JPS622517A - Manufacture of solid electrolytic capacitor - Google Patents
Manufacture of solid electrolytic capacitorInfo
- Publication number
- JPS622517A JPS622517A JP14111585A JP14111585A JPS622517A JP S622517 A JPS622517 A JP S622517A JP 14111585 A JP14111585 A JP 14111585A JP 14111585 A JP14111585 A JP 14111585A JP S622517 A JPS622517 A JP S622517A
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- solid electrolytic
- lead
- metal powder
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Powder Metallurgy (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は固体電解コンデンナに関するものである。[Detailed description of the invention] (Industrial application field) The present invention relates to a solid electrolytic capacitor.
（従来の技術）
一般に、固１ホ電解コンデンサは、タンタル等の弁作用
を有する金属等のＴ５）末にリードを差し込みプレスに
より加圧成形し焼結し、ての焼結体を陽極酸化し、二酸
化マンガン等の半導体層を形成し、カーボン層、銀層と
半田層等の金ｒｓｍを形成し、その後、リードに陽極端
子を溶接等するととしに半田層に陰極リードを半田付け
して製造される。(Prior art) In general, solid 1-hole electrolytic capacitors are made by inserting leads into the T5 end of a metal with a valve action such as tantalum, press-forming and sintering the sintered body, and then anodizing the sintered body. , a semiconductor layer such as manganese dioxide is formed, a carbon layer, a silver layer and a gold rsm such as a solder layer are formed, and then an anode terminal is welded to the lead, and a cathode lead is soldered to the solder layer. be done.
（発明が解決しようとする問題点）
ところで、陽極端子をリードに溶接等する場合、リード
に圧力が加わり、リードと焼結体との密着性が低下し漏
れ電流が増大する欠点があった。(Problems to be Solved by the Invention) By the way, when an anode terminal is welded to a lead, pressure is applied to the lead, reducing the adhesion between the lead and the sintered body and increasing leakage current.
本発明は、以上の欠点を改良し、リードと焼結体との密
着性を改良しつる固体電解コンデンサの製造方法の提供
を目的とづるものである。SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a solid electrolytic capacitor which improves the adhesion between the leads and the sintered body by improving the above-mentioned drawbacks.
（問題点を解決するための手段）
本発明は、上記の目的を達成づ“るために、弁作用を有
する金属粉末を所望の形状に加圧成形し焼結した後、ｌ
ｌ！ｉ極酸化し、半導体層、カーボン層及び金属層を順
次形成した固体電解コンデンサの製造方法において、金
属粉末にリードを差し込み、凸型状パンチにより加圧成
形することを特徴とする固体電解コンデンナの製造方法
を提供するものである。(Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention provides a process in which a metal powder having a valve action is pressure-molded into a desired shape, sintered, and then l
l! A method for manufacturing a solid electrolytic capacitor in which a semiconductor layer, a carbon layer and a metal layer are sequentially formed through i-polar oxidation, the solid electrolytic capacitor being formed by inserting a lead into metal powder and pressurizing it with a convex punch. A manufacturing method is provided.
（作用）
本発明によれば、弁作用を右づる金属粉末にリードを差
し込んだ後、凸型状パンチにより加圧成形しているため
、リードの近傍の金属粉末が高密度に成形される。従っ
て、その後にリードに陽極端子を溶接等した場合、リー
ドに力が加わっても、リードと金属粉末どの密着性が低
下することがない。(Function) According to the present invention, after the lead is inserted into the metal powder that controls the valve action, the lead is press-molded using a convex punch, so that the metal powder near the lead is compacted to a high density. Therefore, when the anode terminal is welded to the lead after that, even if force is applied to the lead, the adhesion between the lead and the metal powder will not deteriorate.
（実施例） 以下、本発明を図示の実施例に基づいて説明する。(Example) Hereinafter, the present invention will be explained based on illustrated embodiments.
先ず、第１図に示す通り、金型１にタンタル等の弁作用
を有する金属の粉末２を充填する。次に、第２図に示す
通り、金属粉末２中にタンタル等のリード線３を差し込
む。リード線３を差し込み後、押圧面が凸型状の上パン
チ４をその凸部５がリード線３の近傍を圧縮するように
下方に押圧するとともに、平面状の押圧面を有する下パ
ンチ６を上方に押圧して、金属粉末２を加圧成形する。First, as shown in FIG. 1, a mold 1 is filled with powder 2 of a metal having a valve action, such as tantalum. Next, as shown in FIG. 2, a lead wire 3 made of tantalum or the like is inserted into the metal powder 2. After inserting the lead wire 3, the upper punch 4 having a convex pressing surface is pressed downward so that its convex portion 5 compresses the vicinity of the lead wire 3, and the lower punch 6 having a flat pressing surface is pressed downward. The metal powder 2 is press-molded by pressing upward.
金属粉末２を、加圧成形後、焼結して、第３図に示す通
り、リード線３の根本付近が凹んだ形状の焼結体７とす
る。そして焼結体７をリン酸や硫酸等の酸性溶液中に浸
漬して陽極酸化し、酸化皮膜を形成する。酸化皮膜を形
成後、焼結体７を硝酸マンガン等の半導体母液中に浸漬
し、二酸化マンガン等の半導体層を形成する。半導体層
を形成後、カーボン層並びに銀層及び半田層の金属層を
形成する。金属層を形成後、リード１１３に、第４図に
示す通り、陽極端子８を溶接するとともに、最外層の半
田層に陰極端子９を半田付けする。その後、樹脂ディッ
プや樹脂モールドを行い外装を形成する。The metal powder 2 is press-molded and then sintered to form a sintered body 7 having a concave shape near the base of the lead wire 3, as shown in FIG. Then, the sintered body 7 is immersed in an acidic solution such as phosphoric acid or sulfuric acid and anodized to form an oxide film. After forming the oxide film, the sintered body 7 is immersed in a semiconductor mother liquor such as manganese nitrate to form a semiconductor layer such as manganese dioxide. After forming the semiconductor layer, a carbon layer and metal layers such as a silver layer and a solder layer are formed. After forming the metal layer, the anode terminal 8 is welded to the lead 113 as shown in FIG. 4, and the cathode terminal 9 is soldered to the outermost solder layer. After that, resin dipping and resin molding are performed to form the exterior.
寸なわら、本発明によれば、押圧面が凸型状の上パンチ
４により加圧成形しているため、リード線３の近傍が特
に高密度に圧縮され、リード［１３と金属粉末２との密
着性が向上する。However, according to the present invention, since the pressing surface is press-formed by the upper punch 4 having a convex shape, the vicinity of the lead wire 3 is compressed to a particularly high density, and the lead [13 and the metal powder 2] are compressed to a high density. Improves adhesion.
（発明の効果）
以上の通り、本発明によれば、凸型状パンチにより金属
粉末を加圧成形しているために、リード線の近傍を高密
度にでき、リード線と金属粉末との密着性を改良でき、
漏れ電流等を改良しつる固体電解コンデンサの製造方法
が得られる。(Effects of the Invention) As described above, according to the present invention, since the metal powder is pressure-molded using a convex punch, the vicinity of the lead wire can be made high-density, and the lead wire and the metal powder are in close contact with each other. can improve sex,
A method for manufacturing a solid electrolytic capacitor with improved leakage current and the like can be obtained.
第１図〜第４図は本発明の製造状態を示し、第１図は金
型に金属粉末を充填した状態の断面図、第２図は金属粉
末にリード線を差し込んだ状態の断面図、第３図は焼結
体の断面図、第４図は焼結体に陽極端子と陰極端子とを
接続した状態の断面図を示す。
２・・・金属粉末、 ３・・・リード線。
４・・・上パンチ、 ５・・・凸部、 ７・・・焼結体
。
特許出願人 日立コンデンサ株式会社
第２図1 to 4 show the manufacturing state of the present invention; FIG. 1 is a cross-sectional view of a mold filled with metal powder; FIG. 2 is a cross-sectional view of a lead wire inserted into the metal powder; FIG. 3 is a sectional view of the sintered body, and FIG. 4 is a sectional view of the sintered body with an anode terminal and a cathode terminal connected to each other. 2...Metal powder, 3...Lead wire. 4... Upper punch, 5... Convex portion, 7... Sintered body. Patent applicant Hitachi Capacitor Co., Ltd. Figure 2
Claims (1)
し焼結した後、陽極酸化し、半導体層、カーボン層及び
金属層を順次形成した固体電解コンデンサの製造方法に
おいて、金属粉末にリードを差し込み、凸型状パンチに
より加圧成形することを特徴とする固体電解コンデンサ
の製造方法。(1) In a method for producing a solid electrolytic capacitor, in which a metal powder having a valve action is pressure-molded into a desired shape, sintered, anodized, and a semiconductor layer, a carbon layer, and a metal layer are sequentially formed, the metal powder is A method for producing a solid electrolytic capacitor, which comprises inserting a lead and forming the solid electrolytic capacitor under pressure using a convex punch.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14111585A JPS622517A (en) | 1985-06-27 | 1985-06-27 | Manufacture of solid electrolytic capacitor |
| US06/784,063 US4676216A (en) | 1984-10-05 | 1985-10-04 | Injection nozzle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14111585A JPS622517A (en) | 1985-06-27 | 1985-06-27 | Manufacture of solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS622517A true JPS622517A (en) | 1987-01-08 |
Family
ID=15284507
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14111585A Pending JPS622517A (en) | 1984-10-05 | 1985-06-27 | Manufacture of solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS622517A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173303A (en) * | 2005-12-19 | 2007-07-05 | Nichicon Corp | Chip type solid electrolytic capacitor |
| JP2008034429A (en) * | 2006-07-26 | 2008-02-14 | Nec Tokin Corp | Solid electrolytic capacitor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831513A (en) * | 1981-08-19 | 1983-02-24 | 日本電気ホームエレクトロニクス株式会社 | Method of producing solid electrolytic condenser |
-
1985
- 1985-06-27 JP JP14111585A patent/JPS622517A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5831513A (en) * | 1981-08-19 | 1983-02-24 | 日本電気ホームエレクトロニクス株式会社 | Method of producing solid electrolytic condenser |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173303A (en) * | 2005-12-19 | 2007-07-05 | Nichicon Corp | Chip type solid electrolytic capacitor |
| JP2008034429A (en) * | 2006-07-26 | 2008-02-14 | Nec Tokin Corp | Solid electrolytic capacitor |
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