JPS6225463A - Manufacture apparatus for thin film photovoltaic element - Google Patents

Abstract

PURPOSE:To improve a material yield without wasteful remaining material therebetween by forming punching cutting edges in a zigzag manner when forming many thin film elements on a substrate and then individually punching with the punching cutting edge, and linearly coupling the opposed sides of the punched elements. CONSTITUTION:Many thin film photovoltaic element devices are formed in contact with a substrate 5 surrounded at both sides with guides 6 having guiding holes 7, and they are cut with the individual punching cutting edges as below. The cutting edges 1 are formed in a zigzag state, a press base 2 having holes 3 corresponding to the edge 1 is placed on the substrate 5, and guide pins 4 provided at the base 2 are engaged with the holes 7 of the substrate 5. Then, the edges 1 are pressed to the holes 3, pressure is applied to punch two unit devices 8 having end faces 9-13 at one side. Thus, the ends 11 are linearly aligned, and no wasteful remaining material exists between the devices 8. Thereafter, two devices 8 are cut out while the base 2 is displaced, and repeated.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an improvement in an apparatus for manufacturing a device for a thin film photovoltaic element.

BACKGROUND OF THE INVENTION Conventionally, when devices are punched out using this type of device manufacturing apparatus for thin film photovoltaic elements, a large amount of residual material is produced, resulting in a decrease in yield. A conventional device manufacturing apparatus will be explained with reference to the punched substrates shown in FIGS. 3 and 4. Reference numeral 16 denotes a press table, which has a hole 17 into which a punching blade 14 having a connecting portion 16 can be tightly fitted. This hole 17 is divided into two by a partition wall 18 corresponding to the connecting portion 15.

The press table 16 is further provided with guide pins 19 for guiding the substrate. The board 5 is mounted on the manufacturing apparatus by inserting the guide hole 7 provided in the guide portion 6 of the board 6 into the guide pin 19, and then the board 5 is punched out by the punching blade 14.

In the portion of the punching blade 14 corresponding to the connecting portion 16,
Since the substrate 6 is not punched out and remains as the remaining portion 22, this causes a deterioration in the yield of the substrate 5. 2o indicates a punched device, and 21 indicates a device before being punched out from the substrate 5.

Problems to be Solved by the Invention According to the punching blade 14 of such a conventional device manufacturing apparatus, the portions corresponding to the connecting portions 15 provided for cutting the devices individually are not punched out. This caused leftover materials to remain.

In order to solve these problems, the present invention aims to improve the shape of the punching blade, eliminate residual material, and improve the material yield.

Means for Solving the Problem In order to solve this problem, the present invention eliminates the connecting part that conventionally connected a plurality of punching blades, and uses punching blades in which each punching blade is staggered and arranged in a staggered manner. This is used to punch out large-sized boards in a staggered pattern.

Function By forming the punching blade in a staggered shape in this way, it is possible to eliminate any remaining material when punching out the device from the substrate, so that the device can be punched out with a high material yield.

Embodiment FIG. 1 is a perspective view of a staggered punching device according to an embodiment of the present invention. In FIG. 1, reference numeral 1 denotes a punching blade arranged in a staggered manner, and numeral 2 denotes a press stand equipped with a hole 3 into which the staggered punching blade 1 is closely inserted, and a guide plate/4. The guide hole provided in the guide 6 of the board 6 shown in FIG. As shown in the figure, when the substrate 5 is punched out, two devices 8 consisting of end faces 9, 10, 11, 12, 13 on one side are punched out in a staggered manner. The remaining material on the substrate S side is formed by the side edges 9', 1σ, 11', 12', and 13'.
Since σ, 11', 12', and 13' form each side edge of the device 8' to be punched out next, the remaining material 22 as shown in the conventional example of FIG. 4 can be eliminated.

Effects of the Invention As described above, according to the present invention, there is no remaining material after punching the substrate, and the material yield of the number of devices that can be removed from the substrate can be improved.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a staggered punching device according to an embodiment of the present invention, FIG. 2 is a plan view of a substrate and device punched by the staggered punching device of FIG. 1, and FIG. 3 is a conventional punching device. FIG. 4 is a plan view of the substrate and device punched out by the punching apparatus of FIG. 3. 1... Punching blades arranged in a staggered pattern, 2...
... Press stand, 3 ... Hole, 8 ... Staggered punched device, 9, 10, 11.12,
13...Each side edge of staggered device 8, q, 1
σ, 11', 12'. 13'...Each side edge forming the remaining material portion of the board 5. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2j Base sheet Figure 3/j

Claims (1)

[Claims] A device punching device for a thin film photovoltaic element, the device comprising:
A device manufacturing device for thin film photovoltaic elements, characterized by punching out devices from a large substrate in a staggered manner using punching blades arranged in a staggered manner.