JPS62259669A - Soldering device - Google Patents

Abstract

PURPOSE:To improve the efficiency of a soldering treatment by providing the control driving system adjusting the initial soldering position inside the device and arranging the monitoring mechanism displaying the soldering part with its enlarging as well. CONSTITUTION:The 1st and 2nd robots 11A, 11B performing the part transportation and soldering treatment are provided on the device main body 10, a soldering mechanism 44 and TV camera 46 are arranged on the subarm of the robot 11A as well and a joining body transport and holding mechanism 48 is set up on the robot 11B. A motion mechanism is connected via a controller and driver to an operation part 120 to form a control driving system. A worker sets the joining body 112 to the body 114 to be joined via the mechanism 48 with the control driving system with monitoring by a monitor 12 and the soldering is automatically performed with the mechanism 44. Owing to the joining being automatically performed with monitoring by a monitor 12, the treatment efficiency is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a soldering device, and more particularly to a soldering device equipped with a soldering mechanism that dispenses a required amount of filamentous solder for soldering.

[Conventional technology]

Conventionally, as this type of soldering device, for example, the 11th soldering device
There is something like the one shown in the figure.

In FIG. 11, reference numeral 1 indicates a table for soldering work, and reference numeral 2 indicates a soldering robot as a soldering mechanism equipped on the table 1. This soldering robot 2 includes a robot arm 3 extending in a substantially inverted shape, a soldering iron 4 and a solder feeding part 5 attached to the tip of the robot arm 3, and a robot main body (not shown). It is configured. Among these, the robot main body has a control section in a part thereof, and a predetermined program for soldering is installed in this control section in advance.

For example, electronic components 6. ..., 6 inserted into the printed circuit board 7 is placed on the table 1, and when the device is driven, the solder between each electronic component 6 and the printed circuit board 7 is removed based on a predetermined program. Attachment is now done automatically.

[Problem that the invention seeks to solve]

However, in the conventional example described above, when mounting small components such as surface mount components on a printed circuit board, the soldering points are small and close to each other, so it is difficult to set the initial soldering position. If there is an unacceptable error, there is a problem in that even if subsequent program control is performed properly, disconnections or poor connections may occur, making it impossible to perform precise soldering.

[Purpose of the invention]

The present invention has been made in view of the problems of the conventional example, and it is possible to more easily and precisely set the initial position for soldering, thereby improving the work efficiency of the entire soldering process. The purpose of the present invention is to provide a soldering device that can perform the following steps.

[Means for solving problems]

Therefore, the present invention includes a soldering mechanism for soldering an object to be joined to an object to be joined, and an initial position adjustment means that can adjust the initial soldering position of this soldering mechanism, and the soldering mechanism The above objective is achieved by providing a monitoring mechanism that can enlarge and display the attached portion.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be described based on FIGS. 1 to 10. This embodiment shows the case where the present invention is implemented in a soldering apparatus exclusively for surface mount components.

In FIG. 1, the soldering apparatus is comprised of an apparatus main body 10 for performing the soldering process, and a monitor 12 as an image display means for displaying an image of the soldering portion of the apparatus main body 10.

The device main body 10 includes a first main body 10 for performing soldering processing, parts transportation, etc., which will be described later. 2nd Roboso) IIA,
IIB (orthogonal coordinate system) is provided on the left and right sides of FIG. The second robots IIA and IIB are installed on the board section 10A and a board stepped section 10B that is integrally provided on the rear side of the board section 10A in FIG. Here, the longitudinal direction of the board stepped portion 10B is defined as the X-axis direction.

As shown in FIG. 2, a round hook 14 is fixed and horizontally suspended in the X-axis direction within the board stepped portion 10B. In this round rack 14, the first and second robots 1
The gear 16A is the drive pulse motors 16 and 18 for the motors 1A and 11B.

18A are arranged so as to be able to engage with the round hooks 14, respectively. Furthermore, these pulse motors 16 and 18 are respectively mounted on long plate-shaped arms 20 and 22 that are installed horizontally in the Y-axis direction with respect to the nine racks 14.
22 are completely housed in boxes 24 and 26, respectively (see FIG. 1). In addition, this box body 24, 2
Rotating wheels (not shown) are arranged at both ends of 6.
It is movable along the groove in the X-axis direction of the board surface portion 10A. Therefore, as the pulse motor 16.degree. 18 rotates, the entire box bodies 24, 26 are rotated.

That is, the first. The second robots IIA and IIB become movable within a predetermined range in the X-axis direction.

Also, inside the boxes 24 and 26, there is a first casing as shown in FIG. Round racks 32.degree. 34 for moving the second robots 11A and 11B in the Y-axis direction are fixedly installed on the boxes 24 and 26, respectively. This round rack 32.34
, the pulse motors 36 and 38 are connected to the gear 36A.
, 38A are arranged so as to be able to engage with the round racks 32 and 34, respectively. The pulse smokes 36 and 38 are respectively mounted on the horizontal portions of sub-arms 40 and 42 having an oval-shaped side surface. Furthermore, the sub-arms 40 and 42 are fitted into and guided by the arms 20 and 22, respectively, and are movable in the Y-axis direction. Of these, the vertical portion of the sub-arm 40 on the side of the first robot IIA is equipped with a soldering mechanism 44, which will be described later, and a television camera 46 as an imaging means.

On the other hand, the vertical portion of the sub-arm 42 on the side of the second robot IIB is equipped with a bonded material transport and holding mechanism 48, which will be described later. Therefore, when the pulse motors 36 and 38 are each driven to rotate based on a predetermined command signal, the soldering mechanism 44, the television camera 46, and the joint transporting and holding mechanism 48 can each independently move in the Y-axis direction. .

Here, the television camera 46 and the monitor 12 constitute a monitoring mechanism.

Furthermore, the soldering mechanism 44 and television camera 46 on the first robot IIA side will be described in detail.

As mentioned above, on one side wall of the vertical portion of the sub-arm 40 movable in the Y-axis direction, there is a holder 50.5 having a substantially U-shaped side surface.
0 is fixed as shown in Fig. 3, and this holder 50.5
0 is provided with a round rack 52 and a column 54 that can be loosely inserted in the vertical direction. The bottoms of the round rack 52 and the pillars 54 are fixed to a long piece-shaped fixing plate 56 having a recessed portion 56A in a portion thereof, as shown in the figure. Further, the upper portions of the round rack 52 and the support column 54 are wound up onto the upper end of the sub-arm 40 by a thin film-like constant pressure spring 60 via a support plate 58.

Further, the round rack 52 is connected to a pulse motor 62 for vertical movement disposed on the other side wall of the vertical portion of the sub-arm 40.
It is designed to mesh with the gear 62A. For this reason,
Is this pulse motor 62 a prescribed system? When rotated based on the ffU signal, the entire fixed plate 56 becomes movable within a predetermined range in the Z-axis direction as shown. In this case, the constant pressure spring 60 functions to keep the load on the pulse motor 62 constant during vertical movement.

Furthermore, a shaft 64 of a predetermined height is provided upright in the recess 56A of the fixing plate 56 as shown in the figure. At the upper end of this shaft 64, a flat plate-like hand 66 whose entire shape is substantially square is arranged so as to be rotatable within a predetermined range. Concrete ÷ this is,
As shown in the figure, a neck portion 66A extending from a part of the hand 66 is rotatably supported by a shaft 64. Also, a solenoid 68 is mounted on one end of the fixed plate 56. , the shaft 68A of this solenoid 68 is locked in a predetermined position of the hand 66 via a stopper 70. Therefore, when an excitation current flows through the solenoid 68, the entire hand 66 is moved in the direction of arrow A due to the attractive force. (See FIG. 3), the hand 66 is horizontally rotated about the shaft 64 to the stopper 72 position.
A spring 74 is stretched between 6A and the fixed plate 56 as shown in the figure, so that when the excitation current to the solenoid 68 is turned off, the hand 66 can immediately return to its original position. It looks like this. Here, hand 66
As shown in FIG. 3, a reel mounting portion 78 for mounting a reel of thread solder 76 is provided in a part thereof.

Further, below the hand 66 in FIG. 3, a soldering means 80 is suspended and provided.

To explain this in detail, first, at a position of the hand 66 facing the lens portion 46A of the television camera 46, a circular hole 66B with a predetermined radius for image pickup is provided. This round hole 66
As shown in FIG. 4, a hollow shaft 82 is fixed to the lower surface of B, and a cylindrical block 84 having a ring gear 84A is arranged around this hollow shaft 82 so as to be rotatable within a predetermined range. There is.

For the ring gear 84A, the hand 66
A gear 86A of a pulse motor 86 fixed to the upper surface side of the motor 86 meshes with the gear 86A of the pulse motor 86. Therefore, when this pulse motor 86 rotates, the block 84 will rotate.

Further, as shown in FIG. 5, the block 84 has a generally fan-shaped holding plate 88 fixedly attached to its side. A soldering iron 90 as the soldering means 80 and a hollow pipe 92 are fixed at a predetermined angle on the side wall of the block 84 of the holding plate 88.
The 0A portion is set to match the focus of the television camera 46. On the other hand, the thread solder 76 wound around the reel attachment part 78 is guided to the hollow pipe 92, reaches the iron tip 90A, and is used for soldering. In this case, a notch 92 is formed in a part of the hollow pipe 92.
A is formed as shown, and a thread solder 76 passes through it.
is configured to come into contact with a gear 94A of a solder feeding pulse motor 94 installed on the opposite side of the holding plate 88. For this reason, the pulse motor 94 is controlled? ff1
By doing this, the amount and speed of the solder thread 76 to be fed out can be controlled. Here, in FIG. 5, 9G indicates a solder guide for the thread solder 76, and 97A997B indicates a stopper for the soldering iron 90. In addition, the soldering iron 9
0 has a heater for heating solder in its long shaft portion, and its tip 90A has a removable structure so that it can be changed depending on the application.

Therefore, when the pulse motor 86 on the hand 66 is rotated by a predetermined control signal, the block 84. Holding plate 88. and the soldering means 80 rotate as one (see arrow B in FIG. 3). This rotation range is set to approximately 300 degrees in this embodiment, and the soldering direction of the soldering iron tip 90A changes little by little as the soldering iron tip 90A rotates. Therefore, the soldering direction can be adjusted by changing the rotation angle, and the structure allows soldering from an appropriate angular direction, making it possible to easily cope with changes in the soldering direction depending on the component. In this case, even if the rotation angle changes, the tip 9
The position of 0A always indicates a fixed point.

On the other hand, the television camera 46 is fixed to the upper end of the sub-arm 40, and its lens portion 46A is always capable of capturing an image of the soldering tip 90A below. Further, the focal length and magnification can also be adjusted by adjusting the lens portion 46A.

Next, the joint transport and holding mechanism 48 provided on the second robot IIB side will be described in detail.

This mechanism 48 is provided in substantially the same manner as the soldering mechanism 44 on one side wall of the vertical portion of the sub-arm 42 movable in the Y-axis direction as described above. That is, the sixth
As shown in the figure, a holder 9 installed horizontally on the sub-arm 42
6.96 and a round rack 9 arranged so that it can be loosely inserted into these.
8 and the pillar 100, and a pulse motor 101 which is fixed to the round rack 98 so as to be able to engage with it by a gear 101A, so that it can move up and down, that is, in the Z-axis direction. The bottoms of the round rack 98 and the support column 100 are fixed to a square plate-shaped hand 102 provided in the horizontal direction, forming an L-shape as a whole.

Here, 103 indicates a constant pressure spring that functions similarly to the one described above.

The hand 102 is equipped with a pulse motor 10 for rotational driving.
4 is installed as shown in the figure, and its output shaft is connected to hand 1.
02, it engages with a rectangular guide block 106.

Therefore, when the pulse motor 104 performs a predetermined rotation,
The entire guide plotter 106 is oriented as shown by arrow C.
It is configured to be rotatable (within a range of 90° in this embodiment).

A first leaf spring 1F38A formed in a key shape is fixed to the tip of the guide block 106.

Further, on the lower surface side of the guide plotter 106, a second temporary spring 108B, which is also shaped like a key, is attached with an arrow D (see Fig. 6.7).
It is arranged so that it can be slid and moved as shown in the figure. As shown in FIG. 7, a linear pulse smoke 110 fixed to the back side of the guide block 106 is configured to act on the second leaf spring 108B. That is,
When the rotor of the linear pulse motor 110 rotates, its output shaft 110A moves in a straight line, which causes the second temporary spring 1
08B, and the second leaf spring 108B performs a rectilinear movement. As a result, the first. Second
leaf spring 108A.

108B, as shown in FIG.
7 (see Figure 1). This first. Second leaf spring 108A.

The vertical portion of 108B is set relatively long in this embodiment, so that the printed circuit board 1 as the object to be bonded is
14 (see Figure 1) so that there is no problem even if there are other tall components on top of the electronic component 112, and the spring effect prevents the electronic component 112 from easily coming off during transportation. It is considered. Also, 1st. Loose 11i Ct is attached to the portions of the second temporary springs 108A and 108B that contact the electronic component 112.

Incidentally, on the panel surface portion 10A of the apparatus main body 10, there are four cross-sectional board holders 116. . . , 116 are arranged at predetermined intervals. Each board holder 116 is
This prevents the printed circuit board 114 from shifting in the horizontal direction and allows the printed circuit board 114 to be mounted in a detachable manner.

Next, the electric circuit configuration of this embodiment will be explained based on FIG. 8.

In this FIG. 8, reference numeral 120 indicates an operating section through which an operator gives instructions. This operation unit 120 includes a controller 122. It is coupled to an operating mechanism 126 via a driver 124 . In this embodiment, this operating mechanism 126 includes each of the aforementioned pulse motors 16A, 18A, . . .
, 110, and a sensor section 126B consisting of positioning sensors.

Each drive circuit of the driver 124 and the motor section 1
It is configured to have a one-to-one correspondence with each motor of 26A,
Further, the detection signal of the sensor section 126B is transmitted to the controller 122.
It is configured to be output to .

Here, the operation section 120. Controller 122, driver 129. The control drive system 127 of this device is composed of the operating mechanism 126 and the operating mechanism 126 . The control drive system 1.27 also functions as an initial position adjustment means for adjusting the initial position of soldering, as will be described later.

Therefore, when the operation unit 120 is operated, a predetermined operation signal is output to the controller 122. Then, the controller 122 outputs a control signal to the driver 124 according to a preset program, and outputs a control signal to the motor unit 126.
Each motor of A can be driven independently. In addition, for the control +B drive system 127, the operating mechanism 127 is controlled by the operator manually operating the operating section 120.
6 motor section 126A can be driven.

The operation section 120 is integrated into the front right side of the panel section 10A in FIG. 1, and can be operated by the operator while looking at the screen of the monitor 12.

Further, the television camera 46 is connected to the monitor 12 via an amplifier 128° mixer 130. Among these, the mixer 130 receives the cursor signal output from the controller 122 and synthesizes it into a video signal.

Therefore, the monitor 12 displays an enlarged image with a "cross-shaped" cursor built into the center of the screen (see FIG. 10). This cursor indicates the soldering position, and here it is set to match the tip of the soldering iron tip 90A. Therefore, positioning for soldering is facilitated.

Next, the overall operation and operating procedure of this embodiment will be explained.

First, the operator inserts the printed circuit board 114 into the panel section 10.
Set each board holder 116 at a predetermined position in A, and set the electronic component 112 at a predetermined position on the component supply plate 107.

Then, while watching the image on the monitor 12, the TV camera 4
6. That is, the soldering mechanism 44 is moved to a predetermined position on the XY plane.

Next, by giving a predetermined command from the operating section 120, the bonded material transporting and holding mechanism 48 moves along the predetermined X-Y-Z axes as described above based on a preset program. As a result, the electronic component 112 is transported to just below the television camera 46. In this case, the soldering mechanism 44 is temporarily retracted by the suction force of the solenoid 68 so as not to become an obstacle to the movement of the bonded object conveying and holding mechanism 48 (the state indicated by the imaginary line P in FIG. 3).

As a result, the electronic component 112 is first connected to the television camera 46.
When the electronic component 112 is within the field of view, an enlarged image of the entire electronic component 112 can be obtained on the monitor 12, as shown in FIG. 9, for example. Therefore, the optimal position (initial position) can be determined more accurately and in a short time by making fine adjustments in a well-balanced manner while taking into account all the positions of the pins 112A relative to the printed pattern 114 of the printed circuit board 114. However, the electronic component 112 is held in the holding portion 108 and pressed to a predetermined position on the printed circuit board 114 with an appropriate pressure.

Next, a cross-shaped cursor is inserted on the screen of the monitor 12 by a predetermined operation, and this cursor is aligned with the soldering point. Then, when you start the soldering operation,
The solenoid 68 is no longer energized and the soldering mechanism 44 returns to its original position. At this time, for example, the first
An image as shown in Figure 0 is obtained.

Then, the pulse motor 86 of the soldering mechanism 44 is driven under predetermined program control, and the soldering iron tip 90A of the soldering iron 90 moves to the part to be soldered, and is lowered by the pulse motor 62.

Furthermore, the required amount of thread solder 76 is fed out by the pulse motor 94 at a predetermined timing, and the soldering process to the soldering part is automatically performed. This process is subsequently performed on other bins 112A.

When this soldering process is completed, each mechanism automatically returns to its original position. The above-described operations are then repeated based on the operator's instructions.

Here, as mentioned above, the first. 2nd robot) 11A
, 11B, the automatic drive operation of each mechanism is controlled by the control section 1.
It is controlled based on a program preset in 22. Therefore, the operating procedure can be easily changed by changing the program.

As described above, in this embodiment, the soldering part can be positioned by manually operating the operation unit 120 while looking at the monitor 12, and the initial setting can be performed reliably and precisely. It can be subjected to a soldering process. Therefore, there is an advantage that soldering defects caused by misalignment of initial settings can be significantly reduced. In addition, during automatic soldering processing, poor joints such as solder bridges can be easily discovered using the monitor 12, so taking measures such as immediately stopping the work can improve overall work efficiency. Improvements can be made. Furthermore, since the operator can perform the above-described initial setting and subsequent monitoring while taking a posture with less fatigue than in the conventional example, the burden on the operator can be reduced accordingly.

Furthermore, in this embodiment, the clamping part 108 of the bonded object conveying and holding mechanism 48 continuously carries and holds the electronic component 112, so there is no need for the operator or other mechanism to hold the electronic component 112 again. It is possible to improve divisional work efficiency.

On the other hand, if the electronic component 112 has been soldered where the soldering mechanism 44 is required (for example, soldering only to one row of pins in an IC),
Even during the remaining soldering process, processing time can be saved by controlling the holding part 108 to carry the next electronic component 112.

In the above embodiment, the monitoring mechanism is configured to be applied to both the initial setting of the soldering position and the monitoring of the soldering process, but the present invention is not necessarily limited to this (for example, the monitoring mechanism is applied to both the initial setting of the soldering position The configuration may be applied only to settings, and the overall configuration may be made more MiiV-like.Furthermore, although the above embodiments have been described as implementations for a soldering device dedicated to surface-mounted components, the present invention does not necessarily apply to this. Without limitation, it can be applied to, for example, a normal printed circuit board (i.e., soldered on the back side), and in that case, if necessary, the bonded material transport and holding mechanism may be removed to create a simpler configuration. In addition, the objects to be bonded and the objects to be bonded are not necessarily limited to electronic components and printed circuit boards, but may be other mechanical components and machines. Roboso l-1
1A.

11B to carry out the soldering process under program control; however, the present invention is not limited to this, and the operator may manually operate the operating section while looking at the monitor.
The present invention is also applicable to soldering one location at a time.

Further, the monitor serving as the image display means may be provided with a memory section so as to be able to freely process image signals, for example. Further, the cursor on the monitor screen may be removed as necessary.

〔Effect of the invention〕

As described above, according to the present invention, the operator can more easily and precisely adjust the position where the soldering mechanism first performs soldering using the initial position adjustment means while viewing the enlarged image provided by the monitoring mechanism. Therefore, it is possible to significantly reduce the occurrence of joint defects during subsequent soldering processing.

In addition, since the monitoring mechanism allows you to obtain an enlarged image of the soldering location during processing, joint defects such as solder blips can be detected in a timely and easy manner, and appropriate measures such as discontinuing the process can be taken as necessary. be able to. Therefore, with these features, it is possible to provide an unprecedented and excellent soldering device that can perform more accurate soldering processing with remarkable efficiency.

[Brief explanation of drawings]

FIG. 1 is a schematic perspective view showing one embodiment of the present invention, FIG. 2 is a schematic perspective view showing the driving parts of the two orthogonal coordinate system robots in FIG. 1, and FIG. 4 is a side view showing details of the soldering means in FIG. 3; FIG. 5 is a left side view with a portion of FIG. 4 omitted; FIG. 6 is a schematic perspective view showing a soldering mechanism and a television camera; 1 is a schematic perspective view showing the joint transport and holding mechanism in FIG. 1, FIG. 7 is a side view for explaining the holding part in FIG. 6, and FIG. 8 is a schematic diagram showing the electric circuit configuration in FIG. 1. The block diagram, FIGS. 9 and 10 are explanatory views each showing an example of a monitor screen, and FIG. 11 is a schematic perspective view showing a conventional example. 12...Monitor as a video display means constituting the main part of the monitoring mechanism, 44...Soldering mechanism,
46...Television camera as an imaging means constituting the main part of the monitoring mechanism, 112...Electronic component as a bonded object, 114...Print as a bonded object Board, 127...Control drive system as initial position adjustment means. Patent applicant: Tokyo Co., Ltd. Keikiki Figure 4 Figure 5 Figure 6 Figure 7 Figure 9 Figure 1O Figure 11

Claims (2)

[Claims] (1) A soldering mechanism for soldering an object to be welded to an object to be welded, and an initial position adjustment means capable of adjusting an initial soldering position of this soldering mechanism, and a soldering portion by the soldering mechanism. A soldering device characterized by being equipped with a monitoring mechanism capable of displaying enlarged images. (2) The monitoring mechanism includes an imaging device that takes an enlarged image of the soldered part and outputs video information corresponding to the image, and a video display that displays an enlarged video based on the video information output from the imaging device. A soldering device according to claim 1, characterized in that it is constituted by means.