JPS62252197A - Cooling apparatus for electronic device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to cooling technology, and is applied to a cooling technology for forcibly cooling electronic components of an electronic device constituted by a wiring board on which a large number of electronic components are mounted. It is related to effective technology.

[Prior art]

As the density and speed of semiconductor devices increase, the number of components that generate high heat increases, and it is desired to efficiently cool these components. As a method for efficiently cooling components that generate such high heat, there is an injection cooling method in which cooling air is directly blown onto heat generating components to cool them.

In a cooling device for an electronic device using a conventional injection cooling method, for example, as shown in FIG. Cooling air is blown onto the electronic components 2 provided, and the air is exhausted from the exhaust lower.

[Problem that the invention seeks to solve]

However, this conventional cooling device for electronic devices has the following problems.

(1) Since the air chamber 5 and the nozzle 6 are integrated, the position of the nozzle 6 is fixed.

There were restrictions on component size and mounting position.

(2) Since the amount of cooling air cannot be changed depending on the amount of heat generated by the parts, the driving power of the cooling fan is wasted, and efficient cooling cannot be achieved.

(3) Cooling performance does not improve because the air injected stays between the air chamber 5 and the wiring board.

The present invention has been made to solve the above problems.

An object of the present invention is to provide a technique that can alleviate restrictions on the size and mounting position of components mounted on a wiring board.

Another object of the present invention is to provide a technique that enables efficient cooling by quickly exhausting used cooling fluid.

The above and other objects and novel features of the present invention are explained by the description of the specification and the accompanying drawings.

[Means for solving problems]

A brief overview of typical inventions disclosed in this application is as follows.

In other words, in a cooling device for an electronic device that blows cooling air onto individual electronic components mounted on a wiring board to forcibly cool them, the connection between a cooling fan that delivers cooling fluid and the cooling fan is used. a cooling fluid chamber having a plurality of nozzle mounting portions disposed at predetermined positions on the opposite surface side of the wiring board on which the electronic component is mounted; This device is characterized by comprising a nozzle having a blowout diameter and an exhaust fan that forcibly exhausts the cooled fluid that has cooled the electronic components.

[Effect]

According to the means described above, for individual parts.

The object of the present invention is achieved by freely selecting the nozzle opening and supplying a flow rate of cooling fluid that matches the amount of heat generated.

[Embodiments of the invention]

Hereinafter, one embodiment of the present invention will be specifically described using the drawings.

Note that throughout the description of the embodiments, parts having the same functions are given the same reference numerals, and repeated explanations thereof will be omitted.

[Embodiment 1] FIG. 1 is a partially cutaway perspective view showing a schematic configuration of a cooling device for an electronic device according to Embodiment I of the present invention, and FIG. FIG.

The electronic device cooling device of this embodiment is shown in FIGS. 1 and 21.
! 1, a cooling fluid 14 made of, for example, cooling air, cooling inert gas, etc. is sent from a cooling fan 13 to an air chamber 17, and is applied onto a wiring board 11 from a nozzle 16 provided on a nozzle plate 15. Cooling fluid 14 is sprayed onto the electronic component 12 provided, and the electronic component 12
The cooling fluid 14 that has absorbed the heat generated by the cooling fluid 14 passes through the exhaust port 18 and is exhausted to the outside by the exhaust fan unit 20.

The nozzle 16 is installed on the nozzle plate 15 by aligning the position with the arrangement of the electronic components 12 in advance, and then attaching the nozzle 16 to the nozzle plate 15.
Nozzle 1 with a diameter that matches the amount of heat generated by the opposing electronic component 12
6 is detachably attached.

A nozzle 16 with a large diameter is attached to a component with a large amount of heat generated per unit, and a nozzle with a small diameter is attached to a component with a small amount of heat generated.

Of course, it is sufficient to prepare a nozzle plate 15 in which the mounting position of the nozzle 16 is changed depending on the component size of the wiring board and the mounting button, and there is no need to change the entire air chamber 17, so flexible and economical cooling can be achieved. structure becomes possible.

Further, the exhaust port 18 is provided with an exhaust fan unit 20, so that the cooling fluid 14 (used cooling fluid) that has absorbed the heat generated by the electronic component 12 is immediately discharged to the outside. Exhausted. Therefore, the flow rate of the cooling fluid 14 sprayed from the nozzle 16 onto the electronic component 12 increases, thereby enhancing the cooling effect.

Further, the exhaust fan unit 20 functions to exhaust the heated cooling fluid 14 inside the cover 19 even when the cooling fan 1.3 stops. This has a cooling capacity equivalent to that of a general forced cooling system that cools the electronic component 12 by flowing the cooling fluid 14 parallel to the surface thereof, so it also serves to ensure the safety of the cooling system.

With this configuration, the cooling fluid 14 heated to high temperature by the cooling fan 13 such as a fan or compressor accumulates in the air chamber 17 and passes through the nozzle 16 to reach the electronic component 12 mounted on the wiring board 11. Since the electronic components 12 that collided and became high temperature at this time are cooled, restrictions on the size and mounting position of components mounted on the wiring board can be relaxed, and the used cooling fluid can be quickly exhausted. , efficient cooling can be performed.

[Example ■]

FIG. 3 is a diagram illustrating a cooling device for an electronic device according to Embodiment 2 of the present invention, and is a perspective view showing a schematic configuration of another embodiment of the nozzle plate attached to the fluid chamber shown in FIG. 1. be.

In FIG. 3, 21 is a nozzle plug, and 22 is a hole in which the nozzle 16 or nozzle plug 21 is set.

The electronic device cooling device of this embodiment (2) is designed to prevent the number of types of nozzle plates 15 from increasing as shown in FIG. 3 when the electronic components 12 shown in FIG. 1 are arranged in many different ways. This is what I did.

That is, an appropriate number of holes 22 are drilled in advance in the nozzle plate 15, and female threads are cut if necessary.
As shown in FIG. 3, nozzles 16 are attached only where necessary for cooling. To install the nozzle 16, cut a male thread on the nozzle 16.

It is screwed together with the female thread of the nozzle plate 15, or fixed with an adhesive or the like. By using nozzles 16 with different diameters at their tips, the flow rate of the cooling fluid 14 from the nozzles 16 can be varied. Holes 22 where nozzles 16 are not needed are plugged with nozzle plugs 21. The method of fixing the nozzle plug 21 is the same as that of the nozzle 16.

If the nozzle plate 15 on which the nozzles 16 are wired in this manner is attached to the air chamber 17, the nozzles 16 can be appropriately arranged in any arrangement state of the electronic component 12, and a sufficient cooling effect can be obtained.

The present invention has been specifically described above based on examples, but 1.
It goes without saying that the present invention is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit thereof.

〔Effect of the invention〕

As explained above, according to one aspect of the present invention, the nozzles are arranged in accordance with the arrangement state of the electronic components.

Since the flow rate of the cooling fluid necessary for cooling the electronic components can be changed depending on the diameter of the nozzle, there is an advantage that an appropriate cooling fluid can be supplied to all the electronic components and sufficient cooling can be achieved when necessary.

[Brief explanation of drawings]

FIG. 1 is a partially cutaway perspective view showing a schematic configuration of a cooling device for an electronic device according to Embodiment I of the present invention, and FIG. 2 is a sectional view taken along the cutting line FIG. 3 is a diagram illustrating a cooling device for an electronic device according to Embodiment 2 of the present invention, and is a perspective view showing a schematic configuration of another embodiment of the nozzle plate attached to the fluid chamber shown in FIG. FIG. 4 is a diagram for explaining the problems of the conventional cooling device for electronic devices. In the figure, 11... wiring board, 12... electronic component, 13
... Cooling fan, 14... Cooling fluid, 15...
Nozzle plate, 16... Nozzle, 17... Air chamber, 18... Exhaust port, 19... Cover, 20... Exhaust fan unit, 21... Nozzle plug, 22...
It's a hole.

Claims (5)

[Claims] (1) In a cooling device for electronic devices that sprays cooling fluid onto individual electronic components mounted on a wiring board to forcibly cool them, the connection between the cooling fan that delivers the cooling fluid and the cooling fan. a cooling fluid chamber having a plurality of nozzle mounting portions disposed at predetermined positions on the opposite surface side of the wiring board on which the electronic component is mounted; 1. A cooling device for an electronic device, comprising: a nozzle having a blowout diameter; and an exhaust fan that forcibly exhausts the cooled fluid that has cooled the electronic components. (2) The cooling device for an electronic device according to claim 1, wherein the cooling fluid comprises, for example, cooling air, cooling inert gas, or the like. (3) The cooling device for an electronic device as set forth in claim 1 or 2, wherein the nozzle mounting portion is formed of a screw hole. (4) The part of the cooling fluid chamber having a plurality of nozzle attachment parts has a removable structure. Cooling device for equipment. (5) The cooling device for an electronic device according to any one of claims 1 to 4, wherein the nozzle has a spiral groove on its outer periphery.