JPS62256841A - Plasma treatment - Google Patents

Abstract

PURPOSE:To make it possible to treat an object uniformly, by adjusting the outputs of electromagnetic wave emitters according to the shape of the object in performing the plasma treatment of the object by using a plurality of electromagnetic wave emitters. CONSTITUTION:Plasma gas generated by electromagnetic wave emitters 10 provided at respective inlets 8 is fed through these inlets 8 and is passed through a plasma treatment chamber 1 toward a plurality of exits 3 corresponding to these inlets to perform the plasma treatment of an object 5 within the plasma treatment chamber 1. At this time, the outputs of those electromagnetic wave emitters 10 which are provided at those inlets through which plasma gas which treat those surfaces (5b), among the surfaces (5a and 5b) of the object 5 to be treated, which have a larger area along the direction of the pass of the plasma gas (e.g., the emitters on the left and right sides) are adjusted to be higher than those of the other electromagnetic emitters (e.g., the emitter at the center).

Description

[Detailed Description of the Invention] 3. Detailed Explanation of Defense (Industrial Field of Application) Mizubonmei is a plasma processing method, especially a plasma that aims to uniformize the processing of the object to be processed! This is related to the method of laminating.

(Prior art) Olefin resins such as PP (polypropylene) and PE (polyethylene) have relatively excellent weather resistance, mechanical strength, moldability, etc., and can be purchased at very low prices, so they are used only for daily necessities. On the other hand, olefin resins have a tendency to be used more and more in automobile parts.However, due to their high crystallinity and non-staining characteristics, olefin resins have poor surface activity and are difficult to adhere to during so-called secondary processing such as painting, printing, and gluing. It is becoming a bottleneck because they are not able to obtain it.

Measures to activate these include flame treatment, ultraviolet ray treatment, corona makiden treatment, radio waves, and microwave treatment.
F! Plasma processing using L8 is being considered.

White! For lI car materials, from the balance of physical properties and cost mentioned above, it is especially important to use 1 < Realobicin or IP! ti+]
3. However, the design of the hammer is also diversifying,
From the perspective of improving the stiffness, it has come to be considered as a part of the small panel, and the color has changed from the conventional resin color (mostly black) to being painted in the same color as the small panel.

Mokode Bamba (When applying this coating, some parts may be
Although the law is in compliance, most of them do not apply body color paint (this is the current situation, but the current situation is that they apply an undercoat such as chlorinated olefin in advance. , requires a large area for the coating booth and drying furnace, requires enormous power costs such as steam and electricity, and uses a large amount of major solvents, making it undesirable in terms of work F14.Therefore, the above-mentioned modification Among the laws, the plasma l1lfi law is
Application to large molded products is being considered from the viewpoint of processing stability.

(Problems to be Solved by the Invention) However, this plasma treatment method also uniformly applies excited gases such as oxygen and nitrogen that contribute to surface modification to the molded product (it is difficult to agitate the molded product); Corners that are difficult to come into contact with gas tend to be insufficiently treated, which can cause problems such as peeling of the coating.Currently, it is necessary to take measures such as lengthening the treatment time, but the cycle time If it is installed on a line, etc. in a position that is unfavorable for production (it will not be balanced with other processes and will cause a big problem.The present invention was made in view of these circumstances, and The present invention aims to provide a plasma processing method that can uniformly process a workpiece.

(Means for Solving the Problems) The plasma processing method according to the present invention aims to make the processing uniform by adjusting the output of an electromagnetic wave oscillator that generates plasma gas. That is, plasma gas generated by an electromagnetic wave oscillator provided at each of the plurality of inlets is introduced from the plurality of inlets and directed to the plurality of exhaust ports corresponding to each of these inlets into the plasma processing chamber. In this method, plasma processing is performed on the object to be processed in the plasma processing chamber by flowing down the plasma gas. It is characterized in that the output of the electromagnetic wave oscillator installed at the inlet for introducing the plasma gas for treating the surface area to be processed, which has a large surface area, is set higher than the output of the other electromagnetic wave oscillators.

(Function) Due to the above-mentioned method, the concentration of the plasma gas that treats the parts of the surface to be treated that are difficult to contact with the plasma gas becomes relatively high, so the amount of waste to be treated per area of the insect spot formed on each part of the surface to be treated is uniform. This results in uniform plasma processing being applied to the entire surface to be processed.

(Effect of the invention) Therefore, according to the invention, uniform plasma processing can be performed regardless of the complicated surface shape of the object to be processed.
□□, which reduces processing time.
By shortening the cycle time, it becomes easier to reline and synchronize with other processes. Furthermore, when a coating treatment is performed in a post-process, it is possible to form a homogeneous coating film.

(Example) An example of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a side sectional view showing a plasma processing apparatus used in the plasma processing method according to this embodiment.

The plasma processing chamber 1 is composed of a cylindrical chamber 2, an inlet side @ 3 and a Taguchi side wall 4, which are provided at both ends of the chamber so as to be openable and closable. is placed on the spot conveyor 6. At the upper end of the cylindrical chamber 2, three plasma generating furnaces 7 are arranged at predetermined intervals along the longitudinal direction of the cylindrical chamber 2. Each plasma generating furnace 7 has plasma processing to 1
A shower pipe 8 serves as an inlet for introducing plasma scum.
．． Three-stub tuner 9 and three electromagnetic wave generators 108
The gas such as oxygen supplied from the gas supply source 11 through the inlet flow rate regulating valve 12 is turned into plasma and introduced into the plasma droplet 1 from the shower pipe 8. There is.

In the lower IJ portion of the cylindrical chamber 2, three openings 13 are formed corresponding to each shower pipe 8 of the plasma generating furnace 7. Each of these discharge ports 13 communicates with a mechanical booster pump 15 and a rotary pump 16 via respective discharge side flow ff14PJ regulating valves 14, and the mechanical booster pump 15 has a bypass passage in which a bypass valve 17 is interposed. ♂2 Begging Plasma! 2! ! When applying tanuki to the workpiece 5, the pressure inside the plasma processing chamber 1 is reduced to about 0.5 Torr, but
The bypass valve 17 is opened and exhaust is performed only by the rotary pump 16 until it reaches about 0T orr, and when the pressure is further reduced by 1U, the bypass valve 1T8 is closed and the mechanical booster pump 15 and rotary pump 16 are directly operated.
Yuko and 8 plasma 9! In order to maintain airtightness within the X-embedded chamber 1, silicone rubber seals 18 are interposed between the cylindrical chamber 2 and the entrance side door 3 and the exit side @4, respectively.

Plasma treatment is the best in the world! When the pressure is reduced to
Plasma gas generated by the 16-wave generator 10 in each plasma stationary furnace 7 or from each shower pipe 8 to the plasma chamber 1
Plasma scum is introduced into the plasma chamber 1179 and flows down toward the L outlet 13, where plasma treatment is performed on the workpiece 5. The liquid flows in the opposite direction (this direction) and is discharged from each discharge port 13.

Therefore, when the object to be processed is a workpiece 5 having a humper shape as shown in FIG.
A surface to be treated having a surface substantially orthogonal to the direction in which the plasma gas flows downward can be plasma-treated and the treatment time can be shortened.
A portion of the surface to be treated that has many surfaces along the flow direction of the plasma scum is difficult to be plasma-treated in a short period of time (3) Therefore, it takes a long time to plasma-treat the entire surface of the workpiece 5 to be treated.

Therefore, in the plasma processing method according to the water embodiment, the degree distribution of the plasma gas within the plasma processing section 1 is adjusted according to the shape of the object to be processed. Specifically, by adjusting the output between the electromagnetic wave oscillators 10 of the three plasma gas generating furnaces 7, the concentration of plasma gas from each shower pipe 8 is adjusted, thereby reducing the plasma processing cost. For example, for a workpiece 5 having a shape as shown in FIG. By setting the output of the electromagnetic wave generators 10 of the generation furnaces 7 on both the left and right sides to be higher than the output of the electromagnetic wave generator 10 of the central generation furnace 7, plasma gas is generated on the surface of the workpiece 5 to be processed. It is possible to relatively increase the flow rate of plasma scum to be treated on the left and right side surfaces 5b, which have many surfaces along the flow direction, thereby making it possible to uniformize the plasma treatment on each part of the surface to be treated.

Even if the object to be treated has a humber shape, unless the side surface is short and has many surfaces along the flow direction of the plasma gas, such as the side surface 5b of the workpiece 5, each plasma generation furnace 7 The outputs of the electric wave generators 10 may be set to be the same.

FIG. 2 is a diagram showing a control mechanism that adjusts the electromagnetic wave generation (output of the heater 10) of the three plasma generating furnaces 7 in order to uniformize the plasma processing on the workpiece 5.

The workpiece 5 is transferred from the conveyor 19 to the conveyor 20 via the net conveyor 6, and is subjected to the above plasma treatment while being placed on the net conveyor 6. In the mounted state, the workpiece shape recognition and recognition means (CCD) 21
The shape of the surface to be processed of the workpiece 5 is recognized and recognized in advance. Is this work shape ψ a means of recognition? CP based on the output signal from 1?2? Accordingly, the output of each electromagnetic wave generator 10 is determined.

By installing the control mechanism described above, it is possible to automate plasma processing and line it up, and it is also possible to process many types of workpieces on the same line, and it is also easy to synchronize with other processes. becomes.

[Brief explanation of drawings]

FIG. 1 is a side cross-sectional view showing an example of a plasma processing apparatus used in the plasma processing method according to the invention, and FIG. 2 is a T for adjusting the concentration of plasma gas in the plasma processing method.
= A diagram showing the output control mechanism. 1... Plasma furnace 5... Workpiece 7... Plasma bioreactor 8... Shower pipe 10... Electromagnetic wave detector 13... Discharge port

Claims (1)

[Claims] Plasma gas generated by an electromagnetic wave oscillator provided at each of a plurality of inlets is introduced from the plurality of inlets, and the plasma is directed to a plurality of outlet ports corresponding to each of these inlets. A method of subjecting a workpiece in a plasma processing chamber to plasma treatment by causing the plasma gas to flow downward in the processing chamber, the method comprising: among the plurality of electromagnetic wave oscillators, one of the plurality of electromagnetic wave oscillators is connected to a surface of the workpiece to be processed in a direction in which plasma gas flows downward. A plasma processing method characterized in that the output of an electromagnetic wave oscillator provided at an inlet into which plasma gas is introduced to treat a surface to be processed having many curved surfaces is set higher than the output of other electromagnetic wave oscillators. .