JPS62253469A - Thermal head and manufacture thereof - Google Patents
Thermal head and manufacture thereofInfo
- Publication number
- JPS62253469A JPS62253469A JP9778886A JP9778886A JPS62253469A JP S62253469 A JPS62253469 A JP S62253469A JP 9778886 A JP9778886 A JP 9778886A JP 9778886 A JP9778886 A JP 9778886A JP S62253469 A JPS62253469 A JP S62253469A
- Authority
- JP
- Japan
- Prior art keywords
- glaze layer
- layer
- glaze
- electrodes
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title description 17
- 239000010410 layer Substances 0.000 claims abstract description 92
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 16
- 239000011241 protective layer Substances 0.000 claims abstract description 6
- 239000000758 substrate Substances 0.000 claims description 10
- 238000007639 printing Methods 0.000 abstract description 7
- 238000005530 etching Methods 0.000 abstract description 5
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 238000004381 surface treatment Methods 0.000 description 5
- 238000007740 vapor deposition Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- KRVSOGSZCMJSLX-UHFFFAOYSA-L chromic acid Substances O[Cr](O)(=O)=O KRVSOGSZCMJSLX-UHFFFAOYSA-L 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- AWJWCTOOIBYHON-UHFFFAOYSA-N furo[3,4-b]pyrazine-5,7-dione Chemical compound C1=CN=C2C(=O)OC(=O)C2=N1 AWJWCTOOIBYHON-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】 （イ）産業上の利用分野 この発明はサーマルヘッドの製造方法に関する。[Detailed description of the invention] (b) Industrial application fields The present invention relates to a method for manufacturing a thermal head.
（ロ）従来の技術
従来、サーマルヘッドは、第３Ａ図、第３Ｂ図及び第３
Ｃ図の工程図で示すような製造方法により形成されてい
る。(b) Conventional technology Conventionally, thermal heads are shown in Figures 3A, 3B and 3.
It is formed by a manufacturing method as shown in the process diagram in Figure C.
アルミナセラミック基板８１の上面に、帯状のガラスグ
レーズを印刷焼成して第１グレーズ層８２を形成した後
（第３Ａ図参照）、この第１グレーズ層８２の頂部へ長
手方向に沿い、第１の層より弯曲の小さい第２グレーズ
Ｊｉ８３を形成させ（第３Ｂ図参照）、次いで、この第
１グレーズ層８２及び第２グレーズ層８３の上面に窒化
タンタル等の抵抗膜８４を形成した後、この抵抗膜８４
の裾部両側へリード用電極８５．８５を重合状に蒸着あ
るいはスパッタ方式で形成する。そして、最終工程にお
いて、前記基板８１、抵抗膜８４及び電極８５の表面に
、二酸化珪素膜（保護膜）８６を蒸着又はスパッタ方式
にて形成している（第３Ｃ図参照）。After forming a first glaze layer 82 by printing and firing a band-shaped glass glaze on the upper surface of the alumina ceramic substrate 81 (see FIG. 3A), a first glaze layer 82 is formed along the longitudinal direction toward the top of the first glaze layer 82. A second glaze Ji83 having a smaller curvature than that of the second glaze layer Ji83 is formed (see FIG. 3B), and then a resistive film 84 made of tantalum nitride or the like is formed on the upper surfaces of the first glaze layer 82 and the second glaze layer 83. membrane 84
Lead electrodes 85, 85 are formed on both sides of the hem in a polymeric manner by vapor deposition or sputtering. In the final step, a silicon dioxide film (protective film) 86 is formed on the surfaces of the substrate 81, the resistive film 84, and the electrode 85 by vapor deposition or sputtering (see FIG. 3C).
この製法にて形成されたサーマルヘッドでは、電極８５
．８５間にパルス電圧を印加すると、発熱抵抗膜８４が
発熱し、この発熱部に対応する感熱紙或いは感熱リボン
によって記録紙９に印字される。In the thermal head formed by this manufacturing method, the electrode 85
．． When a pulse voltage is applied between 85 and 85, the heating resistive film 84 generates heat, and printing is performed on the recording paper 9 using thermal paper or thermal ribbon corresponding to the heating section.
この構成のサーマルヘッドでは、第１グレーズ層の頂部
に重ね餅状に積層された第２グレーズ層が形成され、感
熱記録紙又は感熱リボンと発熱体との密着性が強くなり
、第２グレーズ層を持たない構造のサーマルヘッドに比
し、印字品質の向上が達成できる。In a thermal head with this configuration, a second glaze layer is formed on top of the first glaze layer in a layered manner, and the adhesion between the thermal recording paper or thermal ribbon and the heating element is strengthened, and the second glaze layer Compared to a thermal head with no structure, printing quality can be improved.
（ハ）発明が解決しようとする問題点
上記従来の製造方法では、第２グレーズ層を形成する際
、エツチング工程が採用されている。このため、第２グ
レーズ層はマスクを使用して形成される結果、第１グレ
ーズ層と第２グレーズ層との接続部分、つまりマスクの
位置した第２グレーズ層の根元部に数μの高さのくびれ
部分（第３Ｂ図で示す符号８７）が生じる。従って、第
２グレーズ層の上面に重合状に積層する抵抗膜及び電極
が、このくびれ部分が障害となって、電極形成及び抵抗
膜の重合形成が困難な許かりでなく、電気的に安定性を
失う虞れがある。(c) Problems to be Solved by the Invention In the conventional manufacturing method described above, an etching process is employed when forming the second glaze layer. Therefore, as a result of forming the second glaze layer using a mask, a height of several μm is formed at the connecting portion between the first glaze layer and the second glaze layer, that is, at the root of the second glaze layer where the mask is located. A constricted portion (numeral 87 shown in FIG. 3B) is generated. Therefore, the constriction of the resistive film and the electrode, which are laminated in a polymeric manner on the upper surface of the second glaze layer, is not only difficult to form due to the constriction, but also to ensure electrical stability. There is a risk of losing.
また、このくびれ部分に対応する保護層に段差部が生じ
るため、記録紙と発熱部分との接触が悪くなり、印字品
質のよくない場合が生じる等の不利があった。Further, since a stepped portion is formed in the protective layer corresponding to the constricted portion, contact between the recording paper and the heat generating portion is poor, resulting in disadvantages such as poor print quality.
この発明は、従来のものが持つ、以上のような問題点を
解消させ、第１グレーズ層と第２グレーズ層との接続部
分にくびれ部を生じさせず、電極形成及び抵抗膜形成が
効率よく実行し得るサーマルヘッドの製造方法を提供す
ることを目的とする。This invention solves the above-mentioned problems of the conventional glaze layer, eliminates the formation of a constriction in the connecting portion between the first glaze layer and the second glaze layer, and enables efficient electrode formation and resistive film formation. It is an object of the present invention to provide a method of manufacturing a thermal head that can be implemented.
（ニ）問題点を解決するための手段及び作用この目的を
達成させるために、この発明のサーマルヘッドの製造方
法は、次のような方式で行われる。(d) Means and operation for solving the problems In order to achieve this object, the method for manufacturing a thermal head of the present invention is carried out in the following manner.
サーマルヘッドの製法工程は、絶縁基板の上面に帯状第
１グレーズ層を形成する工程と、この第１グレーズ層の
頂部−・長手方向に沿い直接アルミニウム層を形成し、
このアルミニウム層の表面に酸化被膜処理を施して第２
グレーズ層を形成する工程と、この第２グレーズ層の表
面に発熱抵抗膜を形成する工程と、この発熱抵抗膜の裾
部両側に電極を形成する工程と、前記基板、抵抗膜及び
電極を被覆する保護層を形成する工程とから成る。The manufacturing process of the thermal head includes a step of forming a band-shaped first glaze layer on the upper surface of an insulating substrate, and forming an aluminum layer directly along the longitudinal direction of the top of this first glaze layer.
An oxide film treatment is applied to the surface of this aluminum layer to form a second layer.
a step of forming a glaze layer, a step of forming a heat generating resistive film on the surface of this second glaze layer, a step of forming electrodes on both sides of the base of the heat generating resistive film, and a step of covering the substrate, the resistive film and the electrodes. forming a protective layer.
このような製法によれば、第１グレーズ層の頂部に形成
される第２グレーズ層は、熱伝導性のよいアルミニウム
金属が使用され、このアルミニウムが第１グレーズ層の
上面に直接、蒸着処理等により形成される。更に、この
アルミニウム層の表面には、絶縁酸化被膜が表面処理さ
れて、アルミニウム層とその酸化被膜とで第２グレーズ
層が構成される。According to such a manufacturing method, the second glaze layer formed on the top of the first glaze layer is made of aluminum metal with good thermal conductivity, and this aluminum is directly applied to the top surface of the first glaze layer by vapor deposition, etc. formed by. Furthermore, an insulating oxide film is surface-treated on the surface of this aluminum layer, and a second glaze layer is formed by the aluminum layer and the oxide film.
従って、この製法では、アルミニウム層を形成した後、
その表面に酸化被膜処理を施して第２グレーズ層を形成
するので、第１グレーズ層と第２グレーズ層との接続部
、つまり、第２グレーズ層の根元部分は滑らかな状態に
成形され、従来のようなくびれ部（段部）は生じない。Therefore, in this manufacturing method, after forming the aluminum layer,
Since the second glaze layer is formed by applying an oxide film treatment to the surface, the connecting part between the first glaze layer and the second glaze layer, that is, the root part of the second glaze layer, is formed into a smooth state, and unlike the conventional A constriction (step) like this does not occur.
かくして、電極形成・抵抗膜形成は、第２グレーズ層の
滑らかな面上に電気的に安定した状態で重合形成し得る
。In this way, electrodes and resistive films can be formed by polymerization on the smooth surface of the second glaze layer in an electrically stable state.
しかも、発熱部に対応する保護膜にも、くびれ部に起因
する段部が生じず、記録紙と発熱部との密着性が一層良
好となる。Furthermore, the protective film corresponding to the heat generating part does not have a stepped portion due to the constricted part, and the adhesion between the recording paper and the heat generating part becomes even better.
（ホ）実施例
第２図は、この発明に係る製造方法で形成されたサーマ
ルヘッドの平面図である。(E) Embodiment FIG. 2 is a plan view of a thermal head formed by the manufacturing method according to the present invention.
サーマルヘッドは、公知のように、絶縁性のアルミナ基
板１の上面に、断面が半円形状をした帯状の第１グレー
ズ層２（第３グレーズ層３を含む）を形成し、矢印で示
す記録紙送り方向に対し、直交方向に配置されている。As is well known, the thermal head has a band-shaped first glaze layer 2 (including a third glaze layer 3) with a semicircular cross section formed on the upper surface of an insulating alumina substrate 1, and records as indicated by arrows. It is arranged in a direction perpendicular to the paper feeding direction.
そして、この第１グレーズ層２の頂部に第２グレーズ層
３を形成し、その第２グレーズ層３の表面に抵抗膜４、
この抵抗膜４の裾部両側にそれぞれ対向状にリード用共
通電極５及び切込み部１１によって互いに区分される複
数の個別電極５ａを形成し、さらにこれらを被覆する保
護層が最上部に形成されている。Then, a second glaze layer 3 is formed on the top of the first glaze layer 2, and a resistive film 4 is formed on the surface of the second glaze layer 3.
A plurality of individual electrodes 5a separated from each other by a lead common electrode 5 and a notch 11 are formed in opposing directions on both sides of the bottom portion of the resistive film 4, and a protective layer covering these is formed on the top. There is.
この発明の特徴は、前記第２グレーズ層３の成形方法に
ある。The feature of this invention lies in the method of forming the second glaze layer 3.
第１Ａ図、第１Ｂ図、第１Ｃ図及び第１Ｄ図は、この発
明に係るサーマルヘッドの具体的な製造工程を段階的に
示した断面図である。FIGS. 1A, 1B, 1C, and 1D are cross-sectional views showing step-by-step the specific manufacturing process of the thermal head according to the present invention.
製造工程の第１段階において、絶縁性のアルミナセラミ
ック基板１の上面に、帯状のガラスグレーズを印刷焼成
して第１グレーズ層２を形成する（第１Ａ図参照）。In the first step of the manufacturing process, a band-shaped glass glaze is printed and fired on the upper surface of an insulating alumina ceramic substrate 1 to form a first glaze layer 2 (see FIG. 1A).
続いて、第２段階において、この第１グレーズ層２の頂
部へ直接、導電性の良いアルミニウム層３１を蒸着又は
スパッタ方式により形成し、エツチング工程により所定
形状にパターニングする（第１Ｂ図参照）。Subsequently, in a second step, a highly conductive aluminum layer 31 is formed directly on the top of the first glaze layer 2 by vapor deposition or sputtering, and is patterned into a predetermined shape by an etching process (see FIG. 1B).
その後、このアルミニウム層３１の表面にアルマイト表
面処理を行い、絶縁酸化被膜３２を形成して第２グレー
ズ層３を構成させる（第１Ｃ図参照）。Thereafter, alumite surface treatment is performed on the surface of this aluminum layer 31 to form an insulating oxide film 32 to constitute the second glaze layer 3 (see FIG. 1C).
このアルマイト処理は、例えば、電解による陽極処理方
式（クロム酸あるいは硫酸等の電解質溶液中で電流を流
して酸化被膜を形成させる）か、或いは無電解方式（酸
化力のある無機酸に浸漬しあるいは吹き付は等により表
面酸化処理した後、酸化膜表面を洗浄する）であっても
良い、要は、サーマルヘッドとして充分な絶縁状態（例
えばＩＭΩ以上）が達成できれば良い。かくして、第１
グレーズ層２との接続間にくびれ部がなく、接続部が滑
らかな第２グレーズ層３が形成される（第１Ｃ図参照）
。This alumite treatment can be carried out, for example, by an electrolytic anodic treatment method (forming an oxide film by passing a current through an electrolyte solution such as chromic acid or sulfuric acid), or an electroless method (immersion in an inorganic acid with oxidizing power or The spraying may be performed by performing surface oxidation treatment (eg, cleaning the oxide film surface), as long as it can achieve a sufficient insulation state (for example, IMΩ or higher) as a thermal head. Thus, the first
A second glaze layer 3 is formed with no constriction between the connection to the glaze layer 2 and a smooth connection (see Figure 1C).
.
次いで、この第１グレーズ層２及び第２グレーズ層３の
上面に、窒化タンタル等の抵抗膜４を形成した後、この
抵抗膜４の裾部両側へそれぞれリード用電極（共通電極
、個別電極）５．５ａを対向状に蒸着あるいはスパッタ
方式で重合形成する。Next, a resistive film 4 made of tantalum nitride or the like is formed on the upper surfaces of the first glaze layer 2 and the second glaze layer 3, and then lead electrodes (common electrode, individual electrode) are formed on both sides of the bottom of the resistive film 4. 5.5a are polymerized and formed by evaporation or sputtering in opposite directions.
そして、最終工程において、前記基板１、抵抗膜４及び
電極５．５ａの表面に二酸化珪素膜（保護膜）６を、蒸
着又はスパッタ方式にて形成する（第１Ｄ図参照）。In the final step, a silicon dioxide film (protective film) 6 is formed on the surfaces of the substrate 1, the resistive film 4, and the electrodes 5.5a by vapor deposition or sputtering (see FIG. 1D).
このような製造方法は、第２グレーズ層３は、アルミニ
ウム層３１が第１グレーズＷＩ２に対し直接、蒸着形成
される。次いで、このアルミニウム層３１の表面にアル
マイト表面処理が行われ、酸化膜３２を形成することに
より、第２グレーズ層３を構成する方法であるから、第
１グレーズ層２と第２グレーズ層３との接続部は、段部
のない滑らかな積造状態に成形される。すなわち、アル
ミニウム層３１のパターンエツチングの際、２〜３μの
くびれが根元に発生しても、プルマイト表面処理により
、くびれの突出部分が浸食除去される。In this manufacturing method, the second glaze layer 3 is formed by depositing the aluminum layer 31 directly onto the first glaze WI2. Next, alumite surface treatment is performed on the surface of this aluminum layer 31 to form an oxide film 32, thereby forming the second glaze layer 3. Therefore, the first glaze layer 2 and the second glaze layer 3 are The joints are formed into a smooth pile without any steps. That is, even if a constriction of 2 to 3 microns occurs at the base during pattern etching of the aluminum layer 31, the protruding portion of the constriction is eroded away by the plumite surface treatment.
かくして、このくびれのない滑らかな状態の第２グレー
ズ層３に、重合される抵抗膜４、電極５．５ａは、安定
した状態で電気的に重合形成でき、且つこれら各層を被
覆する保護層６の発熱部に対応する部分を、滑らかな状
態に形成でき、一層、記録紙と発熱部との密着性が良好
となる。In this way, the resistive film 4 and the electrode 5.5a can be electrically polymerized in a stable state on the second glaze layer 3 in a smooth state without constrictions, and the protective layer 6 covering each of these layers can be formed. The portion corresponding to the heat generating portion can be formed in a smooth state, and the adhesion between the recording paper and the heat generating portion is further improved.
（へ）発明の効果
この発明では、以上のように、第１グレーズ層の頂部に
形成する第２グレーズ層を、第１グレーズ層に対し直接
、アルミニウム層を積層させ、このアルミニウム層に酸
化被膜を表面処理して構成させる製法とした。(f) Effects of the Invention In this invention, as described above, the second glaze layer formed on the top of the first glaze layer is formed by laminating an aluminum layer directly on the first glaze layer, and the aluminum layer is coated with an oxide film. The manufacturing method is to perform surface treatment on the material.
この発明によれば、パターンエツチング工程において生
じる第２グレーズ層のくびれ部発生の弊害が、酸化被膜
の表面処理により解消される。According to the present invention, the problem of the generation of constrictions in the second glaze layer during the pattern etching process is eliminated by surface treatment of the oxide film.
従って、従来のように、第２グレーズ層に重合状に形成
される抵抗膜及び電極の重合状態が、くびれ部により電
気的に不安定となることがなく、抵抗膜及び電極が滑ら
かな第２グレーズ層上に電気的に安定した状態で重合形
成し得る。Therefore, the polymerization state of the resistive film and electrodes formed in a polymerized manner on the second glaze layer does not become electrically unstable due to the constriction, as in the conventional case, and the resistive film and electrodes are smooth in the second glaze layer. It can be polymerized and formed on the glaze layer in an electrically stable state.
しかも、この発明では、第２グレーズ層にくびれ部を生
じさせないようにしたから、第１及び第２グレーズ層、
抵抗膜及び電極を被覆する保護膜の発熱部に対応する部
分も、滑らかな状態に仕上げることが可能となり、一層
、発熱部と記録紙との密着性が良好となる結果、印字性
能及び印字エネルギの低減化が達成される等、発明目的
を達成した優れた効果を有する。Moreover, in this invention, since the second glaze layer is prevented from having a constricted portion, the first and second glaze layers,
The part of the protective film that covers the resistive film and electrodes that corresponds to the heat generating part can also be finished in a smooth state, which improves the adhesion between the heat generating part and the recording paper, resulting in improved printing performance and printing energy. The present invention has an excellent effect of achieving the purpose of the invention, such as a reduction in
第１Ａ図、第１Ｂ図、第ｉｃ図及び第１Ｄ図は、この発
明の製造工程を示す断面図、第２図は、サーマルヘッド
の平面図、第３Ａ図、第３Ｂ図及び第３Ｃ図は、従来の
製造工程を示す断面図である。
１：基板、 ２：第１グレーズ層、３：第
２グレーズ層、 ４：抵抗膜、
５・５ａ：電極、 ６：保護膜、
３１ニアルミニウム層、 ３２：酸化膜。1A, 1B, IC, and 1D are cross-sectional views showing the manufacturing process of the present invention, FIG. 2 is a plan view of the thermal head, and FIGS. 3A, 3B, and 3C are , is a cross-sectional view showing a conventional manufacturing process. Reference Signs List 1: Substrate, 2: First glaze layer, 3: Second glaze layer, 4: Resistive film, 5/5a: Electrode, 6: Protective film, 31 Nialium layer, 32: Oxide film.
Claims (1)
頂部へ長手方向に沿い直接アルミニウム層を形成し、こ
のアルミニウム層の表面に酸化被膜処理を施して第２グ
レーズ層を形成する工程と、この第２グレーズ層の表面
に発熱抵抗膜を形成する工程と、この発熱抵抗膜の裾部
両側に電極を形成する工程と、前記基板、抵抗膜及び電
極を被覆する保護層を形成する工程とから成るサーマル
ヘッドの製造方法。(1) Forming a band-shaped first glaze layer on the upper surface of the insulating substrate, forming an aluminum layer directly along the longitudinal direction on the top of this first glaze layer, and subjecting the surface of this aluminum layer to an oxide film treatment. a step of forming a second glaze layer, a step of forming a heat generating resistive film on the surface of the second glaze layer, a step of forming electrodes on both sides of the base of the heat generating resistive film, and a step of forming the substrate, the resistive film and the electrodes. forming a protective layer covering the thermal head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9778886A JPS62253469A (en) | 1986-04-26 | 1986-04-26 | Thermal head and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9778886A JPS62253469A (en) | 1986-04-26 | 1986-04-26 | Thermal head and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62253469A true JPS62253469A (en) | 1987-11-05 |
Family
ID=14201549
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9778886A Pending JPS62253469A (en) | 1986-04-26 | 1986-04-26 | Thermal head and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62253469A (en) |
-
1986
- 1986-04-26 JP JP9778886A patent/JPS62253469A/en active Pending
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