JPH115262A - Separating method and its device for pressing pins of pin board type stripping machine - Google Patents

Separating method and its device for pressing pins of pin board type stripping machine

Info

Publication number
JPH115262A
JPH115262A JP9159521A JP15952197A JPH115262A JP H115262 A JPH115262 A JP H115262A JP 9159521 A JP9159521 A JP 9159521A JP 15952197 A JP15952197 A JP 15952197A JP H115262 A JPH115262 A JP H115262A
Authority
JP
Japan
Prior art keywords
pressing pin
substrate
pressing
upper substrate
pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9159521A
Other languages
Japanese (ja)
Other versions
JP3337397B2 (en
Inventor
Hajime Mano
甫 真野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KIYOUEKI KOGYO KK
TECHNO TRANS KK
Kawahara Shiki KK
Original Assignee
KIYOUEKI KOGYO KK
TECHNO TRANS KK
Kawahara Shiki KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIYOUEKI KOGYO KK, TECHNO TRANS KK, Kawahara Shiki KK filed Critical KIYOUEKI KOGYO KK
Priority to JP15952197A priority Critical patent/JP3337397B2/en
Publication of JPH115262A publication Critical patent/JPH115262A/en
Application granted granted Critical
Publication of JP3337397B2 publication Critical patent/JP3337397B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To easily remove interference pins which meet a border line between a product part and a leftover part, for a pin board type stripping machine which holds pressing pins on either one of a upper base board or a lower base board being attached to a press machine. SOLUTION: Interference pins are held on an upper base board for one time using a first template wherein holes at an area corresponding with the interference pins are closed, and a receiving plate 50 on which receiving holes 48 for pressing pins 10 are provided, is slid downward to the upper base board 18, and after the interference pins are held by the receiving plate from the upper base board, the receiving plate is retracted, and a large number of interference pins can be removed at one time, and at the same time, the removed interference pins can be easily returned to the original locations. After the interference pins have been removed, a leftover part wherein product part is made a blank, is affixed to a second template, and the pressing pins meeting the leftover part are sorted to the upper base board 18, and the pressing pins meeting the blank part are sorted to a lower base board 16 respectively.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は板紙を箱等の製品形
状に打ち抜いた後に、板紙の製品部とその周辺部のカス
部を分離するピンボード式カス取り機の押圧ピンの分離
方法およびその装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of separating a pressing pin of a pinboard type scrap removing machine for separating a product portion of a paperboard from a peripheral portion thereof after punching a paperboard into a product shape such as a box and the like. Related to the device.

【0002】[0002]

【従来の技術】紙器等の製造工程では、先ず印刷した板
紙等のシート状材料を型抜きする。通常型抜きは、合板
にスチールの刃または罫を植え込んで木型を作り、これ
と鋼板製のアンビルとの間に印刷したシート状材料を挟
み込んで打ち抜く。この型抜き工程においては、シート
状材料を完全に打ち抜いてしまうと、製品と屑とが一緒
に混ざってしまうので、振動その他で落ちないようにニ
ックという微小な継ぎ目を残して打ち抜かれ、次のカス
取り工程で手作業または機械でこの型抜き屑を取り外し
ている。
2. Description of the Related Art In a manufacturing process of a paper container or the like, first, a sheet material such as a printed paperboard is die-cut. Normally, die cutting is performed by implanting a steel blade or a rule into plywood to form a wooden pattern, inserting a printed sheet-like material between this and a steel plate anvil, and punching. In this die-cutting process, if the sheet-like material is completely punched out, the product and debris will be mixed together. The die is removed manually or by machine during the scrap removal process.

【0003】このカス取り工程では、型抜き工程から型
抜きされた板紙等のシート状材料が多数積み重ねた状態
で送られてくるので、これを手作業で製品部とカス部を
分離するためには、積み重ねられた型抜き後の板紙を適
当な厚さ取り分け、作業者がカス部をハンマーで叩き落
として製品部からカス部を分離するという極めて原始的
な方法であって、能率が極めて悪い重労働であると共
に、すざましい騒音と紙粉の飛び交う劣悪な環境をかも
しだすものであった。
[0003] In this scrap removing step, a large number of sheet-like materials, such as cardboard, which have been cut from the stamping step, are sent in a piled state. Is a very primitive method in which the stacked paperboards are separated into appropriate thicknesses, and the operator taps off the waste with a hammer to separate the waste from the product part, which is extremely inefficient. Not only was it hard work, but it also created a harsh environment with loud noise and paper dust.

【0004】また、機械でこの型抜き屑を取り外すに
は、製品形状に合わせて木型を製作する必要があり、こ
の木型をプレス機に取り付けて行うものであるが、製品
形状が変わる度にこれに合わせて木型を製作するため、
少品種で大量生産の場合は良いが、多品種少量生産の場
合は木型製作のコストが嵩むという不都合がある。
[0004] In order to remove the mold scraps by a machine, it is necessary to manufacture a wooden mold according to the product shape. This wooden mold is attached to a press machine. In order to make a wooden mold to match this,
In the case of mass production with small varieties, it is good, but in the case of small production of many varieties, there is an inconvenience that the cost of producing a wooden mold increases.

【0005】そこで提案されたのが、特公平7−962
76号公報のピンボード式の板紙打抜き機の発明であ
る。この発明のピンボード式の板紙打抜き機は図2の一
部を切欠した部分斜視図に示すように、下基板16は図
示しないプレス機の基台に固定されており、この下基板
16には押圧ピン10を上下に抜き差し自在に保持する
下押圧ピン保持孔14が所定のピッチで縦横に配列され
ている。さらに下基板16には下係止ピン12の下係止
ピン貫通孔36を各列の下押圧ピン保持孔14と直角に
交錯するように設け、押圧ピン10には下押圧ピン保持
孔14の各列内に貫通された下係止ピン12と嵌合する
下嵌合溝38を設け、挿入された押圧ピン10を下係止
ピン12により係止することができる。また、下支持板
26は、下基板16に設けられた下押圧ピン保持孔14
と上下に対向するように設けられ押圧ピン10を抜き差
し自在に貫通できる貫通孔24bを有し、下基板16に
保持された押圧ピン10の上端と下基板16の間で昇降
自在に弾力的に支持されている。
[0005] The proposal was made in Japanese Patent Publication No. 7-962.
No. 76 discloses a pinboard type paperboard punching machine. In the pinboard type paperboard punching machine of the present invention, as shown in a partially cutaway perspective view of FIG. 2, a lower substrate 16 is fixed to a base of a press (not shown). Lower pressing pin holding holes 14 for holding the pressing pins 10 vertically so as to be freely inserted and removed are arranged vertically and horizontally at a predetermined pitch. Further, the lower board 16 is provided with lower locking pin through holes 36 of the lower locking pins 12 so as to intersect at right angles with the lower pressing pin holding holes 14 of each row. A lower fitting groove 38 that fits with the lower locking pin 12 penetrated in each row is provided, and the inserted pressing pin 10 can be locked by the lower locking pin 12. The lower support plate 26 is provided with the lower pressing pin holding hole 14 provided in the lower substrate 16.
And a through hole 24b which is provided so as to face the upper and lower sides of the pressing pin 10 so that the pressing pin 10 can be freely inserted and removed, and is elastically movable up and down between the upper end of the pressing pin 10 held by the lower substrate 16 and the lower substrate 16. Supported.

【0006】一方この下基板16に向けて昇降するプレ
ス機のプラテンには上基板18が取り付けられている。
この上基板18には下基板16と同様に下押圧ピン保持
孔14と上下に対向するように上押圧ピン保持孔20を
下基板16と同じの所定のピッチで縦横に配列されてい
る。さらに上基板18には上係止ピン貫通孔40を各列
の上押圧ピン保持孔20と直角に交錯するように設け、
押圧ピン10には上押圧ピン保持孔20の各列内に貫通
された上係止ピン22と嵌合する上嵌合溝42を設け、
挿入された押圧ピン10を上係止ピン22により係止す
ることができる。また、上支持板28は、下基板16に
設けられた下押圧ピン保持孔14と上下に対向するよう
に設けられ押圧ピン10を抜き差し自在に貫通できる貫
通孔24aを有し、上基板18に保持された押圧ピン1
0の下端と上基板18の間で昇降自在に弾力的に支持さ
れるている。
On the other hand, an upper substrate 18 is attached to a platen of a press that moves up and down toward the lower substrate 16.
Like the lower substrate 16, the upper substrate 18 has upper pressing pin holding holes 20 arranged vertically and horizontally at the same predetermined pitch as the lower substrate 16 so as to vertically face the lower pressing pin holding holes 14. Further, upper locking pin through holes 40 are provided in the upper substrate 18 so as to intersect at right angles with the upper pressing pin holding holes 20 in each row,
The pressing pin 10 is provided with an upper fitting groove 42 that fits with the upper locking pin 22 penetrated in each row of the upper pressing pin holding holes 20,
The inserted pressing pin 10 can be locked by the upper locking pin 22. The upper support plate 28 has a through-hole 24 a that is provided to face the lower pressing pin holding hole 14 provided in the lower substrate 16 and that can penetrate the pressing pin 10 so that the pressing pin 10 can be freely inserted and removed. Pressed pin 1 held
The upper substrate 18 is elastically supported so as to be able to move up and down.

【0007】[0007]

【発明が解決しようとする問題点】この装置を用いて図
3に示す型抜きした板紙30の製品部32とカス部34
を分離する手順について説明する。先ず図6の断面図に
示すように上下の係止ピン12、22を抜いた状態で上
基板18を降下させ、上基板18、上支持板28、下支
持板26、下基板16の順に上下に密着させ、押圧ピン
10の上部は上押圧ピン保持孔20に、下部は下押圧ピ
ン保持孔14に挿入する。次いで、上係止ピン貫通孔4
0に上係止ピン22を挿通し、押圧ピン10の上嵌合溝
42に上係止ピン22を嵌合させ、上基板18に押圧ピ
ン10を係止する。
The product section 32 and the scrap section 34 of the die-cut paperboard 30 shown in FIG. 3 using this apparatus.
Will be described. First, as shown in the sectional view of FIG. 6, the upper substrate 18 is lowered with the upper and lower locking pins 12 and 22 removed, and the upper substrate 18, the upper support plate 28, the lower support plate 26, and the lower substrate 16 are sequentially moved up and down. The upper portion of the pressing pin 10 is inserted into the upper pressing pin holding hole 20, and the lower portion of the pressing pin 10 is inserted into the lower pressing pin holding hole 14. Then, the upper locking pin through hole 4
The upper locking pin 22 is inserted into the upper pin 18, the upper locking pin 22 is fitted into the upper fitting groove 42 of the pressing pin 10, and the pressing pin 10 is locked to the upper substrate 18.

【0008】次に、図7に示すように上基板18を押圧
ピン10と共に上昇させ、上支持板28を押圧ピン10
の下端まで降下し、下支持板26も下押圧ピン保持孔1
4に押圧ピン10が保持されたときに、その上端と一致
する高さまで上昇させる。上昇させる。続いて、図4お
よび図7に示すように、板紙30から製品部32を打ち
抜いた一枚のカス部34を位置決めして置く。板紙30
が薄い場合は貫通孔24と同じ位置に振り分け孔を打ち
抜いたテンプレートにカス部34を張り付けたものを用
いても良い。
Next, as shown in FIG. 7, the upper substrate 18 is raised together with the pressing pins 10, and the upper support plate 28 is
And the lower supporting plate 26 is also lowered to the lower pressing pin holding hole 1.
When the pressing pin 10 is held at the position 4, the pressing pin 10 is raised to a height corresponding to the upper end thereof. To raise. Subsequently, as shown in FIGS. 4 and 7, a single scrap portion 34 obtained by punching the product portion 32 from the paperboard 30 is positioned and placed. Paperboard 30
In the case where the thickness is small, a template in which the distribution portion is punched out at the same position as the through hole 24 and the waste portion 34 is attached may be used.

【0009】次に、図8に示すように、押圧ピン10を
保持した上基板18を降下させ上押圧ピン保持板20と
下押圧ピン保持板14の上に載せられた板紙30を挟持
した後、上係止ピン22を引き抜く。すると板紙30の
製品部32に当たる部分は打ち抜かれてブランクになっ
ているので、図5に示すように製品部に当たる押圧ピン
10bは下の貫通孔24を貫通して下基板16の下押圧
ピン保持孔14に落下し、かす部34に当たる押圧ピン
10aは落下せずに上押圧ピン保持孔20にそのまま残
る。
Next, as shown in FIG. 8, after the upper substrate 18 holding the pressing pins 10 is lowered to sandwich the paperboard 30 placed on the upper pressing pin holding plate 20 and the lower pressing pin holding plate 14, Then, the upper locking pin 22 is pulled out. Then, the portion of the paperboard 30 corresponding to the product portion 32 is punched out to be a blank, so that the pressing pin 10b corresponding to the product portion passes through the lower through hole 24 and holds the lower substrate 16 as shown in FIG. The pressing pin 10 a that falls into the hole 14 and hits the residue 34 does not fall but remains in the upper pressing pin holding hole 20.

【0010】押圧ピン10はこのようにして上下にいず
れかの基板に振り分けられ、カス部34に当たる押圧ピ
ン10aは上基板18の上押圧ピン保持孔20に上係止
ピン22により係止し、製品部に当たる押圧ピン10b
は下基板16の下押圧ピン保持孔14に下係止ピン12
により係止される。このように押圧ピン10を上基板1
8または下基板16に振り分けた後、適当厚さに積み重
ねた型抜きした板紙30を上昇した下支持板26の上に
位置決めして置きプレスすれば、上基板18に支持され
た押圧ピン10aはダイの役目をし、下基板16に保持
された押圧ピン10bはポンチとして作用し、型抜きし
た板紙30の製品部32とカス部34を分離することが
できる。なお、この公報の発明においては、押圧ピンの
係止手段として係止ピン12または22を抜き差しによ
るものであるが、押圧ピンが遊嵌する孔を設けた一枚の
ロックプレートをそれぞれの基板の中に摺動自在に内蔵
し基板の中で摺動させることにより押圧ピンを係止する
ものでも良い。
In this manner, the pressing pin 10 is distributed to any one of the substrates up and down, and the pressing pin 10a hitting the waste portion 34 is locked in the upper pressing pin holding hole 20 of the upper substrate 18 by the upper locking pin 22, Pressing pin 10b hitting product part
Is the lower locking pin 12 in the lower pressing pin holding hole 14 of the lower substrate 16.
Is locked by. As described above, the pressing pin 10 is connected to the upper substrate 1.
8 or the lower substrate 16, the die-cut paperboards 30 stacked to an appropriate thickness are positioned on the raised lower support plate 26 and pressed, so that the pressing pins 10a supported by the upper substrate 18 are pressed. The pressing pin 10b, which serves as a die and is held by the lower substrate 16, acts as a punch, and can separate the product portion 32 and the scrap portion 34 of the cut boardboard 30. In the invention of this publication, the locking pin 12 or 22 is inserted and removed as locking means for the pressing pin, but one lock plate provided with a hole into which the pressing pin is loosely fitted is attached to each substrate. It may be of a type which is slidably housed therein and which is slid in the substrate to lock the pressing pin.

【0011】しかしながら、図5は図4のB列の断面を
示すものであって、製品部32とカス部34の境界線上
に貫通孔24がないので、問題はないのであるが、図8
は図4のC列の断面図を示すものであって、C列2番ピ
ンでは製品部32とカス部34の境界線が横断してお
り、貫通孔24が半分塞がれるので、C列2番の押圧ピ
ン10は取り除かないと、プレスしたときに製品部32
を損傷する結果となる。また、図4のD列3番の押圧ピ
ン10についても同様の結果となる。
However, FIG. 5 shows a cross section of column B in FIG. 4, and there is no problem because there is no through-hole 24 on the boundary line between the product part 32 and the waste part 34.
FIG. 4 is a cross-sectional view of column C in FIG. 4. In the second pin of column C, the boundary between the product portion 32 and the waste portion 34 crosses, and the through hole 24 is half-closed. If the second pressing pin 10 is not removed, the product part 32
Will result in damage. The same result is obtained for the third pressing pin 10 in column D in FIG.

【0012】そこで、従来は図9に示すように、下係止
ピン貫通孔36に下係止ピン12を差し込み、下基板1
6の下押圧ピン保持孔14に落下した押圧ピン10bを
係止した後、上基板18の上押圧ピン保持孔20に上係
止ピン22により係止された押圧ピン10aを、上係止
ピン22を引き抜くことにより、下基板16の下押圧ピ
ン保持孔14に落下させる。上基板18から落下した押
圧ピン10aは下押圧ピン保持孔14において、下係止
ピン12に突き当たり、すでに下基板16の下押圧ピン
保持孔14に落下し下係止ピン12により係止された押
圧ピン10bより、高い位置になる。そこで、押圧ピン
10aのうち製品とカスの境界線上または切断線に近い
負荷集中部分のピン(以下干渉ピンという。)を取り除
く。
Therefore, conventionally, as shown in FIG. 9, the lower locking pin 12 is inserted into the lower locking pin through hole 36 and the lower board 1 is inserted.
6, the pressing pin 10 b dropped into the lower pressing pin holding hole 14 is locked, and then the pressing pin 10 a locked by the upper locking pin 22 in the upper pressing pin holding hole 20 of the upper substrate 18 is moved to the upper locking pin. By pulling out 22, the lower substrate 16 is dropped into the lower pressing pin holding hole 14. The pressing pin 10 a that has dropped from the upper substrate 18 abuts against the lower locking pin 12 in the lower pressing pin holding hole 14, has already fallen into the lower pressing pin holding hole 14 of the lower substrate 16, and is locked by the lower locking pin 12. The position is higher than the pressing pin 10b. Therefore, the pins (hereinafter, referred to as interference pins) on the load concentration portion on the boundary line between the product and the waste or near the cutting line among the pressing pins 10a are removed.

【0013】このように干渉ピンが取り除かれたら、押
圧ピン10aは上基板18を下降させ、上押圧ピン保持
孔20に戻し、上係止ピンを貫通孔40に差し込み、上
基板18に係止して、適当厚さに積み重ねた型抜きした
板紙30を上昇した下支持板26の上に位置決めして置
きプレスすれば、上基板18に支持された押圧ピン10
aはダイの役目をし、下基板16に保持された押圧ピン
10bはポンチとして作用し、型抜きした板紙30の製
品部32とカス部34を分離することができる。そし
て、製品とかすの分離が終わったら、抜き取った干渉ピ
ンを元の位置に戻して、別の種類の製品部とカス部の分
離の段取りをする。
When the interference pin is removed in this manner, the pressing pin 10a lowers the upper substrate 18 and returns to the upper pressing pin holding hole 20, and inserts the upper locking pin into the through hole 40 to lock the upper substrate 18. Then, the die-cut paperboards 30 stacked to an appropriate thickness are positioned on the raised lower support plate 26 and pressed, whereby the pressing pins 10 supported on the upper substrate 18 are pressed.
“a” serves as a die, and the pressing pins 10 b held on the lower substrate 16 act as a punch, and can separate the product part 32 and the waste part 34 of the die-cut paperboard 30. Then, after the separation of the product and the debris is completed, the extracted interference pin is returned to the original position, and another type of product part and waste part are separated.

【0014】このように、製品部の形状に応じての干渉
ピンの除去および元の位置に帰す作業は、製品部の形状
によっては干渉ピンが数十本にも及ぶので、時間と労力
を要する作業であり、干渉ピンの除去および元の位置に
帰す作業の改善が望まれていた。本発明はピンボード式
カス取り機による押圧ピンの分離方法の前記のごとき問
題点を解決するためになされたものであって、干渉ピン
の除去および元の位置に戻す作業を、簡単な操作で短時
間で達成できるピンボード式ピンボード式カス取り機に
よる押圧ピンの分離方法およびその装置を提供すること
を目的とする。
As described above, the operation of removing the interference pin according to the shape of the product part and returning the interference pin to the original position requires several tens of interference pins depending on the shape of the product part, and thus requires time and labor. It was a task, and it was desired to improve the task of removing the interference pin and returning it to its original position. The present invention has been made in order to solve the above-mentioned problems of the method of separating the pressing pins by the pin board type scraper, and the operation of removing the interference pin and returning to the original position is performed by a simple operation. It is an object of the present invention to provide a method and an apparatus for separating a pressing pin by a pin board type scraper which can be achieved in a short time.

【0015】[0015]

【課題を解決するための手段】本発明のピンボード式カ
ス取り機の押圧ピンの分離方法は、プレス機の基台に固
定された下基板と、押圧ピンを上下に抜き差し自在に保
持し所望のピッチで縦横に前記下基板に配列された下押
圧ピン保持孔と、前記下押圧ピン保持孔に挿入された押
圧ピンの係止手段と、前記下基板に向けて下降する前記
プレス機のプラテンに固定された上基板と、押圧ピンを
上下に抜き差し自在に保持し前記下押圧ピン保持孔の全
てと上下に対向するように縦横に上基板に設けられ上押
圧ピン保持孔と、前記上押圧ピン保持孔に挿入された押
圧ピンの係止手段と、前記下基板および前記上基板の間
に介在し打ち抜くブランクの形状に応じて前記下基板の
前記下押圧ピン保持孔または前記上基板の前記上押圧ピ
ン保持孔のいずれかに保持される押圧ピンと、前記下基
板に設けられた前記押圧ピン保持孔と上下に対向するよ
うに設けられ前記押圧ピンを抜き差し自在に貫通できる
貫通孔を有し下基板に保持された前記押圧ピンの上端と
前記下基板の間で昇降自在に支持される下支持板と、前
記上基板に設けられた前記上押圧ピン保持孔と上下に対
向するように設けられ押圧ピンを抜き差し自在に貫通で
きる貫通孔を有し前記上基板に保持された前記押圧ピン
の下端と前記上基板の間で昇降自在に支持される上支持
板とで構成されるピンボード式カス取り機の押圧ピンの
分離方法であって、前記押圧ピンの全てを上基板に保持
させる工程と、前記下支持板の前記貫通孔と同じ位置に
前記押圧ピンが貫通する振り分け孔を穿設した第1のテ
ンプレートに板紙の製品部を打ち抜いたカス部を位置決
めして置き前記第1のテンプレートの前記振り分け孔の
うち製品とカス部の境界線上またはそれに近接する振り
分け孔を閉塞する工程と、前記下支持板を上昇しその上
に前記下支持板の前記貫通孔と前記振り分け孔とを一致
させて前記第1のテンプレートを載置する工程と、前記
上基板に係止されている押圧ピンの全ての係止を解除し
前記振り分け孔の閉塞により干渉ピンとして残された前
記押圧ピン以外の前記押圧ピンを前記下基板の前記下押
圧ピン保持孔に落下し保持させる工程と、前記上基板に
残された前記干渉ピンを上基板に係止すると共に前記上
基板から除去できる高さに前記上基板を上昇させる工程
と、前記上基板と同様に前記上基板に設けられた所定の
ピッチで縦横に配列した押圧ピン保持孔と上下に対向す
るように設けられた受け孔を有する受け板を前記上基板
と前記下基板間に挿入する工程と、前記上基板に干渉ピ
ンとして係止されている前記押圧ピンの係止を解除する
ことにより前記押圧ピンを前記受け板の前記受け孔に保
持すると共に前記受け板を前記上基板の外に退避させる
工程と、前記下基板に保持された前記押圧ピンを前記上
基板に保持させる工程と、前記下支持板の前記貫通孔と
同じ位置に前記押圧ピンが貫通する振り分け孔を穿設し
た第2のテンプレートに板紙の製品部を打ち抜いたカス
部を位置決めし固定する工程と、前記下支持板を上昇し
その上に前記第2のテンプレートを載置する置する工程
と、前記上基板に係止されている前記押圧ピンの係止を
解除し前記板紙の前記製品部を押圧する押圧ピンをを前
記下基板の前記押圧ピン保持孔に落下し保持させる工程
と、前記上基板に残った前記板紙のカス部を押圧する押
圧ピンをを前記上基板に係止する工程とからなことを要
旨とする。
SUMMARY OF THE INVENTION According to the present invention, there is provided a method for separating a pressing pin of a pin board type scrap removing machine, comprising: a lower substrate fixed to a base of a press; A lower pressing pin holding hole arranged in the lower substrate vertically and horizontally at a pitch of: a locking means of a pressing pin inserted in the lower pressing pin holding hole; and a platen of the press machine descending toward the lower substrate. An upper substrate fixed to the upper substrate and a pressing pin vertically and horizontally provided on the upper substrate such that the pressing pin is vertically detachably held and vertically opposed to all of the lower pressing pin holding holes. Locking means of the pressing pin inserted into the pin holding hole, and the lower pressing pin holding hole of the lower substrate or the lower substrate of the upper substrate depending on the shape of the blank to be punched out interposed between the lower substrate and the upper substrate. Any of the upper pressing pin holding holes A pressing pin held in the lower substrate, and a through-hole that is provided to vertically face the pressing pin holding hole provided in the lower substrate and that can penetrate the pressing pin so that it can be freely inserted and removed. A lower support plate that is supported between the upper end of the pin and the lower substrate so as to be able to move up and down; and a pressure pin that is provided so as to vertically face the upper pressing pin holding hole provided in the upper substrate and penetrates the pressing pin freely. Separation of a pressing pin of a pin board type scraping machine comprising a lower end of the pressing pin held by the upper substrate and having a through hole formed therein and an upper supporting plate supported between the upper substrate and the upper substrate so as to be vertically movable. A method comprising: holding all of the pressing pins on an upper substrate; and disposing a paperboard on a first template in which a distribution hole through which the pressing pin penetrates is formed at the same position as the through hole of the lower support plate. Stamping out the product department Positioning and positioning the waste portion, and closing the distribution hole on or near the boundary line between the product and the waste portion among the distribution holes of the first template, and raising the lower support plate and placing the lower Placing the first template such that the through-hole and the distribution hole of the support plate are aligned with each other, and releasing all the pressing pins locked to the upper substrate to release the distribution hole. A step of dropping the pressing pins other than the pressing pins left as the interference pins due to the blockage into the lower pressing pin holding holes of the lower substrate and holding the lowering pins, and engaging the interference pins remaining on the upper substrate with the upper substrate. Stopping and elevating the upper substrate to a height that can be removed from the upper substrate, and vertically opposing pressing pin holding holes arranged vertically and horizontally at a predetermined pitch provided on the upper substrate similarly to the upper substrate. You Inserting a receiving plate having a receiving hole provided so as to be between the upper substrate and the lower substrate, and releasing the pressing pin locked as an interference pin on the upper substrate. A step of holding the pressing pin in the receiving hole of the receiving plate and retracting the receiving plate out of the upper substrate, and a step of holding the pressing pin held by the lower substrate on the upper substrate, A step of positioning and fixing a scrap portion obtained by punching a product part of a paperboard in a second template having a distribution hole through which the pressing pin penetrates at the same position as the through hole of the lower support plate; And placing the second template on it, and releasing a pressing pin locked on the upper substrate and pressing the product portion of the paperboard with a pressing pin. To the lower substrate. A step of dropping the pin holding hole holding, and the pressing pin presses the scum of remaining the paperboard on the substrate summarized in that a and a step for locking on the substrate.

【0016】また、本発明の請求項2のピンボード式カ
ス取り機は、プレス機の基台に固定された下基板と、押
圧ピンを上下に抜き差し自在に保持し所望のピッチで縦
横に前記下基板に配列された下押圧ピン保持孔と、前記
下押圧ピン保持孔に挿入された押圧ピンの係止手段と、
前記下基板に向けて下降する前記プレス機のプラテンに
固定された上基板と、押圧ピンを上下に抜き差し自在に
保持し前記下押圧ピン保持孔の全てと上下に対向するよ
うに縦横に上基板に設けられ上押圧ピン保持孔と、前記
上押圧ピン保持孔に挿入された押圧ピンの係止手段と、
前記下基板および前記上基板の間に介在し打ち抜くブラ
ンクの形状に応じて前記下基板の前記下押圧ピン保持孔
または前記上基板の前記上押圧ピン保持孔のいずれかに
保持される押圧ピンと、前記下基板に設けられた前記押
圧ピン保持孔と上下に対向するように設けられ前記押圧
ピンを抜き差し自在に貫通できる貫通孔を有し下基板に
保持された前記押圧ピンの上端と前記下基板の間で昇降
自在に支持される下支持板と、前記上基板に設けられた
前記上押圧ピン保持孔と上下に対向するように設けられ
押圧ピンを抜き差し自在に貫通できる貫通孔を有し前記
上基板に保持された前記押圧ピンの下端と前記上基板の
間で昇降自在に支持される上支持板とで構成されるピン
ボード式カス取り機であって、前記上基板に設けられた
所定のピッチで縦横に配列した上押圧ピン保持孔と上下
に対向するように設けられ上基板に保持された干渉ピン
を抜き差し自在に保持する受け孔を有し前記上基板の下
に出入り自在に配置することにより前記上基板に分離さ
れた干渉ピンを一旦退避させる受け板を設けたことを要
旨とする。
Further, in the pin board type scrap removing machine according to the present invention, the lower board fixed to the base of the press machine and the pressing pin are held up and down so as to be freely inserted and removed, and are vertically and horizontally arranged at a desired pitch. Lower pressing pin holding holes arranged on the lower substrate, locking means for pressing pins inserted into the lower pressing pin holding holes,
An upper substrate fixed to a platen of the press machine descending toward the lower substrate, and an upper substrate vertically and horizontally so as to vertically hold a pressing pin so as to be able to be pulled out and inserted and to vertically face all of the lower pressing pin holding holes. An upper pressing pin holding hole provided in, the locking means of the pressing pin inserted in the upper pressing pin holding hole,
A pressing pin held in one of the lower pressing pin holding hole of the lower substrate or the upper pressing pin holding hole of the upper substrate according to the shape of a blank to be punched out between the lower substrate and the upper substrate, An upper end of the pressing pin held by the lower substrate and having a through hole provided to vertically face the pressing pin holding hole provided on the lower substrate and capable of penetrating the pressing pin in a removable manner, and the lower substrate A lower support plate supported so as to be able to move up and down, and a through-hole provided so as to be vertically opposed to the upper pressing pin holding hole provided in the upper substrate and through which a pressing pin can be freely inserted and removed; What is claimed is: 1. A pin board type scrap remover comprising a lower end of the pressing pin held by an upper substrate and an upper support plate supported to be able to move up and down between the upper substrate, wherein a predetermined board provided on the upper substrate Vertical at pitch By having a receiving hole provided so as to face up and down with the upper pressing pin holding hole arranged in the upper substrate and holding the interference pin held in the upper substrate in a removable manner, the receiving pin is arranged so as to be able to come and go under the upper substrate. The gist is that a receiving plate for temporarily retreating the separated interference pin is provided on the upper substrate.

【0017】請求項1の押圧ピンの分離方法において
は、押圧ピン10の全てを上基板18に保持させた後、
下支持板26を上昇しその上に下支持板28の貫通孔2
4bと同じ位置に押圧ピン10が貫通する振り分け孔4
4を穿設した第1のテンプレート46を貫通孔24bと
振り分け孔44とを一致させて載置する。次いで、板紙
30の製品部32を打ち抜いたカス部34を位置決めし
第1のテンプレート46の振り分け孔44のうち製品と
カス部の境界線上またはそれに近接する振り分け孔を閉
塞する。なお、この場合第1のテンプレート46の振り
分け孔44の閉塞は、下支持板26の上に置く前予め他
の作業台で行っても良い。しかるのち、上基板18に係
止されている押圧ピン10の全ての係止を解除すると、
振り分け孔44の閉塞により干渉ピン10cのみが上基
板18に残され、それ以外の押圧ピン10は下基板16
の下押圧ピン保持孔14に落下し保持される。
In the method of separating the pressing pins according to the first aspect, after all of the pressing pins are held on the upper substrate,
The lower support plate 26 is raised and the through hole 2 of the lower support plate 28 is
4b through which the pressing pin 10 penetrates at the same position as
The first template 46 in which the holes 4 are formed is placed so that the through holes 24b and the distribution holes 44 are aligned. Next, the waste portion 34 from which the product portion 32 of the paperboard 30 has been punched is positioned, and the distribution hole 44 of the first template 46 on or near the boundary line between the product and the waste portion is closed. In this case, the closing of the distribution hole 44 of the first template 46 may be performed in advance on another work table before placing it on the lower support plate 26. Thereafter, when all the locks of the pressing pins 10 locked to the upper substrate 18 are released,
Due to the blocking of the distribution hole 44, only the interference pin 10c is left on the upper substrate 18, and the other pressing pins 10 are
And is held by the lower pressing pin holding hole 14.

【0018】次いで、上基板18に残された干渉ピン1
0cを上基板18に係止すると共に上基板18から干渉
ピン10cを除去できる高さに上基板18を上昇させ、
上基板と同様に所定のピッチで縦横に配列した押圧ピン
保持孔と上下に対向するように設けられた受け孔48を
有する受け板50を上基板18と下基板16間に挿入す
る。上基板18に干渉ピンとして係止されている押圧ピ
ン10cの係止を解除することにより干渉ピン10cを
受け板50受け孔48に保持する。続いて、干渉ピン1
0cを受け孔48に保持した受け板50を上基板18の
外に退避させる工程により、干渉ピン10cを瞬時に取
り除くことができる。
Next, the interference pin 1 left on the upper substrate 18
0c to the upper substrate 18 and raise the upper substrate 18 to a height at which the interference pins 10c can be removed from the upper substrate 18,
Similarly to the upper substrate, a receiving plate 50 having pressing pin holding holes arranged vertically and horizontally at a predetermined pitch and receiving holes 48 provided to be vertically opposed to each other is inserted between the upper substrate 18 and the lower substrate 16. The interference pin 10c is held in the receiving plate 48 by releasing the engagement of the pressing pin 10c, which is locked to the upper substrate 18 as an interference pin. Then, interference pin 1
The step of retracting the receiving plate 50 held in the receiving hole 48c out of the upper substrate 18 can instantaneously remove the interference pin 10c.

【0019】その後は従来方法と同様に、下基板16に
保持された押圧ピン10を一旦上基板18に保持させ、
下支持板26を上昇しその上に下支持板26の貫通孔2
4bと同じ位置に押圧ピン10が貫通する振り分け孔4
4を穿設した第2のテンプレート52を載置し、板紙3
0を製品部32を打ち抜いたカス部34を位置決めし第
2のテンプレート52の上に固定する。なお、この場合
第2のテンプレート52の上に板紙30の製品部32を
打ち抜いたカス部の張り付けは、下支持板26の上に置
く前予め他の作業台で行っても良い。この状態で上基板
18に係止されている押圧ピン10の係止を解除する
と、板紙30の製品部32はブランクになっているの
で、製品部32に当たる押圧ピン10bは下基板16の
押圧ピン保持孔14に落下し保持される。一方、板紙3
0のカス部34を押圧する押圧ピン10aは落下せずに
上基板18に残るのでこれを上基板18に係止すること
により、押圧ピン10は干渉ピン10cを取り除いた状
態で、上基板18に係止されダイとして作用する押圧ピ
ン10aと、下基板18に係止されポンチとして作用す
る押圧ピン10bに振り分けされる。なお、第1のテン
プレート46と第2のテンプレート52は使用するとき
は、この順序で使用するが、第1のテンプレートの振り
分け孔44の閉塞と、第2のテンプレート52にカス部
34の張り付けは前後が逆になっても構わない。
Thereafter, similarly to the conventional method, the pressing pins 10 held on the lower substrate 16 are once held on the upper substrate 18 and
The lower support plate 26 is raised, and the through hole 2 of the lower support plate 26 is placed thereon.
4b through which the pressing pin 10 penetrates at the same position as
4 is placed on the second template 52, and the paperboard 3
At position 0, the scrap portion 34 from which the product portion 32 is punched is positioned and fixed on the second template 52. Note that, in this case, the sticking of the scrap portion obtained by punching the product part 32 of the paperboard 30 onto the second template 52 may be performed in advance on another work table before placing it on the lower support plate 26. In this state, when the locking of the pressing pin 10 locked to the upper substrate 18 is released, the product portion 32 of the paperboard 30 is blank, and the pressing pin 10b corresponding to the product portion 32 is It falls into the holding hole 14 and is held. Meanwhile, paperboard 3
Since the pressing pin 10a pressing the 0 waste portion 34 does not fall and remains on the upper substrate 18, the pressing pin 10a is locked to the upper substrate 18 so that the pressing pin 10 is removed from the upper substrate 18 with the interference pin 10c removed. The pressing pin 10a is locked to the lower substrate 18 and functions as a punch, and the pressing pin 10b is locked to the lower substrate 18 and functions as a punch. When the first template 46 and the second template 52 are used, they are used in this order, but the closing of the distribution holes 44 of the first template and the attachment of the waste portion 34 to the second template 52 are not performed. The front and rear may be reversed.

【0020】カス取り作業が終了したら、干渉ピン10
cを受け孔48に保持した受け板50を上基板18の下
に戻し、上基板18の昇降と上係止ピン22の抜き差し
により、干渉ピン10cを極めて簡単に元の位置に戻す
ことができる。
When the scrap removal operation is completed, the interference pin 10
c, the receiving plate 50 held in the receiving hole 48 is returned below the upper substrate 18, and the interference pin 10c can be returned to the original position very easily by lifting and lowering the upper substrate 18 and inserting and removing the upper locking pin 22. .

【0021】請求項2のピンボード式カス取り機は、上
基板18に設けられた所定のピッチで縦横に配列した上
押圧ピン保持孔20と上下に対向するように設けられ上
基板18に保持された干渉ピン10cを抜き差し自在に
保持する受け孔48を有し、上基板18の下に出入り自
在に配置することにより、上基板18に分離された干渉
ピン10cを一旦避難させる受け板50を設けたので、
干渉ピン10cの除去が手作業によらずに瞬時に行うこ
とができ、また一旦除去された干渉ピン10cを簡単な
操作により元の位置に戻すことができる。
The pin board type scraper according to the second aspect is provided so as to be vertically opposed to the upper pressing pin holding holes 20 arranged vertically and horizontally at a predetermined pitch provided on the upper substrate 18 and to be held on the upper substrate 18. The receiving plate 48 has a receiving hole 48 for holding the inserted interference pin 10c so as to be able to be freely inserted and removed, and is disposed under the upper substrate 18 so as to be able to freely enter and exit. Because it was provided,
The removal of the interference pin 10c can be performed instantaneously without manual operation, and the once removed interference pin 10c can be returned to the original position by a simple operation.

【0022】[0022]

【発明の実施の形態】本発明の実施の形態を以下図面に
従って説明する。図1は本発明のピンボード式カス取り
機の一部を切断した部分斜視図である。押圧ピン10は
下基板16の下押圧ピン保持孔14および上基板18の
上押圧ピン保持孔20に抜き差し自在な径の丸棒であっ
て、図6または図14に示すように、下押圧ピン保持孔
14に保持された状態で上基板18の下降によって上押
圧ピン保持孔20に挿入されるに充分な長さを有し、上
部には上係止ピン22が嵌入する上嵌合溝42が、下部
には下係止ピン12が嵌入する下嵌合溝38がそれぞれ
設けられている。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partial perspective view in which a part of a pin board type scrap remover of the present invention is cut. The pressing pin 10 is a round bar having a diameter that can be inserted into and removed from the lower pressing pin holding hole 14 of the lower substrate 16 and the upper pressing pin holding hole 20 of the upper substrate 18. As shown in FIG. The upper fitting groove 42 has a length enough to be inserted into the upper pressing pin holding hole 20 by the lowering of the upper substrate 18 while being held in the holding hole 14, and the upper fitting groove 42 into which the upper locking pin 22 is fitted. However, lower fitting grooves 38 into which the lower locking pins 12 are fitted are provided in the lower portions, respectively.

【0023】下基板16は図示しないプレス機の基台に
固定されており、押圧ピン10を上下に抜き差し自在に
保持する下押圧ピン保持孔14が所定のピッチで縦横に
配列されており、さらに下基板16の側面には下係止ピ
ン12の下係止ピン貫通孔36が各列の下押圧ピン保持
孔14と直角に交錯するように設けられており、下係止
ピン12を下係止ピン貫通孔36に貫通することによ
り、下押圧ピン保持孔14に挿入された押圧ピン10の
下嵌合溝38に下係止ピン12が嵌合し、押圧ピン10
が下基板16に係止される。
The lower substrate 16 is fixed to a base of a press (not shown), and lower pressing pin holding holes 14 for holding the pressing pins 10 up and down so as to be freely inserted and removed are arranged vertically and horizontally at a predetermined pitch. On the side surface of the lower substrate 16, lower locking pin through holes 36 of the lower locking pin 12 are provided so as to intersect at right angles with the lower pressing pin holding holes 14 of each row. The lower locking pin 12 fits into the lower fitting groove 38 of the pressing pin 10 inserted into the lower pressing pin holding hole 14 by penetrating the locking pin through hole 36, and the pressing pin 10
Are locked to the lower substrate 16.

【0024】また、下支持板26は、下基板16に設け
られた下押圧ピン保持孔14と上下に対向するように設
けられ押圧ピン10を抜き差し自在に貫通できる貫通孔
24bを有し、下基板16に保持された押圧ピン10の
上端と下基板16の間で昇降自在に弾力的に支持されて
いる。
The lower support plate 26 has a through hole 24b which is provided so as to vertically face the lower pressing pin holding hole 14 provided in the lower substrate 16 and through which the pressing pin 10 can be freely inserted and removed. It is elastically supported between the upper end of the pressing pin 10 held by the substrate 16 and the lower substrate 16 so as to be able to move up and down.

【0025】上基板18は下基板16に向けて昇降する
図示しないプレス機のプラテンに取り付けられており、
この上基板18には下基板16と同様に下押圧ピン保持
孔14と上下に対向するように上押圧ピン保持孔20が
下基板16と同じの所定のピッチで縦横に配列されてい
る。さらに上基板18の側面には上係止ピン22の上係
止ピン貫通孔40が各列の上押圧ピン保持孔20と直角
に交錯するように設けられており、上係止ピン22を下
係止ピン貫通孔40に貫通することにより、上押圧ピン
保持孔20に挿入された押圧ピン10の上嵌合溝42に
上係止ピン22が嵌合し、押圧ピン10が上基板18に
係止される。
The upper substrate 18 is attached to a platen of a press (not shown) that moves up and down toward the lower substrate 16.
Like the lower substrate 16, the upper substrate 18 has upper pressing pin holding holes 20 arranged vertically and horizontally at the same predetermined pitch as the lower substrate 16 so as to vertically face the lower pressing pin holding holes 14. Further, on the side surface of the upper substrate 18, upper locking pin through holes 40 of the upper locking pins 22 are provided so as to intersect at right angles with the upper pressing pin holding holes 20 of each row. By penetrating through the locking pin through hole 40, the upper locking pin 22 fits into the upper fitting groove 42 of the pressing pin 10 inserted into the upper pressing pin holding hole 20, and the pressing pin 10 Locked.

【0026】また、上支持板28は、上基板18に設け
られた上押圧ピン保持孔20と上下に対向するように設
けられ押圧ピン10を抜き差し自在に貫通できる貫通孔
24aを有し、上基板18に保持された押圧ピン10の
下端と上基板18の間で昇降自在に弾力的に支持される
ている。
The upper support plate 28 has a through-hole 24a which is provided so as to vertically face the upper pressing pin holding hole 20 provided in the upper substrate 18 and through which the pressing pin 10 can be freely inserted and removed. The lower end of the pressing pin 10 held by the substrate 18 and the upper substrate 18 are elastically supported so as to be able to move up and down.

【0027】受け板50は、上基板18および上支持板
28と同じ大きさの板であって、表面には押圧ピン10
が嵌入する受け孔48が、上基板18および上支持板2
8に設けられた押圧ピン保持孔20および貫通孔24a
と同じ間隔とピッチで縦横に配置されている。この受け
板50は、図示しないスライド機構により、上基板18
と下基板16の間に進入し、受け孔48の全てが上支持
板28の貫通孔24aの全てと上下に対向する位置に停
止し、上基板18から落下する押圧ピン10を受け孔4
8に保持した後、上基板18の外へ退去するようになっ
ている。
The receiving plate 50 is a plate having the same size as the upper substrate 18 and the upper supporting plate 28, and has a pressing pin 10 on its surface.
The upper substrate 18 and the upper support plate 2
8 and the pressing pin holding hole 20 and the through hole 24a
They are arranged vertically and horizontally at the same interval and pitch as. The receiving plate 50 is moved by the slide mechanism (not shown) to the upper substrate 18.
And the lower substrate 16, all of the receiving holes 48 stop at positions vertically opposed to all of the through holes 24 a of the upper support plate 28, and the pressing pins 10 falling from the upper substrate 18 are received by the receiving holes 4.
After being held at 8, it retreats out of the upper substrate 18.

【0028】次に、テンプレートについて説明すると、
第1のテンプレート46は、図10に示すように、下支
持板26と同じ大きさの薄いプラスチックの板からな
り、押圧ピン10が嵌入する振り分け孔44が、下支持
板26に設けられた貫通孔24bと同じ間隔とピッチで
打ち抜かれている。この第1のテンプレート46は板紙
30から製品部32を打ち抜いたカス部34を位置決め
して重ね、製品部32とカス部34との境界線が横断す
る振り分け孔44は閉塞板54で閉塞する。なお、この
際に集中負荷により製品部に損傷が生ずることが予想さ
れる部位の振り分け孔44も閉塞する。また、閉塞板5
4はプラスチック板またはビニールテープを用いる。
Next, the template will be described.
As shown in FIG. 10, the first template 46 is made of a thin plastic plate having the same size as the lower support plate 26, and has a distribution hole 44 in which the pressing pin 10 is fitted. The holes are punched at the same interval and pitch as the holes 24b. The first template 46 positions and overlaps the waste portion 34 obtained by punching the product portion 32 from the paperboard 30, and the distribution hole 44 where the boundary between the product portion 32 and the waste portion 34 crosses is closed by the closing plate 54. At this time, the distribution hole 44 of the portion where the product portion is expected to be damaged by the concentrated load is also closed. In addition, the closing plate 5
4 uses a plastic plate or a vinyl tape.

【0029】第2のテンプレート52は、図13に示す
ように第1のテンプレート46と同様に、下支持板26
と同じ大きさの薄いプラスチックの板からなり、押圧ピ
ン10が嵌入する振り分け孔44が、下支持板26に設
けられた貫通孔24bと同じ間隔とピッチで打ち抜かれ
ている。この第2のテンプレート52は板紙30から製
品部32を打ち抜きカス部34だけを残した位置決めし
て張り付ける。
The second template 52 is similar to the first template 46 as shown in FIG.
A distribution hole 44 into which the pressing pin 10 is fitted is punched out at the same interval and pitch as the through holes 24b provided in the lower support plate 26. The second template 52 is formed by punching the product portion 32 from the paperboard 30 and attaching the product portion 32 while leaving only the waste portion 34.

【0030】以上に説明した本発明装置と第1および第
2のテンプレートを用い、干渉ピンの除去と押圧ピンの
分離方法を説明する。先ず図6の断面図に示すように上
下の係止ピン12、22を抜いた状態で上基板18を降
下させ、上基板18、上支持板28、下支持板26、下
基板16の順に上下に密着させ、押圧ピン10の上部は
上押圧ピン保持孔20に、下部は下押圧ピン保持孔14
に挿入する。次いで、上係止ピン貫通孔40に上係止ピ
ン22を挿通し、押圧ピン10の上嵌合溝42に上係止
ピン22を嵌合させ、上基板18に押圧ピン10を係止
する。
Using the above-described apparatus of the present invention and the first and second templates, a method of removing an interference pin and separating a pressing pin will be described. First, as shown in the sectional view of FIG. 6, the upper substrate 18 is lowered with the upper and lower locking pins 12 and 22 removed, and the upper substrate 18, the upper support plate 28, the lower support plate 26, and the lower substrate 16 are sequentially moved up and down. The upper part of the pressing pin 10 is in the upper pressing pin holding hole 20 and the lower part is the lower pressing pin holding hole 14.
Insert Next, the upper locking pin 22 is inserted into the upper locking pin through hole 40, the upper locking pin 22 is fitted into the upper fitting groove 42 of the pressing pin 10, and the pressing pin 10 is locked to the upper substrate 18. .

【0031】次に、図7に示すように上基板18を押圧
ピン10と共に上昇させ、上支持板28を押圧ピン10
の下端まで降下し、下支持板26も下押圧ピン保持孔1
4に押圧ピン10が保持されたときに、その上端と一致
する高さまで上昇させる。続いて、図11に示すよう
に、除去したい干渉ピンに当たる部位の振り分け孔44
を閉塞板54で閉塞した第1のテンプレート46を下支
持板26の上に位置決めして載せ、上下の係止ピン12
および22を引き抜くと、押圧ピン10のうち、干渉ピ
ン10c以外のものは全て下基板16側に落下する。
Next, as shown in FIG. 7, the upper substrate 18 is raised together with the pressing pins 10, and the upper support plate 28 is
And the lower supporting plate 26 is also lowered to the lower pressing pin holding hole 1.
When the pressing pin 10 is held at the position 4, the pressing pin 10 is raised to a height corresponding to the upper end thereof. Subsequently, as shown in FIG. 11, the distribution hole 44 at a portion corresponding to the interference pin to be removed is provided.
The first template 46, which is closed by the closing plate 54, is positioned and placed on the lower support plate 26, and the upper and lower locking pins 12
When the push pins 10 and 22 are pulled out, all of the pressing pins 10 other than the interference pin 10c fall to the lower substrate 16 side.

【0032】そこで、図12に示すように、上係止ピン
22を上係止孔貫通孔40に差込むことにより、上基板
18に残された干渉ピン10cを上基板18に係止する
と共に上基板18から干渉ピン10cを除去できる高さ
に上基板18を上昇させ、受け孔48を有する受け板5
0を上基板18と下基板16間に挿入し、上基板18に
干渉ピンとして係止されている押圧ピン10cの係止を
解除することにより干渉ピン10cを受け板50受け孔
48に保持する。続いて、干渉ピン10cを受け孔48
に保持した受け板50を上基板18の外に退避させるこ
とにより、干渉ピン10cを瞬時に取り除くことができ
る。
Therefore, as shown in FIG. 12, the interference pin 10c left on the upper substrate 18 is locked to the upper substrate 18 by inserting the upper locking pin 22 into the upper locking hole through hole 40. The upper substrate 18 is raised to a height at which the interference pins 10 c can be removed from the upper substrate 18, and the receiving plate 5 having the receiving holes 48 is formed.
0 is inserted between the upper substrate 18 and the lower substrate 16, and the interference pin 10c is held in the receiving hole 50 by releasing the locking of the pressing pin 10c locked as an interference pin on the upper substrate 18. . Subsequently, the interference pin 10c is received in the hole 48.
The interference pin 10c can be instantaneously removed by retracting the receiving plate 50 held at the outside of the upper substrate 18.

【0033】その後は図14に示すように、干渉ピン1
0cが除かれた状態で上下の係止ピン12、22を抜き
上基板18を降下させ、上基板18、上支持板28、下
支持板26、下基板16の順に上下に密着させ、押圧ピ
ン10の上部は上押圧ピン保持孔20に、下部は下押圧
ピン保持孔14に挿入する。次いで、上係止ピン貫通孔
40に上係止ピン22を挿通し、押圧ピン10の上嵌合
溝42に上係止ピン22を嵌合させ、上基板18に押圧
ピン10を係止する。
Thereafter, as shown in FIG.
In a state where 0c has been removed, the upper and lower locking pins 12, 22 are removed, the upper substrate 18 is lowered, and the upper substrate 18, the upper support plate 28, the lower support plate 26, and the lower substrate 16 are brought into close contact with each other up and down in this order. The upper part 10 is inserted into the upper pressing pin holding hole 20 and the lower part is inserted into the lower pressing pin holding hole 14. Next, the upper locking pin 22 is inserted into the upper locking pin through hole 40, the upper locking pin 22 is fitted into the upper fitting groove 42 of the pressing pin 10, and the pressing pin 10 is locked to the upper substrate 18. .

【0034】続いて、図15に示すように上基板18を
押圧ピン10と共に上昇させ、上支持板28を押圧ピン
10の下端まで降下し、下支持板26も下押圧ピン保持
孔14に押圧ピン10が保持されたときに、その上端と
一致する高さまで上昇させ、下支持板26の上に第2の
テンプレート52を載置する。図16に示すように、第
2のテンプレート52には板紙30が貼付され、板紙3
0の製品部32はブランクになっているので、上基板1
8に係止されている押圧ピン10の係止を解除すると、
製品部32に当たる押圧ピン10bは下基板16の押圧
ピン保持孔14に落下し保持される。
Subsequently, as shown in FIG. 15, the upper substrate 18 is raised together with the pressing pins 10, the upper supporting plate 28 is lowered to the lower end of the pressing pins 10, and the lower supporting plate 26 is pressed against the lower pressing pin holding holes 14. When the pin 10 is held, the pin 10 is raised to a height coinciding with the upper end thereof, and the second template 52 is placed on the lower support plate 26. As shown in FIG. 16, the paperboard 30 is attached to the second template 52, and the paperboard 3
0 is blank, so that the upper substrate 1
When the locking of the pressing pin 10 locked to 8 is released,
The pressing pin 10b that hits the product section 32 falls into the pressing pin holding hole 14 of the lower substrate 16 and is held.

【0035】一方、板紙30のカス部34を押圧する押
圧ピン10aは落下せずに上基板18に残るのでこれを
上基板18に係止することにより、押圧ピン10は干渉
ピン10cを取り除いた状態で、上基板18に係止され
ダイとして作用する押圧ピン10aと、下基板18に係
止されポンチとして作用する押圧ピン10bに振り分け
される。
On the other hand, the pressing pin 10a for pressing the waste portion 34 of the paperboard 30 remains on the upper substrate 18 without dropping, and is locked to the upper substrate 18 so that the pressing pin 10 removes the interference pin 10c. In this state, the pressing pins 10a are locked to the upper substrate 18 and function as dies, and the pressing pins 10b are locked to the lower substrate 18 and function as punches.

【0036】カス取り作業が終了したら、干渉ピン10
cを受け孔48に保持した受け板50を上基板18の下
に戻し、上基板18の昇降と上係止ピン22の抜き差し
により、干渉ピン10cを極めて簡単に元の位置に戻す
ことができる。
When the scrap removing operation is completed, the interference pin 10
c, the receiving plate 50 held in the receiving hole 48 is returned below the upper substrate 18, and the interference pin 10c can be returned to the original position very easily by lifting and lowering the upper substrate 18 and inserting and removing the upper locking pin 22. .

【0037】[0037]

【発明の効果】本発明のピンボード式カス取り機の押圧
ピンの分離方法およびその装置は、以上詳述したよう
に、下基板に設けられた押圧ピン保持孔と同じ間隔とピ
ッチで縦横に打ち抜かれた振り分け孔を有する第1のテ
ンプレートを用い、押圧ピンのうち干渉ピンに当たる部
位の振り分け孔を予め閉塞し、干渉ピンだけを上基板に
残した後、上基板の押圧ピン保持孔と同じ間隔とピッチ
で縦横に配置されている受け孔を有する受け板を上基板
に下に進入させ、上基板から多数の干渉ピンを受け孔に
保持し退去した後、製品部をブランクにしたカス部を貼
付した第2のテンプレートを用い、押圧ピンを上基板と
下基板に振り分けるものであり、従来手作業で行ってい
た多数の干渉ピンの抜取り作業を飛躍的に能率化でき
る。除去した干渉ピンは位置関係を維持したまま受け板
に保持されているので、多数の干渉ピン一気に元の位置
に戻すことができるので、次の種類のカス取り作業の段
取りにすぐに移れるという優れた効果がある。
As described above in detail, the method and the apparatus for separating the pressing pins of the pin board type scraper according to the present invention are vertically and horizontally arranged at the same interval and pitch as the pressing pin holding holes provided in the lower substrate. Using the first template having the punched distribution holes, the distribution holes of the pressing pins that hit the interference pins are closed in advance, and only the interference pins are left on the upper substrate, and then the same as the pressure pin holding holes of the upper substrate. After a receiving plate having receiving holes arranged vertically and horizontally at intervals and pitches enters the upper substrate downward, after holding a large number of interference pins in the receiving holes from the upper substrate and retreats, the waste part where the product part is blank Using the second template to which the pressure pins are attached, the pressing pins are assigned to the upper substrate and the lower substrate, so that the operation of removing a large number of interference pins, which has been manually performed conventionally, can be dramatically improved. Since the removed interference pins are held on the receiving plate while maintaining the positional relationship, a large number of interference pins can be returned to their original position at once, so it is possible to immediately move to the next type of scrap removal work setup Has an effect.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のピンボード式カス取り機の一部を切断
した部分斜視図である。
FIG. 1 is a partial perspective view in which a part of a pin board type scrap remover of the present invention is cut.

【図2】従来のピンボード式カス取り機の一部を切断し
た部分斜視図である。
FIG. 2 is a partial perspective view of a part of a conventional pin board type scrap removing machine.

【図3】製品部を打ち抜いた板紙の平面図である。FIG. 3 is a plan view of a paperboard from which a product section has been punched.

【図4】製品部を打ち抜いた板紙を下支持板に載せた状
態の平面図である。
FIG. 4 is a plan view showing a state in which a paperboard from which a product portion has been punched is placed on a lower support plate.

【図5】製品部をブランクにした板紙を用い押圧ピンを
上下の基板に振り分けた状態の図4のB列の断面図であ
る。
5 is a cross-sectional view of column B in FIG. 4 in a state in which pressing pins are distributed to upper and lower substrates using a paperboard with a blank product part.

【図6】上基板を降下させ全ての押圧ピンを上基板に保
持した状態の断面図である。
FIG. 6 is a cross-sectional view of a state in which the upper substrate is lowered and all the pressing pins are held on the upper substrate.

【図7】押圧ピンの全てを上基板に係止し上昇した状態
で下支持板に製品部をブランクにした板紙を載せた図4
のC列の断面図である。
FIG. 7 shows a state in which all the pressing pins are engaged with the upper substrate and the paperboard with the product part blanked is placed on the lower support plate in a state where the pressing pins are raised.
It is sectional drawing of C row | line.

【図8】上基板を降下し上下の支持板で板紙を挟んだ状
態で上係止ピンを抜く前の図4のC列の断面図である。
8 is a cross-sectional view of column C in FIG. 4 before the upper board is lowered and the upper locking pin is pulled out while the paperboard is sandwiched between the upper and lower support plates.

【図9】干渉ピンを抜くため上基板に分離した押圧ピン
を下基板に降下させた状態の図4のC列の断面図であ
る。
9 is a cross-sectional view of column C of FIG. 4 in a state where a pressing pin separated from an upper substrate is lowered onto a lower substrate to remove an interference pin.

【図10】干渉ピンに当たる振り分け孔を閉塞板で閉塞
した第1のテンプレートの平面図である。
FIG. 10 is a plan view of a first template in which a distribution hole corresponding to an interference pin is closed by a closing plate.

【図11】第1のテンプレートを用い干渉ピンを上基板
に保持した状態の図4のC列の断面図である。
11 is a cross-sectional view of column C in FIG. 4 in a state where the interference pins are held on the upper substrate using the first template.

【図12】上基板に保持した干渉ピンを受け板に落下す
る前の図4のC列の断面図である。
12 is a cross-sectional view of column C in FIG. 4 before the interference pin held on the upper substrate is dropped on a receiving plate.

【図13】製品部をブランクにした板紙を貼付した状態
の第2のテンプレートの平面図である。
FIG. 13 is a plan view of a second template in a state in which a paperboard with a blank product part is attached.

【図14】干渉ピンを抜き取った後上基板を降下させ全
ての押圧ピンを上基板に保持した状態の断面図である。
FIG. 14 is a cross-sectional view showing a state in which the upper substrate is lowered after the interference pins are removed and all the pressing pins are held on the upper substrate.

【図15】干渉ピンを抜き取った後押圧ピンの全てを上
基板に係止し上昇した状態で下支持板に製品部をブラン
クにした板紙を貼付した第2のテンプレートを載せた図
4のC列の断面図である。
FIG. 15C shows a state in which all of the pressing pins are latched to the upper substrate after the interference pins are pulled out and the second template on which the paperboard with the product section blanked is stuck on the lower support plate in a state where the pressing pins are raised. It is sectional drawing of a row.

【図16】干渉ピンを抜き取った後上基板を降下し上下
の支持板で板紙を挟んだ状態で上係止ピンを抜く前の図
4のC列の断面図である。
FIG. 16 is a cross-sectional view of column C in FIG. 4 before the upper board is lowered after the interference pin is removed and the upper locking pin is removed with the paperboard sandwiched between the upper and lower support plates.

【符号の説明】[Explanation of symbols]

10・・・・・押圧ピン 10a・・・・上基板に保持される押圧ピン 10c・・・・下基板に保持される押圧ピン 10c・・・・干渉ピン 12・・・・・下係止ピン 14・・・・・下押圧ピン保持孔 16・・・・・下基板 18・・・・・上基板 20・・・・・上押圧ピン保持孔 22・・・・・上係止ピン 24・・・・・貫通孔 26・・・・・下支持板 28・・・・・上支持板 30・・・・・板紙 32・・・・・製品部 34・・・・・カス部 36・・・・・下係止ピン貫通孔 38・・・・・下嵌合溝 40・・・・・上係止ピン貫通孔 42・・・・・上嵌合溝 44・・・・・振り分け孔 46・・・・・第1のテンプレート 48・・・・・受け孔 50・・・・・受け板 52・・・・・第2のテンプレート 54・・・・・閉塞板 ································································································ Lower locking Pin 14: Lower pressing pin holding hole 16: Lower substrate 18: Upper substrate 20: Upper pressing pin holding hole 22: Upper locking pin 24 ····· Through hole 26 ····· Lower support plate 28 ······ Upper support plate 30 ···· Paperboard 32 ····· Product part 34 ···· Dust part 36 · ····· Lower locking pin through hole 38 ····· Lower fitting groove 40 ······ Upper locking pin through hole 42 ······ Upper fitting groove 44 ····· Distribution hole 46... First template 48... Receiving hole 50... Receiving plate 52... Second template 54.

─────────────────────────────────────────────────────
────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成9年7月1日[Submission date] July 1, 1997

【手続補正2】[Procedure amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0014[Correction target item name] 0014

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0014】このように、製品部の形状に応じての干渉
ピンの除去および元の位置に帰す作業は、製品部の形状
によっては干渉ピンが数十本にも及ぶので、時間と労力
を要する作業であり、干渉ピンの除去および元の位置に
帰す作業の改善が望まれていた。本発明はピンボード式
カス取り機による押圧ピンの分離方法の前記のごとき問
題点を解決するためになされたものであって、干渉ピン
の除去および元の位置に戻す作業を、簡単な操作で短時
間で達成できるピンボード式カス取り機による押圧ピン
の分離方法およびその装置を提供することを目的とす
る。
As described above, the operation of removing the interference pin according to the shape of the product part and returning the interference pin to the original position requires several tens of interference pins depending on the shape of the product part, and thus requires time and labor. It was a task, and it was desired to improve the task of removing the interference pin and returning it to its original position. The present invention has been made in order to solve the above-mentioned problems of the method of separating the pressing pins by the pin board type scraper, and the operation of removing the interference pin and returning to the original position is performed by a simple operation. and to provide a separation method and apparatus of the pressing pin by a short time can be achieved Lupi onboard type weed machine.

【手続補正3】[Procedure amendment 3]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】0035[Correction target item name] 0035

【補正方法】変更[Correction method] Change

【補正内容】[Correction contents]

【0035】一方、板紙30のカス部34を押圧する押
圧ピン10aは落下せずに上基板18に残るのでこれを
上基板18に係止することにより、押圧ピン10は干渉
ピン10cを取り除いた状態で、上基板18に係止され
ダイとして作用する押圧ピン10aと、下基板18に係
止されポンチとして作用する押圧ピン10bに振り分け
される。これにより、図17の断面図に示すように製品
部32を型抜きした板紙30を下支持板26の上に適宜
枚数積み重ね、上基板18を下降すると、板紙30を押
圧ピン10で損傷することなく、製品部32からカス部
34を分離することができる。
On the other hand, the pressing pin 10a for pressing the waste portion 34 of the paperboard 30 remains on the upper substrate 18 without dropping, and is locked to the upper substrate 18 so that the pressing pin 10 removes the interference pin 10c. In this state, the pressing pins 10a are locked to the upper substrate 18 and function as dies, and the pressing pins 10b are locked to the lower substrate 18 and function as punches. As a result, as shown in the sectional view of FIG.
The paperboard 30 from which the portion 32 has been die-cut is appropriately placed on the lower support plate 26.
When the sheets are stacked and the upper substrate 18 is lowered, the paperboard 30 is pushed.
Without any damage from the product pin 32,
34 can be separated.

【手続補正4】[Procedure amendment 4]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】図面の簡単な説明[Correction target item name] Brief description of drawings

【補正方法】追加[Correction method] Added

【補正内容】[Correction contents]

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明のピンボード式カス取り機の一部を切断
した部分斜視図である。
FIG. 1 is a partial perspective view in which a part of a pin board type scrap remover of the present invention is cut.

【図2】従来のピンボード式カス取り機の一部を切断し
た部分斜視図である。
FIG. 2 is a partial perspective view of a part of a conventional pin board type scrap removing machine.

【図3】製品部を打ち抜いた板紙の平面図である。FIG. 3 is a plan view of a paperboard from which a product section has been punched.

【図4】製品部を打ち抜いた板紙を下支持板に載せた状
態の平面図である。
FIG. 4 is a plan view showing a state in which a paperboard from which a product portion has been punched is placed on a lower support plate.

【図5】製品部をブランクにした板紙を用い押圧ピンを
上下の基板に振り分けた状態の図4のB列の断面図であ
る。
5 is a cross-sectional view of column B in FIG. 4 in a state in which pressing pins are distributed to upper and lower substrates using a paperboard with a blank product part.

【図6】上基板を降下させ全ての押圧ピンを上基板に保
持した状態の断面図である。
FIG. 6 is a cross-sectional view of a state in which the upper substrate is lowered and all the pressing pins are held on the upper substrate.

【図7】押圧ピンの全てを上基板に係止し上昇した状態
で下支持板に製品部をブランクにした板紙を載せた図4
のC列の断面図である。
FIG. 7 shows a state in which all the pressing pins are engaged with the upper substrate and the paperboard with the product part blanked is placed on the lower support plate in a state where the pressing pins are raised.
It is sectional drawing of C row | line.

【図8】上基板を降下し上下の支持板で板紙を挟んだ状
態で上係止ピンを抜く前の図4のC列の断面図である。
8 is a cross-sectional view of column C in FIG. 4 before the upper board is lowered and the upper locking pin is pulled out while the paperboard is sandwiched between the upper and lower support plates.

【図9】干渉ピンを抜くため上基板に分離した押圧ピン
を下基板に降下させた状態の図4のC列の断面図であ
る。
9 is a cross-sectional view of column C of FIG. 4 in a state where a pressing pin separated from an upper substrate is lowered onto a lower substrate to remove an interference pin.

【図10】干渉ピンに当たる振り分け孔を閉塞板で閉塞
した第1のテンプレートの平面図である。
FIG. 10 is a plan view of a first template in which a distribution hole corresponding to an interference pin is closed by a closing plate.

【図11】第1のテンプレートを用い干渉ピンを上基板
に保持した状態の図4のC列の断面図である。
11 is a cross-sectional view of column C in FIG. 4 in a state where the interference pins are held on the upper substrate using the first template.

【図12】上基板に保持した干渉ピンを受け板に落下す
る前の図4のC列の断面図である。
12 is a cross-sectional view of column C in FIG. 4 before the interference pin held on the upper substrate is dropped on a receiving plate.

【図13】製品部をブランクにした板紙を貼付した状態
の第2のテンプレートの平面図である。
FIG. 13 is a plan view of a second template in a state in which a paperboard with a blank product part is attached.

【図14】干渉ピンを抜き取った後上基板を降下させ全
ての押圧ピンを上基板に保持した状態の断面図である。
FIG. 14 is a cross-sectional view showing a state in which the upper substrate is lowered after the interference pins are removed and all the pressing pins are held on the upper substrate.

【図15】干渉ピンを抜き取った後押圧ピンの全てを上
基板に係止し上昇した状態で下支持板に製品部をブラン
クにした板紙を貼付した第2のテンプレートを載せた図
4のC列の断面図である。
FIG. 15C shows a state in which all of the pressing pins are latched to the upper substrate after the interference pins are pulled out and the second template on which the paperboard with the product section blanked is stuck on the lower support plate in a state where the pressing pins are raised. It is sectional drawing of a row.

【図16】干渉ピンを抜き取った後上基板を降下し上下
の支持板で板紙を挟んだ状態で上係止ピンを抜く前の図
4のC列の断面図である。
FIG. 16 is a cross-sectional view of column C in FIG. 4 before the upper board is lowered after the interference pin is removed and the upper locking pin is removed with the paperboard sandwiched between the upper and lower support plates.

【図17】干渉ピンを除去し製品部を型抜きした板紙をFIG. 17 shows a paperboard from which an interference pin is removed and a product part is cut out.
下支持板の上に適宜枚数積み重ね、上基板を下降して板The appropriate number of sheets are stacked on the lower support plate,
紙の製品部からカス部を分離する状態の断面図である。It is sectional drawing of the state which separates a waste part from the product part of paper.

【符号の説明】 10・・・・・押圧ピン 10a・・・・上基板に保持される押圧ピン 10c・・・・下基板に保持される押圧ピン 10c・・・・干渉ピン 12・・・・・下係止ピン 14・・・・・下押圧ピン保持孔 16・・・・・下基板 18・・・・・上基板 20・・・・・上押圧ピン保持孔 22・・・・・上係止ピン 24・・・・・貫通孔 26・・・・・下支持板 28・・・・・上支持板 30・・・・・板紙 32・・・・・製品部 34・・・・・カス部 36・・・・・下係止ピン貫通孔 38・・・・・下嵌合溝 40・・・・・上係止ピン貫通孔 42・・・・・上嵌合溝 44・・・・・振り分け孔 46・・・・・第1のテンプレート 48・・・・・受け孔 50・・・・・受け板 52・・・・・第2のテンプレート 54・・・・・閉塞板[Description of Signs] ····························································································· ..Lower locking pin 14... Lower pressing pin holding hole 16... Lower substrate 18... Upper substrate 20... Upper pressing pin holding hole 22. Upper locking pin 24 ... Through hole 26 ... Lower support plate 28 ... Upper support plate 30 ... Paperboard 32 ... Product part 34 ...・ Cut portion 36 ・ ・ ・ ・ ・ Lower locking pin through hole 38 ・ ・ ・ ・ ・ Lower fitting groove 40 ・ ・ ・ ・ ・ Upper locking pin through hole 42 ・ ・ ・ ・ ・ Upper fitting groove 44 ・ ・... Distributing holes 46... First template 48... Receiving holes 50... Receiving plate 52... Second template 54. ... the closure plate

【手続補正5】[Procedure amendment 5]

【補正対象書類名】図面[Document name to be amended] Drawing

【補正対象項目名】図17[Correction target item name] FIG.

【補正方法】追加[Correction method] Added

【補正内容】[Correction contents]

【図17】 FIG.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 プレス機の基台に固定された下基板と、
押圧ピンを上下に抜き差し自在に保持し所望のピッチで
縦横に前記下基板に配列された下押圧ピン保持孔と、前
記下押圧ピン保持孔に挿入された押圧ピンの係止手段
と、前記下基板に向けて下降する前記プレス機のプラテ
ンに固定された上基板と、押圧ピンを上下に抜き差し自
在に保持し前記下押圧ピン保持孔の全てと上下に対向す
るように縦横に上基板に設けられ上押圧ピン保持孔と、
前記上押圧ピン保持孔に挿入された押圧ピンの係止手段
と、前記下基板および前記上基板の間に介在し打ち抜く
ブランクの形状に応じて前記下基板の前記下押圧ピン保
持孔または前記上基板の前記上押圧ピン保持孔のいずれ
かに保持される押圧ピンと、前記下基板に設けられた前
記押圧ピン保持孔と上下に対向するように設けられ前記
押圧ピンを抜き差し自在に貫通できる貫通孔を有し下基
板に保持された前記押圧ピンの上端と前記下基板の間で
昇降自在に支持される下支持板と、前記上基板に設けら
れた前記上押圧ピン保持孔と上下に対向するように設け
られ押圧ピンを抜き差し自在に貫通できる貫通孔を有し
前記上基板に保持された前記押圧ピンの下端と前記上基
板の間で昇降自在に支持される上支持板とで構成される
ピンボード式カス取り機の押圧ピンの分離方法であっ
て、 前記押圧ピンの全てを上基板に保持させる工程と、前記
下支持板の前記貫通孔と同じ位置に前記押圧ピンが貫通
する振り分け孔を穿設した第1のテンプレートに板紙の
製品部を打ち抜いたカス部を位置決めして置き前記第1
のテンプレートの前記振り分け孔のうち製品とカス部の
境界線上またはそれに近接する振り分け孔を閉塞する工
程と、前記下支持板を上昇しその上に前記下支持板の前
記貫通孔と前記振り分け孔とを一致させて前記第1のテ
ンプレートを載置する工程と、前記上基板に係止されて
いる押圧ピンの全ての係止を解除し前記振り分け孔の閉
塞により干渉ピンとして残された前記押圧ピン以外の前
記押圧ピンを前記下基板の前記下押圧ピン保持孔に落下
し保持させる工程と、前記上基板に残された前記干渉ピ
ンを上基板に係止すると共に前記上基板から除去できる
高さに前記上基板を上昇させる工程と、前記上基板と同
様に前記上基板に設けられた所定のピッチで縦横に配列
した押圧ピン保持孔と上下に対向するように設けられた
受け孔を有する受け板を前記上基板と前記下基板間に挿
入する工程と、前記上基板に干渉ピンとして係止されて
いる前記押圧ピンの係止を解除することにより前記押圧
ピンを前記受け板の前記受け孔に保持すると共に前記受
け板を前記上基板の外に退避させる工程と、前記下基板
に保持された前記押圧ピンを前記上基板に保持させる工
程と、前記下支持板の前記貫通孔と同じ位置に前記押圧
ピンが貫通する振り分け孔を穿設した第2のテンプレー
トに板紙の製品部を打ち抜いたカス部を位置決めし固定
する工程と、前記下支持板を上昇しその上に前記第2の
テンプレートを載置する置する工程と、前記上基板に係
止されている前記押圧ピンの係止を解除し前記板紙の前
記製品部を押圧する押圧ピンをを前記下基板の前記押圧
ピン保持孔に落下し保持させる工程と、前記上基板に残
った前記板紙のカス部を押圧する押圧ピンをを前記上基
板に係止する工程とからなることを特徴とするピンボー
ド式カス取り機の押圧ピンの分離方法。
1. A lower substrate fixed to a base of a press machine,
A lower pressing pin holding hole arranged vertically and horizontally at a desired pitch to hold the pressing pin up and down so as to be freely inserted and removed, locking means for the pressing pin inserted into the lower pressing pin holding hole, An upper substrate fixed to a platen of the press machine descending toward the substrate, and vertically and horizontally provided on the upper substrate so as to vertically hold the pressing pins so as to be able to be pulled out and inserted and to vertically face all of the lower pressing pin holding holes. And an upper pressing pin holding hole,
Locking means of the pressing pin inserted in the upper pressing pin holding hole, and the lower pressing pin holding hole or the upper surface of the lower substrate according to the shape of the blank interposed between the lower substrate and the upper substrate and punched out. A pressing pin held in one of the upper pressing pin holding holes of the substrate, and a through hole provided so as to vertically face the pressing pin holding hole provided in the lower substrate and through which the pressing pin can be freely inserted and removed. A lower support plate that is vertically supported between an upper end of the pressing pin held by the lower substrate and the lower substrate, and vertically faces the upper pressing pin holding hole provided in the upper substrate. A lower end of the pressing pin held by the upper substrate and an upper support plate supported up and down between the upper substrate and having a through hole through which the pressing pin can be freely inserted and removed. Pin board type waste A method of separating a pressing pin of a pressing machine, wherein a step of holding all of the pressing pins on an upper substrate and a distribution hole through which the pressing pin penetrates are formed at the same position as the through hole of the lower support plate. The scrap part obtained by punching the product part of the paperboard is positioned and placed on the first template.
Closing the distribution hole on or near the boundary line between the product and the waste portion of the distribution hole of the template, and raising the lower support plate thereon, the through-hole and the distribution hole of the lower support plate, Placing the first template in such a manner that all the pressing pins locked to the upper substrate are released, and the pressing pins left as interference pins by closing the distribution holes A step of dropping and holding the other pressing pins in the lower pressing pin holding holes of the lower substrate, and a height at which the interference pins remaining on the upper substrate are locked to the upper substrate and can be removed from the upper substrate. A step of elevating the upper substrate, and a receiving hole provided so as to vertically face pressing pin holding holes arranged vertically and horizontally at a predetermined pitch provided on the upper substrate similarly to the upper substrate. A step of inserting a plate between the upper substrate and the lower substrate, and releasing the pressing pin locked as an interference pin to the upper substrate so that the pressing pin receives the receiving hole of the receiving plate. Holding the receiving plate out of the upper substrate, holding the pressing pin held by the lower substrate on the upper substrate, and holding the lower plate at the same position as the through hole of the lower support plate. Positioning and fixing a scrap portion obtained by punching a product part of a paperboard into a second template having a distribution hole through which the pressing pin penetrates; and elevating the lower support plate and placing the second template thereon. And placing a pressing pin for releasing the locking of the pressing pin locked on the upper substrate and pressing the product portion of the paperboard in the pressing pin holding hole of the lower substrate. Process of dropping and holding The method for separating the pressing pin pinboard-type scrap winder characterized by comprising a pressing pin presses the scum of the paperboard remaining on the substrate and a step of locking on the substrate.
【請求項2】 プレス機の基台に固定された下基板と、
押圧ピンを上下に抜き差し自在に保持し所望のピッチで
縦横に前記下基板に配列された下押圧ピン保持孔と、前
記下押圧ピン保持孔に挿入された押圧ピンの係止手段
と、前記下基板に向けて下降する前記プレス機のプラテ
ンに固定された上基板と、押圧ピンを上下に抜き差し自
在に保持し前記下押圧ピン保持孔の全てと上下に対向す
るように縦横に上基板に設けられ上押圧ピン保持孔と、
前記上押圧ピン保持孔に挿入された押圧ピンの係止手段
と、前記下基板および前記上基板の間に介在し打ち抜く
ブランクの形状に応じて前記下基板の前記下押圧ピン保
持孔または前記上基板の前記上押圧ピン保持孔のいずれ
かに保持される押圧ピンと、前記下基板に設けられた前
記押圧ピン保持孔と上下に対向するように設けられ前記
押圧ピンを抜き差し自在に貫通できる貫通孔を有し下基
板に保持された前記押圧ピンの上端と前記下基板の間で
昇降自在に支持される下支持板と、前記上基板に設けら
れた前記上押圧ピン保持孔と上下に対向するように設け
られ押圧ピンを抜き差し自在に貫通できる貫通孔を有し
前記上基板に保持された前記押圧ピンの下端と前記上基
板の間で昇降自在に支持される上支持板とで構成される
ピンボード式カス取り機であって、 前記上基板に設けられた所定のピッチで縦横に配列した
上押圧ピン保持孔と上下に対向するように設けられ上基
板に保持された干渉ピンを抜き差し自在に保持する受け
孔を有し前記上基板の下に出入り自在に配置することに
より前記上基板に分離された干渉ピンを一旦退避させる
受け板を設けたことを特徴とするピンボード式カス取り
2. A lower substrate fixed to a base of a press machine,
A lower pressing pin holding hole arranged vertically and horizontally at a desired pitch to hold the pressing pin up and down so as to be freely inserted and removed, locking means for the pressing pin inserted into the lower pressing pin holding hole, An upper substrate fixed to a platen of the press machine descending toward the substrate, and vertically and horizontally provided on the upper substrate so as to vertically hold the pressing pins so as to be able to be pulled out and inserted and to vertically face all of the lower pressing pin holding holes. And an upper pressing pin holding hole,
Locking means of the pressing pin inserted in the upper pressing pin holding hole, and the lower pressing pin holding hole or the upper surface of the lower substrate according to the shape of the blank interposed between the lower substrate and the upper substrate and punched out. A pressing pin held in one of the upper pressing pin holding holes of the substrate, and a through hole provided so as to vertically face the pressing pin holding hole provided in the lower substrate and through which the pressing pin can be freely inserted and removed. A lower support plate that is vertically supported between an upper end of the pressing pin held by the lower substrate and the lower substrate, and vertically faces the upper pressing pin holding hole provided in the upper substrate. A lower end of the pressing pin held by the upper substrate and an upper support plate supported up and down between the upper substrate and having a through hole through which the pressing pin can be freely inserted and removed. Pin board type waste A receiving device provided vertically above and below the upper pressing pin holding holes arranged at a predetermined pitch provided on the upper substrate and vertically holding the interference pins held on the upper substrate so as to be freely inserted and removed. A pin board type scrap removing machine, comprising: a receiving plate having holes and disposed so as to be able to freely enter and exit under the upper substrate to temporarily retreat an interference pin separated from the upper substrate.
JP15952197A 1997-06-17 1997-06-17 Method and apparatus for separating pressing pin of pin board type scraper Expired - Fee Related JP3337397B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15952197A JP3337397B2 (en) 1997-06-17 1997-06-17 Method and apparatus for separating pressing pin of pin board type scraper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15952197A JP3337397B2 (en) 1997-06-17 1997-06-17 Method and apparatus for separating pressing pin of pin board type scraper

Publications (2)

Publication Number Publication Date
JPH115262A true JPH115262A (en) 1999-01-12
JP3337397B2 JP3337397B2 (en) 2002-10-21

Family

ID=15695592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15952197A Expired - Fee Related JP3337397B2 (en) 1997-06-17 1997-06-17 Method and apparatus for separating pressing pin of pin board type scraper

Country Status (1)

Country Link
JP (1) JP3337397B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101136454B1 (en) 2010-10-20 2012-04-19 (주)헤넥스 Blank separator
JP2017052048A (en) * 2015-09-09 2017-03-16 株式会社レザック Pin separation template and method for manufacturing pin separation template

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6271778B1 (en) * 2017-01-20 2018-01-31 株式会社レザック Waste removal device and waste removal method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101136454B1 (en) 2010-10-20 2012-04-19 (주)헤넥스 Blank separator
WO2012053748A2 (en) * 2010-10-20 2012-04-26 주식회사 헤넥스 Blank separator
WO2012053748A3 (en) * 2010-10-20 2012-06-14 주식회사 헤넥스 Blank separator
JP2017052048A (en) * 2015-09-09 2017-03-16 株式会社レザック Pin separation template and method for manufacturing pin separation template

Also Published As

Publication number Publication date
JP3337397B2 (en) 2002-10-21

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