JPS6225892Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a hybrid integrated circuit device, and particularly to a hybrid integrated circuit device configured by mounting a beam lead element.

In general, a beam lead element is an active element that has a lead made of platinum or gold that protrudes from the element side of a silicon chip, and is connected face-down to a circuit board on which a connection electrode is provided at the part corresponding to the lead. semiconductor and integrated circuit devices used in

This beam lead element has the advantage that the protective covering of the element itself is more reliable than other types of integrated circuit elements, so it can be used as an active element in equipment that requires the reliability of hybrid integrated circuits due to its advantages such as ease of mounting. It has been used a lot.

In addition, as the number of terminals coming out of integrated circuit devices has increased in recent years, beam lead devices, which can form leads on the device itself and are easy to connect to circuit boards, are increasingly being used as devices for products with extremely narrow terminal pitches. I'm getting old.

In particular, in diode arrays used as isolation diodes in thermal head devices, the heating resistor pitch is 6 to 8 dots per mm, and the number of dots is approximately
700 to 1600, and one diode must be connected in series to one heating resistor.
Inevitably, the terminal pitch of the element is required to be equal to or smaller than the array pitch of the resistor, approximately 150μ to 100μ.
It has reached μ pitch.

When converting this type of diode array into a beam lead, there are many cases in which about 30 diodes are made into a chip, and there are also many two-way beam lead elements in which one side is a cathode lead and the opposite side is an anode lead. . Furthermore, it is possible to create a circuit by providing an electrically independent cathode and anode in one diode in terms of circuit wiring, but one of the cathodes and anodes is electrically common, and the other is connected to the number of diodes. It is possible to construct circuits that are electrically independent.

Conventional hybrid integrated circuit devices have leads on two opposing sides, at least one of which is a common lead that can be connected in common, and the other is an independent lead that can be connected in common, such as an alumina substrate equipped with a beam lead element. A common electrode for connecting a common lead and an independent electrode for connecting an independent lead are provided on an insulating substrate, and will be described with reference to FIGS. 1a and 2b and FIG. 2.

Figures 1a and 1b are plan views showing a conventional example;
FIG. 2 is a sectional view along AA', and is a plan view from which the beam lead element shown in FIG. 1a is removed.

First, a well-known thick film or thin film technique is used on the main surface of the alumina substrate 1 to correspond to the positions where the resistor element (not shown since it is not directly related to the present invention) and the leads of the beam lead element 4 are connected. The uppermost layer including the common electrode 2 for connecting the anode lead, which is the common lead of the beam lead element 4, and the individual electrode 3, for connecting the cathode lead 6, which is the individual lead of the beam lead element 4, is covered with a gold film. It is formed of a circuit conductor consisting of.

Then, the anode lead 5 and cathode lead 6 of the beam lead element 4 are connected to the common electrode 2, respectively.
and independent electrodes 3, and are connected by thermocompression bonding to form a hybrid integrated circuit.

In the circuits shown in FIGS. 1a and 1b, the beam lead element 4 has an anode lead 5, which is a common lead, arranged in parallel on the side with fewer leads, and a cathode lead, which is an electrically independent independent lead, on the opposite side. Leads 6 are provided in parallel.

In the figure, 13 cathode leads 6 are shown for convenience, but in reality, there are many around 30, and depending on the number of dots, 20 to 50 chips are mounted on the same alumina substrate 1. In multi-chip type hybrid integrated circuits, even if individual beam lead elements 4 are mounted with good electrical characteristics, the dynamic characteristics after all beam lead elements 4 are mounted may be incomplete. There are cases. In such a case, as the number of chips increases, it becomes an important technique to replace the beam lead element 4 whose characteristics are incomplete to improve the function of the entire hybrid integrated circuit.

However, when the lead pitch becomes narrower to about 150 μm, the corresponding common electrode 2 and independent electrode 3 also become narrower to about 100 μm. When the defective beam lead element 4 is removed, as shown in FIG.
Although the connection part 7 to which the anode lead 5 is connected remains, the independent electrode 3 of the connection part 7 to which the cathode lead 6 is connected may peel off from the interface of the alumina substrate 1 and become a peeled part 8. In this case, the connecting portion 7 cannot be formed at the same location.

This phenomenon does not make much difference even if conductors are formed using thick film technology or thin film technology.
When connecting μm leads and measuring the adhesion strength between the film and the alumina substrate 1, it is approximately 10 gr, which is weaker than the strength of the leads themselves.

In other words, in the conventional hybrid integrated circuit device, if the independent electrodes 3 are not peeled off when the beam lead elements 4 are replaced, defective beam lead elements 4 will be removed.
When the beam lead element is removed and then reconnected, the leads do not reach both electrodes, making mounting impossible, resulting in a defective product, which is a serious disadvantage in practical use.

An object of the present invention is to provide a hybrid integrated circuit device in which beam lead elements can be easily replaced.

That is, the purpose of the present invention is to provide a hybrid integrated circuit device in which a beam lead element having leads on two opposing sides is mounted on a circuit board, in which the beam lead element can be easily replaced when a defect occurs in the beam lead element. The purpose of the present invention is to provide a circuit device.

The hybrid integrated circuit device of the present invention is equipped with a beam lead element including independent leads provided in parallel on one side and a common lead provided in parallel opposite to said one side and connectable in common, and the beam lead element. an insulating substrate for connecting to the insulating substrate; an independent electrode provided on the insulating substrate and formed in parallel to connect with the corresponding independent lead; and an insulating substrate formed on the insulating substrate to face the independent electrode; The common leads are commonly connected and extended toward the independent electrodes such that the distance between the common leads is narrower than the distance between the independent leads and the common lead. A common electrode.

That is, the hybrid integrated circuit device of the present invention is a hybrid integrated circuit device in which a beam lead element having leads on two opposing sides is mounted on a circuit board, in which the leads of the beam lead element protrude further inward than the connection position. Then, a connection electrode pattern of the circuit board is provided.

Next, embodiments of the present invention will be described with reference to the drawings.

3a and 3b are a plan view and a BB' cross-sectional view of a hybrid integrated circuit device showing an embodiment of the present invention,
FIG. 4 is a plan view when the beam lead element shown in FIG. 3a is removed and a new beam lead element is mounted.

The following explanation is intended to clarify the features of this invention.
Only the differences in configuration from the conventional example shown in FIGS. 1a, b and 2 will be explained. In addition, in FIGS. 3a, b and 4, the same parts are given the same reference numerals as in FIGS. 1a, b and 2.

The difference from the conventional structure is that thin film technology or thick film technology is used on the alumina substrate 1 to connect to the anode lead 5, which is the common lead of the beam lead element 4 with a gold film as the top layer. When forming the common electrode 2', a pattern is provided so that it protrudes further inward than the normal connection position, that is, extends toward the cathode lead 6, which is an independent lead.

When installing the beam lead element 4 for the first time,
As shown in FIGS. 3a and 3b, the connecting portion 7 of the beam lead element 4 to the cathode lead 6 is aligned with approximately the tip of the corresponding independent electrode 3 and connected.

Next, when the beam lead element 4 is replaced due to a defect, etc., when the beam lead element 4 is removed from the circuit board, the cathode lead 6 of the beam lead element 4 is disconnected for the same reason as explained in FIG. Only the connection part 7 is connected to the alumina substrate 1 and the independent electrode 3.
It peels off from the interface to form a peeled part 8 shown in FIG.

When mounting the beam lead element 4 again, as shown in FIG. 4, it is moved to the front (downward in FIG. 4) from the initial mounting position, aligned, and connected.

In this way, if the beam lead element 4 has a width and is provided with a pattern in which the common electrode 2 sufficiently protrudes and extends toward the independent electrode 3, the beam lead element 4 can be used again. It is also possible to exchange

Therefore, with the structure of the hybrid integrated circuit device according to the present invention, the beam lead element can be easily replaced, and significant practical benefits can be obtained.

In the hybrid integrated circuit device of the present invention, by extending the common electrode toward the independent electrode, even if the end of the independent electrode is peeled off, the beam lead element can be connected by shifting the position. This has the effect of making it easier to replace elements.

[Brief explanation of the drawing]

Figures 1a and 1b are front views showing a conventional example;
AA' cross-sectional view, Figure 2 is a plan view with the beam lead element shown in Figure 1a removed, Figures 3a and b
4 is a front view and a BB' sectional view showing one embodiment of the present invention, and FIG. 4 is a plan view when the beam lead element is mounted again after the beam lead element shown in FIG. 3a has been removed. 1...Alumina substrate, 2 and 2'...Common electrode, 3...Independent electrode, 4...Beam lead element,
5... Anode lead, 6... Cathode lead,
7...Connection part, 8...Peeling part.

Claims (1)

[Scope of utility model registration request] a beam lead element including independent leads provided in parallel on one side and a common lead that can be commonly connected and provided in parallel opposite to the one side; an insulating substrate for mounting the beam lead element; independent electrodes provided on an insulating substrate and formed in parallel to connect with the corresponding independent leads;
All of the common leads are formed on the insulating substrate to face the independent electrodes, and the distance between the independent electrodes is narrower than the distance between the independent leads and the common lead. and a common electrode extending toward the independent electrode so that the hybrid integrated circuit device has a common electrode extending toward the independent electrode.