JPH0245950B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a soldering device, and more particularly to a soldering device equipped with a soldering device that performs soldering by paying out a required amount of filamentous solder.

[Conventional technology]

Conventionally, as this type of soldering device, there is one shown in FIG. 11, for example.

In FIG. 11, reference numeral 1 indicates a table for soldering work, and reference numeral 2 indicates a soldering robot as a soldering mechanism equipped on the table 1. This soldering robot 2 includes a robot arm 3 extending in a substantially inverted L shape, a soldering iron 4 and a solder feeding part 5 attached to the tip of the robot arm 3, and a robot main body (not shown). It is configured. Among these, the robot main body has a control section in a part thereof, and a predetermined program for soldering is installed in this control section in advance.

For example, when the device is driven after the printed circuit board 7 into which the electronic components 6, ..., 6 are inserted is placed on the table 1, each electronic component 6 and the printed circuit board 7 are connected based on a predetermined program. The soldering between them is automatically done.

[Problem that the invention seeks to solve]

However, in the conventional example described above, when mounting small components such as surface mount components on a printed circuit board, the soldering points are small and close to each other, so it is difficult to set the initial soldering position. If there is an unacceptable error, even if the subsequent program control is performed properly, there is a problem in that the soldering process cannot be performed accurately due to disconnections or poor connections.

[Purpose of the invention]

The present invention has been devised in view of the problems of the conventional example, and provides a soldering system that can more easily set the initial position for soldering, thereby improving the work efficiency of the entire soldering process. Its purpose is to provide a mounting device.

[Means for solving problems]

Therefore, in the present invention, a soldering mechanism is freely transported to a position opposite to the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the soldering work point on the workpiece to be joined. and a second robot that freely transports and places the object to be joined so that the soldering location of the object coincides with the soldering work point on the object. The first robot is equipped with a television camera that continuously displays the operating moments of the soldering mechanism on a television monitor. A hand support plate is installed on the soldering work point side of the television camera so as to be orthogonal to the direction of the television camera, and a soldering mechanism is attached to the first robot via this solder support plate. . A through hole of an appropriate size is provided in the hand support plate portion on the straight line connecting the television camera and the soldering work point. The first robot is equipped with an avoidance movement mechanism for temporarily moving the hand support plate equipped with the soldering mechanism from the soldering work point to another area as necessary. This aims to achieve the above-mentioned purpose.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to FIGS. 1 to 10.
This will be explained based on the diagram. This embodiment shows the case where the present invention is implemented in a soldering apparatus dedicated to surface mount components.

In FIG. 1, the soldering apparatus is comprised of an apparatus main body 10 for performing the soldering process, and a monitor 12 as an image display means for displaying an image of the soldering portion of the apparatus main body 10.

The apparatus main body 10 is provided with first and second robots 11A and 11B (orthogonal coordinate system) on the left and right sides of FIG. 1, respectively, for performing soldering processing, component transportation, etc., which will be described later. These first and second robots 11A and 11B are connected to the board part 10A and the board part 10.
It is equipped with a board stepped portion 10B that is integrally provided on the rear side of A in FIG. Here, the longitudinal direction of the board stepped portion 10B is defined as the X-axis direction.

As shown in FIG. 2, inside the board stepped portion 10B,
A round rack 14 is fixedly suspended horizontally in the X-axis direction. And this round rack 14 has the first,
The driving pulse motors 16, 18 for the second robots 11A, 11B are connected to their gears 16A, 18A.
are arranged so that they can be engaged with the round racks 14. Furthermore, these pulse motors 16, 18
are mounted on long plate-shaped arms 20 and 22 that are horizontally installed in the Y-axis direction with respect to the round rack 14, and the arms 20 and 22 are entirely attached to the box body 2.
4 and 26, respectively (see Fig. 1).

Furthermore, rotary wheels (not shown) are disposed at both ends of the boxes 24 and 26, and are movable along the grooves in the X-axis direction of the board section 10A. Therefore, as the pulse motors 16 and 18 rotate, the entire boxes 24 and 26, that is, the first and second robots 11A and 11B, are movable within a predetermined range in the X-axis direction.

Furthermore, inside the boxes 24 and 26, the first and second robots 11A and 11B are installed as shown in FIG.
Round racks 32 and 34 for axial movement are fixedly installed on the boxes 24 and 26, respectively.
Pulse motors 36, 38 are disposed with respect to the round racks 32, 34 so that their gears 36A, 38A can be engaged with the round racks 32, 34, respectively.

The pulse motors 36 and 38 are mounted on horizontal portions of sub-arms 40 and 42, respectively, which have substantially L-shaped sides. Furthermore, the sub-arms 40 and 42 are the arm 2
0 and 22, respectively, and are guided so as to be movable in the Y-axis direction. Of these, the vertical portion of the sub-arm 40 on the side of the first robot 11A is equipped with a soldering mechanism 44, which will be described later, and a television camera 46 as an imaging means.

On the other hand, the sub arm 4 on the second robot 11B side
2, there is a joint holding mechanism 48, which will be described later.
is equipped with. For this reason, the pulse motor 3
6 and 38 are each rotated based on a predetermined command signal, the soldering mechanism 44, the television camera 46, and the bonded object holding mechanism 48 are each independently operated by Y.
It becomes possible to move in the axial direction.

Here, the television camera 46 and the monitor 12 constitute a monitoring mechanism.

Furthermore, the soldering mechanism 44 and television camera 46 on the first robot 11A side will be described in detail.

As mentioned above, the sub-arm 4 is movable in the Y-axis direction.
As shown in FIG. 3, holders 50, 50 having a substantially U-shaped side surface are fixed to one side wall of the vertical portion of 0. A round rack 52 and a support post 54 are provided. The bottom portions of the round rack 52 and the support column 54 are fixed to a long piece-shaped fixing plate 56 having a recessed portion 56A in a portion thereof, as shown in the figure.

Further, the upper portions of the round rack 52 and the support column 54 are wound up onto the upper end of the sub-arm 40 by a thin film-like constant pressure spring 60 via a support plate 58. The round rack 52 is adapted to mesh with a gear 62A of a pulse motor 62 for vertical movement disposed on the other side wall of the vertical portion of the sub-arm 40. Therefore, when the pulse motor 62 rotates based on a predetermined control signal, the entire fixed plate 56 becomes movable within a predetermined range in the Z-axis direction as shown in the figure. In this case, the constant pressure spring 60 functions to keep the load on the pulse motor 62 constant during vertical movement.

Furthermore, a shaft 64 of a predetermined height is provided upright in the recess 56A of the fixed plate 56 as shown in the figure. This axis 6
A flat hand support plate 66, which is generally rectangular in its entirety, is disposed at the upper end of the hand support plate 4 so as to be rotatable within a predetermined range. Specifically, a neck portion 66A extending from a part of the hand support plate 66 as shown in the figure is attached to the shaft 64.
It is rotatably supported by. Further, a solenoid 68 is mounted on one end of the fixed plate 56, and a shaft 68A of the solenoid 68 is locked at a predetermined position on the hand support plate 66 via a stopper 70. Therefore, when an excitation current flows through the solenoid 68, the attraction force causes the entire hand support plate 66 to move toward the shaft 64 in the direction of arrow A (see FIG. 3).
It will be horizontally rotated about the position of the stopper 72.

Further, a spring 74 is stretched between the neck 66A of the hand support plate 66 and the fixed plate 56 as shown in the figure, so that when the excitation current to the solenoid 68 is turned off, the hand support The plate 66 can be immediately returned to its original position.
Here, the hand support plate 66 has a reel attachment portion 7 on which a reel of thread solder 76 is attached.
8 as shown in Fig. 3.

Below the hand support plate 66 in FIG.
A soldering means 80 is suspended and provided. To explain this in more detail, first, a circular hole 66B with a predetermined radius for imaging is provided at a position of the hand support plate 66 facing the lens portion 46A of the television camera 46. A hollow shaft 82 is fixed to the lower surface of the round hole 66B as shown in FIG. 4, and a block 84 having a ring gear 84A is arranged around the hollow shaft 82 so as to be rotatable within a predetermined range. It is set up. A gear 86A of a pulse motor 86 fixed to the upper surface of the hand support plate 66 meshes with the ring gear 84A. Therefore, when the pulse motor 86 rotates, the block 84 rotates.

That is, this pulse motor 86 and gear 86A
and ring gear 84A.
A rotation mechanism for 0 is formed.

In addition, the block 84, as shown in FIG.
A substantially fan-shaped holding plate 88 is fixedly attached to the side thereof. A soldering iron 90 as a soldering means 80 is mounted on the side wall of the holding plate 88 on the block 84 side.
and a hollow pipe 92 are fixed at a predetermined angle, and the tip 90A of the soldering iron 90 is set to be in focus of the television camera 46.

On the other hand, the thread solder 76 wound around the reel attachment part 78 is guided to the hollow pipe 92, reaches the iron tip 90A, and is used for soldering. In this case, a notch 92A is formed in a part of the hollow pipe 92 as shown in the figure, and the thread solder 76 passing therethrough is connected to the gear of a pulse motor 94 for feeding solder installed on the opposite side of the holding plate 88. 94
It is configured to come into contact with A. Therefore, by controlling the pulse motor 94, the thread solder 7
It is possible to control the feeding amount and feeding speed of 6. Here, in FIG. 5, 95 indicates a soldering guide for the thread solder 76, and 97A and 97B indicate the soldering iron 9.
0 stop is shown. Further, the soldering iron 90 has a heater for heating solder in its long shaft portion, and the soldering iron tip 90A has a removable structure so that it can be changed depending on the application.

Therefore, the pulse motor 8 on the hand support plate 66
6 rotates under the influence of a predetermined control signal, the block 84, the holding plate 88, and the soldering means 80
rotate as a unit (see arrow B in Fig. 3).

That is, the shaft 64, solenoid 68, and spring 74 provided at the corner of the hand support plate 66 allow
An avoidance movement mechanism for the soldering mechanism 44 is formed. This rotation range is set to approximately 300 degrees in this embodiment, and the soldering direction of the soldering iron tip 90A changes little by little as the soldering iron tip 90A rotates. Therefore, the soldering direction can be adjusted by changing the rotation angle, and the structure allows soldering from an appropriate angular direction, making it possible to easily cope with changes in the soldering direction depending on the component. In this case, even if the rotation angle changes, the position of the iron tip 90A always points to a fixed point.

On the other hand, the television camera 46 is fixed to the upper end of the sub-arm 40, and its lens portion 46A is
The lower part of the soldering iron tip 90A can always be imaged. In addition, the focal length and magnification are also determined by the lens portion 46A.
This has been made possible by adjusting the

Next, the joint holding mechanism 48 provided on the second robot 11B side will be described in detail.

This joint holding mechanism 48 is provided in substantially the same manner as the soldering mechanism 44 on one side wall of the vertical portion of the sub-arm 42 movable in the Y-axis direction as described above. That is, as shown in FIG. 6, holders 96, 96 installed horizontally on the sub-arm 42,
It can be moved up and down, that is, in the Z-axis direction, by a round rack 98 and a column 100 that are loosely inserted into these, and a pulse motor 101 that is fixed to the round rack 98 so that it can be engaged with a gear 101A. It is composed of Then, the round rack 98 and the pillar 1
The bottom of 00 is fixed to a rectangular plate-shaped hand 102 provided in the horizontal direction, forming an L-shape as a whole. Here, 103 indicates a constant pressure spring that functions similarly to the one described above.

A pulse motor 104 for rotational driving is attached to the hand 102 as shown in the figure, and its output shaft engages with a rectangular guide block 106 below the hand 102. Therefore, when the pulse motor 104 performs a predetermined rotation, the entire guide block 106 is configured to be able to rotate in the direction shown by the arrow C (within a range of 90 degrees in this embodiment).

A first leaf spring 108A shaped like a key is fixed to the tip of the guide block 106. Moreover, on the lower surface side of the guide block 106,
The second leaf spring 108B, which is also key-shaped, is indicated by arrow D.
It is arranged so that it can slide and move as shown in FIGS. 6 and 7. This second leaf spring 108
As shown in FIG. 7, a linear pulse motor 110 fixed to the back side of the guide block 106 acts on the motor B. As shown in FIG. That is,
When the linear pulse motor 110 rotor rotates,
The output shaft 110A moves in a straight line, and this
is transmitted to the second leaf spring 108B.
8B performs a straight movement. With this, the holding part 1
The first and second leaf springs 108A and 10 as 08
8B, as shown in FIG. 6, can hold an electronic component (for example, an IC component) 112 as a bonded object from the component supply plate 107 (see FIG. 1). These first and second leaf springs 108A, 108B
The vertical portion of the board is set relatively long in this embodiment, so that there is no problem even if there are other tall components on the printed circuit board 114 (see Figure 1) as the object to be bonded. It is designed to prevent the electronic component 112 from easily coming off during transportation due to its curved shape and spring effect. In addition, the first and second leaf springs 108A, 10
A cushioning material is attached to the portion of 8B that comes into contact with the electronic component 112.

By the way, four key-shaped board holders 116, . Each board holder 116 prevents the printed circuit board 114 from shifting in the horizontal direction, and also allows the printed circuit board 114 to be placed thereon in a detachable manner.

Next, the electric circuit configuration of this embodiment will be explained based on FIG. 8.

In this FIG. 8, reference numeral 120 indicates an operating section through which an operator gives instructions. This operation section 12
0 is coupled to an operating mechanism 126 via a controller 122 and a driver 124. In this embodiment, the operating mechanism 126 includes a motor section 126A consisting of the aforementioned pulse motors 16A, 18A, . . . , 110, and a sensor section 126B consisting of positioning sensors. Each driver circuit of the driver 124 and each motor of the motor section 126A are configured to have a one-to-one correspondence, and the detection signal of the sensor section 126B is output to the controller 122.

Here, the operation section 120, the controller 12
2, the driver 129, and the operating mechanism 126 constitute a control drive system 127 of this device.
The control drive system 127 also functions as an initial position adjusting means for adjusting the initial position of soldering, as will be described later.

Therefore, when the operation unit 120 is operated, a predetermined operation signal is output to the controller 122. The controller 122 sends control signals to the driver 12 according to a preset program.
4, so that each motor of the motor section 126A can be driven independently. In addition, for the control drive system 127, the operator
By manually operating 0, the motor section 126A of the operating mechanism 126 can be driven.

The operating section 120 is integrated into the front right side of the panel section 10A in FIG. 1, so that the operator can operate it while looking at the screen on the monitor 12.

Furthermore, the television camera 46 is connected to the monitor 12 via an amplifier 128 and a mixer 130. Of these, the mixer 130 receives the cursor signal output from the controller 122 and synthesizes it into a video signal. For this reason,
The monitor 12 displays an enlarged image with a "cross-shaped" cursor built into the center of the screen (see FIG. 10). This cursor indicates the soldering position, and is set here to match the tip of the soldering iron tip 90A. Therefore, positioning for soldering is facilitated.

Next, the overall operation and operating procedure of this embodiment will be explained.

First, the operator sets the printed circuit board 114 in the predetermined position of each board holder 116 on the board section 10A, and then places the electronic component 112 on the component supply plate 107.
set in the specified position.

Then, while viewing the image on the monitor 12, the television camera 46, ie, the soldering mechanism 44, is moved to a predetermined position on the XY plane.

Next, by giving a predetermined command from the operation unit 120, the bonded object holding mechanism 48 moves to a predetermined X-Y position as described above based on a preset program.
−Move along the Z axis. As a result, the electronic component 112 is transported to just below the television camera 46. In this case, the soldering mechanism 44 is temporarily retracted by the suction force of the solenoid 68 so as not to interfere with the movement of the bonded object holding mechanism 48 (the state indicated by the imaginary line P in FIG. 3).

As a result, when the electronic component 112 first enters the field of view of the television camera 46, an enlarged image of the entire electronic component 112 is displayed on the monitor 12, for example, on the ninth screen.
Obtained as shown in the figure. Therefore, the printed circuit board 114
pin 112 opposite the printed pattern 114 of
The optimum position (initial position) can be determined more accurately and within a short time by making fine adjustments in a well-balanced manner while considering all positions of A. Moreover, while the electronic component 112 is held by the holding part 108,
It is pressed into a predetermined position on the printed circuit board 114 with appropriate pressure.

Next, a cross-shaped cursor is inserted on the screen of the monitor 12 by a predetermined operation, and the cursor is aligned with the soldering point. When the soldering operation is started, the solenoid 68 is no longer energized and the soldering mechanism 44 returns to its original position. At this time, an image as shown in FIG. 10, for example, is obtained from the monitor 12.

Then, the pulse motor 86 of the soldering mechanism 44 is driven under predetermined program control, and the tip 90A of the soldering iron 90 moves to the part to be soldered, and is lowered by the pulse motor 62. Furthermore, the required amount of thread solder 76 is fed out by the pulse motor 94 at a predetermined timing, and the soldering process to the soldering part is automatically performed.
This process is subsequently performed on the other pins 112A.

When this soldering process is completed, each mechanism automatically returns to its original position. The above-described operations are then repeated based on the operator's instructions.

Here, as described above, the automatic drive operation of each mechanism of the first and second robots 11A and 11B is controlled based on a program set in the control section 122 in advance. Therefore, the operating procedure can be easily changed by changing the program.

As described above, in this embodiment, the soldering part can be positioned by manually operating the operation unit 120 while looking at the monitor 12, and the initial setting can be performed reliably and precisely. It can be subjected to a soldering process. Therefore, there is an advantage that soldering defects caused by misalignment of initial settings can be significantly reduced. In addition, during automatic soldering processing, it is possible to easily detect joint defects such as solder bridges using the monitor 12, so by taking measures such as immediately stopping the work, the overall It is possible to improve work efficiency. Furthermore,
Since the operator can perform the above-mentioned initial setting and subsequent monitoring while taking a posture with less fatigue than in the conventional example, the burden on the operator can be reduced accordingly.

Furthermore, in this embodiment, since the holding part 108 of the bonded object holding mechanism 48 continuously carries and holds the electronic component 112, there is no need for the operator or other mechanism to hold the electronic component 112 again. Work efficiency can be improved.

On the other hand, the soldering mechanism 44 is used to solder the electronic component 112 at a necessary location (for example, an IC
If soldering is performed only on the pin row on one side, the holding portion 108 will hold the next electronic component 112 even during the remaining soldering.
It is also possible to save processing time by controlling the transportation of the material.

In the above embodiment, the monitoring mechanism is configured to be applied to both the initial setting of the soldering position and the monitoring of the soldering process, but the present invention is not necessarily limited to this. It is also possible to simplify the overall configuration by applying the configuration only to the following. In addition, although the embodiments have been described with respect to a soldering device dedicated to surface-mounted components, the present invention is not necessarily limited to this, and may be applied to, for example, a normal printed circuit board (i.e., soldering on the back side). is also applicable, and in that case, the bonded object holding mechanism may be removed as necessary to provide a simpler configuration. Furthermore, the objects to be bonded and the objects to be bonded are not necessarily limited to electronic components and printed circuit boards, but may also be other mechanical components and machines. Further, in the embodiment, the soldering process is performed under program control using the first and second robots 11A and 11B, but the invention is not necessarily limited to this, and the operator can control the operation unit while looking at the monitor. This can be similarly applied to cases in which soldering is performed one by one by manual operation.

Further, the monitor serving as the image display means may be provided with a memory section so as to be able to freely process image signals, for example. Further, the cursor on the monitor screen may be removed as necessary.

〔Effect of the invention〕

As described above, according to the present invention, the operator operates the avoidance movement mechanism to temporarily move the soldering mechanism aside, and then adjusts the position where the soldering mechanism first performs soldering using the television camera. This can be done easily and precisely while viewing an enlarged image of the soldering process, which can significantly reduce joint defects and the like in subsequent soldering processes. In addition, since an enlarged image of the soldering location being processed can be easily obtained using a television camera without looking at the surrounding area, joint defects such as solder bridges can be easily discovered in a timely manner.
Appropriate processing such as processing interruption can be performed as necessary. Therefore, with these, it is possible to provide an unprecedented and excellent soldering device that can perform more accurate soldering processing with remarkable efficiency.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view showing an embodiment of the present invention;
FIG. 2 is a schematic perspective view showing the driving parts of the two orthogonal coordinate system robots in FIG. 1, FIG. 3 is a schematic perspective view showing the soldering mechanism and television camera in FIG. 1, and FIG. 3 is a side view showing details of the soldering means, FIG. 5 is a partially omitted left side view of FIG. 4, and FIG. 6 is a schematic perspective view showing the joint holding mechanism in FIG. 1; FIG. 7 is a side view for explaining the holding part in FIG. 6, FIG. 8 is a schematic block diagram showing the electric circuit configuration of FIG. 1, and FIGS. 9 and 10 each show an example of the monitor screen. FIG. 11 is a schematic perspective view showing a conventional example. 12...Monitor, 44...Soldering mechanism, 4
6...TV camera, 64...Shaft forming part of avoidance movement mechanism, 66B...Round hole as through hole, 68
... Solenoid that forms part of the avoidance movement mechanism, 74
... Spring for returning to original position forming part of avoidance movement mechanism, 112 ... Electronic component as bonded object, 114
...Printed circuit board as the object to be bonded.

Claims (1)

[Claims] 1. A board surface part on which an object to be welded such as a printed circuit board is placed and fixed at an arbitrary position, and a soldering mechanism that is freely transported to a position opposite to a soldering work point on the object to be welded. and a second robot that freely transports and places the object to be joined so that the soldering point of the object coincides with the soldering work point on the object to be joined. , the first robot is equipped with a television camera that continuously displays the operating moments of the soldering mechanism on a television monitor, and a television camera is installed on the soldering work point side of the television camera. A hand support plate is provided so as to be orthogonal to the direction, and the soldering mechanism is mounted on the first robot via the hand support plate, and the soldering mechanism is mounted on a straight line connecting the television camera and the soldering work point. A through hole of an appropriate size is provided in the hand support plate portion of the hand support plate, and the hand support plate equipped with the soldering mechanism is temporarily moved from above the soldering work point to another area as necessary. A soldering mechanism characterized in that the first robot is equipped with a moving mechanism.