JPS62259453A - Probe card - Google Patents

Abstract

PURPOSE:To improve the durability of a probe card against a contacting pressure applied from a plurality of bumps of an LSI by raising a plurality of contacting pads on a substrate for the card corresponding by 1:1 to the plurality of bumps formed on a wafer. CONSTITUTION:A probe card is formed with a plurality of contacting pads 7, 7,.. raised on a multilayered substrate 5 for the probe card corresponding by 1:1 to bumps 3 of an LSI 2. Contact pins 6, 6,.. are provided on the peripheral edge of the substrate 5, and the pins 6 are wired through the substrate 5 with the pads 7, respectively. Matching holes 8 are formed through the substrate 5 partly at the substrate 5. Thus, even if using the pads of fine diameter when the number of the bumps of the LSI is increased, sufficient durability is provided against the contacting pressure applied from the bumps of the LSI to the pads.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a probe card used during LSI wafer testing.

[Conventional technology]

In FIGS. 3(a) and 3(b), the probe card conventionally used for this type of LSI test on a wafer is
A plurality of bumps 3, 3 . . . formed on the LSI 2 on the wafer 1 shown in the figure and the same number of needles 4, 4 . ..., one end of each fold 4 is supported by the multilayer substrate 5, and the other end is arranged in a position corresponding to the bump 3 on a one-to-one basis, and each fold 4 is connected to each bump of the LSI 2. 3, a signal from a prober device (not shown) is input to the needle 4 through the contact pin 6 of the probe card, and is used as a measuring jig for transmitting and receiving signals between the needle 4 and the bump 3. ing.

[Problem that the invention seeks to solve]

However, in the conventional probe card mentioned above, the needle contacts the bumps of the LSI, so in the case of a probe card for an LSI that has many bumps 3 per side of the LSI 2, a thinner needle is used. This makes manufacturing difficult. In addition, since the needle is thin, its strength is reduced and its durability is disadvantageous.

SUMMARY OF THE INVENTION An object of the present invention is to provide a probe card that has improved durability against contact pressure from bumps on an LSI.

[Means for solving problems]

The present invention provides a probe card characterized in that a plurality of contact pads are formed by protruding them on a probe card substrate in one-to-one correspondence with each of a plurality of bumps of an LSI formed on a wafer. It is.

〔Example〕

Hereinafter, one embodiment of the present invention will be described with reference to the drawings.

In FIGS. 1(a) and 1(b), the probe card according to the present invention has a plurality of contact pads on the surface of a multilayer substrate 5 for a probe card in one-to-one correspondence with each bump 3 of the LSI 2. 7.7... is formed by raising it. Further, contact pins 6.6 are provided at the periphery of the substrate 5.
- are provided, each contact pin 6 and each pad 7
is wired through the board 5.

Further, in a part of the substrate 5, an alignment hole 8 penetrating through the substrate 5 is provided.
is the provision.

In the probe card according to the present invention, the substrate 5 is attached to a probe device (not shown) with the contact pads 7 facing downward, and the contact pins 6 of the substrate 5 are connected to signal lines of the probe device. The contact pad 7 is aligned with the bump 3 of the LSI 2 through the hole 8, the pad 7 and the bump 3 are brought into contact, and signals are exchanged between them to test the electrical characteristics of the LSI.

〔Effect of the invention〕

As explained above, in the present invention, the contact pads are formed by protruding them on the substrate, so that even when using small diameter contact pads as the number of bumps in LSI increases,
The contact pad can have sufficient durability against the contact pressure exerted by the bumps of the LSI, and can be used for testing LSIs with a large number of bumps. Furthermore, since the contact pad is durable,
This has the effect that it can be brought into contact with the bumps of the SI with sufficient pressing force, the contact resistance can be sufficiently reduced, signals can be sent and received, and even minute signals can be picked up to perform accurate tests.

[Brief explanation of drawings]

FIG. 1(a) is a front view showing a probe card of the present invention;
(b) is a partial side view, FIG. 2 is a front view showing a wafer on which LSI is formed, FIG. 3 (a) is a front view showing a conventional probe card, and (b) is the same side view. be.

Claims (1)

[Claims] (1) A probe card characterized in that a plurality of contact pads are formed by raising a plurality of contact pads on a probe card substrate in one-to-one correspondence with each of a plurality of bumps of an LSI formed on a wafer. .