surface of the plurality of lead pins 80i drawn out from the side surface of the IC package 81. The amount of light received by the light receiver 85 after passing through the plurality of lead pins 80i from the laser light 86 having the thickness S and width T emitted from the light emitter 84 is stored as the output value of the light receiver 85. Next, the set of the light emitter 84 and the light receiver 85 is moved from the position shown by the solid line in the figure to the position shown by the alternate long and short dash line, and the same operation is repeated.

The lead pin 80i of the IC package 81 is inspected by comparing the thus stored output value of the light receiver 85 with that of a normal IC package having no defect in the lead pin. For example, when a certain lead pin is displaced or displaced in height, the output value of the light receiver 85 is different from the output value obtained in the case of a normal IC package. Therefore, it is determined whether or not there is a displacement in height or displacement of the lead pin. (See JP-A-1-260349).

Further, a conventional position control method using a laser length measuring device will be described with reference to FIG. Here, FIG.
[Fig. 3] is a side view of two surfaces facing each other. Face to face in parallel 2
When controlling the relative positions of the two surfaces, the laser length measuring device 87 is fixed to one A surface and the reflection mirror 88 is fixed to the other B surface. While moving the A surface or B surface in the vertical direction, the laser length measuring device 87 emits laser light to the reflecting mirror 88, and the phase of the laser light reflected by the reflecting mirror 88 is detected by the laser length measuring device 87. To do. Then, the distance between the A surface and the B surface is measured from the detected change in the phase of the laser light. In this way, the A surface and the B surface can be controlled to positions having a predetermined distance.

[0010]

However, in the conventional IC package lead pin inspection method using the above-mentioned CCD camera, all the lead pins 80i on one side of the IC package 81 are placed within the field of view of the CCD camera 82 and once. It is difficult to perform the inspection by the image pickup because of the resolution of the CCD camera 82. Therefore, in order to obtain a resolution above a certain level, the IC package 81 or CCD
The camera 82 must be moved multiple times, resulting in a defect that the inspection time increases. The CCD camera 82
Although it is possible to reduce the inspection time by installing a plurality of inspection devices, in this case, there is a defect that the inspection device becomes complicated and the cost is increased.

Further, the above-mentioned conventional displacement sensor is used.
In the lead pin inspection method for the C package, the displacement sensor 83 uses the laser light reflected on the lower surface of the lead pin 80i.
Since there is a defect that the reflected light fluctuates depending on the surface condition of the lower surface of the lead pin 80i, it may be difficult to stably detect the displacement of the height or the displacement of the interval.

Further, the lead pin 8 of the IC package 81
Since the width of 0i is usually 100 to 200 μm, the displacement sensor 83 is required to have a minute laser spot of about 10 μmφ and high-speed response. Therefore, unless such a high-performance displacement sensor 83 is used, the inspection accuracy is lowered, but if the inspection accuracy is to be guaranteed, there is a problem that the cost is increased.

In the lead pin inspection method for an IC package using the above-mentioned conventional light emitter and light receiver,
In order to compare the total amount of light passing between the plurality of lead pins 80i with that of a normal IC package, it is possible to determine the presence or absence of height deviation or position deviation in the plurality of lead pins 80i, but there is a defect in the lead pin 80i. It is not possible to measure the amount of height deviation or the amount of position deviation of itself. Therefore, there is a defect that the inspection based on the judgment of the amount of the deviation is impossible and the inspection cannot be performed with high accuracy. In addition, it is impossible to analyze which lead pin 80i is likely to have a defect, and it is not possible to improve the handling method and the storage method based on the analysis.

Further, in the above-mentioned conventional position control method using the laser length-measuring device, the laser length-measuring device 87 is expensive, so that the cost is increased. Also,
The reflection mirror 88 is installed in such a direction that the reflected laser light is accurately incident on the laser length measuring device 87, and the surface thereof is held on a mirror surface with an accuracy of λ / 2 to λ / 4 with respect to the laser light wavelength λ. Therefore, there is also a problem that in actual use, it requires a great deal of trouble to install and manage it.

Therefore, the present invention solves the problems of the prior art as described above, and shifts the lead pin position, height, and disappears.
Lead pin inspection device that stably inspects defects such as collective inclination at high speed, high precision, low cost, and stably controls the relative position of two facing surfaces at high speed, high precision, low cost. An object is to provide a position control device.

[0016]

The above object is to provide a lead pin inspection apparatus for inspecting a plurality of lead pins arranged at a predetermined interval, and a stage on which an object to be inspected having a plurality of lead pins is mounted, An emitter / receiver comprising a light emitter for irradiating the alignment surface of the lead pin with spot light at a predetermined angle and a light receiver for receiving the spot light from the light emitter passing between the plurality of lead pins, and the light emitter / receiver or the stage. Driving means for moving the lead pins in the alignment direction of the plurality of lead pins, relative speed detecting means for detecting a relative moving speed of the projecting / receiving device and the stage by the driving means, and a light receiving state of the light receiving device. Time detection means for detecting a transition time to a light blocking state or a transition time from a light blocking state to a light entering state, and a speed signal from the relative speed detection means And a displacement amount of each lead pin measured from the normal position or the number of defects of the lead pin based on the transition time detected by the time detection unit, and a displacement amount of each lead pin or a lead pin measured by the arithmetic unit. And a defect determining means for determining the presence or absence of a defect in the plurality of lead pins based on the number of defects.

Further, in the above lead pin inspection device, instead of the drive means and the relative speed detection means,
The light emitting / receiving device or the stage has a constant velocity driving means for moving at a constant velocity in the alignment direction of the plurality of lead pins, and the computing means operates normally on each lead pin based on the transition time detected by the time detecting means. This is achieved by a lead pin inspection device characterized by measuring the amount of displacement from various positions or the number of lead pin defects.

Further, in the above lead pin inspection device, instead of the relative speed detecting means, a distance from a predetermined reference position of the plurality of lead pins to a pin to be inspected to which the projector emits spot light is detected. A distance detecting means is provided, and the calculating means calculates the displacement amount of each lead pin from the normal position or the number of missing lead pins based on the distance signal from the distance detecting means and the transition time detected by the time detecting means. It is achieved by a lead pin inspection device characterized by measuring.

Further, the above-mentioned lead pin inspection device is provided with a measured amount storage means for storing the displacement amount of each lead pin or the number of lead pin defects measured by the calculation means. . Further, in the above lead pin inspection apparatus, the light projector is installed so as to irradiate the tip end portions of the plurality of lead pins obliquely with respect to the alignment surface of the plurality of lead pins, and This is achieved by a lead pin inspection device characterized by measuring the amount of positional deviation and the number of lost pins, or the amount of height deviation of each lead pin and the number of lost pins.

Further, in the above lead pin inspection apparatus, the light projector is installed so as to irradiate the root portions of the plurality of lead pins substantially perpendicularly to the alignment surfaces of the plurality of lead pins. It is achieved by a lead pin inspection device, which is characterized by measuring the number of lost pins in. Further, in the above lead pin inspection device, the first light emitter / receiver for irradiating the tip ends of the plurality of lead pins substantially perpendicularly to the alignment surface of the plurality of lead pins, and the plurality of light emitters / receivers. A second light emitter / receiver for irradiating the tip end portion of the lead pin obliquely with respect to the alignment surface of the plurality of lead pins, and measuring the positional deviation amount and height deviation amount of each lead pin in the plurality of lead pins. Is achieved by the lead pin inspection device.

Further, in the above lead pin inspection apparatus, the first light emitter / receiver for irradiating the tip ends of the plurality of lead pins substantially perpendicularly to an alignment surface of the plurality of lead pins. A second light emitter / receiver for irradiating the root portions of the plurality of lead pins substantially perpendicularly to the alignment surface of the plurality of lead pins, wherein the plurality of lead pins are collectively inclined in the alignment direction. It is achieved by a lead pin inspection device characterized by measuring a quantity.

Further, in the above lead pin inspection apparatus, the light projecting / receiving device projects a light projecting light onto the alignment surface of the plurality of lead pins, and collects the light emitted from the light projecting device to a predetermined size at a predetermined position. And an optical system for irradiating the spot light, and a plurality of light receivers arranged near the outer diameter of the spot light for receiving the light emitted from the projector and irradiating at different angles with respect to the alignment surfaces of the lead pins. And a lead pin inspection device.

Further, in the above lead pin inspection device, the lead pin inspection device is characterized in that linear members for transmitting light are respectively provided on the front surfaces of the plurality of light receivers. Further, in the above lead pin inspection device, the mask is provided on the front surface of the light receiver, in which a mask having fine holes for transmitting light from the light projector is formed.

Further, in the above lead pin inspection apparatus, the lead pin is characterized in that a mask having fine holes for transmitting light from the projector is formed on the front surface of the linear member for transmitting light. Achieved by inspection equipment. Further, in the above lead pin inspection device, on a straight line that intersects at a right angle at substantially the center of the spot light,
This is achieved by a lead pin inspection device characterized in that the plurality of light receivers are arranged at positions where the intensity of light emitted from the light projector is substantially equal.

Further, in a position control device for controlling the relative position of the first surface and the second surface facing each other, a projector fixed to the first surface, and a projector installed on the second surface, The light receiver fixed so that the optical axes thereof coincide with each other when the first surface and the second surface have a predetermined relative position, and the position of the first surface or the second surface are A driving means for changing the relative positions of the first and second surfaces by the driving means, and the optical axes of the light projector and the light receiver are made to coincide with each other, whereby the first surface is changed. And the second
Is achieved by a position control device characterized by controlling the surface and the surface to a predetermined relative position.

Further, in the above position control device, the driving means moves the first surface or the second surface in a certain direction so as to change the interval between the first and second surfaces. Drive means, and by changing the relative position with respect to the first and second surfaces by the drive means so that the optical axes of the light projector and the light receiver coincide with each other, the predetermined surface of the first surface can be adjusted. This is achieved by a position control device characterized in that the distance between a point and a predetermined point on the second surface is controlled to a predetermined distance.

Further, in the above position control device, the first surface and the second surface are two surfaces that face each other in parallel, and the relative position between the first surface and the second surface by the driving means. The position control is characterized in that the distance between the first surface and the second surface is controlled to a predetermined distance by changing the target position and matching the optical axes of the light projector and the light receiver. Achieved by the device.

Further, in the above position control device, the light projector comprises at least three light projectors having optical axes in different directions, and the light receiver has at least three light receivers corresponding to the at least three light projectors. And a drive means for changing a distance and an angle formed by the first surface and the second surface, the drive means being configured to move relative to the first and second surfaces. By changing the positions and making the optical axes of the at least three light emitters and the at least three light receivers coincide with each other, the distance and angle formed by the first surface and the second surface can be set to predetermined values. It is achieved by a position control device characterized by controlling distance and angle.

[0029]

According to the present invention, while moving the stage on which the light emitter / receiver or the object to be inspected is mounted in the alignment direction of the plurality of lead pins,
The light emitting device irradiates the alignment surface of the lead pins with a spot light at a predetermined angle, and the light receiving device receives the spot light passing between the lead pins. It is possible to detect the transition time or the transition time from the light blocking state to the light entering state.

If a certain lead pin is displaced or missing from the normal position in the plurality of lead pins, the time when the light receiver shifts from the light-entering state to the light-shielding state or from the light-shielding state to the light-entering state is detected. The migration time is different from the normal migration time. Therefore, the amount of change is detected,
By performing a predetermined calculation, the amount of displacement of each lead pin from the normal position or the number of lead pin defects can be easily and accurately measured. Therefore, it is possible to determine the presence / absence of a defect in the plurality of lead pins based on the displacement amount or the number of defects.

[0031]

The present invention will be described below based on illustrated embodiments. FIG. 1 is a schematic diagram for explaining a brush lead pin inspection device for transmitting a signal to a rotary shaft according to a first embodiment of the present invention. The inspection is shown in FIGS. 1 (a), 1 (b) and 1 (c). The arrangement of a pair of light emitters / receivers when the target brush is viewed from the front, side, and top, respectively is shown. Also, in FIG.
It is a block diagram which shows the circuit structure which processes the output signal of a light receiver.

A plurality of lead pins 10i (i
= 1, 2, ..., N) is pulled out, the brush 11
It is mounted on a transparent table 12 that transmits light. In addition, the transparent table 12 is a constant speed drive (not shown).
By this, the lead pins 10i are moved at a constant speed in the alignment direction. Above the transparent table 12, an oblique projector 13 for irradiating, for example, a semiconductor laser is installed to irradiate spot light at a predetermined angle φ with respect to the alignment surface of the lead pins 10i. Further, below the transparent table 12, an oblique light receiver 14 using, for example, a pin photodiode is installed so as to face the oblique light projector 13, and the oblique light projector 13 passing between the lead pins 10i is provided. It is designed to receive spot light. In this way, a pair of light emitter / receiver is arranged with the alignment surface of the lead pin 10i sandwiched therebetween.

In addition, the spot light is blocked by the lead pin 10i from the state where the spot light from the oblique projector 13 passes between the lead pins 10i and enters the oblique light receiver 14. Time (light-blocking state) and time when the light-blocking state shifts to the light entering state, that is, the on / off time Ti of the output signal of the oblique light receiver 14 (i = 1, 2, ..., N). And off / on time T '
Time detection circuit 15 for detecting i (i = 1, 2, ..., N)
Are connected.

The time detection circuit 15 includes a pin number counter 16 for counting the number of lead pins 10i, an on / off time counter 17 for counting the on / off time Ti, and an off / on time T'i. The off / on time counters 18 are connected to each other. Also, the pin number counter 16 and the on / off time counter 1
A height deviation amount calculation circuit 19 for calculating the height deviation amount ΔZ is connected to 7, and the on / off time counter 17 and the off / on time counter 18 each include a disappearance pin for calculating the disappearance pin number m of the lead pin. The number arithmetic circuit 20 is connected.

Further, the pin number counter 16, the height deviation amount calculation circuit 19, and the disappearance pin number calculation circuit 20 are connected to the measurement amount storage circuit 21, and the height deviation amount calculation circuit 19 and the disappearance pin number are also connected. The arithmetic circuit 20 is connected to a defect determination circuit 22 that finally determines whether or not there is a defect in the lead pin. Next, a case where the lead pin height deviation amount ΔZ is measured using the lead pin inspection apparatus according to the first embodiment will be described with reference to the block diagram of FIG. 2 and the time chart of the output signal of the photodetector shown in FIG. To do.

Now, as shown in FIG. 3, it is assumed that the width of each lead pin 10i of the brush to be inspected is W, its thickness is H, and the normally aligned intervals are L. It is also assumed that the j-th lead pin 10j is shifted downward by .DELTA.Zj in the direction perpendicular to the alignment surface of the lead pins 10i. However, it is assumed that the lead pins 10i are not displaced in the alignment direction.

First, after mounting the brush 11 on the transparent table 12, the transparent table 12 is moved at a constant speed Vo in the alignment direction of the plurality of lead pins 10i by a constant speed drive (not shown). And at the same time, the oblique light projector 13
The spot light is emitted from. At this time, the oblique projector 13
It is desirable to irradiate the tip portion of the lead pin 10i with the spot light from. This is because the height deviation amount ΔZ becomes larger at the tip end portion, so that the measurement becomes easier and more accurate.
In addition, the spot light from the oblique projector 13 leads to the lead pin 1.
The angle made with respect to the aligned plane of 0i, the so-called irradiation angle φ, is
Assuming that the maximum amount of deviation of the lead pins 10i in the height direction from the alignment surface is ΔZ _MAX , it is set to satisfy π / 2>φ> tan ⁻¹ {(H + 2 · ΔZ _MAX ) / L} (1) There is a need to. Irradiation angle φ is π /
This is because when it becomes 2, the oblique projector 13 irradiates the light vertically, and it becomes impossible to measure the height deviation amount ΔZ, and when the irradiation angle φ becomes smaller than the range of the above formula (1), This is because the spot light may not be able to pass between the lead pins 10i. However, when measuring the height shift amount ΔZ, it is desirable that the amount is as small as possible within the range of the above formula (1), that is, the spot light is obliquely emitted.

Thus, the spot light from the oblique light projector 13 irradiates the tip of the lead pin 10i, while the spot light passing between the lead pins 10i is the oblique light receiver 1.
It is received by 4. Then, from the incident state of the spot light to the oblique light receiver 14, the upper left corner of the lead pin 10i (see FIG.
The time to shift to the light-shielded state by (indicated by ● in (a)),
That is, the on / off time Ti of the output signal (● in FIG.
3) and the time when the light-shielded state is changed to the light-incident state by the lower right corner of the lead pin 10i (shown by a circle in FIG. 3 (a)), that is, the output signal on / off time T'i (FIG. 3).
(Indicated by a circle in (b)) is detected by the time detection circuit 15, and the on / off time Tj by the j-th lead pin 10j is counted by the on / off time counter 17.

Next, in the height deviation amount calculation circuit 19, the height deviation amount ΔZj is calculated based on the number j of the target lead pins from the pin number counter 16 and the on / off time Tj from the on / off time counter 17. Calculate That is, the on / off time T by the j-th lead pin 10j
j is, Tj = {(W + L ) × (j-1) + ΔZj / tan φ} / Vo + T 1 ... (2) next, thus the height deviation amount DerutaZj of j th lead pin 10j is, ΔZj = {(Tj - T ₁ ) × Vo − (W + L) × (j−1)} × tan φ (3)

Next, in the case of measuring the number of lost pins m of the lead pin using the lead pin inspection apparatus according to the first embodiment, the block diagram of FIG. 2 and the time chart of the output signal of the photodetector shown in FIG. 4 are used. Explain. Now
As shown in FIG. 4, it is assumed that m lead pins have disappeared from the jth lead pin 10j.

Similarly to the case where the height deviation amount ΔZ is measured, the brush 11 to be inspected is mounted on the transparent table 12, and is moved at a constant speed Vo in the alignment direction of the lead pins 10i by a constant speed driving machine. Spot light is emitted from the oblique light projector 13. The oblique light receiver 14 receives the spot light passing between the lead pins 10i, and the output signal of the oblique light receiver 14 is turned on / off at time Ti and turned off / off.
The on-time T'i is detected by the time detection circuit 15.

Then, the off / on time T'j of the j-th lead pin 10j detected by the time detection circuit 15 is counted by the off / on time counter 18, and the on / off time Tk by the lead pin 10k next to the lead pin 10j is counted. Is counted by the on / off time counter 17. Next, the lost pin count calculation circuit 20 measures the lost pin count m based on the off / on time T'j and the on / off time Tk from the off / on time counter 18 and the on / off time counter 17.

That is, when there are m vanishing pins, the light incident time to the oblique light receiver 14 from the off / on time T'j of the j-th lead pin 10j to the on / off time Tk of the next lead pin 10k. .DELTA.T becomes longer, and .DELTA.T = Tk-T'j = {(W + L) .times.m + L} / Vo (4). Therefore, the number of lost pins m is m = (ΔT × Vo-L) / (W + L) = {(Tk-T'j) × Vo-L)} / (W + L) (5).

The height deviation amount ΔZj of the lead pin and the number m of lost pins measured as described above are stored as data in the measured amount storage circuit 21 and the defect determination circuit 22.
At, a final determination is made as to the defect of the lead pin based on these count values. As described above, according to the first embodiment, the brush 11 for transmitting a signal to the rotary shaft is moved in the direction V of the lead pin 10i by the constant velocity drive machine.
While moving at a constant speed at o, the oblique light projector 13 irradiates the tip of the lead pin 10i with a predetermined acute angle φ with respect to its alignment surface, and the oblique light receiver 14 emits the spot light passing between the lead pins 10i. The time detection circuit 15 detects the on / off time Ti and the off / on time T'i of the output signal of the oblique light receiver 14, respectively, and detects the height deviation amount calculation circuit 19 and the lost pin number calculation circuit 2.
When 0 is calculated based on the equations (3) and (5), the height deviation amount ΔZ of the lead pin and the number of lost pins m can be measured. Therefore, the defect determination circuit 22 determines whether or not the target lead pin is defective based on the height deviation amount ΔZj of these lead pins and the number of lost pins m, and the defect of the lead pin among the plurality of lead pins 10i is determined. The presence or absence can be finally determined.

At this time, the lead pin height deviation amount ΔZj
And the number of lost pins m can be measured only by the characteristic amount based on the on / off time Ti and the off / on time T'i of the output signal of the oblique light receiver 14, and therefore, the brush 11 is conveyed for inspection. It is possible to obtain the determination result at high speed in a short time after the movement. Further, since the amount of height deviation ΔZj of the lead pin and the count amount of the lost pin number m are stored in the measured amount storage circuit 21 as data, they can be used for analysis for improving the manufacturing process, the handling method and the like. It will be possible.

The oblique light projector 13 and the oblique light receiver 14 are also provided.
Since relatively inexpensive elements such as a semiconductor laser and a pin photodiode can be used for
It is possible to reduce the cost in terms of cost. Also,
Since the light emitter / receiver composed of the oblique light emitter 13 and the oblique light receiver 14 is a transmission type optical system, a stable output signal from the oblique light receiver 14 can be obtained without depending on the surface state of the lead pin 10i. You can Therefore, the lead pin 10
It is possible to measure the displacement amount and the loss amount of i with high accuracy, and the final determination of the defect of the lead pin is also highly reliable.

Further, for example, by attaching a predetermined lens system to the semiconductor laser, the spot light of the oblique light projector 13 is more minutely narrowed, and the output signal of the oblique light receiver 14 is sampled at a higher speed. It is possible to measure at high speed with high resolution, and thus it is possible to improve accuracy and speed in inspection. In the first embodiment described above, the case where the transparent table 12 having the brushes 11 mounted thereon is moved at a constant speed in the alignment direction of the lead pins 10i by the constant speed drive has been described. Because of the relative relationship with a set of the light emitter / receiver composed of the oblique light emitter 13 and the oblique light receiver 14, instead of moving the lead pin 10i, the light emitter / receiver is moved at a constant speed. May be.

Further, since the width W and the interval L of the lead pin 10i of the brush 11 are extremely small, it may be difficult to perform strict constant velocity movement. In such a case, the transparent table 12 is replaced with the lead pin 10 instead of the constant speed driving machine.
It suffices to install a driving machine that moves in the alignment direction of i and a relative speed detection sensor that detects the moving speed of the driving machine.

In this case, the block diagram showing the circuit configuration for processing the output signal of the photodetector is such that, as shown in FIG. 5, the relative speed detection sensor 23 is added to the block diagram of FIG. Therefore, the speed signal V at each time is sent to the height deviation amount calculation circuit 19 and the lost pin number calculation circuit 20. Accordingly, the height deviation amount calculating circuit 19, in place of (Tj -T ₁₎ × Vo in (3),

[0050]

[Equation 1] And the height deviation amount ΔZj of the j-th lead pin 10j is

[0051]

[Equation 2] Becomes Further, in the lost pin number calculation circuit 20,
Instead of (Tk-T'j) * Vo in the equation (5),

[0052]

[Equation 3] And the number of lost pins m is

[0053]

[Equation 4] Becomes Furthermore, (3), instead of based on (5) in equation (Tj -T ₁₎ Since × Vo and (Tk -T'j) × Vo in which both represent the displacement, velocity information as described above, The distance in the alignment direction of the lead pin 10i from a certain reference position to the lead pin 10i may be obtained by using the distance detecting means.

In this case, as shown in FIG. 6, the block diagram showing the circuit configuration for processing the output signal of the photodetector is such that the distance detection sensor 24 is added to the block diagram of FIG. off/
Instead of the on-time counter 18, on / off time Ti
Distance counter 25 for counting the distance Li from the predetermined reference position to the left side surface of the lead pin 10i and the distance L'i from the predetermined reference position at the off / on time T'i to the right side surface of the lead pin 10i. An off / on distance counter 26 that counts is connected to the time detection circuit 15 and the distance detection sensor 24, respectively. Accordingly, the height deviation amount calculating circuit 19, based on the distance Lj to the left side of the j th lead pin 10j sent from the distance counter 25, instead of (Tj -T ₁₎ × Vo in (3) , the computation is made using Lj -L _1, the height deviation amount DerutaZj of j th lead pin 10j _{is, ΔZj = {(Lj -L 1} ) - (W + L) × (i-1)} × tan φ ... (8)

In the lost pin count calculation circuit 20, the distance L'j to the right side surface of the jth lead pin 10j sent from the distance counter 26 and the jth next one sent from the distance counter 25. Based on the distance Lk to the left side surface of the lead pin 10k, Lk-L'j is used instead of (Tk-T'j) * Vo in the equation (5), and the number of lost pins m is m = (Lk-L'j-L) / (W + L) (9). Further, the distance Lj to the left side surface of the j-th lead pin 10j is Lj = L'j-W (10), so that m = {(Lk-Lj)-(W + L)} / (W + L) ( 11)

As the distance detecting means at this time, specifically, a linear length measuring device, a rotary encoder, a pulse count transmitted to a pulse motor, a rotation angle detection of a polygon mirror by laser scanning and the like can be considered. In addition, in the first embodiment, assuming that there is no positional deviation in the alignment direction of the plurality of lead pins 10i, the height deviation amount ΔZ of the lead pin and the number of lost pins m are measured to determine whether there is a defect in the lead pin. However, depending on the manufacturing method and the handling method of the brush 11 having the lead pin 10i, the brush 11 may not be vertically displaced but may be horizontally displaced to cause positional displacement.

Of course, also in this case, it is possible to measure the positional deviation amount ΔX by using the lead pin inspection apparatus according to the first embodiment. However, in the case of the first embodiment, in order to measure the height deviation amount ΔZ easily and accurately,
It is desirable that the irradiation angle φ of the spot light is as small as possible within the range of the above formula (1). However, when measuring the positional deviation amount ΔX of the lead pin, in order to make the measurement easy and accurate, it is desirable that the irradiation angle φ of the spot light be vertical or an angle close thereto.

Therefore, next, assuming that there is no deviation in the height direction from the alignment surface of the plurality of lead pins 10i,
A lead pin inspection device that measures the amount of lead pin displacement ΔX and the number of lost pins m will be described in detail as a second embodiment. A brush lead pin inspection device for transmitting a signal to a rotary shaft according to a second embodiment of the present invention will be described with reference to FIGS.

FIGS. 7A, 7B, and 7C are schematic views showing the arrangement of a pair of light emitters / receivers when the brush to be inspected is viewed from the side surface and the plane, respectively, and FIG. 2 is a block diagram showing a circuit configuration for processing an output signal of a light receiver. The same components as those of the lead pin inspection device shown in FIGS. 1 and 2 are designated by the same reference numerals and the description thereof will be omitted.

In the second embodiment, the oblique projector 13 and the oblique light receiver 14 of the first embodiment are used.
While a pair of light emitters / receivers are arranged obliquely with respect to the alignment plane of the lead pins 10i, as shown in FIG. 7, one light emitter / receiver consisting of a vertical light emitter 27 and a vertical light receiver 28 is a lead pin. It is characterized in that it is arranged perpendicular to the 10i alignment plane.

In the circuit configuration for processing the output signal of the light receiver, as shown in FIG. 8, a position shift amount calculation circuit 29 is provided instead of the height shift amount calculation circuit 19. Except for this, it is almost the same as the case of the first embodiment. Next, a case of measuring the lead pin positional deviation amount ΔX using the lead pin inspection apparatus according to the second embodiment will be described using the block diagram of FIG. 8 and the time chart of the output signal of the photodetector shown in FIG. .

Now, as shown in FIG. 9A, the j-th lead pin 10j of the lead pin 10i of the brush 11 to be inspected is deviated by .DELTA.Xj in the direction opposite to the moving direction of the brush 11 in the alignment direction of the lead pin 10i. It is assumed that there is no height deviation from the aligned surface. Similar to the case of the first embodiment, the brush 1 is driven by the constant velocity drive machine.
While the transparent table 12 on which 1 is mounted is moved in the alignment direction of the lead pins 10i at a constant speed Vo, spot light is emitted from the vertical projector 27. At this time, it is desirable that the spot light from the vertical projector 27 irradiates the tip end portion of the lead pin 10i, as in the case of the first embodiment described above, but from the vertical projector 27 to the alignment surface of the lead pin 10i. The irradiation angle φ of the spot light of is greatly different.

That is, the irradiation angle φ of the spot light from the vertical projector 27 with respect to the alignment surface of the lead pin 10i is φ = π / 2 (12), and therefore the spot light irradiates the lead pin 10i vertically. However, this angle does not have to be strict, and irradiation may be performed at an angle close to vertical.

Thus, the spot light from the vertical projector 27 irradiates the tip of the lead pin 10i, while the spot light passing between the lead pins 10i receives the vertical light receiver 2.
It is received by 8. Then, the spot light receiver 27
The time detection circuit 15 detects the transition time from the light entering state to the light blocking state and the transition time from the light blocking state to the light entering state, that is, the on / off time ti and the on / off time t'i of the output signal, ON / OFF by jth lead pin 10j
The off time tj is counted by the on / off time counter 17.

Then, the positional deviation amount calculating circuit 29 calculates the positional deviation amount ΔXj based on the number j of the target lead pins from the pin number counter 16 and the on / off time tj from the on / off time counter 17. . That is, the on / off time tj of the j-th lead pin 10j
Is, tj = {(W + L ) × (j-1) + ΔXj} / Vo + t 1 ... (13) becomes, therefore positional deviation amount .DELTA.xj of j th lead pin 10j _{is, ΔXj = {(tj -t 1} ) × Vo − (W + L) × (j−1)} (14)

The operation of measuring the number of lost pins m of the lead pin by the lead pin inspection apparatus according to the second embodiment is almost the same as in the first embodiment,
Therefore, the number of lost pins m is m = {(tk-t'j) * Vo-L)} / (W + L) (15).

The positional deviation amount ΔXj of the lead pin and the number m of lost pins measured as described above are stored as data in the measured amount storage circuit 21 and the defect determination circuit 22.
At, a final determination is made as to the defect of the lead pin based on these count values. As described above, according to the second embodiment, the brush 11 for transmitting a signal to the rotary shaft is moved at a constant speed Vo in the alignment direction of the lead pin 10i by the constant speed driving machine, and the tip portion of the lead pin 10i is moved by the vertical projector 27. Is irradiated perpendicularly to the aligned surface,
The spot light passing between the lead pins 10i is received by the vertical photodetector 28, the on / off time ti and the off / on time t'i of the output signal of the vertical photodetector 28 are detected by the time detection circuit 15, and the positional deviation occurs. The amount calculation circuit 29 and the lost pin number calculation circuit 20 can calculate the positional deviation amount ΔX of the lead pin and the lost pin number m by performing calculations based on the equations (14) and (15).

Therefore, the positional deviation amount ΔX of these lead pins and the number of lost pins m are stored as data in the measured amount storage circuit 21, and the defect determination circuit 22 determines the presence / absence of a defect in the lead pin. It can be finally determined. As described in the first embodiment, the light emitter / receiver may be moved at a constant speed instead of moving the lead pin 10i. Also,
Instead of the constant speed driving machine, a driving machine and a relative speed detection sensor may be installed. Further, distance detecting means may be used.

In the second embodiment, however, it is desirable that the spot light irradiates the tip of the lead pin 10i in order to measure the positional deviation amount ΔX easily and accurately. However, when measuring the number of lost pins m of the lead pin, it is preferable to irradiate the root portion of the lead pin 10i with spot light, unlike the case shown in FIG.

For example, as shown in FIG. 10 (a), if the lead pins are very misaligned and the lead pin spacing A at the tip is A to 2L + W (16), the spot light is When the tip portion of the lead pin is irradiated, it may be mistakenly recognized as the case where the lead pin disappears, as shown in FIG. On the other hand, when irradiating the root portion of the lead pin, the distance a between the lead pins at the root portion is a <2L + W (17) no matter how large the positional deviation is. Therefore, it may be mistakenly recognized that the lead pin has disappeared. There is no. Therefore, measure the number of lost pins m of the lead pin,
In order to stably determine the presence or absence of the light, it is desirable that the spot light irradiates the root portion of the lead pin 10i.

In the first and second embodiments, the height deviation amount ΔZ and the number of lost pins m are measured on the premise that there is no positional deviation of the lead pin 10i on one side, and the height of the lead pin 10i on the other side is measured. The positional deviation amount ΔX and the number of lost pins m are measured on the assumption that there is no deviation. However, in the case of a lead pin of an IC package, for example, a positional deviation and a height deviation often occur in combination.

Therefore, next, the irradiation angle φ of the spot light should be as acute as possible within the range of the above formula (1), and should be perpendicular or close thereto, and the spot light should irradiate the tip of the lead pin. Of the lead pins which cannot be measured in the first and second embodiments. A lead pin inspection device capable of measuring various inclination amounts will be described in detail as a third embodiment.

Next, a lead pin inspection device for an IC package according to a third embodiment of the present invention will be described with reference to FIGS. 11 and 12. 11A and 11B are schematic diagrams showing the arrangement of three sets of light emitters / receivers when the IC package to be inspected is viewed from the side and the plane, respectively.
[FIG. 3] is a block diagram showing a circuit configuration for processing an output signal of a light receiver.

A plurality of lead pins 30i (i =
IC package 3 in which 1, 2, ..., N) are extracted
1 is mounted on a transparent table 32 that transmits light. The transparent table 32 is moved at a constant speed in the alignment direction of the lead pins 30i by a constant speed driving machine (not shown). Further, above the transparent table 32, a first vertical light projector 33, an oblique light projector 34, and a second vertical light projector 35, which respectively irradiate spot light, are installed, and the first vertical light projector 33 among them is a lead pin. Three
Irradiate the tip of 0i almost perpendicularly to the alignment plane,
The oblique projector 34 irradiates the tip portion of the lead pin 30i with a predetermined angle φ with respect to the alignment surface thereof, and the second vertical projector 35 irradiates the root portion of the lead pin 30i substantially perpendicularly with respect to the alignment surface thereof. It has become. At this time, the first vertical light projector 33 and the second vertical light projector 35 have a distance b in the alignment direction of the lead pins 30i because of their installation.
Just away.

Below the transparent table 32, the first
The first vertical light receiver 36, the oblique light receiver 37, and the second vertical light receiver 38 are installed in opposition to the vertical light projector 33, the oblique light projector 34, and the second vertical light projector 35, respectively.
First vertical projector 3 passing between the lead pins 30i
3, the spot light from the oblique light projector 34 and the second vertical light projector 35 are respectively received. In this way, three sets of light emitters / receivers are arranged with the alignment surfaces of the lead pins 30i sandwiched therebetween.

The first vertical light receiver 36, the oblique light receiver 37, and the second vertical light receiver 38 include the first vertical light projector 33, the oblique light projector 34, and the second vertical light projector 35. From the incident state of the spot light from the lead pin 30i
Transition time to the light blocking state or transition time from the light blocking state to the light entering state, that is, on / off time of output signals of the first vertical light receiver 36, the oblique light receiver 37, and the second vertical light receiver 38. ti, Ti, τi (i = 1, 2, ..., N) and off / on times t'i, T'i, τ'i (i = 1, 2,
, N) are connected to the time detection circuits 39, 40 and 41, respectively.

Further, the time detection circuit 39 is connected to a pin number counter 42 for counting the number of lead pins 30i and an on / off time counter 43 for counting the on / off time ti, and the time detection circuit 40 is turned on. An on / off time counter 44 for counting the on / off time Ti is connected, and an on / off time counter 45 for counting the on / off time τi and an off for counting the off / on time τ′i are connected to the time detection circuit 41. / On time counter 4
6 is connected.

Further, the ON / OFF time counter 43 and the pin number counter 42 are connected to a positional deviation amount calculation circuit 47 for calculating the positional deviation amount ΔX, and the ON / OFF time counter 44 and the pin number counter 42 are A height deviation amount calculating circuit 48 for calculating the height deviation amount ΔZ is connected, and the on / off time counter 43 and the on / off time counter 45 are provided with a tilt amount calculating circuit for calculating a collective tilt amount ΔXs of the lead pins. 49 connected, on / off time counter 4
5 and the off / on time counter 46 are connected to a lost pin count calculation circuit 50 that calculates the lost pin count m of the lead pin.

Furthermore, the pin number counter 42, the position shift amount calculation circuit 47, the height shift amount calculation circuit 48, the inclination amount calculation circuit 49, and the lost pin number calculation circuit 50 are connected to the count amount storage circuit 51. , These positional deviation amount calculation circuits 4
The height deviation amount calculation circuit 48, the inclination amount calculation circuit 49, and the lost pin number calculation circuit 50 are connected to a defect determination circuit 52 that finally determines a defect of the lead pin.

Next, in the case where the lead pin position deviation amount ΔX and the height deviation amount ΔZ are measured using the lead pin inspection apparatus according to the third embodiment, the output of the photodetector shown in the block diagram of FIG. 12 and FIG. This will be described using a signal time chart. Now, as shown in FIG.
Each lead pin 3 of the IC package 31 to be inspected
The width of 0i is W, the thickness is H, and the normally aligned spacing is L, and the j-th lead pin 30j is the lead pin 30i.
It is assumed that the IC package 31 is deviated by .DELTA.Xj in the direction opposite to the moving direction of the IC package 31 and is further deviated by .DELTA.Zj in the direction perpendicular to the aligned direction.

First, after mounting the IC package 31 to be inspected on the transparent table 32, the transparent table 3 is mounted.
Spot light is emitted from the first vertical light projector 33 and the oblique light projector 34 while moving 2 at a constant speed Vo in the direction in which the plurality of lead pins 30i are aligned by a constant speed driving device (not shown). The spot light from the first vertical light projector 33 and the oblique light projector 34 irradiates the tip of the lead pin 30i, while passing between the lead pins 30i, and the first vertical light receiver 36 and the oblique light receiver 37. Enter into.

As in the case of the second embodiment, the lead pin 30i shields the light from the spot light emitted from the first vertical light projector 33 in a substantially vertical direction to the first vertical light receiver 36. The time detection circuit 39 detects the transition time to the state and the transition time from the light blocking state to the light entering state, that is, the on / off time ti and the off / on time t'i of the output signal.
The on / off time tj by the j-th lead pin 30j is counted by the on / off time counter 43.

Further, similarly to the case of the first embodiment, the spot light emitted from the oblique light projector 34 at a predetermined angle φ enters the second light receiver 37 from the incident state to the upper left of the lead pin 30i. The transition time to the light-shielding state by the angle (indicated by ● in FIG. 13A), that is, the on / off time Ti of the output signal (indicated by ● in FIG. 13C) and the right of the lead pin 30i from the light-shielded state. The time detection circuit 40 indicates the transition time to the light entering state by the lower corner (indicated by ◯ in FIG. 13A), that is, the OFF / ON time T′i (indicated by ● in FIG. 13C) of the output signal. Detected by the j-th lead pin 30
The on / off time Tj by j is counted by the on / off time counter 44.

Next, in the position shift amount calculation circuit 47 and the height shift amount calculation circuit 48, the number j of the target lead pins from the pin number counter 42 and the on / off time tj from the on / off time counters 43 and 44. , Tj, the positional shift amount ΔXj and the height shift amount ΔZj are calculated. That is, on with j th lead pins 30j / off time tj, Tj is, tj = {(W + L ) × (j-1) + ΔXj} / Vo + t 1 ... (18) Tj = {(W + L) × (j-1 ) + ΔXj + ΔZj / tan φ } / Vo + T 1 ... (19) becomes, therefore positional deviation amount .DELTA.xj of j th lead pin 30j _{is, ΔXj = {(tj -t 1} ) × Vo - (W + L) × (j-1 )} ... (20), and also the height deviation amount DerutaZj _{is, ΔZj = {(Tj -T 1} ) × Vo - (W + L) × (j-1) -ΔXj} × tan φ = {(Tj -T 1 ) × Vo − (tj −t ₁ ) × Vo} × tan φ (21)

Next, in the case of measuring the collective inclination amount ΔXs of the lead pins by using the lead pin inspection apparatus according to the third embodiment, the block diagram of FIG. 12 and FIG.
This will be described with reference to the enlarged plan view of the lead pin 30i shown in FIG. Now, it is assumed that all the lead pins 30i of the IC package 31 are uniformly displaced as shown in FIG. Such a collective tilt is generated by the first vertical projector 3
3 and the oblique light projector 34, and the first vertical light receiver 36 and the oblique light receiver 37 cannot detect it, so that the tip and the root of the lead pin 30i are irradiated substantially perpendicularly to its alignment surface. Two vertical light projectors 33, 35 and corresponding first and second vertical light receivers 36, 38
To detect.

The IC package 3 to be inspected is measured in the same manner as the case where the positional deviation amount ΔX and the height deviation amount ΔZ are measured.
While moving the transparent table 32 on which 1 is mounted in the alignment direction of the lead pins 30i at a constant speed Vo, spot light is emitted from the first and second vertical projectors 33 and 35. Then, the transition time from the incident state of the spot light from the first vertical light projector 33 to the first vertical light receiver 36 to the light blocking state, that is, the on / off time ti of the output signal of the first vertical light receiver 36.
And the transition time of the spot light from the second vertical light projector 35 from the light entering state to the second vertical light receiver 38 to the light blocking state, that is, the on / off time τ of the output signal of the second vertical light receiver 38.
i and are detected by the time detection circuits 39 and 41, respectively, and are counted by the on / off time counters 43 and 45.

Next, in the inclination amount calculation circuit 49, the inclination amount is calculated based on the on / off times ti and τi from the on / off time counters 43 and 45 in the same manner as in the first embodiment. . Here, assuming that the distance ΔXs in the alignment direction from the root to the tip of the lead pin 30i is the collective tilt amount of the lead pin 30i, the tilt amount ΔXs.
.DELTA.Xs = (ti-.tau.i) .times.Vo-b (22) where i = 1, 2, ..., N.

Next, the number m of disappeared lead pins is measured using a set of the light emitter / receiver composed of the second vertical light emitter 35 and the second vertical light receiver 38 in the lead pin inspection apparatus according to the third embodiment. To do. The operation in this case is almost the same as that in the second embodiment except for the irradiation of the root portion or the tip portion of the lead pin 30i. Therefore, the number of lost pins m is m = {(τk-τ'j) × Vo-L} / (W + L) (23).

The lead pin position deviation amount ΔXj, the height deviation amount ΔZj, and the collective tilt amount Δ measured as described above.
The Xs and the number of lost pins m are stored as data in the count amount storage circuit 51, and the defect determination circuit 52 makes a final determination of the defect of the lead pin based on these count amounts. As described above, according to the third embodiment, the IC package 31 is moved at the constant speed Vo in the alignment direction of the lead pins 30i by the constant speed driving machine,
The first vertical light projector 33 irradiates the tip of the lead pin 30i substantially perpendicularly to its alignment surface, and the oblique light projector 34 irradiates the tip of the lead pin 30i with respect to the alignment surface at a predetermined angle φ. The second vertical projector 35 irradiates the root portion of the lead pin 30i substantially perpendicularly to its alignment surface, and the first vertical projector 33, the oblique projector 34, and the second projector 33 which pass between the lead pins 30i.
ON / OFF times ti, Ti of the output signals of the first vertical light receiver 36, the oblique light receiver 37, and the second vertical light receiver 38 which have respectively received the spot lights from the vertical light projectors 35,
τi and off / on times t′i, T′i, τ′i are detected by time detection circuits 39, 40 and 41, respectively, and a position shift amount calculation circuit 47, a height shift amount calculation circuit 48, a tilt amount calculation circuit are detected. 49, and the lost pin number calculation circuit 50, based on the equations (20) to (23), the lead pin position deviation amount ΔX and the height deviation amount ΔZ, respectively.
It is possible to measure the collective inclination amount ΔXs and the number of lost pins m.

Therefore, the positional deviation amount ΔX and height deviation amount ΔZ of these lead pins, the collective inclination amount ΔXs, and the number of lost pins m are stored as data in the count amount storage circuit 51, and the defect determination is performed. The circuit 52 can finally determine the defect of the lead pin based on these count values. Incidentally, in the third embodiment, as in the case of the first and second embodiments, the I
Instead of moving the transparent table 32 on which the C package 31 is mounted at a constant speed, the three sets of light emitters / receivers may be moved at a constant speed.

Instead of the constant speed driving machine, a driving machine for moving the transparent table 32 in the alignment direction of the lead pins 30i and a relative speed detecting sensor for detecting the moving speed of the driving machine may be installed. Further, by using a distance detecting means such as a linear length measuring device, the lead pin position deviation amount ΔXj, the height deviation amount ΔZj, and the number of lost pins m can be measured based on distance information instead of speed information. Good.

Next, a lead pin inspection device for an IC package according to a fourth embodiment of the present invention will be described with reference to FIGS. FIG. 15 is a diagram for explaining the principle of this embodiment, and FIG. 16 is a diagram showing an example in which it is used as a light emitting and receiving unit based on the principle of this embodiment shown in FIG. FIG. 17 is a diagram illustrating a method for inspecting the bending of the lead pin.

In the above-mentioned third embodiment, one light emitter and one light receiver are paired, and two or more pairs of light emitter / receiver units having different irradiation angles are used. However, in this embodiment, one light emitter is used. On the other hand, it is configured as a light emitter / receiver unit provided with a plurality of light receivers. In the principle explanatory view of FIG. 15, the projector 1
The case where two light receivers are used for each is shown.

The IC package 104, which is the object of inspection, has a plurality of lead pins 106 pulled out from each side surface.
Are mounted on a transparent table 108 that transmits light. A light projector 100 that emits light is provided above the transparent table 108, and the light projector 1 is provided below the light projector 100.
An optical system mainly including a lens 102 that collects light from 00 is provided.

Below the transparent table 108, the projector 1
Two optical receivers 110 are installed in the direction of an angle θ with respect to the optical axis ZZ ′ of 00. The light emitted from the projector 100 is condensed by an optical system including a lens 102 as a main component,
The light has a spread of an angle θ with respect to the optical axis ZZ ′ of the projector 100. Light obliquely incident on the IC package 104 at an angle of θ passes between the lead pins 106,
It is incident on the light receiver 110.

In this way, the light incident on the left and right light receivers 110 is applied to the IC package 104 at different angles. Therefore, it is possible to realize lights having different irradiation angles with one light projector 100. As shown in FIG. 16, a projecting / receiving unit of the lead pin inspection apparatus according to the present embodiment has one light emitting device 100 and four light receiving devices 112, 114, 116, 118, and a U-shaped support frame 120. It is formed integrally with. The four light receivers 112, 114, 116, 118 are used for the optical system 12
2 goes straight about in the center of the spot 124 focused by 2
It is located above the straight lines, XX 'and YY'. The IC package 104 to be inspected is placed between the optical system 122 and the plurality of light receivers 112, 114, 116, 118. Although the IC package 104 is placed on the transparent table 108, only the IC package 104 is shown here for simplification.

Now, the alignment direction of the lead pins 106 of the IC package 104 to be inspected is aligned with the YY 'direction, and the relative movement direction thereof is also the YY' direction (arrow direction in the figure). At this time, the light incident on the light receivers 112 and 114 is deflected in a direction perpendicular to the relative movement direction, and therefore can be regarded as vertically incident light on the lead pin 106. Further, the light incident on the light receivers 116 and 118 is deflected in the relative movement direction, so that the lead pin 106
Can be regarded as obliquely incident light.

As described above, by using the light emitting / receiving unit according to the present embodiment, the same function as using two vertical light emitting / receiving units and two oblique light emitting / receiving units can be obtained. You can Therefore, as shown in the third embodiment, it is possible to measure the positional deviation amount, the height deviation amount, the collective inclination amount, and the lost pin number of the lead pin 106.

Next, as an example of measurement in this embodiment,
The measurement of the lead pin bend will be described. As shown in FIG. 17, when the lead pin 106 having a bend of an angle α in the XX ′ direction is an object to be inspected, when the lead pin 106 moves from the Y direction to the Y ′ direction, the light incident on the photodetector 114 is detected by the lead pin A Although the light is blocked when reaching the point, the light entering the light receiver 112 is not blocked until the lead pin 106 reaches the point B. By utilizing this fact and detecting the distance between the points A and B using the relative speed detection sensor 23 and the distance detection sensor 24, the bend angle α of the lead pin and the disappearance of the pin can be calculated.

As described above, according to this embodiment, all the inspections of the lead pins can be performed by the light emitting / receiving unit which is composed of one light emitting unit and a plurality of light receiving units. Also, 1
Since a series of inspections can be performed with one light emitter / receiver unit, the installation space can be reduced. Further, since the distance between the four light receivers can be shortened, the moving distance of the lead pin at the time of inspection becomes short, and the inspection processing time can be shortened.

In the light emitter / receiver unit shown in FIG. 15, the light emitted from the light emitter 100 is directly received by the light receiver 110, but as shown in FIG. 18, a linear member 156 for transmitting light such as an optical fiber. It is also possible to provide a light receiving function by arranging a plurality of the above and further connecting the light receiver 110 to the end thereof. Further, as shown in FIG. 19, in front of a linear member 156 that transmits light, such as a light receiver or an optical fiber,
Mask 16 having fine holes 158 such as pinholes
By setting 0, the intensity of the received light may be adjusted or the entry of ambient light may be blocked to stabilize the light receiving function.

Further, in the projector / receiver unit shown in FIG. 15, the receivers 110 are arranged on the same circumference. However, as long as the light intensities are substantially equal, it is not limited to the circumference and other shapes such as ellipses. You may arrange | position on the outer periphery of a shape. Next, FIG. 20 shows an IC package lead pin inspection apparatus according to a fifth embodiment of the present invention.
The description will be made with reference to Nos. 24 to 24.

FIG. 20 is an explanatory view of the principle of this embodiment.
21 is a schematic diagram for explaining the lead pin inspection apparatus according to the present embodiment, and FIG. 22 is a block diagram showing a signal processing circuit of the lead pin inspection apparatus. 23 and 24 are operation explanatory views of the lead pin inspection device shown in FIG. In the above-described fourth embodiment, it has been shown that the lead pin inspection can be performed with one light emitting / receiving unit shown in FIG. The lead pin inspection apparatus of this embodiment utilizes the bidirectionality which is another advantage of the light emitter / receiver shown in FIG.

The principle of this embodiment will be described with reference to FIG. 20A shows the principle when the lead pin 106 moves from left to right, and FIG. 20B shows the principle when the lead pin 106 moves from right to left.
In addition, YY 'in the figure corresponds to the symbol of FIG.
When the lead pin 106 is moved from right to left, the receiver 1
The light entering 16 is blocked at the bottom edge B of the lead pin 106, and the light entering the light receiver 118 is blocked at the top edge A of the lead pin 106. When the lead pin is moved from left to right, the light incident on the light receiver 118 is blocked at the lower edge C point of the lead pin 106, and
The light incident on the light receiver 116 is blocked at the point D on the upper surface of the lead pin 106.

When inspecting the lead pin 106, it is desirable to unify the detection surface (upper surface or lower surface) of the lead pin 106. Therefore, when only one light receiver is provided in the Y-Y 'direction, the moving direction of the lead pin 106. Is limited to one direction from right to left or left to right. But,
By disposing two light receivers, the lead pin 106 can be moved in both left and right directions. However, in that case, the light receiver 116 or 1 which detects according to the moving direction
It is necessary to select 18. That is, when the upper surface of the lead pin 106 is used as the detection surface, the light receiver 118 is used to detect the point A when moving to the left, and the light receiver 116 is used to move the point D to move to the right. It should be detected.

The lead pin inspection apparatus according to this embodiment will be described with reference to FIG. 21A and 21B respectively show a top view and a side view of the lead pin device. On the slide guide 130 fixed to the base 128, a slide table 132 that moves left and right is provided. The slide table 132 has four light-emitter / receiver units 134, 13 for inspecting the lead pins 106.
6, 138, 140 are provided. It should be noted that the light emitter / receiver units 134, 136, 138, 140 are those shown in FIG. In addition, the light emitter / receiver units 134, 13
6, 138, 140 projectors 110 and receivers 112, 1
A work support base 152 for mounting the IC package 104 to be inspected is arranged between 14, 116 and 118.

The transfer robot 142 for carrying the IC package 104 is attached to the shaft column 144 fixed to the base 128 and rotates about the shaft column 144. Further, the transfer robot 142 is provided with four arms 146 having IC chucks 148 attached to the tip thereof and intersecting at right angles, and can simultaneously carry four IC packages 104.

Further, as shown in FIG.
4 can move up and down, and moves downward when gripping or releasing the IC package 104, and moves upward when rotating the transfer robot. The circuit configuration for processing the output signals of the projector / receiver units 134, 136, 138, 140 will be described with reference to FIG.

Time detection circuits 39 and 41 are respectively connected to the first vertical light receiver 112 and the second vertical light receiver 114 of each of the light emitter / receiver units. Further, the first oblique light receiver 116 and the second oblique light receiver 118 are connected to the time detection circuit 40 via the switch 162. The switch 162 functions to switch which of the light receivers 116 and 118 is connected to the time detection circuit 40 based on the switch signal.

Since the other points are the same as those in the third embodiment, description thereof will be omitted. Next, the operation of the lead pin inspection apparatus of this embodiment will be described with reference to FIGS. Figure 2
3 is a reciprocating slide table 132 for lead pin inspection
24 is a diagram showing the position of the lead pin when the IC package 104 is carried by the transfer robot 142.

Now, a square IC package 104 having lead pins on four sides as shown in FIG. 24 will be inspected. The IC package 104 is supplied to the supply stage 150 with the index mark 164 indicating the arrangement of the lead pin 106 at the lower left. Supply stage 15
The IC package 104 supplied to 0 is the transfer robot 1
It is carried to the point A of the work support base 152 by 42. Point A is located at a position 90 ° from the supply stage 150 with the shaft 144 of the transfer robot 142 as the center. That is, the IC package 104 supplied by the supply stage 150
Is rotated 90 ° by moving to point A, and the index mark 164 of the IC package 104 moves to the upper left.

In order to inspect the IC package 104 placed at the point A, the reciprocating slide table 132 at the position shown in FIG. 23A may be moved to the right. As a result, the I / O units 134 and 136 are used to
The lead pin inspection of the upper and lower two sides of the C package 104 is performed. That is, the first lead pin row 166 and the second lead pin row 168 are inspected by the light emitter / receiver units 134 and 136, respectively.

When the inspection at point A is completed, the IC package 104 is transferred to the work support table 15 by the transfer robot 142.
It is carried from the point A of 2 to the point B of the work support table 152. Similarly, the point B is located at a position 90 ° from the point A about the shaft 144 of the transfer robot 142. Therefore, the IC package 104 is further rotated 90 ° and the index mark moves to the upper right. Further, the first lead pin row 166 and the second lead pin row 168 inspected at the point A are on the right side and the left side of the IC package 104, respectively.

As a result of the above inspection, the reciprocating slide table 132 moves to the right side of the slide guide 130, and FIG.
As shown in (b), the emitter / receiver unit 1 is placed on the right side of the point B.
38 and 140 will be located. Therefore, in order to inspect the IC package 104 placed at the point B, the reciprocating slide table 132 may be moved leftward this time. Thereby, the light emitter / receiver units 138 and 140
Is used to inspect lead pins on the remaining two sides of the IC package 104. That is, the third lead pin row 170 and the fourth lead pin row 172 are inspected by the light emitter / receiver units 138 and 140, respectively.

As described above, when reversing the moving direction of the reciprocating slide table 130, it is necessary to switch the photodetectors 116 and 118 in the oblique direction, so that the time detector circuit 40 is switched by using the switch 162. Switch the light receiver in the diagonal direction to be connected. When the inspection at point B is completed,
The IC package 104 is carried from the point B of the work support table 152 to the take-out stage 154 by the transfer robot 142, and the inspection process is finished here.

Further, in the above series of procedures, the IC package 1 which is different at the points A and B of the work supporting base 152.
It is possible to test 04 at the same time. As described above, according to this embodiment, the set of the light emitting and receiving unit having one light emitting unit and the plurality of light receiving units fixes the moving direction with respect to the lead pin alignment direction by switching between the two oblique light receiving units. unnecessary. Therefore, when it is used as a lead pin inspection device as shown in FIG. 21, it is not necessary to return the reciprocating slide table 132 for each inspection, and the inspection time can be shortened.

Next, a position controller for controlling the relative positions of the two surfaces according to the sixth embodiment of the present invention will be described with reference to FIG. 25 (a) and 25 (b) are schematic views showing the arrangement of a pair of light emitters / receivers when two surfaces to be controlled are viewed from the side, and FIG. 25 (c) is a position control thereof. It is a time chart of the output signal of the light receiver of the device.

As shown in FIG. 25 (a), two planes A and B face each other in parallel at a certain distance. An optical system 60 to which, for example, a television camera is connected is fixed to the surface A.
The tip portion of 0 projects downward from the surface A by a distance d. Further, on the A surface, a projector 61 for irradiating spot light
However, it is fixed by inclining by an angle φ from the normal line standing on the A surface.

On the other B surface, a light receiver 62 for receiving the spot light is included in the plane formed by the optical axis of the projector 61 and the normal line standing on the B surface, and an angle φ from the normal line standing on the B surface. Only tilted and fixed. A stage 63 is attached to the lower surface of the B surface so that it can be moved only in the z-axis direction by a driving machine (not shown). Further, as shown in FIG. 25B, the distance between the A surface and the B surface of the projector 61 fixed to the A surface and the light receiver 62 fixed to the B surface is a predetermined distance D. The optical axes of the two are sometimes coincident with each other, and the spot light from the light projector 61 is arranged to be received by the light receiver 62. At this time, the distance from the front end of the optical system 60 to the B surface, that is, the working distance (focusing distance) f of the optical system 60 is f = D-d (24).

Therefore, when the stage 63 is moved in the z-axis direction by the driving device while the spotlight is being emitted from the projector 61, when the distance between the A surface and the B surface becomes D, As shown in FIG. 25C, the photodetector 62 outputs a predetermined detection signal. As described above, according to the sixth embodiment, the light projector 61 and the light receiver 62 are fixed to the A and B surfaces facing each other in parallel by an angle φ from the normal line standing on those surfaces, and at the same time, one of the two surfaces is fixed. By moving the B surface in the z-axis direction by the driving device, the spot light from the projector 61 is received by the light receiver 62 when the A surface and the B surface reach a predetermined distance D, and a predetermined detection signal is generated. Since it is output, the working distance f of the optical system 60 can be easily and accurately controlled. Further, by connecting the output of the light receiver 62 and the driving device and automatically stopping the movement in response to a predetermined detection signal, the optical system 60 can be automatically focused.

In the sixth embodiment, the driving machine moves the stage 63 only in the z-axis direction. However, if a driving machine that also moves in the x-axis direction and the y-axis direction is attached. Good. In this case, not only the automatic focusing of the optical system 60 but also the alignment of the optical system 60 and the observation target on the B surface in the x-axis direction and the y-axis direction can be performed. Further, the movement by such a driving machine is not limited to the B side, and the A side may be moved, or both sides may be moved together.

In the sixth embodiment, the light projector 61 is fixed to the surface A and the light receiver 62 is fixed to the surface B, but they may be mounted in reverse. Further, in the sixth embodiment, the case where the faces A and B face each other in parallel has been described, but the present invention can be applied to the case where the faces A and B are not parallel to each other. In this case, the distance D between the A surface and the B surface is not controlled, but the distance between the predetermined point in the A surface and the predetermined point in the B surface is controlled.

Further, it is desirable that the spot light emitted from the projector 61 is sufficiently narrowed down. Fig. 25 (b)
This is because the width of the predetermined detection signal output from the photodetector 62 shown in (1) becomes infinitely small, and thus the working distance f of the optical system 60 is controlled with high accuracy. Next, a position control device for controlling the relative positions of two surfaces according to the seventh embodiment of the present invention will be described with reference to FIGS. 26 and 27.

FIGS. 26 (a) and 26 (b) are schematic views showing the arrangement of three sets of light emitters / receivers when the two surfaces to be controlled are viewed from the side, and FIG. 27 shows the position control. It is a detection figure of the output signal of the light receiver of a device. As shown in FIG. 26A, two planes A and B face each other with a certain space, but they are not necessarily parallel to each other.
Further, the first to third light projectors 64, 65, 66 for irradiating the spot light are fixed to the surface A. Among them, the first light projector 64 is mounted vertically to the A surface, the second light projector 65 is mounted at an angle φ with respect to the normal line standing on the A surface, and the third light projector 66 is mounted on the A surface. It is attached at an angle ψ from the normal.

On the other surface B, first to third photodetectors 67, 68, 69 for receiving the spot light are provided, respectively.
It is fixed so as to face the third projectors 64, 65, 66. That is, the first light receiver 67 is mounted perpendicularly to the B surface, the second light receiver 68 is tilted by an angle φ from the normal to the B surface, and the third light receiver 69 is mounted on the B surface. It is attached at an angle ψ from the standing normal.

Further, a driving machine (not shown) for moving the position of the A surface or the B surface is provided, and by this driving machine,
It is arranged so that the distance formed by the A surface and the B surface and the facing angle formed by the A surface and the B surface can be changed. Then, the first to third projectors 64 and 6 fixed to the A surface
5, 66 and the first to third light receivers 6 fixed to the B surface
As shown in FIG. 16B, 7, 68 and 69 are
When the A surface and the B surface are parallel to each other and the distance between the A surface and the B surface becomes a predetermined distance D, the optical axes of the three sets of light emitters / receivers coincide with each other, and the first to third Floodlights 64, 65, 66
Spot light from the first to third light receivers 67, 68,
It is set to receive light by 69 respectively.

Therefore, the first to third projectors 64, 6
While irradiating the spot light from Nos. 5 and 66, the A plane or the B plane is moved by the driving machine to change the distance formed by the A plane and the B plane and the facing angle formed by the A plane and the B plane. When the A surface and the B surface are parallel to each other and the distance between the A surface and the B surface is a predetermined distance D, as shown in FIG. 27, the first to third light receivers 67 are provided. , 68, 69 respectively output predetermined detection signals.

As described above, according to the seventh embodiment, the first to third light projectors 64, 65 are provided on the facing surfaces A and B, respectively.
66 and first to third light receivers 67, 68, and 69 of three sets of light emitters / receivers are mounted in different directions, and the distance between the A surface and the B surface and the A surface and the B surface are set by the driver. By changing the face-to-face angle formed by A and B, and when the A and B surfaces become parallel and the distance between the A and B surfaces becomes a predetermined distance D, the first to third projectors 64 ,
The spot lights from 65 and 66 are the first to third photodetectors 6
Light is received by 7, 68, and 69, and a predetermined detection signal is output, so that it is possible to easily and accurately control the facing A and B surfaces to be in parallel positions with a predetermined distance D. You can Therefore, by connecting the respective outputs of the first to third light receivers 67, 68, 69 and the driving device, it is possible to automatically control the parallelism between the A surface and the B surface with a predetermined distance D. Become.

In the seventh embodiment, the first light projector 64 is perpendicular to the plane A, and the second light projector 65 is tilted by an angle φ from the normal line standing on the plane A to form the third light projector. 66 are inclined and fixed by an angle ψ with respect to the normal line to the A plane, and the first to third projectors 64, 65, 6 are also fixed.
The first to third light receivers 67, 68, 69 are fixed to the B surface relative to 6, but as shown in FIG. 28, for example,
Instead of the third projector 66 therein, the first projector 6
As in the case of 4, the third light projector 70 fixed perpendicularly to the A surface is used, and the third light receiver 6 is provided so as to face the third light projector 70.
Even if the third photodetector 71 is fixed vertically to the B surface instead of 9, the same effect can be obtained. This is because if the directions of at least two sets of the three sets of light emitters / receivers fixed at different positions are different, the relative positions of the A surface and the B surface can be determined.

In the seventh embodiment, the case has been described in which the A surface and the B surface are controlled so as to be parallel to each other. However, the mounting positions of the light emitter / receiver of the pair fixed to the A surface and the B surface have been described. And by adjusting the direction, A side and B
It is not limited to the case where the surfaces are parallel, but it is also possible to control so as to have a predetermined facing angle.

[0131]

As described above, according to the present invention, in a lead pin inspection apparatus for inspecting a plurality of lead pins arranged at a predetermined interval, a stage mounting a light emitting / receiving device or an object to be inspected by a driving means is installed. While moving in the alignment direction of the multiple lead pins, the light emitter / receiver illuminates the spot light on the alignment surface of the multiple lead pins at a predetermined angle, receives the spot light passing between the lead pins, and enters the light receiver. The time detecting means detects the transition time from the light state to the light blocking state or the transition time from the light blocking state to the light entering state, and based on the transition time, the displacement amount from the normal position of each lead pin or the number of lead pin defects is calculated. The defect can be determined by the defect determining unit based on the measured amount by the calculating unit and the amount of measurement.

As a result, it becomes possible to stably inspect defects such as positional deviation, height deviation, disappearance, and collective inclination of the lead pins at high speed, high accuracy, and low cost. Further, in a position control device that controls the relative positions of the first surface and the second surface facing each other, the position of the first surface to which the projector is fixed or the position of the second surface to which the light receiver is fixed is driven. By changing the first surface and the second surface so that the optical axes of the first surface and the second surface coincide with each other when the first surface and the second surface reach a predetermined relative position, Can be controlled to the target position.

This makes it possible to stably control the relative positions of two facing surfaces at high speed, with high accuracy, at low cost.

[Brief description of drawings]

FIG. 1 is a schematic diagram illustrating a lead pin inspection device for a brush that transmits a signal to a rotating shaft according to a first embodiment of the present invention.

FIG. 2 is a block diagram showing a circuit configuration for processing an output signal of an oblique light-shielding light receiver in the lead pin inspection device of FIG.

FIG. 3 is a time chart of output signals of the oblique light receiver in the lead pin inspection apparatus of FIG.

FIG. 4 is a time chart of output signals of the oblique light receiver in the lead pin inspection apparatus of FIG.

5 is a block diagram showing a circuit configuration for processing an output signal of the oblique light receiver in the first modified example of the lead pin inspection device of FIG. 1. FIG.

FIG. 6 is a block diagram showing a circuit configuration for processing an output signal of an oblique light receiver in a second modification of the lead pin inspection device of FIG.

FIG. 7 is a schematic view for explaining a brush lead pin inspection device for transmitting a signal to a rotating shaft according to a second embodiment of the present invention.

8 is a block diagram showing a circuit configuration for processing an output signal of a vertical photodetector in the lead pin inspection apparatus of FIG.

9 is a time chart of output signals of a vertical photodetector in the lead pin inspection device of FIG.

FIG. 10 is a diagram for explaining that it is desirable to irradiate the root portion of the lead pin with spot light when measuring the number m of lost pins of the lead pin.

FIG. 11 is a schematic diagram illustrating an IC package lead pin inspection apparatus according to a third embodiment of the present invention.

12 is a block diagram showing a circuit configuration for processing output signals of a vertical photodetector and an oblique photodetector in the lead pin inspection apparatus of FIG.

13 is a time chart of output signals of the vertical photodetector and the oblique photodetector in the lead pin inspection device of FIG.

14 is an enlarged plan view of a lead pin in the lead pin inspection apparatus of FIG.

FIG. 15 is a diagram for explaining the principle of the light emitter / receiver of the lead pin inspection apparatus according to the fourth embodiment of the present invention.

FIG. 16 is a schematic diagram for explaining the operation of the light emitter / receiver used in the lead pin inspection apparatus according to the fourth embodiment of the present invention.

FIG. 17 is a diagram for explaining a modified example of the light emitter / receiver of FIG.

FIG. 18 is a diagram for explaining a modified example of the light emitter / receiver of FIG. 15.

FIG. 19 is a diagram for explaining a process of inspecting the bending of the lead pin using the light emitter / receiver of FIG. 16;

FIG. 20 is a principle explanatory diagram of a lead pin inspection apparatus according to a fifth embodiment of the present invention.

FIG. 21 is a schematic diagram for explaining a lead pin inspection device according to a fifth embodiment of the present invention.

22 is a block diagram showing a circuit configuration for processing output signals of the vertical photodetector and the oblique photodetector in the lead pin inspection apparatus of FIG. 21.

FIG. 23 is a schematic view for explaining the operation of the reciprocating slide table in the lead pin inspection device of FIG. 21.

24 is a schematic diagram for explaining movement of the IC package in the lead pin inspection device of FIG. 21.

FIG. 25 is a schematic diagram for explaining a position control device according to a sixth embodiment of the present invention.

FIG. 26 is a schematic diagram for explaining a position control device according to a seventh embodiment of the present invention.

27 is a detection diagram of an output signal of a light receiver of the position control device of FIG. 26.

FIG. 28 is a schematic diagram for explaining a modified example of the position control device in FIG. 26.

FIG. 29 is a schematic diagram for explaining a conventional lead pin inspection method.

FIG. 30 is a schematic diagram for explaining a conventional lead pin inspection method.

FIG. 31 is a schematic diagram for explaining a conventional lead pin inspection method.

FIG. 32 is a schematic diagram for explaining a conventional position control method.

[Explanation of symbols]

 10i (i = 1, 2, ..., N) ... Plural lead pins 11 ... Brush 12 ... Transparent table 13 ... Oblique projector 14 ... Oblique receiver 15 ... Time detection circuit 16 ... Pin number counter 17 ... On / off time Counter 18 ... OFF / ON time counter 19 ... Height deviation amount calculation circuit 20 ... Lost pin number calculation circuit 21 ... Measured amount storage circuit 22 ... Defect determination circuit 23 ... Relative speed detection sensor 24 ... Distance detection sensor 25 ... ON / OFF Time distance counter 26 ... OFF / ON time distance counter 27 ... Vertical light emitter 28 ... Vertical light receiver 29 ... Position shift amount calculation circuit 30i (i = 1, 2, ..., N) ... Plural lead pins 31 ... IC package 32 ... Transparent Table 33 ... First vertical projector 34 ... Oblique projector 35 ... Second vertical projector 36 ... First vertical receiver 37 ... Oblique receiver 38 ... Second vertical receiver 39, 40, 41 ... Time detection circuit 42 ... Pin number counter 43 ... ON / OFF time counter 44 ... ON / OFF time counter 45 ... ON / OFF time counter 46 ... OFF / ON time counter 47 ... Position shift amount calculation circuit 48 ... Height deviation amount calculation circuit 49 ... Inclination amount calculation circuit 50 ... Loss pin number calculation circuit 51 ... Count amount storage circuit 52 ... Defect determination circuit 60 ... Optical system 61 ... Emitter 62 ... Photoreceiver 63 ... Stage 64 ... First Projector 65 ... Second projector 66 ... Third projector 67 ... First light receiver 68 ... Second light receiver 69 ... Third light receiver 70 ... Third light emitter 71 ... Third light receiver 80i ( i = 1, 2, ..., N) ... Plural lead pins 81 ... IC package 82 ... CCD camera 83 ... Displacement sensor 84 ... Light emitting device 85 ... Light receiving device 86 ... Laser length measuring device 87 ... Reflective mirror 100 ... Projector 102 ... Lens 104 ... IC package 106 ... Lead pin 108 ... Transparent table 110 ... Photoreceiver 112 ... Photoreceiver 114 ... Photoreceiver 116 ... Photoreceiver 118 ... Photoreceiver 120 ... Support frame 122 ... Optical system 124 ... Spot 126 ... Lead pin 128 ... Base 130 ... Slide guide 132 ... Reciprocating slide table 134 ... Emitter / receiver unit 136 ... Emitter / receiver unit 138 ... Emitter / receiver unit 140 ... Emitter / receiver unit 142 ... Transfer robot 144 ... Shaft column 146 ... Arm 148 ... IC chuck 150 ... Supply stage 152 ... Work support 154 ... Extraction stage 156 ... Optical fiber 158 ... Fine hole 160 ... Mask 162 ... Switcher 164 ... Index mark 166 ... First lead pin row 168 ... 2 of the lead pin rows 170 ... third lead pin rows 172 ... fourth lead pin column

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Taketoshi Araya 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Automation Limited (72) Kouji Arai, 1015 Kamiodanaka, Nakahara-ku, Kawasaki, Kanagawa Fujitsu Automation Ceremony In-house (72) Inventor Katsuhisa Kamazono 1015 Kamiodanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Fujitsu Automation Company

Claims (17)

[Claims] 1. A lead pin inspection apparatus for inspecting a plurality of lead pins arranged at a predetermined interval, comprising: a stage on which an object to be inspected having a plurality of lead pins is mounted; and a predetermined angle on an alignment surface of the plurality of lead pins. An emitter and a receiver for receiving spot light from the projector that has passed between the plurality of lead pins, and an aligning direction of the plurality of lead pins for the emitter and receiver or the stage. Driving means for moving the light-receiving device to the light-receiving device, a relative speed detecting device for detecting a relative moving speed of the light-emitter / receiver and the stage by the driving device, and a transition time from the light-entering state to the light-shielding state of the light-receiving device or the light-shielding state. The time detection means for detecting the transition time from the state to the light entering state, the speed signal from the relative speed detection means and the time detection means. Based on the transition time detected by the calculation means for calculating the displacement amount of each lead pin from the normal position or the number of defects of the lead pin, and the displacement amount of each lead pin or the number of defects of the lead pin measured by the calculation means. A lead pin inspection device, comprising: a defect determining unit that determines whether or not there is a defect in the plurality of lead pins. 2. The lead pin inspection apparatus according to claim 1, wherein, instead of the drive means and the relative speed detection means, the light emitter / receiver or the stage is moved at a constant speed in the alignment direction of the plurality of lead pins. A lead pin inspection device having a drive unit, wherein the calculation unit measures the amount of displacement of each lead pin from a normal position or the number of missing lead pins based on the transition time detected by the time detection unit. . 3. The lead pin inspection apparatus according to claim 1, wherein, instead of the relative speed detection means, a distance from a predetermined reference position of the plurality of lead pins to a pin to be inspected to which the projector emits spot light. A distance detection means for detecting, the calculation means, based on the distance signal from the distance detection means and the transition time detected by the time detection means, the displacement amount of each lead pin from the normal position or the lead pin A lead pin inspection device characterized by measuring the number of defects. 4. The lead pin inspection apparatus according to claim 1, further comprising a measurement amount storage unit that stores the displacement amount of each lead pin or the number of lead pin defects measured by the calculation unit. Lead pin inspection device. 5. The lead pin inspection device according to claim 1, wherein the light projector is installed so that the tip end portions of the plurality of lead pins are obliquely irradiated to the alignment surfaces of the plurality of lead pins. A lead pin inspection device characterized by measuring a positional deviation amount and the number of lost pins of each lead pin among the plurality of lead pins, or a height deviation amount and the number of lost pins of each lead pin. 6. The lead pin inspection apparatus according to claim 1, wherein the light projecting unit irradiates the roots of the plurality of lead pins substantially perpendicularly to the alignment surfaces of the plurality of lead pins. A lead pin inspection device, which is installed and measures the number of lost pins in the plurality of lead pins. 7. The lead pin inspection apparatus according to claim 1, wherein the light emitter / receiver irradiates the tip end portions of the plurality of lead pins substantially perpendicularly to an alignment surface of the plurality of lead pins. It has the 1st light emitter / receiver and the 2nd light emitter / receiver which irradiates the tip part of the above-mentioned lead pins diagonally to the alignment surface of the above-mentioned lead pins. A lead pin inspection device characterized by measuring a positional deviation amount and a height deviation amount. 8. The lead pin inspection device according to claim 1, wherein the light emitter / receiver irradiates the tip end portions of the plurality of lead pins substantially perpendicularly to an alignment surface of the plurality of lead pins. It has the 1st light emitter / receiver and the 2nd light emitter / receiver which irradiates the root part of the plurality of lead pins almost perpendicularly to the alignment surface of the plurality of lead pins, and the plurality of lead pins are collectively. A lead pin inspection device characterized by measuring the amount of inclination in the alignment direction. 9. The lead pin inspection apparatus according to claim 1, wherein the light projecting / receiving device projects a light projecting light to an alignment surface of the plurality of lead pins, and collects light emitted from the light projecting device. Then, an optical system for irradiating a spot light of a predetermined size at a predetermined position, arranged near the outer diameter of the spot light, emitted from the projector, at different angles with respect to the alignment surface of the plurality of lead pins. A lead pin inspection device having a plurality of light receivers for receiving light to be emitted. 10. The lead pin inspection apparatus according to claim 9, wherein linear members that transmit light are provided on the front surfaces of the plurality of light receivers, respectively. 11. The lead pin inspection apparatus according to claim 9, wherein a mask having fine holes for transmitting light from the projector is formed on the front surface of the light receiver. 12. The lead pin inspection apparatus according to claim 10, wherein a mask having fine holes for transmitting light from the light projector is provided on the front surface of the linear member for transmitting light. Lead pin inspection device 13. The lead pin inspection apparatus according to claim 9, wherein the intensity of light emitted from the light projector is substantially equal on a straight line that intersects at a right angle at approximately the center of the spot light. Lead pin inspection device characterized in that the plurality of light receivers are arranged at positions 14. A position control device for controlling a relative position between a first surface and a second surface facing each other, wherein a projector is fixed to the first surface, and the projector is installed on the second surface. A light receiver fixed so that the optical axes thereof coincide with each other when the first surface and the second surface have a predetermined relative position, and a position of the first surface or the second surface. Driving means for changing the relative positions of the first and second surfaces by the driving means, and aligning the optical axes of the light projector and the light receiver, thereby the first surface And a position control device that controls the second surface to a predetermined relative position. 15. The position control device according to claim 14, wherein the drive unit moves the first surface or the second surface in a predetermined direction so as to change a distance between the first surface and the second surface. Drive means for moving the first surface to the first surface by changing the relative position of the first and second surfaces by the driving means and aligning the optical axes of the light projector and the light receiver. The position control device is characterized in that the distance between the predetermined point on the second surface and the predetermined point on the second surface is controlled to a predetermined distance. 16. The position control device according to claim 15, wherein the first surface and the second surface are two surfaces that face each other in parallel, and the first and second surfaces are driven by the driving unit. And the optical axes of the light projector and the light receiver are made to coincide with each other, whereby the distance between the first surface and the second surface is controlled to a predetermined distance. Position control device. 17. The position control device according to claim 14, wherein the light emitter comprises at least three light emitters having optical axes in different directions, and the light receiver comprises at least three light emitters corresponding to the at least three light emitters. It is composed of a plurality of light receivers, and the drive means is a drive means for changing a distance and an angle formed by the first surface and the second surface, the drive means changing the distance between the first surface and the second surface. By changing the relative position of each of the light sources so that the optical axes of the at least three light emitters and the at least three light receivers respectively coincide with each other, and thereby the distance and the angle formed by the first surface and the second surface. A position control device for controlling the distance to a predetermined distance and angle.