JPS62260685A - Package of electronic part with large number of pin - Google Patents

Package of electronic part with large number of pin

Info

Publication number
JPS62260685A
JPS62260685A JP61097981A JP9798186A JPS62260685A JP S62260685 A JPS62260685 A JP S62260685A JP 61097981 A JP61097981 A JP 61097981A JP 9798186 A JP9798186 A JP 9798186A JP S62260685 A JPS62260685 A JP S62260685A
Authority
JP
Japan
Prior art keywords
film
package
foam sheet
less
electrical resistivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61097981A
Other languages
Japanese (ja)
Inventor
英二 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP61097981A priority Critical patent/JPS62260685A/en
Publication of JPS62260685A publication Critical patent/JPS62260685A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 (産業上の利用分野〕 本発明は、ICなどの多数のピン状接続端子を有し、静
電気障害を受は易い電子部品の包装体lご関し、特に比
較的少数の部品を個々に包装するのに適した包装体に関
するものである。
[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to packages for electronic components such as ICs that have a large number of pin-shaped connection terminals and are easily susceptible to electrostatic damage, The present invention relates to a packaging body suitable for individually packaging parts of.

〔従来の技術〕[Conventional technology]

ICなどの多数のピン状喘子を有する電子部品の包装に
は、ぞの形状に合わせた硬質のマガジンヤ)]ヘレーそ
の仙の成形容器類が用いられることが多い。しかし、こ
れらは特定の形状をもった個別の部品に合わせて作られ
る容器で、少数少量の種々な形状の部品の包装には適し
ていない。少数少量で種々の形状のものを包装する場合
、軟質の小袋が用いられるが、小袋はピンにより破れ易
くx緩衝性に欠ける欠点かあった。又、導電性の発泡体
の小片に部品のピンを刺し、これをアルミ箔で包む方法
が末端使用者ではよく行われていたが、アルミ箔は高価
で、不透明で内容物が見えず、又解装後頁包装しても判
別できないので製造者の責任が不明確になるなどの欠点
があった。
For packaging electronic components such as ICs that have a large number of pin-like pins, molded containers made of hard magazines that match the shape of the pins are often used. However, these containers are made to fit individual parts with specific shapes, and are not suitable for packaging small quantities of parts of various shapes. When packaging items of various shapes in small quantities, soft pouches are used, but pouches have the drawback of being easily torn by pins and lacking in cushioning properties. In addition, it was common for end users to stick component pins into small pieces of conductive foam and wrap them in aluminum foil, but aluminum foil is expensive, opaque, and does not allow the contents to be seen. There were drawbacks such as the manufacturer's responsibility being unclear because it could not be identified even if the page was packaged after being unpacked.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

本発明は上記のような現状を改良する為になされたもの
で、少量多品種の部品を、静電気および機械的外力から
保護し、個別に包装したままで外部から識別でき、しか
も識別のために包装をほどく必要がなく、製造者が包装
した状態のままで使用者までミスなく流通できる包装体
を提供することを目的とするものである。
The present invention has been made in order to improve the current state of affairs as described above, and it is possible to protect a large variety of parts in small quantities from static electricity and external mechanical forces, and to make it possible to identify them from the outside while individually packaged. The object of the present invention is to provide a package that does not require unwrapping and can be distributed to users without any errors in the state it was packaged by the manufacturer.

(問題点を解決するための手段) 上記の目的は、以下のような手段で解決できる。(Means for solving problems) The above objective can be achieved by the following means.

表面電気抵抗率が107オーム以下のプラスチック発泡
体シートの小片又は表面電気抵抗率が107オーム以下
の導電フィルムをプラスデック発泡体シートに積層した
積層発泡体シートの小片の表面電気抵抗率が107オー
ム以下の面に、電子部品類のピンを突き剌してピン同志
を電気的に連結させ部品と発泡体とを固定したものを更
に表面電気抵抗率が1010オーム以下で透視可能な導
電フィルムで外表面を被装する。この場合、フィルムは
あらかじめ製袋したものではなく、ピンを突き剌して部
品を固定した発泡体小片の外周に筒状に巻きつ(プて、
筒がほどけない手段を講じるだ(プでよい。筒状に巻い
たフィルムの両端部をツイストしてほどけないように止
めた包装体は、簡便安価で特に望ましいものである。又
ツイストしてとめる他に、筒状に巻きつ(プた両端を熱
シールしてとめた包装体は、一旦包装を開くと同じ4A
利を用いて再包装することができなくなるので、製造者
の責任を明確にする目的には特に有用である。また、上
記の包装体は、いずれも筒の縦方向のフィルムの継ぎ目
を熱シールすることなく単に重ね合わせるだけにしであ
るから、仝休としてフレキシブルな包装 3一 体となり、フィルムが外力を受けた際に破損しにくくな
る利点がある。又、発泡体の形状を長方形とし、角を鈍
角におとしたもの、あるいは角を丸めた形状としたもの
は、外装するフィルムに余分な力を集中させることを少
なくするので、特に望ましい。又フィルムとして熱収縮
性のものを用いて、上記のようなツイスト或いは熱融合
した包装体をつくり、更にこれを加熱してフィルムを収
縮させた包装体は、フィルムが部品表面に密着して部品
表面の文字等の透視確認が容易になり、外観を美しくし
、包装体の余分な体積を減少させて効率を高上させるこ
とができ、更に間装すると再び同じ材わ1では包装でき
なくなるので、製造者の責任を明確にできる等の利点が
あり、特に望ましい。
A small piece of plastic foam sheet with a surface electrical resistivity of 107 ohms or less, or a small piece of a laminated foam sheet made by laminating a conductive film with a surface electrical resistivity of 107 ohm or less on a Plusdec foam sheet, has a surface electrical resistivity of 107 ohm. The pins of electronic components are inserted into the following surface to electrically connect the pins to fix the component and the foam, and the surface is further covered with a transparent conductive film with a surface electrical resistivity of 1010 ohms or less. Coat the surface. In this case, the film is not made into a bag in advance, but is wrapped in a cylindrical shape around the outer circumference of a small piece of foam to which the parts are fixed using pins.
Take measures to prevent the tube from unraveling.A package in which both ends of a cylindrical film are twisted to prevent it from unraveling is particularly desirable as it is simple and inexpensive. In addition, a package that is wrapped into a cylindrical shape and heat-sealed at both ends can be used as a cylindrical package.
This is particularly useful for the purpose of clarifying the liability of the manufacturer, as it will no longer be possible to repackage using the product. In addition, in all of the above packaging bodies, the longitudinal film seams of the cylinder are simply overlapped without heat sealing, so the packaging is flexible and can be wrapped in one piece, and when the film is subjected to external force. has the advantage of being less likely to be damaged. In addition, it is particularly desirable that the foam has a rectangular shape with obtuse corners or rounded corners, since this reduces the concentration of excess force on the exterior film. In addition, in a package in which a heat-shrinkable film is used to create a twisted or heat-fused package as described above, and the film is further heated to shrink the film, the film adheres to the surface of the part and the part This makes it easier to see through the text on the surface, improves the appearance, reduces excess volume of the package, and improves efficiency.Furthermore, when it is interleaved, it can no longer be packaged with the same material 1 again. This is especially desirable since it has the advantage of making it possible to clarify the responsibility of the manufacturer.

本発明に用いる発泡体シートは、カーボンブラック等の
導電性フィラーを分′散させたポリウレタン、ポリエチ
レン等の発泡体シート、又は導電フィルムを表面に積層
した積層発泡体のシートが用いられる。ピンを刺すシー
ト面の表面電気抵抗率は107オーム以下であることを
要し、そ゛うでないものは、ピンを剌しても十分な保護
回路として鋤か1、【い。発泡体シートの厚みはピンの
長さより若干厚いものが望ましく、5ミリのピンを有す
る部品では6乃至10ミリ程度の厚みのシーi〜がよい
。発泡体片の大きさは、部品1個又は数個を並べて固定
した場合c、l外縁に3〜10ミリ程度の余りがある大
きさがよい。発泡体片は、長方形にカットしたものを用
意すると、包装体がほぼ長方形に仕上がるので好都合で
あり、特に角を鈍角にカットするか角を丸めた形にする
と、ツイストした包装体の仕上り形状が良く、ツイスト
以外の包装体の場合□にも角で包装体が破損することが
少なくなり、特に望ましい。発泡体の材質は、上に例示
したちの以外にも種々の樹脂類の配合物の発泡体が用い
得るが、軟質乃至半硬質の発泡体がよい。フィルムは表
面電気抵抗率が1010オーム以下であることを要し、
透視可能でなければならない。1010オーム以下でな
いものは、包装体外部から加えられる静電気の作用から
、内容物を十分に保護することができない。この包装体
用に特に望ましいフィルムとしでは、プラスチックフィ
ルムの表面に、カーボンブラックとバインダーを含む導
電性塗料を]−トした薄膜層を設け、さらにその上に薄
い保護]−ト層を設けて成る透視可能な導電性フィルム
(特開昭60−214945号公報)がある。このもの
は、表面電気抵抗率を1010オーム以下にすることが
可能であり、該保護]−ト層により表面の滑りが良好で
あるために包装の作業性がよく、カーボンの脱落にJ:
る被包装物汚染の心配がなく、又基材として熱収縮性の
フィルムを用いると、導電性の熱収縮性フィルムを得る
ことができるので、熱収縮させた包装体を得る為には特
に望ましい等の特徴を有している。又、ポリエステルフ
ィルム、ポリプロピレンフィルム等の薄い基材フィルム
に金属を透視出来る程度に極めて薄く蒸着等によって]
−トした導電性のフィルム、及び金属の上に更に薄い保
護]−トを行った導電1ノ1のフィルムも、好適に用い
ることができる。
The foam sheet used in the present invention is a foam sheet of polyurethane, polyethylene, etc. in which a conductive filler such as carbon black is dispersed, or a laminated foam sheet with a conductive film laminated on the surface. The surface electrical resistivity of the sheet surface to be pierced with a pin must be 107 ohms or less, and if it is not, a spade or 1 is used as a sufficient protective circuit even if the pin is pierced. The thickness of the foam sheet is preferably slightly thicker than the length of the pin, and for parts with 5 mm pins, the thickness of the foam sheet is preferably about 6 to 10 mm. The size of the foam piece is preferably such that when one or several parts are fixed side by side, there is a surplus of about 3 to 10 mm at the outer edge. It is advantageous to cut the foam pieces into rectangular shapes, as this will result in a nearly rectangular package; in particular, cutting the corners at obtuse angles or rounding them will improve the finished shape of the twisted package. In the case of a package other than a twist, the package is less likely to be damaged at the corners, which is particularly desirable. As for the material of the foam, foams made of various resin compounds other than those exemplified above can be used, but soft to semi-rigid foams are preferable. The film must have a surface electrical resistivity of 1010 ohms or less,
Must be transparent. If the resistance is less than 1010 ohms, the contents cannot be sufficiently protected from the effects of static electricity applied from outside the package. A particularly desirable film for this packaging comprises a plastic film with a thin layer of conductive paint containing carbon black and a binder on the surface, and a thin protective layer on top of that. There is a transparent conductive film (Japanese Unexamined Patent Publication No. 60-214945). This product can have a surface electrical resistivity of 1010 ohms or less, and the protective layer provides good surface slippage, making it easy to package and prevent carbon from falling off.
This method is particularly desirable for obtaining heat-shrinkable packages because there is no need to worry about contaminating the packaged objects, and when a heat-shrinkable film is used as a base material, a conductive heat-shrinkable film can be obtained. It has the following characteristics. Also, by vapor deposition, etc., the metal is made extremely thin to the extent that the metal can be seen through a thin base film such as a polyester film or a polypropylene film]
A coated conductive film and a conductive film coated with a thin layer of protection on the metal can also be suitably used.

表面電気抵抗率の測定は以下の方法で行った。The surface electrical resistivity was measured by the following method.

幅10m、長さ30m以上の短冊形の試料を用意し、平
置した試料に直角に、10mmの間隔をあけて幅10M
の短冊形の導電ゴム製電極2個を接触させて、電極間の
抵抗を測定し、この値を電極間にはさまれた10#X1
0#の正方形の表面抵抗、即ち表面電気抵抗率とした。
Prepare a rectangular sample with a width of 10 m and a length of 30 m or more, and place it at right angles to the flat sample with an interval of 10 mm.
Two rectangular conductive rubber electrodes are brought into contact, the resistance between the electrodes is measured, and this value is calculated from the 10#
It was defined as the surface resistance of a 0# square, that is, the surface electrical resistivity.

〔実施例〕〔Example〕

以下実施例で本発明を説明する。 The present invention will be explained below with reference to Examples.

実施例1 密度0.03Kg/矛、厚み6Mのポリエヂ
レン発泡体シーi−と、厚み16ミクロンの二軸延伸ポ
リスヂレンフイルムの片面に、カーボンブラックを含有
した導電塗料を塗布し、その上に滑剤としてポリエチレ
ンワックスを含むアクリル樹脂系の保護]−1〜を博く
施した、表面電気抵抗率が8×刊4オームの導電性フィ
ルムを積層接着した積層発泡体シートを、幅25mm、
長さ50朧の長方形に切る。次に、この角を11mm落
し、鈍角とした該小片の導電性の面に、本体12mmX
32mm、厚み4彪、DTP形に2列24本の長さ5面
のピンを有するICを、はぼ中央部においてピンを刺し
込み固定する。これを厚み16ミクロンの二軸延伸ポリ
スチレンフィルムの片面に、カーボンブラックを含有し
た導電塗料を極めて薄く塗布し、その上に、滑剤として
ポリエチレンワックスを含むアクリル樹脂系の保護]−
1・を薄く施した、表面電気抵抗率が6×105オーム
の透視できる導電性フィルムを110#X 70mの長
方形に切ったもので、発泡体片の長手方向とフィルムの
長手方向を一致させて発泡体片をフィルムのほぼ中央に
おいてフィルムで筒状に包み、両端をライス1−シ゛て
第1図、第2図および第3図に示したような包装体を得
た。
Example 1 A conductive paint containing carbon black was coated on one side of a polyethylene foam sheet with a density of 0.03 kg/lack and a thickness of 6 M, and a biaxially stretched polystyrene film with a thickness of 16 microns, and then Acrylic resin protection containing polyethylene wax as a lubricant] A laminated foam sheet laminated and bonded with a conductive film having a surface electrical resistivity of 8 x 4 ohms and subjected to -1~ was 25 mm wide,
Cut into rectangles 50mm long. Next, this corner was lowered by 11 mm, and the main body 12 mm
A DTP-shaped IC with a diameter of 32 mm and a thickness of 4 square meters and having 2 rows of 24 pins with a length of 5 sides is fixed by inserting the pins into the center of the rib. This is coated on one side of a biaxially stretched polystyrene film with a thickness of 16 microns with an extremely thin layer of conductive paint containing carbon black, and then an acrylic resin-based protection containing polyethylene wax as a lubricant is applied on top of it.
1. A transparent conductive film with a surface electrical resistivity of 6 x 105 ohms, coated with The foam piece was wrapped in a cylindrical shape with a film at approximately the center of the film, and both ends were wrapped with rice 1-seam to obtain a package as shown in FIGS. 1, 2, and 3.

ICは積層導電フィルム(4)にピン(2)を剌して回
路的に保護され、更に導電フィルム(3)で外周の静電
界から保護され、又発泡体(5)で緩衝されていた。T
C面の文字は包装体の外から容易に識別されたので、確
認のために包装を開く必要はなかった。ツイスト部分(
6)は導電フィルム(3)がほど(プるのを防止しまた
横方向からの外力に対しての緩衝の効果を有していた。
The IC was circuit-protected by placing a pin (2) on a laminated conductive film (4), was further protected from an electrostatic field around the periphery by a conductive film (3), and was buffered by a foam (5). T
The letters on side C were easily discernible from outside the package, so there was no need to open the package for confirmation. Twist part (
6) had the effect of preventing the conductive film (3) from unraveling and of buffering against external forces from the lateral direction.

実施例2 実施例1の導電フィルムの寸法を70#X7
0Mとして、フィルムで筒状に包んだ後、両端を熱シー
ルして、第4図および第5図に示したような包装体を得
た。
Example 2 The dimensions of the conductive film of Example 1 were 70#X7
After wrapping the product in a cylindrical shape with a film as 0M, both ends were heat-sealed to obtain a package as shown in FIGS. 4 and 5.

実施例3 実施例1および実施例2の包装体の上方から
、120’Cの加熱空気流を短時間あてて、包装体の上
面のフィルムを収縮させた。収縮後の包装体は、文字の
識別がより容易になり、美観が増した。又、両端部をラ
イス1〜した後収縮さ−Vた包装体は、フィルムを破ら
ないとライス1〜部分をほどくことはできなくなった。
Example 3 A stream of heated air at 120'C was applied from above the packages of Examples 1 and 2 for a short period of time to shrink the film on the top surface of the packages. After shrinking, the packaging became easier to identify characters and had an improved aesthetic appearance. In addition, after the both ends of the package were shrunk, the rice portion could no longer be unraveled without tearing the film.

〔発明の効果〕〔Effect of the invention〕

以上説明した通り、本発明の包装体は、特定の導電性の
発泡体シートと特定の透視できる導電フィルムを組み合
わせた包装体で、静電気障害防1トについて端子間の短
絡及び外部静電界の遮蔽の両面から被包装物を保護し、
小単位の包装であり包装のままで内部を確認できる為に
、使用時まで包装をほどく必要がなく、製造者の責任範
囲が明確になり、包装方法が簡便で多品種小母の部品の
包装にも適し、緩衝性が良く取扱に余分な注意を要しな
い等の有用な効果を有している。
As explained above, the package of the present invention is a package that combines a specific conductive foam sheet and a specific transparent conductive film, and is designed to prevent short circuits between terminals and shield external electrostatic fields in order to prevent electrostatic damage. Protects the packaged item from both sides,
Because it is a small-unit package and the inside can be checked without leaving the package, there is no need to unwrap the package until use, making the scope of the manufacturer's responsibility clear, and the packaging method is simple, making it suitable for packaging a wide variety of small parts. It has useful effects such as good cushioning properties and no need for extra care in handling.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は、本発明の包装体の一例(実施例1)を側視し
た図である。 第2図は第1図のa、 a’平面の断面を示した図であ
る。 第3図は第1図の包装体を上方から見た図である。 第4図は本発明の包装体の他の一例(実施例2)を側視
した図である。 第5図は第4図の包装体を上方から見た図である。 特許出願人 旭化成工業株式会社 代理人 弁理士 野 崎 鋏 也 第1図 (1)IC本体 (2)ピン (3)導電フィルム (4)ポリエチレン発泡体に積層した導電フィルム(5
)ポリエチレン発泡体 (6)ツイストした端部 第2図 (fl (1)IC本体 (2)ピン (311電フイルム (4)ポリエチレン発泡体に@層したS電フィルム(5
)ポリエチレン発泡体 (7)ilXフィルムの重なり合った部分第3図 (2)ピン (3)導電フィルム (6)ツイストした端部 (8)積層発泡体 (9)角をカットして鈍角にした部分 (io) I C上面の表示文字 第4図 (1)IC本体 (2)ピン (3)導電フィルム (4)ポリエチレン発泡体に積層した導電フィルム(5
)ポリエチレン発泡体 (11)ヒートシールした端部 第5図 (1)IC本体 (2)ピン (3)l電フィルム (8)積層発泡体 (9)角をカットして鈍角にした部分 (10) I C上面の表示文字 (11)ヒートシールした端部
FIG. 1 is a side view of an example of the package of the present invention (Example 1). FIG. 2 is a cross-sectional view taken along plane a and a' of FIG. 1. FIG. 3 is a top view of the package shown in FIG. 1. FIG. 4 is a side view of another example (Example 2) of the package of the present invention. FIG. 5 is a top view of the package shown in FIG. 4. Patent Applicant Asahi Kasei Industries Co., Ltd. Agent Patent Attorney Kazuya Nozaki Figure 1 (1) IC body (2) Pin (3) Conductive film (4) Conductive film laminated on polyethylene foam (5)
) Polyethylene foam (6) Twisted end Figure 2 (fl (1) IC body (2) Pin (311 electric film (4) S electric film layered on polyethylene foam (5
) Polyethylene foam (7) Overlapping portion of ilX film Figure 3 (2) Pin (3) Conductive film (6) Twisted end (8) Laminated foam (9) Corner cut to make obtuse angle (io) Display characters on top of IC Figure 4 (1) IC body (2) Pin (3) Conductive film (4) Conductive film laminated on polyethylene foam (5
) Polyethylene foam (11) Heat-sealed end Figure 5 (1) IC body (2) Pin (3) Electrical film (8) Laminated foam (9) Corner cut to make obtuse angle (10 ) Indication characters on top of IC (11) Heat-sealed edges

Claims (1)

【特許請求の範囲】 1 表面電気抵抗率が10^7オーム以下のプラスチッ
ク発泡体シートの小片、又は表面電気抵抗率が10^7
オーム以下の導電フィルムを積層した積層発泡体シート
の小片の表面電気抵抗率が10^7オーム以下の面に、
電子部品のピンを突き剌して固定したものを、表面電気
抵抗率が10^1^0オーム以下の透視可能な導電プラ
スチックフィルムで外表面を個別に被装したことを特徴
とする多数のピンを有する電子部品の包装体。 2 発泡体シートの小片が長方形で角を鈍角にカットす
るか角を丸めた形であることを特徴とする特許請求の範
囲第1項記載の包装体。 3 電子部品のピンを突き剌して固定した発泡体シート
の小片にフィルムを巻きつけて両端部をツイストしてと
めたことを特徴とする特許請求の範囲第1項又は第2項
記載の包装体。 4 電子部品のピンを突き剌して固定した発泡体シート
の小片にフィルムを巻きつけて両端部を熱融着させてと
めたことを特徴とする特許請求の範囲第1項又は第2項
記載の包装体。 5 ツイスト又は熱融着の後、加熱してフィルムを収縮
させたことを特徴とする特許請求の範囲第3項又は第4
項記載の包装体。
[Scope of Claims] 1. A small piece of a plastic foam sheet with a surface electrical resistivity of 10^7 ohm or less, or a small piece of a plastic foam sheet with a surface electrical resistivity of 10^7 ohm or less.
A small piece of laminated foam sheet laminated with a conductive film of ohm or less has a surface electrical resistivity of 10^7 ohm or less,
A large number of pins that are made by stably fixing the pins of an electronic component and individually covering the outer surface with a transparent conductive plastic film with a surface electrical resistivity of 10^1^0 ohm or less. A packaging body for electronic components. 2. The package according to claim 1, wherein the small pieces of the foam sheet are rectangular and have obtusely cut corners or rounded corners. 3. The package according to claim 1 or 2, characterized in that the film is wrapped around a small piece of a foam sheet secured by a pin of an electronic component, and the both ends are twisted. body. 4. Claim 1 or 2, characterized in that the film is wrapped around a small piece of a foam sheet that is fixed by pushing a pin of an electronic component, and the ends are heat-sealed. packaging. 5. Claim 3 or 4, characterized in that the film is shrunk by heating after twisting or heat-sealing.
Packaging as described in section.
JP61097981A 1986-04-30 1986-04-30 Package of electronic part with large number of pin Pending JPS62260685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61097981A JPS62260685A (en) 1986-04-30 1986-04-30 Package of electronic part with large number of pin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61097981A JPS62260685A (en) 1986-04-30 1986-04-30 Package of electronic part with large number of pin

Publications (1)

Publication Number Publication Date
JPS62260685A true JPS62260685A (en) 1987-11-12

Family

ID=14206841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61097981A Pending JPS62260685A (en) 1986-04-30 1986-04-30 Package of electronic part with large number of pin

Country Status (1)

Country Link
JP (1) JPS62260685A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01153472A (en) * 1987-11-27 1989-06-15 Matsushita Electric Ind Co Ltd Packing method of liquid crystal display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01153472A (en) * 1987-11-27 1989-06-15 Matsushita Electric Ind Co Ltd Packing method of liquid crystal display device

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