JPS62259884A - Transfer film, transferred article obtained using the same and transfer forming method - Google Patents
Transfer film, transferred article obtained using the same and transfer forming methodInfo
- Publication number
- JPS62259884A JPS62259884A JP61091495A JP9149586A JPS62259884A JP S62259884 A JPS62259884 A JP S62259884A JP 61091495 A JP61091495 A JP 61091495A JP 9149586 A JP9149586 A JP 9149586A JP S62259884 A JPS62259884 A JP S62259884A
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- metal
- film
- vehicle
- coating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 239000000843 powder Substances 0.000 claims abstract description 57
- 239000000463 material Substances 0.000 claims abstract description 45
- 239000011247 coating layer Substances 0.000 claims abstract description 28
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 20
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000011230 binding agent Substances 0.000 claims abstract description 18
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012790 adhesive layer Substances 0.000 claims abstract description 10
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 9
- 229920000298 Cellophane Polymers 0.000 claims abstract description 7
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 239000010948 rhodium Substances 0.000 claims abstract description 7
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims abstract description 5
- 229920000728 polyester Polymers 0.000 claims abstract description 5
- 229910052703 rhodium Inorganic materials 0.000 claims abstract description 5
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000919 ceramic Substances 0.000 claims abstract description 3
- 238000007747 plating Methods 0.000 claims description 19
- 239000010410 layer Substances 0.000 claims description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 238000007772 electroless plating Methods 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 5
- 239000002075 main ingredient Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- -1 polyimideamide Polymers 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000003197 catalytic effect Effects 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 32
- 230000000694 effects Effects 0.000 description 5
- 239000002932 luster Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000012038 nucleophile Substances 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/16—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like
- B44C1/165—Processes, not specifically provided for elsewhere, for producing decorative surface effects for applying transfer pictures or the like for decalcomanias; sheet material therefor
- B44C1/17—Dry transfer
- B44C1/1712—Decalcomanias applied under heat and pressure, e.g. provided with a heat activable adhesive
- B44C1/1716—Decalcomanias provided with a particular decorative layer, e.g. specially adapted to allow the formation of a metallic or dyestuff layer on a substrate unsuitable for direct deposition
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/385—Contact thermal transfer or sublimation processes characterised by the transferable dyes or pigments
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
Landscapes
- Duplication Or Marking (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、転写用フィルムと、この転写用フィルムを用
いて転写された被転写物と、この被転写物を形成する転
写形成方法とに関するものであって、詳しくは、工業用
の電気リード線プリント配線、或いは金属光沢をもった
文字、符号、絵等の模様を転写基材に形成するための熱
転写用フィルムと熱転写された被転写物とこの被転写物
を形成する方法とに関するものである。[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a transfer film, a transfer object transferred using the transfer film, and a transfer forming method for forming the transfer object. Specifically, thermal transfer films and thermally transferred transfer materials for forming industrial electrical lead wire printed wiring, or patterns such as letters, codes, pictures, etc. with metallic luster on transfer substrates. The present invention relates to a method for forming this transferred object.
〈従来の技術〉
従来一般に用いられる熱転写方法としては、通常ホット
スタンプ方式と呼ばれる方法であって、第10図に示す
如(、熱転写フィルム(a)に金属箔(b)を接着し、
これに感熱接着剤(e)をコーティングしたものを転写
用基材(d)に対向させ、所望の型(e)によって加熱
押圧した後、前記熱転写フィルム(a)を除去し、前記
基材(d)上に金属光沢を有する所望の模様や文字等を
得るようにしていた。<Prior art> A conventionally commonly used thermal transfer method is a method usually called a hot stamping method, as shown in FIG.
The film coated with a heat-sensitive adhesive (e) is placed opposite the transfer base material (d), heated and pressed using a desired mold (e), and then the heat transfer film (a) is removed and the base material ( d) Desired patterns, letters, etc. with metallic luster were obtained on the surface.
本発明は、上述の従来技術における欠点を解消し、微細
な線状の転写物でも転写可能で、転写された文字、符号
、絵、プリント配線その池の模様を転写型の形状通りに
、シャープな転写模様緑をもって転写することができる
加熱または加圧転写用フィルムと、この加熱または加圧
転写用フィルムを用いて転写され、その転写面上に連続
した金R層を有する被転写物と、この被転写物を形成す
る転写形成方法とをここに提案するものである。The present invention eliminates the drawbacks of the above-mentioned conventional technology, and can transfer even minute linear transfers, and the transferred characters, codes, pictures, printed wiring, and pond patterns can be sharply transferred according to the shape of the transfer mold. A heat or pressure transfer film that can be transferred with a green transfer pattern, and a transferred object that is transferred using this heat or pressure transfer film and has a continuous gold R layer on the transfer surface, A transfer forming method for forming this transferred object is proposed here.
先ず、第1発明としての転写用フィルムの構成は、微粉
求核(1)に金属(2)がコーティングされている金属
被覆パウダー(3)と溶液状8I脂バインダー(4)と
が主剤として混合された混合ビヒクル(5)が転写用フ
ィルム(6)の片面にコーティングされてビヒクルコー
ティング!(5a)が形成されている構成としたもので
ある。First, the configuration of the transfer film as the first invention consists of a mixture of a metal-coated powder (3) in which a fine powder nucleophile (1) is coated with a metal (2) and a solution-like 8I fat binder (4) as the main ingredients. The mixed vehicle (5) is coated on one side of the transfer film (6), resulting in vehicle coating! (5a) is formed.
また、第2発明としての被転写物の構成は、微粉求核(
1)に金属(2)がコーティングされている金属被覆パ
ウダー(3)と溶液状樹脂バインダー(4)とが主剤と
して混合された混合ビヒクル(5)が転写用フィルム(
6)の片面にコーティングされてビヒクルコーティング
層(5a)が形成されているコーティングフィルム(6
)上のビヒクルコーティング層(5a)が、転写型(1
0)によって転写用基材(9)上に模様1!!(5b)
が転写形成され、この転写形成された被転写模様膜(5
b)の表面に、前記ビヒクル(5)中のパウダー(3)
にコーティングされた触媒金属(2)をメッキ層の成長
核として一連に連続した金属メッキ層(5C)が形成さ
れている構成としたものである。Further, the structure of the transfer target as the second invention is that the fine powder nucleophilic (
A mixture vehicle (5) in which a metal coating powder (3) in which metal (2) is coated on 1) and a solution resin binder (4) as main ingredients is used as a transfer film (
6) coated on one side to form a vehicle coating layer (5a).
) on the transfer mold (1
0) on the transfer base material (9) with pattern 1! ! (5b)
is transferred and formed, and this transfer-formed pattern film (5
b) powder (3) in the vehicle (5);
A series of continuous metal plating layers (5C) are formed using the catalyst metal (2) coated on the metal plate as a growth nucleus of the plating layer.
更に、ptS3発明としての被転写物を形成する転写形
成方法は、(イ)微粉求核(1)に金属(2)成し、(
ロ)前記金属被覆パウダー(3)と溶液状樹脂パイング
ー(4)とを°混合して混合ビヒクル(5)を形成し、
(ハ)前記混合ビヒクル(5)を転写用フィルム(6)
の片面にコーティングしてビヒクルコーティングff1
(5a)を形成し、(ニ)以上の各工程を経て得られた
前記転写用フィルム(6)上のビヒクルコーティング層
(5a)を直後にまたはその表面に形成された接着剤層
(7)を介して転写用基材(9)上に対向配置し、型面
に所望の模様を形成した転写型(10)によって該転写
用フィルム(6)の背面を加圧押圧した後、該転写用フ
ィルム(6)を転写用基材(9)から除去し、転写型(
10)の型面に形成された模様に応答する模様膜(5b
)を転写用基材(9)上に転写形成し、(ホ)このよう
にして、得られた模様膜(5b)形成転写用基材(9)
を無電解金属メッキ液(11)中に浸漬し、模様g!(
5b)表面の前記金属被覆パウダー(3)に一連に連結
された金属メッキ層(5C)拆出形成する。(へ)以上
の手段を経て形成する方法としたものである。Furthermore, the transfer forming method for forming a transferred object as the ptS3 invention includes (a) forming a metal (2) on a fine powder nucleophile (1);
b) mixing the metal coating powder (3) and solution resin paint (4) to form a mixing vehicle (5);
(c) The mixture vehicle (5) is transferred to the transfer film (6).
Vehicle coating ff1 by coating on one side of
(5a) and (d) an adhesive layer (7) formed immediately after or on the surface of the vehicle coating layer (5a) on the transfer film (6) obtained through the above steps. After applying pressure to the back side of the transfer film (6) with a transfer mold (10) which is placed oppositely on the transfer base material (9) and has a desired pattern formed on the mold surface, The film (6) is removed from the transfer base material (9), and the transfer mold (
10) A patterned film (5b) that responds to the pattern formed on the mold surface.
) is transferred onto the transfer substrate (9), and (e) the pattern film (5b) thus obtained is formed on the transfer substrate (9).
is immersed in the electroless metal plating solution (11), pattern g! (
5b) Form a metal plating layer (5C) connected to the metal coating powder (3) on the surface in series. (v) This method is to form the film through the above-mentioned means.
〈作用〉
本発明は、微粉末技(1)に金属(2)をコーティング
してこれに溶液状とした樹脂バインダー(4)を加えた
混合ビヒクル(5)を主剤として、ビヒクルコーティン
グ層(5a)を形成するどう極めて特殊な手段を用いる
ので、このビヒクルコーティング層(5a)が転写用基
材(9)に転写される際ビヒクルコーティング層(5a
)が前記全粉末核(1)間に位置する樹脂バインダー(
4)部分で、切断されることになり、金属コーティング
された微粉末技(1)自体を分断する必要がないので、
極めて細い線でも容易かつスムースに転写模様の側縁が
シャープな状態で転写できる。<Function> The present invention uses a mixed vehicle (5), which is a mixture of fine powder (1) coated with a metal (2) and a resin binder (4) in the form of a solution, as a main ingredient, and a vehicle coating layer (5a). ), so when this vehicle coating layer (5a) is transferred to the transfer substrate (9), the vehicle coating layer (5a
) is located between the whole powder cores (1), and the resin binder (
4) It will be cut at the part, and there is no need to separate the metal-coated fine powder technique (1) itself.
Even extremely thin lines can be easily and smoothly transferred with sharp side edges of the transfer pattern.
しかる後、無電解メッキ処理により、前記金属(2)を
コーティングした微粉末技(1)同士を完全に連結し、
転写パターンを電気的導体とすると同時に金属密度を高
めて光沢を増大させることができるのである。After that, the fine powder technique (1) coated with the metal (2) is completely connected to each other by electroless plating treatment,
This makes it possible to make the transferred pattern an electrical conductor and at the same time increase the metal density and increase the gloss.
〈実施例〉
第1図は、本発明の方法に用いられる微粉末技(1)と
してのセラミック微粉末(高分子、金属の微粉末でもよ
い)に、例えばパラジウム(Pd)、白金(p t)、
ロジウム(Rh)などの金属(2)をコーティングして
得た金属被覆パウダー(3)の拡大図を示す、このパウ
ダー(3)は、超微粒粉末であって、その粒径は0.0
1〜30μmのものが主として用いられる。しかも、粒
径は、o、oos〜1000μmの範囲のものであって
もよい。!@2図は前記パウダー(3)に溶液状とした
樹脂バインダー(4)を重景比6:4の割合で混合した
ビヒクル(5)を得た段階を示す。f53図は、前記ビ
ヒクル(5)をポリエステル、セロファンなどの材料で
形成された転写用フィルム(6)テープの片面にコーテ
ィングして厚さ0.1〜100μmのコーティング層(
5a)を形成し、更に表面上に感熱接着剤M (7)(
または感圧接着剤でもよい)をコーティング形成し、必
要に応じてその表面に剥離紙などの剥離膜(8)を仮貼
した状態の−n幼欠き斜視図を示す、第4図は、第5図
の一部を拡大して示した部分拡大縦断側面図を示す。f
jS5図は、前記のビヒクルコーティングフィルムを、
ポリエステル製のプレートで形成された転写用基材(9
)(ポリイミド、ポリイミドアミド、セロファンなどの
プレートや可撓フィルムでもよい)上に前記接着剤層(
7)が対向接当するようにして@置し、型面に所定の模
様文字Aを形成した熱伝写型(10)によって加熱押圧
した直後の状態を示す。f56図は、この転写型(10
)によって加熱押圧した後に、前記転写用フィルム(6
)を転写用基材(9)上から除去した状態の断面形状を
示す。このようにしてビヒクルコーティング層(5a)
が前記感熱接着剤NJ(7)を介して前記転写用基材(
9)上に接着転写される。第7図は、前記工程で得られ
た転写用基材(9)を、無電解メッキ液、例えば胴、ニ
ッケル、金、銀、白金またはそれらの合金などのMM解
メッキ液に浸漬し、無電解メッキ処理を行う工程を示し
、前記微粉末技(1)にコーティングされた金属(2)
を触媒として、厚みが約20ミクロン程度のメッキ層く
別実雄側〉
■ 前記樹脂バインダー(4)の材料を前記転写用基材
(9)の材料と同系同質の材料または相客度の高い材料
を選択することによってビヒクルコーティング層(5a
)の表面に接着剤層(7)を形成することなく、前記樹
脂バインダー(4)の樹脂を加熱溶融して転写用基材(
9)上に熱転写を行なう方法。<Example> Fig. 1 shows a fine powder technique (1) used in the method of the present invention, in which ceramic fine powder (polymer or metal fine powder may be used), for example, palladium (Pd), platinum (Pt), etc. ),
An enlarged view of metal-coated powder (3) obtained by coating metal (2) such as rhodium (Rh) is shown. This powder (3) is an ultra-fine powder with a particle size of 0.0
Those having a diameter of 1 to 30 μm are mainly used. Moreover, the particle size may be in the range of o, oos to 1000 μm. ! Figure @2 shows the stage at which a vehicle (5) was obtained by mixing the resin binder (4) in solution form with the powder (3) at a ratio of 6:4. Figure f53 shows a coating layer (with a thickness of 0.1 to 100 μm) obtained by coating the vehicle (5) on one side of a transfer film (6) tape made of a material such as polyester or cellophane.
5a) and further heat-sensitive adhesive M (7) (
or a pressure-sensitive adhesive), and if necessary, a release film (8) such as release paper is temporarily pasted on the surface. 5 is a partially enlarged vertical sectional side view showing a part of FIG. 5 enlarged. f
Figure jS5 shows the above vehicle coating film,
Transfer base material (9) made of polyester plate
) (which may be a plate or flexible film made of polyimide, polyimideamide, cellophane, etc.) and the adhesive layer (
7) are placed so as to face each other and are in contact with each other, and the state immediately after being heated and pressed by a heat transfer mold (10) with a predetermined pattern letter A formed on the mold surface is shown. The f56 diagram shows this transcription type (10
), the transfer film (6) is heated and pressed.
) is removed from the transfer base material (9). In this way the vehicle coating layer (5a)
is attached to the transfer base material (
9) Adhesive transfer onto. FIG. 7 shows that the transfer substrate (9) obtained in the above step is immersed in an electroless plating solution, for example, a MM deplating solution for nickel, gold, silver, platinum, or an alloy thereof. Showing the process of performing electrolytic plating treatment, the metal coated on the fine powder technique (1) (2)
As a catalyst, a plating layer with a thickness of about 20 microns is applied to the side of the plating layer> ■ The material of the resin binder (4) is a material of the same type and quality as the material of the transfer base material (9), or a material with a high degree of mutual affinity. The vehicle coating layer (5a
The resin of the resin binder (4) is heated and melted without forming an adhesive layer (7) on the surface of the transfer base material ().
9) A method of performing thermal transfer on.
このため組合せ材料としては、例えば次のものが使泪で
きる。For this reason, the following can be used as combination materials, for example.
樹脂バインダー(4)をポリ塩化ビニール、酢酸ビニー
ルなどの共重合体としたとき、転写用基材(9)として
はポリ塩化ビニール、ABS。When the resin binder (4) is a copolymer such as polyvinyl chloride or vinyl acetate, the transfer base material (9) is polyvinyl chloride or ABS.
AS、ポリカーボネイト、メタアクリル酸メチル、スチ
ロールなどの樹脂材シートなどを用いるとよい。It is preferable to use a resin material sheet such as AS, polycarbonate, methyl methacrylate, or styrene.
■ 前記パウダー(3)と前記樹脂バインダー(4)と
の重量混合比は、上述の6:4以外に95:5〜5:9
5の範囲の割合としても゛実施が可能である。■ The weight mixing ratio of the powder (3) and the resin binder (4) is 95:5 to 5:9 in addition to the above-mentioned 6:4.
It can also be implemented as a ratio in the range of 5.
■ 前記接着剤ffi (7)を形成する接着剤は感熱
性のものについて述べたが感圧性の接着剤を用いてもよ
い。(2) The adhesive forming the adhesive ffi (7) has been described as being heat-sensitive, but a pressure-sensitive adhesive may also be used.
■ 前記微粉末技(1)とこれをコーティングする金1
(2)としては、次の組合せ材料を用いることができる
。■ The above-mentioned fine powder technique (1) and gold 1 to coat it
As (2), the following combination of materials can be used.
微粉末技(1)の具体的な材料としては、プラス、珪砂
、炭素、酸化チタン、アルミナ、硫酸バリウム、鉄、ニ
ッケル、フェノール、ポリプロピレンなどがあり、コー
ティング金属(2)としては、パラジウム、ロジウム、
白金などが用いられる。Specific materials for fine powder technique (1) include plas, silica sand, carbon, titanium oxide, alumina, barium sulfate, iron, nickel, phenol, and polypropylene, and coating metals (2) include palladium and rhodium. ,
Platinum or the like is used.
■ 前記金M(2)と無電解メッキ液との組合せは、次
の組合せ材料を用いることができる。(2) The following combination of materials can be used for the combination of the gold M(2) and the electroless plating solution.
金属(2)としてパラジウム、ロジウム、白金などを用
いたとき、無電解メッキ液としては銅、ニッケル、クロ
ーム、金、銀、白金またはこれらの合金を用いることが
できる。When palladium, rhodium, platinum, etc. are used as the metal (2), copper, nickel, chromium, gold, silver, platinum, or an alloy thereof can be used as the electroless plating solution.
■ 前記転写用フィルム(6)及び転写用基材(9)の
材料としては、上述のテトロン、セロファン、ポリイミ
ド、ポリイミドアミドなどの材料を用いることができる
。(2) As the material for the transfer film (6) and the transfer base material (9), the above-mentioned materials such as Tetoron, cellophane, polyimide, and polyimideamide can be used.
■ 前記実施例では転写用基材(9)としてテトロン製
のプレート材に文字Aを転写した構造として示したがm
8図(イ)に示したように、転写用基材(9)を7レキ
シプルな薄膜状フィルムとし、電気リードM(5e)や
、同(ロ)図に示したようにプレート配#1(5c)を
形成してもよい。■ In the above example, the structure was shown in which the letter A was transferred to a plate material made of Tetron as the transfer base material (9), but m
As shown in Figure 8 (A), the transfer base material (9) is a 7lexible thin film, and as shown in Figure 8 (B), the electrical lead M (5e) and the plate arrangement #1 ( 5c) may be formed.
■ また、第9図に示したように、絵を転写用基材(9
)に形成し、無電解メッキ処理によって優れた金属光沢
をもつ絵(5c)を形成してもよ111゜
〈発明の効果〉
本発明にいう第1発明は、転写用フィルム上に形成した
ビヒクルコーティング層を微粉末技に金属をコーティン
グした金属被覆パウダーを主要剤としてこれをバインダ
ーとしての樹脂溶液と混合した混合ビヒクルを用いてコ
ーティングした転写用フィルムであるから、被転写物即
ち転写用基材への加熱または加圧軒耳に当って、ビヒク
ルコーティング層中の金属コーティングされたバラグー
自体を分−する必要がなく、これらのパウダー間に位置
するパイングーとしての樹脂材のみを転写用フィルムか
ら転写用基材へ分R転写すればよいので、転写周基村上
へ転写される模様膜の側縁部を転写型の形状通りに極め
てシャープなものとすることができ、従って、従来のホ
ットメルトスタンプ方式では不可能であった極めて小さ
い文字や符号、絵、電線模様等を確実に転写することが
できるという顕著な効果を有する。■ Also, as shown in Figure 9, transfer the picture to a transfer base (9
), and a picture (5c) with excellent metallic luster can be formed by electroless plating. Since the coating layer is a transfer film coated using a mixed vehicle in which metal coating powder, which is a metal coating powder coated with metal using a fine powder technique, is mixed with a resin solution as a binder, the transfer target, that is, the transfer substrate. There is no need to separate the metal-coated powder itself in the vehicle coating layer by applying heat or pressure to the eaves sill, and only the resin material as the paint located between these powders is transferred from the transfer film. Since it is only necessary to transfer the pattern to the substrate for printing, the side edges of the pattern film to be transferred onto the transfer base material can be made extremely sharp in accordance with the shape of the transfer mold. It has the remarkable effect of being able to reliably transfer extremely small characters, codes, pictures, wire patterns, etc., which was impossible with conventional methods.
また、本発明にいう第2発明は、このようにして形成さ
れた前記転写用フィルムを用いて転写された転写周基村
上の転写摸様膜上に、前記混合ビヒクル中のパウダーに
コーティングされている金属を連結触媒として金属メッ
キ層を形成したものであるから、該金属メッキ層を前記
パウダーの存在する部分のみに正確に形成することがで
き、光沢に富んだ金属メッキ層を極めて細い線上にも確
実に形成することがでさるとともに、前記転写慎様外に
金属メッキ層が形成されることはないので、隣接間隔の
極めて小さい文字や符号、絵殊に!絡の危険性を有する
ために従来のホットメルトスタンプ方式では不可能であ
った微小間隔で平行させた電気リード線やプリント配線
を基材に形成することができ、しかも基材が硬質プレー
トでなくて可撓性に富んだ薄膜材であっても容易に形成
でさるという顕著な効果を有する。Further, the second invention referred to in the present invention is such that the powder in the mixing vehicle is coated on the transfer pattern-like film on the transfer Shukimura that has been transferred using the transfer film thus formed. Since the metal plating layer is formed using the metal as a connecting catalyst, the metal plating layer can be accurately formed only on the part where the powder is present, and the metal plating layer with high gloss can be formed on extremely thin lines. In addition to being able to reliably form a metal plating layer on the outside of the transfer plate, it is especially suitable for letters, symbols, and pictures with extremely small spacing between adjacent lines. It is possible to form parallel electrical lead wires and printed wiring on the base material at minute intervals, which was impossible with the conventional hot-melt stamping method due to the risk of electrical shock, and the base material is not a rigid plate. It has the remarkable effect that even thin film materials with high flexibility can be easily formed.
更に、本発明にいう第3発明の方法は、このような顕著
な効果を有する被転写物を極めて容易に得ることができ
るという効果を有する。Furthermore, the method of the third aspect of the present invention has the effect that a transfer material having such a remarkable effect can be obtained extremely easily.
本発明は以上のように、従来のホットスメルトタンブ方
式では期待することができなかった細密な文字、符号、
絵、配線などの模様を通電性に富み、金属光沢のある模
様として容易に得ることができるようになった点に最大
の効果を有するものである。As described above, the present invention enables the production of fine characters, codes, and
The greatest effect is that patterns such as pictures and wiring can now be easily obtained as patterns with high conductivity and metallic luster.
図面中tjS1図〜第図面第9図発明に係る実施例を示
し、!51図は微粉末技に金属コーティングを施したパ
ウダーの拡大図、第2図は容器内に入れたパウダーと樹
脂バインダーとを混合したビヒクルを示す側面図、第3
図はビヒクルコーティング層を形成した転写用フィルム
の一部切欠き斜視図、第4図はtjS3図の要部の拡大
断面図、第5IIXlは熱転写工程を示す概略斜視図、
第6図は転写後の要部の縦断側面図、第7図は無電解メ
ッキ工程を示す概略斜視図、第8図(イ)図は可撓軒耳
基材に電気リード線を形成した斜視図、同(ロ)図はプ
リント配線を形成した斜視図、第9図は転写絵を示す斜
視図、第10図は従来の方法を示す縦断側面図である。
図中、(1)は微粉末技、(2)は金属、(3)はパウ
ダー、(4)はバインダー、(5)はビヒクル、(5a
)はビヒクルコーティング層、(5b)は模様膜、(5
c)は金属メッキ層、(6)は転写用フィルム、(7)
は接着剤層、(9)は軒耳用基材、(10)は転写第1
141
第2図 第3図
第4図
第6図
第7図
C
第914
第10図In the drawings, tjS1 to 9 illustrate embodiments of the invention. Figure 51 is an enlarged view of powder coated with metal in fine powder technique, Figure 2 is a side view showing a vehicle in which the powder and resin binder are mixed in a container, and Figure 3
The figure is a partially cutaway perspective view of a transfer film on which a vehicle coating layer has been formed, Figure 4 is an enlarged sectional view of the main part of Figure tjS3, and Figure 5IIXl is a schematic perspective view showing the thermal transfer process.
Figure 6 is a longitudinal side view of the main part after transfer, Figure 7 is a schematic perspective view showing the electroless plating process, and Figure 8 (a) is a perspective view of electrical lead wires formed on the flexible eave selvage base material. FIG. 9 is a perspective view showing a printed wiring, FIG. 9 is a perspective view showing a transferred picture, and FIG. 10 is a longitudinal sectional side view showing a conventional method. In the figure, (1) is fine powder technique, (2) is metal, (3) is powder, (4) is binder, (5) is vehicle, (5a
) is the vehicle coating layer, (5b) is the patterned film, (5
c) is a metal plating layer, (6) is a transfer film, (7)
is the adhesive layer, (9) is the base material for the eaves, and (10) is the first transfer layer.
141 Figure 2 Figure 3 Figure 4 Figure 6 Figure 7 C 914 Figure 10
Claims (1)
ている金属被覆パウダー(3)と溶液状樹脂バインダー
(4)とが主剤として混合された混合ビヒクル(5)が
転写用フィルム(6)の片面にコーティングされてビヒ
クルコーティング層 (5a)が形成されている転写用フィルム。 [2]微粉末核(1)が、セラミック、高分子、金属の
何れかから選択された微粉末である特許請求の範囲第[
1]項に記載の転写用フィルム。 [3]微粉末核(1)へのコーティング金属(2)が、
パラジウム、ロジウム、白金の何れかから選択された金
属である特許請求の範囲第[1]項に記載の転写用フィ
ルム。 [4]微粉末核(1)が、粒径0.01〜30μmのも
のである特許請求の範囲第[1]項に記載の転写用フィ
ルム。 [5]微粉末核(1)へのコーティング金属(2)のコ
ーティング膜厚が0.001〜30μmのものである特
許請求の範囲第[1]項に記載の転写用フィルム。 [6]転写用フィルム(6)が、テトロン、セロファン
……の何れかから選択されたフィルムである特許請求の
範囲第[1]項に記載の転写用フィルム。 [7]転写用フィルム(6)面へのビヒクルコーティン
グ層(5a)の厚さが0.1〜100μmのものである
特許請求の範囲第[1]項に記載の転写用フィルム。 [8]ビヒクルコーティング層(5a)上に感熱接着剤
または感圧接着剤の何れかからなる接着剤層(7)が形
成されている特許請求の範囲第[1]項に記載の転写用
フィルム。 [9]微粉末核(1)に金属(2)がコーティングされ
ている金属被覆パウダー(3)と溶液状樹脂バインダー
(4)とが主剤として混合された混合ビヒクル(5)が
転写用フィルム(6)の片面にコーティングされてビヒ
クルコーティング層 (5a)が形成されているコーティングフィルム(6)
上のビヒクルコーティング層(5a)が、転写型(10
)によって転写用基材(9)上に模様膜(5b)が転写
形成され、この転写形成された被転写模様膜(5b)の
表面に、前記ビヒクル(5)中のパウダー(3)にコー
ティングされた触媒金属(2)をメッキ層の成長核とし
て一連に連続した金属メッキ層(5c)が形成されてい
る被転写物。 [10]転写用基材(9)が、ポリエステル、ポリイミ
ド、ポリイミドアミド、セロファンの何れかから選択さ
れた可撓フィルムである特許請求の範囲第[9]項に記
載の被転写物。 [11]転写用基材(9)が、ポリエステル、ポリイミ
ド、ポリイミドアミド、セロファンの何れかから選択さ
れたプレートである特許請求の範囲第[9]項に記載の
被転写物。 [12]転写形成された被転写模様膜(5b)が、文字
、符号、絵、電気リード線、プリント配線模様膜の何れ
かから選択された模様膜である特許請求の範囲第[9]
項に記載の被転写物。 [13]金属メッキ層(5c)が、銅、ニッケル、金、
銀、白金またはそれらの合金の何れかから選択された金
属メッキ層である特許請求の範囲第[9]項に記載の被
転写物。 [14](イ)微粉末核(1)に金属(2)をコーティ
ングして金属被覆パウダー(3)を形成し、 (ロ)前記金属被覆パウダー(3)と溶液状樹脂バイン
ダー(4)とを混合して混合ビヒクル(5)を形成し、 (ハ)前記混合ビヒクル(5)を転写用フィルム(6)
の片面にコーティングしてビヒクルコーティング層(5
a)を形成し、 (ニ)以上の各工程を経て得られた前記転写用フィルム
(6)上のビヒクルコーティング層(5a)を直後にま
たはその表面に形成された接着剤層(7)を介して転写
用基材(9)上に対向配置し、型面に所望の模様を形成
した転写型 (10)によって該転写用フィルム(6)の背面を加圧
押圧した後、該転写用フィルム(6)を転写用基材(9
)から除去し、転写型(10)の型面に形成された模様
に応答する模様膜(5b)を転写用基材(9)上に転写
形成し、 (ホ)このようにして、得られた模様膜(5b)形成転
写用基材(9)を無電解金属メッキ液(11)中に浸漬
し、模様膜(5b)表面の前記金属被覆パウダー(3)
に一連に連結された金属メッキ層(5c)拆出形成する
。 (ヘ)以上の手段を経て形成する被転写物の転写形成方
法。 [15]転写用基材(9)上に転写形成される金属メッ
キ模様膜(5c)が、文字、符号、絵、電気リード線、
プリント配線の何れかから選択された模様である特許請
求の範囲第[14]項に記載の被転写物の転写形成方法 [16]無電解金属メッキ液(11)が、銅、ニッケル
、金、銀、白金またはそれらの合金の何れかから選択さ
れた無電解メッキ液である特許請求の範囲第[14]項
に記載の被転写物の転写形成方法。 [17]転写用フィルム(6)上のビヒクルコーティン
グ層(5a)を、該ビヒクルコーティング層(5a)中
の樹脂バインダー(4)の熱溶融による融着力を利用し
て転写用基材(9)に転写する特許請求の範囲第[14
]項に記載の被転写物の転写形成方法。 [18]転写用フィルム(6)上のビヒクルコーティン
グ層(5a)を、該ビヒクルコーティング層(5a)の
表面に塗着形成された接着剤層(7)の接着剤が感圧接
着剤である特許請求の範囲第[14]項に記載の被転写
物の転写形成方法。 [19]転写型(10)が、感圧転写型であって、ビヒ
クルコーティング層(5a)の表面に塗着形成された接
着剤層(7)の接着剤が感圧接着剤である特許請求の範
囲第[14]項に記載の被転写物の転写形成方法。 [20]転写型(10)が、熱転写型であって、ビヒク
ルコーティング層(5a)の表面に塗着形成された接着
剤層(7)の接着剤が感熱接着剤である特許請求の範囲
第[14]項に記載の被転写物の転写形成方法。[Scope of Claims] [1] A mixed vehicle (5) in which a metal-coated powder (3) in which a fine powder core (1) is coated with a metal (2) and a solution resin binder (4) are mixed as main ingredients. ) is coated on one side of the transfer film (6) to form a vehicle coating layer (5a). [2] Claim No. 2, wherein the fine powder core (1) is a fine powder selected from ceramic, polymer, or metal.
The transfer film according to item 1]. [3] The coating metal (2) on the fine powder core (1) is
The transfer film according to claim 1, which is a metal selected from palladium, rhodium, and platinum. [4] The transfer film according to claim [1], wherein the fine powder cores (1) have a particle size of 0.01 to 30 μm. [5] The transfer film according to claim [1], wherein the coating thickness of the coating metal (2) on the fine powder core (1) is 0.001 to 30 μm. [6] The transfer film according to claim [1], wherein the transfer film (6) is a film selected from Tetoron, cellophane... [7] The transfer film according to claim [1], wherein the vehicle coating layer (5a) on the surface of the transfer film (6) has a thickness of 0.1 to 100 μm. [8] The transfer film according to claim [1], wherein an adhesive layer (7) made of either a heat-sensitive adhesive or a pressure-sensitive adhesive is formed on the vehicle coating layer (5a). . [9] A mixture vehicle (5) containing a metal-coated powder (3) in which a fine powder core (1) is coated with a metal (2) and a solution resin binder (4) as main ingredients is used as a transfer film ( 6) coated on one side to form a vehicle coating layer (5a);
The upper vehicle coating layer (5a) is applied to the transfer mold (10
), the pattern film (5b) is transferred onto the transfer substrate (9), and the surface of the transferred pattern film (5b) is coated with the powder (3) in the vehicle (5). A transferred object on which a continuous metal plating layer (5c) is formed using the catalytic metal (2) as a growth nucleus of the plating layer. [10] The transferred object according to claim [9], wherein the transfer substrate (9) is a flexible film selected from polyester, polyimide, polyimideamide, and cellophane. [11] The transferred object according to claim [9], wherein the transfer substrate (9) is a plate selected from polyester, polyimide, polyimideamide, and cellophane. [12] Claim No. 9, wherein the transferred pattern film (5b) is a pattern film selected from characters, codes, pictures, electrical lead wires, and printed wiring pattern films.
Materials to be transferred as described in Section. [13] The metal plating layer (5c) is copper, nickel, gold,
The transferred object according to claim 9, which is a metal plating layer selected from silver, platinum, or an alloy thereof. [14] (a) Coating the fine powder core (1) with the metal (2) to form a metal-coated powder (3); (b) forming the metal-coated powder (3) and the solution resin binder (4); (c) mix the mixed vehicle (5) to form a transfer film (6);
Coat one side of the vehicle coating layer (5
(d) Immediately after the vehicle coating layer (5a) on the transfer film (6) obtained through each of the above steps, or an adhesive layer (7) formed on the surface thereof. After pressing the back side of the transfer film (6) with a transfer mold (10) which is placed oppositely on the transfer base material (9) and has a desired pattern formed on the mold surface, the transfer film (6) is pressed. (6) to transfer base material (9)
), and a pattern film (5b) responsive to the pattern formed on the mold surface of the transfer mold (10) is transferred and formed on the transfer base material (9); The pattern film (5b) formation transfer substrate (9) is immersed in an electroless metal plating solution (11), and the metal coating powder (3) on the surface of the pattern film (5b) is removed.
A metal plating layer (5c) connected in series is formed. (F) A transfer forming method for a transfer object formed through the above-mentioned means. [15] The metal plating pattern film (5c) transferred and formed on the transfer base material (9) can contain characters, codes, pictures, electrical lead wires,
[16] The electroless metal plating solution (11) may contain copper, nickel, gold, copper, nickel, gold, The transfer forming method of a transfer target according to claim 14, wherein the electroless plating solution is selected from silver, platinum, or an alloy thereof. [17] The vehicle coating layer (5a) on the transfer film (6) is transferred to the transfer base material (9) by using the fusing force due to thermal melting of the resin binder (4) in the vehicle coating layer (5a). Claim No. [14]
] The method for forming a transfer of a transfer target according to item 1. [18] The adhesive of the adhesive layer (7) formed by coating the vehicle coating layer (5a) on the transfer film (6) on the surface of the vehicle coating layer (5a) is a pressure-sensitive adhesive. A method for forming a transfer object according to claim [14]. [19] A patent claim in which the transfer type (10) is a pressure-sensitive transfer type, and the adhesive of the adhesive layer (7) applied and formed on the surface of the vehicle coating layer (5a) is a pressure-sensitive adhesive. The method for forming a transfer object according to item [14]. [20] The transfer type (10) is a thermal transfer type, and the adhesive of the adhesive layer (7) applied and formed on the surface of the vehicle coating layer (5a) is a heat-sensitive adhesive. [14] The method for forming a transfer object according to item [14].
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61091495A JPS62259884A (en) | 1986-04-21 | 1986-04-21 | Transfer film, transferred article obtained using the same and transfer forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61091495A JPS62259884A (en) | 1986-04-21 | 1986-04-21 | Transfer film, transferred article obtained using the same and transfer forming method |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62259884A true JPS62259884A (en) | 1987-11-12 |
JPH0331596B2 JPH0331596B2 (en) | 1991-05-07 |
Family
ID=14027991
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61091495A Granted JPS62259884A (en) | 1986-04-21 | 1986-04-21 | Transfer film, transferred article obtained using the same and transfer forming method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62259884A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7727596B2 (en) * | 2004-07-21 | 2010-06-01 | Worcester Polytechnic Institute | Method for fabricating a composite gas separation module |
US8366805B2 (en) | 2007-04-05 | 2013-02-05 | Worcester Polytechnic Institute | Composite structures with porous anodic oxide layers and methods of fabrication |
CN112677669A (en) * | 2020-12-23 | 2021-04-20 | 苏州市深广印刷有限公司 | Holographic positioning accurate printing method |
-
1986
- 1986-04-21 JP JP61091495A patent/JPS62259884A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7727596B2 (en) * | 2004-07-21 | 2010-06-01 | Worcester Polytechnic Institute | Method for fabricating a composite gas separation module |
US8366805B2 (en) | 2007-04-05 | 2013-02-05 | Worcester Polytechnic Institute | Composite structures with porous anodic oxide layers and methods of fabrication |
CN112677669A (en) * | 2020-12-23 | 2021-04-20 | 苏州市深广印刷有限公司 | Holographic positioning accurate printing method |
Also Published As
Publication number | Publication date |
---|---|
JPH0331596B2 (en) | 1991-05-07 |
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