JPS62287873A - Cushioning package of electronic part with large number of pin - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

Detailed Description of the Invention 3. Detailed Description of the Invention [Industrial Application Field] The present invention is directed to the buffering of electronic components such as ICs, which have a large number of pin-shaped connection terminals and are susceptible to electrostatic damage. This invention relates to a package and its method of use.

[Conventional technology and its problems]

Magazines, trays, etc., which are hard molded containers that match the shape of ICs, are used to package electronic components that have a large number of pins and are easily susceptible to static electricity damage.
Although these are suitable for packaging large quantities of parts of the same shape, they are not suitable for packaging small quantities of parts of a wide variety. Flexible bags have been used as packaging bodies that can be adapted to parts of various shapes, but they lack cushioning properties. When handling small quantities of ICs, etc., pins are fixed on a conductive foam sheet, and the pins are electrically connected using the foam to form a protective circuit to prevent static electricity damage, and this can be left as is. Alternatively, the method of handling the product by packaging it in a box or wrapping it in aluminum foil was also adopted, but this method was not effective because the surface not in contact with the conductive foam sheet was not protected against static electricity, or the surface in contact with the foam sheet was not protected against static electricity. There were drawbacks such as the fact that the exposed surface was not buffered against external forces.

[Means for solving problems]

It is an object of the present invention to be able to universally deal with electronic components of various types having different shapes, having a large number of pins, and which are easily susceptible to static electricity damage, and to effectively protect the electronic parts from static damage and mechanical damage. It is an object of the present invention to provide a packaging body that can protect the environment.

That is, in the present invention, on one side of a plastic foam sheet,
A laminate made of conductive plastic films with a surface electrical resistivity of 107 ohms or less, with a folding line notch provided in the center of the foam sheet for folding the conductive plastic film surface in half inward. This invention relates to a shock-absorbing package for electronic components having a large number of pins.

Furthermore, the present invention provides a method for using the above-mentioned buffer packaging body, and also provides a method for using the above-mentioned buffer package, in which one side of the plastic foam sheet has a surface electrical resistivity of 1.
A laminate of conductive plastic films of 0'7 ohm or less, with a folding cut line provided in the center of the foam sheet for folding the conductive plastic film in half inward. The pins of the electronic component are pushed and fixed onto the surface of one half of the conductive plastic film of the cushioning package for the electronic component having a large number of pins, and the pins of the electronic component are fixed at the bending cut line. This invention relates to a '6kiE packaging method for electronic components having a large number of pins, which is characterized by folding a laminated sheet, sandwiching and covering the electronic component, and fixing the i portions of both sheets in contact with each other in this state.

As the plastic foam sheet in the present invention, any material can be used as long as it does not cause the electronic parts to rust, but polyethylene, ethylene-vinyl acetate copolymer, polypropylene, or modified polymers based on these materials may be used. A soft or semi-rigid foam sheet is preferably used.

The thickness of this foam sheet needs to be slightly thicker than the length of the pin of the electronic component in order to sufficiently cushion and protect the electronic component, and the thickness is usually about 6 to 10+1 lffi.

The conductive plastic film laminated on the surface of the plastic foam sheet must have a surface electrical resistivity of 10 7 ohms or less.

If the value is larger than this, the protection of electronic components from static electricity will not be sufficient.

A suitable base material for these films is a biaxially oriented film of polystyrene, polyester, or polypropylene with a thickness of 5 to 40 microns, which is coated with a conductive surface coating to achieve a surface electrical resistivity of 107 ohms or less. This is what I did.

As the conductive surface coating, it is desirable that the surface electrical resistivity does not change significantly due to changes in relative humidity, such as a metal vapor deposition coating or a carbon black coating.

The VI layer of the present invention preferably has a conductive coating laminated on the surface of a plastic foam sheet, and a protective coating further applied to improve the surface strength.

Since the laminate of the present invention is used by folding it in half and sandwiching electronic components inside, a cut line for bending is provided in the center. This score line is made on the plastic foam sheet side. This score line can be a half-cut score line made with a knife inserted into the plastic foam sheet (or a line made by pressing a heating bar to melt the foam sheet), or a line made by mechanically making a cut by pressing a heating bar to melt the foam sheet. It may be a compressed wire, and various methods are preferred.

To package electronic components using the buffer packaging obtained in this way, first turn the packaging with the conductive plastic film side facing up, and place one half of the packaging with the pins facing down. Place the electronic component, press it from above to pierce the pin into the laminated sheet, fix the component, then fold the laminated sheet in half along the folding cut line, cover the side of the electronic component without the pin, and use the sand inch. Sandwich the sheet so that the edges of the sheet on the opposite side of the folding line touch and secure.

The method of fixing is not particularly limited, but examples include fixing with adhesive tape, using a stapler, applying adhesive to the sheet itself, gluing, heat sealing, and hanging a band from the outside. Any means may be used.

In addition, a fitting means may be provided on a part of the edge, or the buffer package sandwiching the electronic component may be further packaged by placing it in a box or bag, instead of the above-mentioned fixing means.

FIG. 1 is a plan view showing a state in which electronic components are fixed to one side of the buffer package of the present invention. In the figure, 1 is a laminated sheet, and the conductive film side is visible. 2 is a central bending line, 3 is an electronic component, and 4 is a pin thereof.

FIG. 2 is a side view of electronic components packaged in a buffer package, as seen from direction A in FIG. 1.

1 to 4 are the same as shown in FIG. Reference numeral 5 indicates a conductive film, 6 indicates a foam sheet, and 7 indicates an adhesive tape with its edges fixed.

FIG. 3 shows a cushioning package provided with fitting means,
Reference numeral 8 designates a notch provided at the center of the edge of the laminated sheet, 9 a fitting part with the notch 8, 10 a cut line, and 11 a fold line processing part.

FIG. 4 shows a case in which a large number of electronic components are lined up and packaged in damp packaging.The laminated sheet is folded from the fold line 2 in the center, and a large number of electronic components are packaged together.

〔Example〕

Examples are shown below. In the examples, the surface electrical resistivity was measured by the following method.

Prepare a rectangular sample with a width of 1 mm and a length of 30 mm or more, and place it flat.
Two rectangular conductive rubber electrodes with a length of 0 mm and a length of 10 m+- or more are brought into contact and the resistance between the electrodes is measured, and this value is calculated as the surface resistance of a 10 a+m x 10++ m square sandwiched between the electrodes, i.e. It was defined as surface electrical resistivity.

Example 1 A polyethylene foam sheet with a density of 0.03 kg/l and a thickness of 6a+- and a biaxially stretched polystyrene film with a thickness of 16 microns were coated with a conductive paint containing carbon lacquer on one side. Conductive films with a surface electrical resistivity of 8 x 10" ohms and a protective coating of acrylic resin were adhesively laminated with the conductive side facing outward. This laminated sheet was canted into a rectangle of 70 mm x 75 mm, and the conductive side was From the opposite side, 5 incisions were made in the center of the 70+am side parallel to the 75mm side.This condition is shown in the plan view of Figure 1.Depth of 5n+m
0 body shown in 2 is 32+
Two DIP-type ICs having 24 pins and having a thickness of 13 amX 4 mm (thickness) were fixed by pushing them onto the conductive surface of the laminated sheet as shown in FIG. In this state, the pins of the IC are electrically short-circuited with a conductive film, and this short circuit functions as a protection circuit for the internal circuit.

Further, the sheet was folded in two along the fold line and the edges of the sheet were fixed with adhesive tape to obtain a package as shown in FIG. 2. Figure 2 shows a laminated sheet fixed with adhesive tape.
FIG. 2 is a side view seen from the direction of A in FIG. 1; In this state, the outer periphery of the IC is surrounded by a conductive film 5 to protect it from an external electrostatic field, and the foam sheet surrounded by a foam sheet is filled with a filler to provide conductivity. Since the mechanical properties are not deteriorated, the cushioning properties are good.

This package is useful for storing and distributing it as it is and delivering it to the end user, and is also useful for re-packing opened items.

Example 2 The laminated foam sheet used in Example 1 was 50 m+
It was cut into a rectangle of 901, and a folded line with a depth of 5 cm was applied to the center of the side of 90a+m from the opposite side of the conductive film. Furthermore, as shown in Figure 3, 1 is attached to the outer edge of the sheet.
Two 1011- cuts such as 0 are made, and between the cuts, a polygonal line processing 11 is applied from the opposite side of the conductive film with a depth of 5 mm and a length of 15 m, and a 10 mm x A notch 8 of 14 mm was machined.

A package in which the edges of the stacked sheets are fixed by inserting and fixing the same IC as in Example 1 as shown in Figure 3, bending from the fold line, folding the processed part 9 and pushing it into the notch 8. I got a body.

This package provided good protection for the IC by a short circuit, protection from an external electrostatic field by electrostatic field shielding, and protection by buffering, and was easy to repack after unpacking.

Example 3 The laminated foam sheet used in Example 1 was cut into long strips with a width of 100 mm, and a half-cart fold line was cut at a depth of 51 mm from the opposite side of the conductive film in the center (Fig. 4). 2) and half-cut polygonal line incisions with a depth of 51 perpendicular to the longitudinal direction at intervals of 4011 Im (1 in Fig. 4).
2) was processed, and the same ICs as in Example 1 were lined up and fixed to the conductive film surface of this laminated foam sheet as shown in FIG.

This long sheet was folded from the center fold line, and with the IC sandwiched between the sheets, the sheet was rolled up to form a disc-shaped package with the side where the IC was inserted in the longitudinal direction facing outward. Since this package is rolled up in multiple layers, the foam is laminated and has very good cushioning properties. This package is useful for transporting and storing as it is or in its outer packaging, or for cutting out one or several parts at a time while still being packaged with a sheet and using them in small quantities.

〔Effect of the invention〕

As explained above, the present invention is a novel packaging body obtained by processing a specific laminated foam sheet. Protection circuit formation, shielding from external electrostatic fields, protection of easily bent pins, fixing and buffering, easy support for various sizes and shapes, support for small quantity or individual packaging, simplification of packaging, packaging price It has a useful effect that satisfies the required characteristics such as reduction of .

[Brief explanation of the drawing]

FIG. 1 is a plan view showing a state in which electronic components are fixed to one side of the buffer package of the present invention. FIG. 2 is a side view from the direction A in FIG. 1 showing a state in which electronic components are packaged in a buffer package. FIG. 3 is a plan view showing a cushioning package provided with fitting means. FIG. 4 is a plan view of a case where a large number of electronic components are lined up and packaged in cushioning packaging. 1... Laminated sheet 2... Folded line portion at the center of the sheet 3... Electronic component 4... Pin of electronic component 5... Conductive film 6... Foam sheet 7... Edge portion Adhesive tape 8 that stopped the laminate sheet... Notch 9 provided at the center of the edge of the laminated sheet... Fitting part 10 with the notch 8... Cut line 11... Creased line processing part 12...・Notch of polyline

Claims (2)

[Claims] (1) A laminate in which a conductive plastic film with a surface electrical resistivity of 10^7 ohm or less is laminated on one side of a plastic foam sheet, and the conductive plastic film surface is placed in the center of the foam sheet. A shock-absorbing package for electronic components having a large number of pins, characterized in that it is provided with a folding cut line for folding in half. (2) A laminate in which a conductive plastic film with a surface electrical resistivity of 10^7 ohm or less is laminated on one side of a plastic foam sheet, and the conductive plastic film surface is placed in the center of the foam sheet. The electronic component pins are placed on the surface of one half of the conductive plastic film of a cushioning package for electronic components having a large number of pins, which is characterized by being provided with folding cut lines for folding into two. An electronic device having a large number of pins, characterized in that the laminated sheet is fixed by being pushed into place, the laminated sheet is bent at the bending cut line, the electronic component is sandwiched and covered, and the ends of both sheets are abutted and fixed in this state. Buffer packaging method for parts.